Conductive adhesive layer structure of ceramic core body

Abstract

The utility model discloses a conductive adhesive layer structure of a ceramic core body, the ceramic core body comprises a thin sheet and a thick sheet which are separated by a gap, a gold layer is arranged on one surface, facing the thick sheet, of the thin sheet, a sealing adhesive layer is arranged between the thin sheet and the thick sheet, and the sealing adhesive layer is enclosed outside the gold layer; the thick sheet is provided with a through pin hole, and the hole bottom of the pin hole is opposite to the gold layer. The pin holes are filled with conductive adhesive. From the bottom to the top of the pin hole, the conductive adhesive is divided into a bottom filling adhesive layer and a plurality of height filling adhesive layers which are formed layer by layer; the bottom glue filling layer is formed by flowing and gathering a plurality of glue points, and the glue points in the bottom glue filling layer flow and seep to fill a gap between the gold layer and the thick sheet; the bottom filling glue layer and the height filling glue layer are formed by flowing and gathering sprayed glue points, and the spraying speed of the glue points forming the bottom filling glue layer is larger than that of the glue points forming the height filling glue layer. According to the utility model, the conductive adhesive layer is not easy to break.

Description

Technical Field

[0001] The utility model relates to the technical field of ceramic cores, in particular to a conductive adhesive layer structure of a ceramic core. Background Art

[0002] As shown in the appendix Figure 2 In the existing ceramic core, the conductive adhesive is filled in the pin holes to connect the thin gold layer and the pins to achieve the conduction function. The conductive adhesive contains solid conductive media, has a high viscosity and extremely poor fluidity. There are two problems with the dispensing of the traditional screw valve dispensing system. One is that the conductive adhesive cannot flow to the bottom to connect with the gold layer after the screw valve dispenses, which easily leads to a connection open circuit; the other is that there are many air bubbles after the screw valve dispenses, which easily causes an open circuit. In view of the above problems, the conductive adhesive layer structure of the existing ceramic core is improved. Summary of the Invention

[0003] Object of the Invention: In order to overcome the deficiencies in the prior art, the utility model provides a conductive adhesive layer structure of a ceramic core, which can prevent the conductive adhesive layer from easily generating an open circuit.

[0004] Technical Solution: To achieve the above object, a conductive adhesive layer structure of a ceramic core of the utility model, the ceramic core includes a thin sheet and a thick sheet separated by a gap. One side of the thin sheet facing the thick sheet has a gold layer. There is a sealing adhesive layer between the thin sheet and the thick sheet, and the sealing adhesive layer surrounds the gold layer. The thick sheet has a through pin hole, and the bottom of the pin hole faces the gold layer. The pin hole is filled with a conductive adhesive. From the bottom to the top of the pin hole, the conductive adhesive is divided into a bottom filling adhesive layer and several height filling adhesive layers formed layer by layer. The bottom filling adhesive layer is formed by the flow and convergence of several adhesive dots, and the adhesive dots in the bottom filling adhesive layer seep and fill the gap between the gold layer and the thick sheet.

[0005] Further, the boundary position between the bottom filling adhesive layer and the height filling adhesive layer is higher than one side of the thick sheet facing the thin sheet.

[0006] Further, the height filling adhesive layer is also formed by the flow and convergence of several adhesive dots.

[0007] Further, when there is no pin inserted in the pin hole, the topmost height filling adhesive layer is lower than one side of the thick sheet facing away from the thin sheet.

[0008] Further, both the bottom filling adhesive layer and the height filling adhesive layer are formed by the flow and convergence of the ejected adhesive dots, and the ejection speed of the adhesive dots forming the bottom filling adhesive layer is greater than the ejection speed of the adhesive dots forming the height filling adhesive layer.

[0009] Further, the conductive adhesive is epoxy conductive silver adhesive.

