Bare chip aging screening device

Abstract

The utility model relates to the technical field of bare chip screening, in particular to a bare chip aging screening device which comprises a bottom plate, a plurality of aging tools are arranged on the bottom plate in an array mode, each aging tool comprises a ceramic substrate, and a frame-shaped base is detachably connected to the ceramic substrate; a power supply positive electrode assembly is arranged on the ceramic substrate and connected with a liquid metal electrode I, and the liquid metal electrode I is located in the frame-shaped base; and a power supply negative electrode assembly is connected to the frame-shaped base in a sliding manner and is connected with a liquid metal electrode II. According to the utility model, the liquid metal electrode I is connected to the positive electrode of the power supply and protects the lower end of the bare chip at the same time, and the liquid metal electrode II is connected to the negative electrode of the power supply and protects the upper end of the bare chip at the same time, thereby isolating hard contact when the bare chip is electrified, and preventing the bare chip of the laser chip from cracking.

Description

Technical Field

[0001] The utility model relates to the technical field of bare chip screening, and particularly relates to a bare chip aging screening device. Background Art

[0002] A bare chip refers to the product form before semiconductor components are manufactured and packaged. It usually exists in the form of a large wafer or a single chip, and becomes a component of semiconductor elements, integrated circuits, or more complex circuits after packaging. Before the bare chip of a laser chip is packaged, it is necessary to perform high-temperature aging screening on the bare chip of the laser chip by powering it on through an aging screening device to save economic costs and time costs; however, the existing aging screening device powers on the bare chip in a hard contact manner. The bare chip of a laser chip is brittle and is extremely likely to crack after being squeezed, increasing unnecessary manufacturing costs. Therefore, it is necessary to avoid the situation where the bare chip of a laser chip cracks.

[0003] In the prior art, for example: Utility Model CN201298046Y, a temporary packaging carrier for a bare chip. In this patent, a metal bump area exposed in the cavity of the support fixing member is provided in the middle of the electrical interconnection substrate, and the metal bumps are used to contact the pads of the bare chip to be tested. When this patent is applied to high-temperature aging screening of the bare chip of a laser chip, when the metal bumps are in hard contact with the bare chip of the laser chip, the bare chip of the laser chip is extremely likely to crack due to the extrusion of the hard contact, increasing unnecessary manufacturing costs.

[0004] Therefore, how to avoid the situation where the bare chip of a laser chip cracks is an urgent problem to be solved in this technical field. Summary of the Utility Model

[0005] Aiming at the deficiency that the existing aging screening device powers on the bare chip in a hard contact manner, and the bare chip of the laser chip is brittle and is extremely likely to crack after being squeezed, a bare chip aging screening device is provided, which isolates the hard contact when the bare chip is powered on and avoids the situation where the bare chip of the laser chip cracks.

[0006] In order to achieve the above utility model purpose, the utility model provides the following technical solutions:

[0007] A bare chip aging screening device, including a bottom plate, on which a plurality of aging toolings are arranged in an array, and the aging tooling includes:

[0008] A ceramic substrate, on which a frame-shaped base is detachably connected;

[0009] The positive power supply component is arranged on the ceramic substrate. The positive power supply component is connected to a liquid metal electrode I, and the liquid metal electrode I is located within the frame-shaped base. The liquid metal electrode I is used to provide the positive power supply while protecting the bare chip.

[0010] The negative power supply component is slidably connected to the frame-shaped base. The negative power supply component is connected to a liquid metal electrode II, and the liquid metal electrode II is arranged corresponding to the liquid metal electrode I. The liquid metal electrode II is used to provide the negative power supply while protecting the bare chip.

[0011] As a preferred embodiment, the positive power supply component includes:

[0012] A gold plating layer is coated on the ceramic substrate, and the liquid metal electrode I is connected to the gold plating layer.

[0013] A positive electrode wire, one end of the positive electrode wire is connected to the gold plating layer, and the other end of the positive electrode wire is used to access the positive power supply.

