Aluminum substrate beneficial to heat dissipation
By setting multiple heat dissipation components at the bottom of the aluminum substrate and optimizing the base layer and through-hole design, the high temperature problem caused by the small heat dissipation area of the aluminum substrate is solved, achieving more efficient heat dissipation effects and more stable operation of electronic components.
Patent Information
- Application Number
- CN202421805287.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-07-29
AI Technical Summary
The heat dissipation of aluminum substrates mainly depends on natural convection and radiation, and the heat dissipation area is small, so it is impossible to effectively dissipate heat quickly, resulting in too high component temperature in high power electronic components.
A plurality of heat dissipation components are arranged at the bottom of the aluminum substrate, including a vertical plate, a first heat dissipation plate and a second heat dissipation plate, forming a multi-faceted heat dissipation structure, increasing the air contact area, and promoting air circulation and water-cooled heat dissipation through the base layer and through-hole design.
It significantly increases the effective surface area for heat dissipation, improves heat dissipation efficiency, avoids local overheating, and ensures the stable operation of electronic components in high temperature environments.
Smart Images
Figure CN222954166U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of aluminum substrates, in particular to an aluminum substrate which is conducive to heat dissipation. Background Art
[0002] As electronic devices develop towards miniaturization and high performance, the electronic components and power density on printed circuit boards have increased significantly, resulting in an increase in heat generation. In order to ensure that electronic devices can operate stably and reliably, effective thermal management becomes crucial. Among the many thermal management solutions, aluminum substrates are widely used in high-power electronic components due to their good thermal conductivity and relatively low cost.
[0003] Aluminum substrates usually have smooth surfaces, and heat dissipation mainly relies on natural convection and radiation. The heat dissipation area is small and cannot effectively dissipate heat quickly. Therefore, in high-power electronic components, when the heat generated exceeds a certain threshold, the heat dissipation capacity of the aluminum substrate itself is often not enough to dissipate the heat in time, resulting in excessive component temperature, affecting its performance and life. Utility Model Content
[0004] The problem solved by the utility model is that the heat dissipation of the aluminum substrate usually relies mainly on natural convection and radiation, the heat dissipation area is small, and the heat cannot be effectively dissipated quickly. In high-power electronic components, when the heat generated exceeds a certain threshold, the heat dissipation capacity of the aluminum substrate itself is often not enough to dissipate the heat in time, resulting in excessive component temperature.
[0005] In order to solve the above problems, the utility model provides an aluminum substrate that is conducive to heat dissipation, including an aluminum substrate, a base layer and a heat dissipation component; the base layer is arranged at the top of the aluminum substrate, and a plurality of the heat dissipation components are evenly arrayed at the bottom of the aluminum substrate; each of the heat dissipation components includes a vertical plate, a first heat dissipation plate and a second heat dissipation plate; the bottom of the vertical plate is fixedly connected to the bottom of the aluminum substrate, two first heat dissipation plates are respectively arranged on both sides of the vertical plate, and the bottom of the second heat dissipation plate is fixedly connected to the top of the vertical plate.
[0006] Preferably, the base layer includes an insulating layer, a copper foil layer and an anti-etching agent layer; the insulating layer is arranged on the top of the aluminum substrate, the copper foil layer is arranged on the top of the insulating layer, and the anti-etching agent layer is arranged on the top of the copper foil layer.
[0007] Preferably, each of the heat dissipation components further includes a semicircular groove, and a plurality of the semicircular grooves are respectively opened on one side of each of the second heat dissipation plates.
[0008] Preferably, the vertical plate, the first heat sink and the second heat sink are respectively made of aluminum.
[0009] Preferably, the aluminum substrate comprises a mounting plate and mounting holes; a plurality of the mounting plates are respectively arranged on both end surfaces of the aluminum substrate, and a plurality of the mounting holes are respectively opened on the plurality of the mounting plates.
[0010] Preferably, the aluminum substrate further includes a semicircular through hole and a circular through hole; the two semicircular through holes are respectively opened on both sides of the aluminum substrate, and the two circular through holes are opened on the aluminum substrate and located on the inner sides of the two semicircular through holes.
[0011] Preferably, quick connectors are respectively provided at both ends of the two circular through holes.