[0010] Beneficial effects: In the conductive adhesive layer structure of a ceramic core of the present utility model, the conductive adhesive of the ceramic core is divided into multiple layers, and each layer of conductive adhesive is formed separately. Moreover, the conductive adhesive is formed by the flow and convergence of ejected glue dots, enabling the conductive adhesive to flow and infiltrate to fill the gap between the gold layer and the thick sheet, and it is not easy to generate air bubbles in the conductive adhesive, thereby making it not easy for the conductive adhesive layer in the ceramic core to generate open circuits. Description of the Drawings

[0011] Att Figure 1 is a schematic structural diagram of the conductive adhesive layer of the present utility model;

[0012] Att Figure 2 is a schematic diagram of the conductive adhesive in an existing ceramic core. Detailed Embodiment

[0013] The present utility model will be further described below with reference to the accompanying drawings.

[0014] As in Att Figures 1 to 2 In the conductive adhesive layer structure of a ceramic core, the ceramic core includes a thin sheet 1 and a thick sheet 2. Both the thin sheet 1 and the thick sheet 2 are made of ceramic material, and the thin sheet 1 and the thick sheet 2 are parallel to each other and spaced apart. A gold layer 3 is coated on one side of the thin sheet 1 facing the thick sheet 2, and there is a gap between the gold layer 3 and the thick sheet 2. There is a sealing adhesive layer 4 between the thin sheet 1 and the thick sheet 2, and the sealing adhesive layer 4 surrounds the gold layer 3. In one embodiment, the sealing adhesive layer 4 is a sealing glass glue.

[0015] A pin hole 5 is provided on the thick sheet 2. The pin hole 5 vertically penetrates the thick sheet 2, and the bottom of the pin hole 5 faces the gold layer 3 on the thin sheet 1. A conductive adhesive 6 is filled in the pin hole 5. After inserting a pin into the pin hole 5, the pin is connected to the gold layer 3 through the conductive adhesive 6.

[0016] In the present utility model, from the bottom to the top of the pin hole 5, the conductive adhesive 6 is divided into a bottom filling adhesive layer 7 and several height filling adhesive layers 8 formed layer by layer. The bottom filling adhesive layer 7 correspondingly fills the bottom of the pin hole 5, and the height filling adhesive layers 8 can fill up the bottom filling adhesive layer 7. The bottom filling adhesive layer 7 is formed by the flow and convergence of several glue dots, so that the bottom filling adhesive layer 7 has better fluidity during the forming process, enabling the glue dots in the bottom filling adhesive layer 7 to flow and infiltrate to fill the gap between the gold layer 3 and the thick sheet 2, thereby covering the surface of the gold layer 3 and strengthening the connection performance between the conductive adhesive 6 and the gold layer 3, and it is not easy to generate open circuit phenomena. In addition, since the conductive adhesive 6 is divided into multiple layers and formed layer by layer instead of filling the pin hole 5 with conductive adhesive 6 at one time, the thickness of the bottom filling adhesive layer 7 is relatively thin, which also helps the glue dots in the bottom filling adhesive layer 7 to flow to between the gold layer 3 and the thick sheet 2.

[0017] As in Att Figure 1As shown, the demarcation position between the bottom filling glue layer 7 and the height filling glue layer 8 is higher than the side of the thick sheet 2 facing the thin sheet 1, so as to ensure that the bottom filling glue layer 7 has enough glue to fill the gap between the gold layer 3 and the thick sheet 2.

[0018] The height filling glue layer 8 is also formed by the flow and convergence of several glue dots, so that the height filling glue layer 8 also has good fluidity and it is not easy to generate air bubbles inside the height filling glue layer 8.

[0019] As shown in the appendix Figure 1 As shown, when there is no pin inserted in the pin hole 5, the topmost height filling glue layer 8 is lower than the side of the thick sheet 2 facing away from the thin sheet 1. Thus, when a pin is inserted into the pin hole 5, the conductive glue 6 is not easy to overflow from the pin hole 5.

[0020] Both the bottom filling glue layer 7 and the height filling glue layer 8 are formed by the flow and convergence of ejected glue dots. The ejected glue dots have a higher initial velocity. The higher the initial velocity of the glue dots, the better the fluidity, and it is easier to cover the surface of the gold layer 3 and reduce the generation of air bubbles.