[0014] As a preferred embodiment, the negative power supply component includes:

[0015] A counterweight is slidably connected to the frame-shaped base, and the counterweight is used to vertically apply a downward gravity.

[0016] A metal electrode is connected through the counterweight, and the liquid metal electrode II is connected to the head end of the metal electrode.

[0017] A negative electrode wire, one end of the negative electrode wire is connected to the tail end of the metal electrode, and the other end of the negative electrode wire is used to access the negative power supply.

[0018] As a preferred embodiment, an embedding opening is also formed through the bottom end of the frame-shaped base, and a light-receiving diode is embedded in the embedding opening. The light-receiving diode abuts against the ceramic substrate, and the light-receiving diode is used to receive the light source of the bare chip and feedback it to the monitoring device.

[0019] As a preferred embodiment, the way that the counterweight is slidably connected to the frame-shaped base is:

[0020] A plurality of positioning pins are connected to the frame-shaped base, and a plurality of sliding holes are formed on the counterweight. The sliding holes are slidably connected to the positioning pins.

[0021] As a preferred embodiment, the way that the positioning pins are connected to the frame-shaped base is:

[0022] A positioning groove is formed on the frame-shaped base, the bottom of the positioning pin is arranged in the positioning groove with a clearance fit, and a positioning screw I is also threadedly connected to the frame-shaped base corresponding to the positioning groove, and the end of the positioning screw I abuts against the positioning pin.

[0023] As a preferred embodiment, the metal electrode includes:

[0024] A metal barrel body, the tail end of the metal barrel body is connected to the negative electrode wire, the metal barrel body is connected through the weight block, and a limiting ring is integrally arranged in the metal barrel body;

[0025] A metal terminal, a abutting plate is integrally arranged at the tail of the metal terminal, the abutting plate is arranged in the inner wall of the metal barrel body with a clearance fit, and the abutting plate abuts against the limiting ring after sliding;

[0026] A spring, the spring is arranged in the metal barrel body, one end of the spring abuts against the inner bottom end of the metal barrel body, and the other end of the spring abuts against the abutting plate.

[0027] As a preferred embodiment, the way that the metal barrel body is connected through the weight block is:

[0028] A positioning hole is formed on the weight block, the metal barrel body is arranged in the positioning hole, and a positioning screw II is also threadedly connected to the weight block corresponding to the positioning hole, and the end of the positioning screw II abuts against the outer wall of the metal barrel body.

[0029] As a preferred embodiment, the way that the frame-shaped base is detachably connected to the ceramic substrate is:

[0030] A plurality of high-temperature resistant insulating screws are arranged on the frame-shaped base, and the high-temperature resistant insulating screws are threadedly connected to the ceramic substrate.

[0031] As a preferred embodiment, the bottom plate is made of an aluminum alloy bottom plate.

[0032] By adopting the above technologies, compared with the prior art, the beneficial effects of the present utility model are:

[0033] In the present utility model, the positive electrode of the power supply is connected through the liquid metal electrode I, and at the same time, the lower end of the bare chip is protected. The negative electrode of the power supply is connected through the liquid metal electrode II, and at the same time, the upper end of the bare chip is protected, isolating the hard contact when the bare chip is electrified, and avoiding the occurrence of the situation that the bare chip of the laser chip cracks. Description of the Drawings

[0034] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0035] Figure 1 Structural schematic diagram of the present application;

[0036] Figure 2 Structural schematic diagram of the aging tooling of the present application;

[0037] Figure 3 Exploded view of the aging tooling of the present application;

[0038] Figure 4 Side view of the aging tooling of the present application;

[0039] Figure 5 Top view of the aging tooling of the present application;

[0040] Figure 6 Structural schematic diagram of the metal electrode of the present application; Specific embodiments

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model.