[0012] Compared with the prior art, the utility model increases the effective surface area for heat dissipation and improves the heat dissipation efficiency by arranging multiple heat dissipation components at the bottom of the aluminum substrate. The vertical plate, the first heat dissipation plate and the second heat dissipation plate of the heat dissipation components work together to form a multi-faceted heat dissipation structure, which increases the air contact area and helps to dissipate heat to the surrounding environment faster; the uniform array distribution of the heat dissipation components ensures a more uniform heat distribution, avoids local overheating, and improves the overall heat dissipation performance; the use of aluminum with good thermal conductivity as the material of the vertical plate, the first heat dissipation plate and the second heat dissipation plate can improve the heat dissipation efficiency; the design of the mounting plate and the mounting hole allows the aluminum substrate to be easily fixed to the corresponding bracket or other structure, simplifies the installation process, and is also convenient for later maintenance or replacement; the design of the semicircular through hole promotes the flow of air inside the aluminum substrate, helps to form natural convection, thereby enhancing the heat dissipation effect; the quick connectors arranged at both ends of the circular through hole allow the water-cooled radiator to be quickly and easily connected, which can effectively take away heat, and is particularly suitable for high-power applications to ensure that electronic components can operate stably even in high-temperature environments. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the structure of an aluminum substrate that is beneficial to heat dissipation in an embodiment of the utility model;
[0014] Figure 2 This is an enlarged partial schematic diagram of the base layer in the embodiment of the utility model;
[0015] Figure 3 This is an enlarged partial schematic diagram of the heat dissipation component in the embodiment of the utility model;
[0016] Figure 4 It is a schematic diagram of the structure of an aluminum substrate that is beneficial to heat dissipation in an embodiment of the utility model.
[0017] Explanation of the reference numerals: 1-aluminum substrate, 2-base layer; 3-heat dissipation component; 4-vertical plate, 5-first heat dissipation plate; 6-second heat dissipation plate; 7-insulating layer, 8-copper foil layer; 9-anti-etching layer; 10-semicircular groove; 11-mounting plate; 12-semicircular through hole; 13-quick connector. DETAILED DESCRIPTION
[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.
[0019] It should be noted that the terms "first", "second", etc. in the specification and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein.
[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0021] In the description of this specification, the description with reference to the terms "embodiment", "one embodiment" and "one implementation" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or implementation are included in at least one embodiment or implementation of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or implementation. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or implementations in a suitable manner.
[0022] To solve the above problems, Figure 1 As shown, the embodiment of the utility model provides an aluminum substrate that is conducive to heat dissipation, including an aluminum substrate 1, a base layer 2 and a heat dissipation component 3; the base layer 2 is arranged on the top of the aluminum substrate 1, as shown in FIG. Figure 3 As shown, a plurality of the heat dissipation components 3 are evenly arrayed at the bottom of the aluminum substrate 1; each of the heat dissipation components 3 includes a vertical plate 4, a first heat dissipation plate 5 and a second heat dissipation plate 6; the bottom of the vertical plate 4 is fixedly connected to the bottom of the aluminum substrate 1, two first heat dissipation plates 5 are respectively arranged on both sides of the vertical plate 4, and the bottom of the second heat dissipation plate 6 is fixedly connected to the top of the vertical plate 4.
[0023] It should be noted that the base layer 2 is connected to the electronic components, and the heat generated by the electronic components is transferred to the aluminum substrate 1, and the aluminum substrate 1 transfers the heat to the heat dissipation component 3, and the heat dissipation component 3 dissipates the heat into the air, thereby achieving a heat dissipation effect. By arranging multiple heat dissipation components 3 at the bottom of the aluminum substrate 1, the effective surface area for heat dissipation can be significantly increased, and the heat dissipation efficiency can be improved. The vertical plate 4, the first heat dissipation plate 5 and the second heat dissipation plate 6 of the heat dissipation component 3 work together to form a multi-faceted heat dissipation structure, thereby increasing the air contact area, which helps to dissipate heat into the surrounding environment faster, thereby effectively controlling the operating temperature of the electronic components and avoiding performance degradation or failure due to overheating.
[0024] In one embodiment of the present invention, Figure 2 As shown, the base layer 2 includes an insulating layer 7, a copper foil layer 8 and an anti-etching layer 9; the insulating layer 7 is arranged on the top of the aluminum substrate 1, the copper foil layer 8 is arranged on the top of the insulating layer 7, and the anti-etching layer 9 is arranged on the top of the copper foil layer 8.
