Miniature laser integrated module
By designing a small laser integrated module and using a combination of integrated blocks and circuit boards, the existing hydrothermal laser equipment has been solved, miniaturized and simplified in structure, and reduced costs and maintenance difficulties.
Patent Information
- Application Number
- CN202422089189.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-08-27
AI Technical Summary
The existing hydrophone laser equipment is huge in size and complex in structure, which makes it difficult to miniaturize the equipment, high manufacturing and assembly costs, and difficult to maintain and repair.
By designing a small laser integrated module, the combination of integrated block, upper circuit board and lower circuit board is adopted to reduce the separation between functional modules, optimize the optical path design and arrangement of optical components, integrate lasers and circuit boards, and reduce external wiring requirements.
The miniaturization of hydro-audit lasers is achieved, which significantly reduces the equipment volume, simplifies structural design, reduces manufacturing and assembly complexity, improves the convenience of maintenance and repair, and reduces maintenance and production costs.
Smart Images

Figure CN222953521U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of lasers, and in particular to a small laser integrated module. Background Art
[0002] Most of the hydrophone laser devices currently on the market are large in size and complex in structure. Their design usually includes multiple large-sized optical components and lengthy optical paths, which makes it difficult to reduce the overall size of the device. The various functional modules in the prior art (such as optical modules, electronic control modules, and heat dissipation modules) are usually designed separately. For example, the application with publication number CN118198849A discloses a multi-channel integrated packaging structure of a semiconductor laser. This design method requires more space when the device is integrated, which affects the miniaturization of the device. The commonly used internal structure of the hydrophone is designed to place the lasers opposite to each other to facilitate fiber arrangement, and the distance between the pump lasers is far to facilitate heat dissipation. The high manufacturing and assembly costs lead to an increase in the overall cost of the equipment. The equipment has a complex structure and is difficult to maintain and repair, which increases maintenance costs and time. There is currently a lack of a smaller laser integrated module. Utility Model Content
[0003] The purpose of the utility model is to provide a small laser integrated module, which can realize the miniaturization of the hydrophone laser, significantly reduce the volume of the device, and make it more suitable for occasions with limited space, such as portable devices and submersibles.
[0004] The utility model is realized by the following technical solutions:
[0005] A small laser integrated module includes a housing, a laser is arranged in the housing, a sealing plate is arranged on the housing, an integrated block and a fixing column are arranged on the housing, a placement groove is arranged on the integrated block, a laser is arranged in the placement groove, and a cover plate is arranged above the placement groove; an upper circuit board and a lower circuit board are arranged on the fixing column, the tail of the laser is connected to the lower circuit board, and the upper circuit board cover is arranged on the lower circuit board. Integrating the laser and circuit board components in one module reduces the need for external wiring and improves the compactness of the overall system.
[0006] Furthermore, an opening is provided in the middle portion of the upper circuit board and the lower circuit board, and the limiting block is arranged in the opening.
[0007] Furthermore, the manifold block includes a plurality of limit blocks, which are arranged in an interlaced manner, and are provided with positioning holes and placement slots, which are through-through, and the cover plate is connected to the positioning holes by screws. The placement slots are provided with laser head openings and laser tail openings, the head openings are all facing the inside of the manifold block, and the tail openings are all facing the outside of the manifold block, making the overall structure more compact.
[0008] Furthermore, the fixing column is provided with a threaded hole, and the upper circuit board and the lower circuit board are supported and fixed by studs, and the studs are connected and locked by passing through the threaded holes on the fixing column of the lower circuit board; the upper circuit board is locked with the studs by bolts.
[0009] Furthermore, a thermally conductive pad is provided in the placement groove, and the thermally conductive pad in the placement groove can effectively conduct the heat generated by the laser to the outside, which helps to improve the working stability of the laser and extend the service life.
[0010] Furthermore, an electrical connector is provided between the upper circuit board and the lower circuit board.
[0011] Furthermore, the integrated block, housing and cover plate are all made of aluminum, which is a lightweight material to reduce the overall weight of the equipment.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] The utility model adopts the mode of cooperation of integrated block, upper circuit board and lower circuit board, reduces the separation between various functional modules, significantly improves the space utilization efficiency, optimizes the optical path design and the arrangement of optical elements, and makes the overall structure more compact. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a structural schematic diagram of the utility model;
[0015] Figure 2 It is a structural schematic diagram of an upper circuit board and a lower circuit board of the utility model.
[0016] In the figure: 1. integrated block; 2. housing; 3. cover plate; 4. sealing plate; 5. electrical connector; 6. upper circuit board; 7. lower circuit board; 8. fixing column. DETAILED DESCRIPTION
[0017] In order to enable those skilled in the art to better understand the technical solution of the present invention, the following is a clear and complete description of the technical solution of the present invention in conjunction with the drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by ordinary technicians in this field without creative work should all fall within the scope of protection of this application. In addition, the directional words mentioned in the following embodiments, such as "up", "down", "left" and "right", are only reference to the directions of the drawings. Therefore, the directional words used are used to illustrate rather than limit the creation of the present invention.
[0018] The utility model is further described below in conjunction with the accompanying drawings.