[0042] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this utility model is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0043] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0044] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "arranged", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0045] Embodiment, such as Figures 1-6 as shown in

[0046] A bare chip aging and screening device, comprising a bottom plate 1, on which a plurality of aging toolings 2 are arranged in an array. The aging tooling 2 includes:

[0047] A ceramic substrate 3, on which a frame-shaped base 4 is detachably connected;

[0048] A power supply positive electrode assembly 5, which is arranged on the ceramic substrate 3. The power supply positive electrode assembly 5 is connected with a liquid metal electrode I 6, and the liquid metal electrode I 6 is located inside the frame-shaped base 4. The liquid metal electrode I 6 is used to provide the power supply positive electrode while protecting the bare chip;

[0049] A power supply negative electrode assembly 7, which is slidably connected to the frame-shaped base 4. The power supply negative electrode assembly 7 is connected with a liquid metal electrode II 8, and the liquid metal electrode II 8 is arranged corresponding to the liquid metal electrode I 6. The liquid metal electrode II 8 is used to provide the power supply negative electrode while protecting the bare chip.

[0050] When performing high-temperature aging screening on the bare chip of a laser chip, the bare chip is placed into the frame-shaped base 4. The bare chip is located on the liquid metal electrode I 6. One end of the power input of the bare chip abuts against the liquid metal electrode I 6. The liquid metal electrode I 6 protects the lower end of the bare chip to prevent the lower end of the bare chip from making hard contact with the power positive electrode assembly 5. Subsequently, the power negative electrode assembly 7 is slidably connected to the frame-shaped base 4. After the liquid metal electrode II 8 enters the frame-shaped base 4, it abuts against the other end of the power input of the bare chip. The power negative electrode assembly 7 restricts the movement position of the liquid metal electrode II 8. The liquid metal electrode II 8 protects the upper end of the bare chip to prevent the upper end of the bare chip from making hard contact with the power negative electrode assembly 7. After multiple aging toolings 2 are sequentially placed with bare chips according to the above steps, the power supply is started for high-temperature aging screening. The positive electrode of the power supply is input to the bare chip through the power positive electrode assembly 5 and the liquid metal electrode I 6, and the negative electrode of the power supply is input to the bare chip through the power negative electrode assembly 7 and the liquid metal electrode II 8; in this technical solution, the power positive electrode is connected through the liquid metal electrode I 6 while protecting the lower end of the bare chip, and the power negative electrode is connected through the liquid metal electrode II 8 while protecting the upper end of the bare chip, isolating the hard contact during the energization of the bare chip and avoiding the occurrence of the situation where the bare chip of the laser chip cracks.

[0051] As a preferred implementation, the power positive electrode assembly 5 includes:

[0052] A gold plating layer 51, the gold plating layer 51 is coated on the ceramic substrate 3, and the liquid metal electrode I 6 is connected to the gold plating layer 51;

[0053] A positive electrode wire 52, one end of the positive electrode wire 52 is connected to the gold plating layer 51, and the other end of the positive electrode wire 52 is used to connect to the power positive electrode.

[0054] The ceramic substrate 3 has high thermal conductivity and insulation performance. The gold plating layer 51 is coated on the ceramic substrate 3, and the positive electrode wire 52 is connected to the gold plating layer 51. After the positive electrode wire 52 is connected to the power positive electrode, it can be transmitted to the liquid metal electrode I 6 through the gold plating layer 51, and then transmitted from the liquid metal electrode I 6 to the bare chip of the laser chip. The ceramic substrate 3 can conduct heat dissipation while avoiding electric leakage, preventing the temperature in the frame-shaped base 4 from being too high.

[0055] As a preferred implementation, the power negative electrode assembly 7 includes:

[0056] A counterweight 71, the counterweight 71 is slidably connected to the frame-shaped base 4, and the counterweight 71 is used to apply a vertical downward gravity;

[0057] A metal electrode 72, the metal electrode 72 is connected through and on the counterweight 71, and the liquid metal electrode II 8 is connected to the head end of the metal electrode 72;

[0058] A negative electrode wire 73, one end of the negative electrode wire 73 is connected to the tail end of the metal electrode 72, and the other end of the negative electrode wire 73 is used to access the negative pole of the power supply.