[0021] The ejection speed of the glue dots forming the bottom filling glue layer 7 is greater than that of the glue dots forming the height filling glue layer 8. The greater ejection speed of the glue dots forming the bottom filling glue layer 7 makes it easier to fill the gap between the gold layer 3 and the thick sheet 2. The smaller ejection speed of the glue dots forming the height filling glue layer 8 makes it not easy for the glue dots to splash out from the pin hole 5.

[0022] The conductive glue 6 is epoxy conductive silver glue. A forming method of the conductive glue layer structure of the present utility model is as follows: A high-speed injection valve is used to implement the dispensing process. The maximum working frequency of the injection dispensing is 1000 times / s, and the minimum injection dot diameter is 0.2 mm. The injection dispensing process is as follows:

[0023] The first step: Preset the weight of the glue dots, and preset the first injection position, the second injection position, and the third injection position from bottom to top according to the injection valve pressure, frequency, and injection measurement;

[0024] The second step: The injection nozzle 9 reaches the first injection position, and then 100 epoxy conductive silver glue dots are ejected at a frequency of 1000 HZ to form the bottom filling glue layer 7, so that the epoxy conductive silver glue covers the surface of the gold layer 3;

[0025] The third step: 0.5 s after the second step is completed, the nozzle 9 is automatically lifted to the second injection position, and then 200 epoxy conductive silver glue dots are ejected at a frequency of 500 HZ to form the first layer of height filling glue layer 8. The first layer of height filling glue layer 8 is connected to the bottom filling glue layer 7 through gravity fluidity;

[0026] Step 4: 0.5 s after the completion of the third step, automatically raise the nozzle 9 to a position higher than the top plane of the ceramic core, and then spray 200 points of epoxy conductive silver glue at a frequency of 500 HZ to form the second heightening glue layer 8. The second heightening glue layer 8 is connected to the first heightening glue layer 8 at the bottom through gravitational fluidity, and the second heightening glue layer 8 roughly fills the entire pin hole 5.

[0027] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A conductive adhesive layer structure of a ceramic core, characterized in that: The ceramic core comprises a thin sheet (1) and a thick sheet (2) separated by a gap, a gold layer (3) is provided on the thin sheet (1) on a side facing the thick sheet (2), a sealing layer (4) is provided between the thin sheet (1) and the thick sheet (2), and the sealing layer (4) is enclosed outside the gold layer (3); a through pin hole (5) is provided on the thick sheet (2), and the bottom of the pin hole (5) is opposite to the gold layer (3); The pin hole (5) is filled with conductive glue (6); from the bottom to the top of the pin hole (5), the conductive glue (6) is divided into a bottom-filling glue layer (7) and a plurality of height-filling glue layers (8) formed layer by layer; the bottom-filling glue layer (7) is formed by the flow of a plurality of glue points, and the glue points in the bottom-filling glue layer (7) flow and infiltrate to fill the gap between the gold layer (3) and the thick sheet (2).

2. The conductive adhesive layer structure of a ceramic core according to claim 1, characterized in that: The boundary position between the bottom filling adhesive layer (7) and the height filling adhesive layer (8) is higher than the side of the thick sheet (2) facing the thin sheet (1).

3. The conductive adhesive layer structure of a ceramic core according to claim 1, characterized in that: The filling glue layer (8) is also formed by the flow and convergence of a number of glue points.

4. The conductive adhesive layer structure of a ceramic core according to claim 3, characterized in that: When no pin is inserted into the pin insertion hole (5), the topmost filling glue layer (8) is lower than the side of the thick sheet (2) facing away from the thin sheet (1).

5. The conductive adhesive layer structure of a ceramic core according to claim 4, characterized in that: The bottom filling glue layer (7) and the height filling glue layer (8) are both formed by the flow of sprayed glue dots, and the spraying speed of the glue dots forming the bottom filling glue layer (7) is greater than the spraying speed of the glue dots forming the height filling glue layer (8).

6. The conductive adhesive layer structure of a ceramic core according to claim 1, characterized in that: The conductive glue (6) is epoxy conductive silver glue.

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