[0019] Embodiment 1: A small laser integrated module, such as Figure 1 and Figure 2As shown, it includes a housing 2, a laser is arranged in the housing 2, a sealing plate 4 is arranged on the housing 2, an integrated block 1 and four fixing columns 8 are arranged on the housing 2, a placement groove is arranged on the integrated block 1, a laser is arranged in the placement groove, a cover plate 3 is arranged above the placement groove, the placement groove is arranged to facilitate heat dissipation and avoid signal interference between lasers, and is used to fix the laser, the tail of the laser is connected to the lower circuit board 7, and the upper circuit board 6 is covered on the lower circuit board 7; the four corners of the bottom shell are provided with through holes with a diameter of 2.4mm. Integrating the laser and circuit board components in one module reduces the need for external wiring and improves the compactness of the overall system.
[0020] Embodiment 2: A small laser integrated module, wherein the middle part of the upper circuit board 6 and the lower circuit board 7 is provided with an opening, and the limit block is arranged in the opening; the integrated block 1 includes four limit blocks, which are arranged in an interlaced manner and are formed in one piece, and the limit blocks are provided with positioning holes and placement slots, the placement slots are through-through, and the cover plate 3 is connected to the positioning holes by screws. The placement slot is provided with a laser head opening and a laser tail opening, the head openings are both facing the inside of the integrated block 1, and the tail openings are both facing the outside of the integrated block 1; the fixing column 8 is provided with a threaded hole, and the upper circuit board 6 and the lower circuit board 7 are supported and fixed by a stud, and the stud is connected and locked by passing through the threaded hole on the lower circuit board 7 and the fixing column 8; the upper circuit board 6 is locked with the stud by bolts; the placement slot is provided with a thermal conductive pad, and the thermal conductive pad in the placement slot can effectively conduct the heat generated by the laser to the outside, which helps to improve the working stability of the laser and extend the service life. An electrical connector 5 and a fiber outlet are provided between the upper circuit board 6 and the lower circuit board 7. The integrated block 1, the housing 2 and the cover plate 3 are all made of aluminum, which is a lightweight material to reduce the overall weight of the device. The rest is the same as in the first embodiment.
[0021] The present application adjusts the position of the pump laser based on the common hydrophone laser structure, from being dispersed in the four corners to being concentrated in the middle. Since the pump laser has no fixing hole as a whole, the limiters in the four directions of front, back, left and right are set at the corresponding positions of the housing 2. The limit blocks on the left and right sides of the pump laser are raised to be flush with the pump laser, so that the heat generated by the pump laser during operation is conveniently conducted to the bottom surface of the housing 2. At the same time, each pump laser is separated to form an independent space, and the design block is connected to the housing 2 to fix the pump laser. The circuit board is divided into two layers, the upper circuit board 6 and the lower circuit board 7 are connected in the middle by an electrical connector 5. There is no device on the front of the lower circuit board 7, which is convenient for optical fiber coiling. A heat sink is set on the housing 2, and the heat sink is set just below the heating device on the lower circuit board 7 to transfer heat to the bottom surface of the housing 2. The upper circuit board 6 has no heating device and is fixed to the lower circuit board by glue, which compresses part of the space in height.
[0022] Compared with the existing technical solutions, the hydrophone laser of the present application is simpler in structural design, reducing the complexity of manufacturing and assembly. The simplified structure makes it easier to maintain and repair the equipment, reducing maintenance costs and time, and further reducing production costs.
[0023] The present invention has been described in detail above. The above description is only a preferred embodiment of the present invention and should not limit the scope of implementation of the present invention. That is, all changes and modifications made within the scope of this application should still fall within the scope of the present invention.
Claims
1. A small laser integrated module, comprising a housing (2), a laser arranged in the housing (2), and a sealing plate (4) arranged on the housing (2), characterized in that: The housing (2) is provided with an integrated block (1) and a fixing column (8); the integrated block (1) is provided with a placement groove, a laser is provided in the placement groove, and a cover plate (3) is provided above the placement groove; an upper circuit board (6) and a lower circuit board (7) are provided on the fixing column (8), the tail of the laser is connected to the lower circuit board (7), and the upper circuit board (6) is covered on the lower circuit board (7).
2. The small laser integrated module according to claim 1, characterized in that: The integrated block (1) comprises a plurality of limit blocks, which are arranged in a staggered manner. The limit blocks are provided with positioning holes and placement grooves, which are through-connected from top to bottom. The cover plate (3) is connected to the positioning holes by screws.
3. The small laser integrated module according to claim 2, characterized in that: The middle parts of the upper circuit board (6) and the lower circuit board (7) are provided with openings, and the limit blocks are arranged in the openings.
4. The small laser integrated module according to claim 1, characterized in that: The fixing column (8) is provided with a threaded hole, and the upper circuit board (6) and the lower circuit board (7) are supported and fixed by a stud, and the stud passes through the threaded hole on the lower circuit board (7) and is connected and locked with the fixing column (8); the upper circuit board (6) is locked with the stud by a bolt.
5. The small laser integrated module according to claim 1, characterized in that: A heat-conducting pad is arranged in the placement groove.
6. The small laser integrated module according to claim 1, characterized in that: An electrical connector (5) is provided between the upper circuit board (6) and the lower circuit board (7).
7. The small laser integrated module according to claim 1, characterized in that: The integrated block (1), the housing (2) and the cover plate (3) are all made of aluminum.
Citation Information
Patent Citations
Semiconductor laser multi-path integrated packaging structure
CN118198849A