[0059] When the liquid metal electrode II 8 contacts the upper end of the bare chip, a slight downward gravity needs to be applied to the liquid metal electrode II 8 to ensure that the liquid metal electrode II 8 is in close contact with the upper end of the bare chip for the negative input of a stable power supply; therefore, the counterweight 71 is slidably connected to the frame-shaped base 4, and the metal electrode 72 is connected through and on the counterweight 71. After the counterweight 71 is slidably connected to the frame-shaped base 4, the counterweight 71 vertically applies a downward gravity, driving the metal electrode 72 to apply a slight downward gravity, so that the liquid metal electrode II 8 is in close contact with the upper end of the bare chip, thereby ensuring that the negative pole of the power supply can be stably input to the bare chip after flowing through the negative electrode wire 73, the metal electrode 72, and the liquid metal electrode II 8.

[0060] As a preferred embodiment, an embedding opening 43 is also penetrated and opened at the bottom end of the frame-shaped base 4, a light-receiving diode 44 is fitted in the embedding opening 43, the light-receiving diode 44 abuts against the ceramic substrate 3, and the light-receiving diode 44 is used to receive the light source of the bare chip and feedback it to the monitoring device.

[0061] The bare chip of the laser chip will generate a light source after being powered on. Monitoring the light source state of the bare chip can know the real-time state of the bare chip of the laser chip during high-temperature aging, so as to facilitate accurate and efficient screening by the staff; therefore, an embedding opening 43 is penetrated and opened at the bottom end of the frame-shaped base 4, and the light-receiving diode 44 is fitted in the embedding opening 43. After the negative power supply component 7 is connected to the frame-shaped base 4, the top end of the frame-shaped base 4 is closed, so that the bare chip of the laser chip is in a closed space. The light-receiving diode 44 receives the light source generated by the bare chip in the embedding opening 43, and the light-receiving diode 44 feeds back the light source of the bare chip to the monitoring device, and the monitoring device monitors the light source state of the bare chip to know the real-time state of the bare chip of the laser chip during high-temperature aging.

[0062] As a preferred embodiment, the way that the counterweight 71 is slidably connected to the frame-shaped base 4 is:

[0063] A plurality of positioning pins 41 are connected to the frame-shaped base 4, a plurality of sliding holes are opened on the counterweight 71, and the sliding holes are slidably connected to the positioning pins 41.

[0064] The connection between the counterweight 71 and the frame-shaped base 4 needs to ensure that the counterweight 71 slides vertically downward to ensure that the liquid metal electrode II 8 applies uniform pressure to the upper end of the bare chip. Therefore, a plurality of positioning pins 41 are connected to the frame-shaped base 4. The counterweight 71 is slidably connected to the positioning pins 41 through sliding holes, and the deflection of the counterweight 71 is restricted by the plurality of positioning pins 41, so as to ensure that the counterweight 71 can slide vertically downward.

[0065] As a preferred embodiment, the manner in which the positioning pins 41 are connected to the frame-shaped base 4 is as follows:

[0066] A positioning groove is provided on the frame-shaped base 4. The bottom of the positioning pin 41 is provided with a clearance fit in the positioning groove. A positioning screw I 42 is also threadedly connected to the frame-shaped base 4 corresponding to the positioning groove, and the end of the positioning screw I 42 abuts against the positioning pin 41.

[0067] When the specifications of the bare chip of the laser chip change, the specifications of the counterweight 71 also need to be synchronously replaced. When the counterweight 71 is replaced, the positioning pins 41 of the corresponding length need to be replaced. Therefore, a positioning groove is provided on the frame-shaped base 4. The bottom of the positioning pin 41 is provided with a clearance fit in the positioning groove, and the positioning pin 41 is clamped in the positioning groove by the abutment of the positioning screw I 42 against the positioning pin 41, which ensures the connection strength of the positioning pin 41 and is convenient for disassembly and replacement.

[0068] As a preferred embodiment, the metal electrode 72 includes:

[0069] A metal barrel 721, the tail end of the metal barrel 721 is connected to the negative wire 73, the metal barrel 721 is connected through the counterweight 71, and a limiting ring 722 is integrally provided in the metal barrel 721;

[0070] A metal terminal 723, a abutment plate 724 is integrally provided at the tail of the metal terminal 723, the abutment plate 724 has a clearance fit with the inner wall of the metal barrel 721, and the abutment plate 724 abuts against the limiting ring 722 after sliding;

[0071] A spring 725 is arranged in the metal barrel 721, one end of the spring 725 abuts against the inner bottom end of the metal barrel 721, and the other end of the spring 725 abuts against the abutment plate 724.

[0072] When the pressure applied by the counterweight 71 is too large, the metal electrode 72 is pushed by the counterweight 71, and there is a situation where the metal electrode 72 excessively squeezes the liquid metal electrode II 8 and then makes hard contact with the bare chip of the laser chip. Therefore, the metal terminal 723 is slidably arranged in the metal barrel 721, and a spring 725 is arranged between the metal terminal 723 and the metal barrel 721. When the pressure applied by the counterweight 71 is too large, the metal terminal 723 is subjected to the reverse acting force of the liquid metal electrode II 8, and the metal terminal 723 pushes the spring 725 to contract in the metal barrel 721, thereby avoiding the situation where the metal electrode 72 excessively squeezes the liquid metal electrode II 8 and then makes hard contact with the bare chip of the laser chip. The limiting ring 722 cooperates with the abutting plate 724 to prevent the metal terminal 723 from detaching from the metal barrel 721. The clearance fit between the abutting plate 724 and the inner wall of the metal barrel 721, as well as the spring 725 with the metal terminal 723 and the metal barrel 721, can ensure the electrical conductivity of the metal electrode 72.

[0073] As a preferred implementation, the way that the metal barrel 721 is connected through the counterweight 71 is as follows:

[0074] A positioning hole 711 is opened on the counterweight 71, the metal barrel 721 is inserted into the positioning hole 711, and a positioning screw II 712 is also threadedly connected to the counterweight 71 corresponding to the positioning hole 711. The end of the positioning screw II 712 abuts against the outer wall of the metal barrel 721.

[0075] When the specifications of the bare chip of the laser chip change, the specifications of the counterweight 71 also need to be synchronously replaced. When replacing the counterweight 71, the metal barrel 721 needs to be replaced onto the replaced counterweight 71. Therefore, a positioning hole 711 is opened on the counterweight 71, the metal barrel 721 is inserted into the positioning hole 711, and the metal barrel 721 is limited and fixed on the counterweight 71 by the end of the positioning screw II 712 abutting against the outer wall of the metal barrel 721, which ensures the connection strength of the metal barrel 721 and is convenient for disassembly and replacement.

[0076] As a preferred implementation, the way that the frame-shaped base 4 is detachably connected to the ceramic substrate 3 is as follows:

[0077] A plurality of high-temperature resistant insulating screws 45 are inserted through the frame-shaped base 4, and the high-temperature resistant insulating screws 45 are threadedly connected to the ceramic substrate 3.

[0078] By connecting the frame-shaped base 4 to the ceramic substrate 3 through a plurality of high-temperature resistant insulating screws 45, after the high-temperature resistant insulating screws 45 come into contact with the gold plating layer 51, they will not conduct electricity, avoiding the occurrence of electric leakage. And the high-temperature resistant insulating screws 45 can withstand a relatively high temperature and will not deform in a high-temperature environment, thereby ensuring the connection stability of the frame-shaped base 4 connected to the ceramic substrate 3.

[0079] As a preferred embodiment, the bottom plate 1 is provided as an aluminum alloy bottom plate. Through the aluminum alloy bottom plate, the heat conducted by the ceramic substrate 3 can be further heat-conducted and then dissipated, improving the heat dissipation efficiency.

[0080] The above are only the preferred embodiments of the utility model and are not used to limit the technical solutions of the utility model. For those skilled in the art, various changes and modifications can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the technical solutions of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A bare chip aging screening device, comprising a base plate, on which a plurality of aging devices are arranged in an array, characterized in that: The old chemical equipment includes: A ceramic substrate, to which a frame-shaped base is detachably connected; A positive power supply assembly, the positive power supply assembly is arranged on the ceramic substrate, the positive power supply assembly is connected with a liquid metal electrode I, the liquid metal electrode I is located in the frame-shaped base, and the liquid metal electrode I is used to provide a positive power supply while protecting the bare chip; A negative power supply assembly is slidably connected to the frame-shaped base, and is connected to a liquid metal electrode II. The liquid metal electrode II is arranged corresponding to the liquid metal electrode I, and the liquid metal electrode II is used to provide a negative power supply while protecting the bare chip.

2. The bare chip aging screening device according to claim 1, characterized in that: The power positive electrode assembly comprises: A gold-plated layer, the gold-plated layer is coated on the ceramic substrate, and the liquid metal electrode I is connected to the gold-plated layer; A positive wire, one end of which is connected to the gold-plated layer, and the other end of which is used to connect to the positive electrode of a power source.

3. The bare chip aging screening device according to claim 1, characterized in that: The negative electrode component of the power supply comprises: A counterweight block, the counterweight block is slidably connected to the frame-shaped base, and the counterweight block is used to apply gravity vertically downward; A metal electrode, the metal electrode is connected to the counterweight through-hole, and the liquid metal electrode II is connected to the head end of the metal electrode; A negative electrode wire, one end of which is connected to the tail end of the metal electrode, and the other end of which is used to connect to the negative electrode of the power supply.

4. The bare chip aging screening device according to claim 1, characterized in that: The bottom end of the frame-shaped base is also provided with an inlay opening, in which a light-receiving diode is embedded. The light-receiving diode abuts against the ceramic substrate, and is used to receive the light source of the bare chip and feed it back to the monitoring device.

5. The bare chip aging screening device according to claim 3, characterized in that: The counterweight block is slidably connected to the frame-shaped base in the following manner: The frame-shaped base is connected with a plurality of positioning pins, the counterweight block is provided with a plurality of sliding holes, and the sliding holes are slidably connected with the positioning pins.

6. The bare chip aging screening device according to claim 5, characterized in that: The frame-shaped base is connected with a positioning pin in the following manner: The frame-shaped base is provided with a positioning groove, and the bottom clearance of the positioning pin is arranged in the positioning groove. The frame-shaped base is also threadedly connected with a positioning screw I corresponding to the positioning groove, and the end of the positioning screw I abuts against the positioning pin.

7. The bare chip aging screening device according to claim 3, characterized in that: The metal electrode comprises: A metal barrel body, wherein the tail end of the metal barrel body is connected to the negative electrode wire, the metal barrel body is connected to the counterweight through-through, and a limiting ring is integrally provided in the metal barrel body; A metal terminal, wherein a backing plate is integrally provided at the tail of the metal terminal, the backing plate is clearance-matched with the inner wall of the metal barrel, and the backing plate abuts against the limit ring after sliding; A spring is inserted into the metal barrel body, one end of the spring abuts against the inner bottom end of the metal barrel body, and the other end of the spring abuts against the abutting plate.

8. The bare chip aging screening device according to claim 7, characterized in that: The metal barrel is connected to the counterweight block in the following manner: The counterweight block is provided with a positioning hole, the metal barrel body is inserted into the positioning hole, and the counterweight block is also threadedly connected with a positioning screw II corresponding to the positioning hole, and the end of the positioning screw II abuts against the outer wall of the metal barrel body.

9. The bare chip aging screening device according to claim 1, characterized in that: The ceramic substrate is detachably connected to a frame-shaped base in the following manner: The frame-shaped base is provided with a plurality of high-temperature resistant insulating screws, and the high-temperature resistant insulating screws are threadedly connected with the ceramic substrate.

10. The bare chip aging screening device according to claim 1, characterized in that: The bottom plate is configured as an aluminum alloy bottom plate.

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