[0025] It should be noted that the insulating layer 7 can ensure the electrical isolation between the aluminum substrate 1 and the circuit, prevent the occurrence of short circuits, and improve the safety of the circuit; the insulating layer 7 can also protect the aluminum substrate 1 from corrosion and extend its service life; the copper foil layer 8, as the carrier layer of the circuit, can form complex circuit patterns through etching and other processes as needed to achieve precise circuit design; the good conductivity of the copper foil layer 8 ensures the high efficiency of current transmission and reduces the loss during signal transmission; the role of the anti-etching layer 9 is to protect the parts that do not need to be etched during the circuit etching process to ensure the accuracy and consistency of the circuit pattern; the anti-etching layer 9 can also serve as a protective layer to prevent the influence of environmental factors on the circuit, such as moisture and pollutants, further enhancing the stability and durability of the circuit; the insulating layer 7 can transfer the heat energy generated by the copper foil layer 8 to the aluminum substrate 1.
[0026] In an embodiment of the present invention, each of the heat dissipation components 3 further includes a semicircular groove 10 , and a plurality of the semicircular grooves 10 are respectively opened on one side of each of the second heat dissipation plates 6 .
[0027] It should be noted that if Figure 4 As shown, a plurality of semicircular grooves 10 are provided on one side of each second heat sink 6. The plurality of semicircular grooves 10 allow heat to pass through, which helps to accelerate the heat dissipation and avoid local overheating when a plurality of second heat sinks 6 are arrayed together, thereby promoting air circulation, enhancing heat exchange efficiency, improving heat distribution, and thus improving the thermal stability of the entire system.
[0028] In an embodiment of the present invention, the vertical plate 4, the first heat sink 5 and the second heat sink 6 are respectively made of aluminum.
[0029] It should be noted that aluminum is a metal with good thermal conductivity. It can quickly transfer heat from electronic components to the heat dissipation component 3, thereby improving the heat dissipation efficiency. Compared with other metal materials, aluminum is relatively light, which helps to reduce the weight of the entire aluminum substrate 1. Aluminum is easy to process into various shapes and sizes, and can more easily realize complex heat dissipation structure design.
[0030] In one embodiment of the present invention, Figure 4 As shown, the aluminum substrate 1 includes a mounting plate 11 and mounting holes; a plurality of the mounting plates are respectively arranged on both end surfaces of the aluminum substrate 1 , and a plurality of the mounting holes are respectively opened on the plurality of the mounting plates 11 .
[0031] It should be noted that the multiple mounting plates 11 can conveniently fix the aluminum substrate 1 on the corresponding bracket or other structure, and the mounting holes provide fixing points, and the aluminum substrate 1 can be stably installed by passing screws or other fasteners through these holes.
[0032] In one embodiment of the present invention, Figure 4 As shown, the aluminum substrate 1 also includes a semicircular through hole 12 and a circular through hole; the two semicircular through holes 12 are respectively opened on both sides of the aluminum substrate 1, and the two circular through holes are opened on the aluminum substrate 1 and located on the inner side of the two semicircular through holes 12.
[0033] It should be noted that the two semicircular through holes 12 are respectively opened on both sides of the aluminum substrate 1, which can promote the flow of air inside the aluminum substrate 1, increase air flow, help to form natural convection, thereby enhancing the heat dissipation effect, and can accelerate the heat dissipation of the aluminum substrate 1. The two semicircular through holes 12 not only help to dissipate heat, but also reduce the amount of material used, thereby reducing the overall weight; two circular through holes are opened on the aluminum substrate 1 and are located on the inner side of the two semicircular through holes 12. The two ends of these through holes can be connected to quick connectors 13 for installing water-cooled radiators; in an environment with severe sealing and poor air flow, the coolant can be directly introduced into the interior of the aluminum substrate 1 through the water cooling system, and contact with the aluminum substrate 1, thereby more effectively taking away heat and improving heat dissipation efficiency. It is also suitable for high-power applications. The water-cooled radiator can handle a larger heat load to ensure that the electronic equipment can operate stably in a high-temperature environment;
[0034] Finally, the two semicircular through holes 12 and the two circular through holes can enhance air flow, and the two circular through holes also provide necessary structural support for the installation of the water-cooled radiator. By combining air convection and water-cooled heat dissipation, the aluminum substrate 1 can ensure efficient heat dissipation while also having better thermal management capabilities and adapting to more application scenarios.
[0035] In an embodiment of the present invention, quick connectors 13 are respectively provided at both ends of the two circular through holes.
[0036] It should be noted that the quick connector 13 allows the water-cooled radiator to be quickly and easily connected to the aluminum substrate 1, greatly saving installation time and labor costs. The quick connector 13 usually has good sealing performance, which can effectively prevent the coolant from leaking at the connection point, ensuring the safety and reliability of the water cooling system.
[0037] It should be noted that the above-described implementation methods of the utility model do not constitute a limitation on the protection scope of the utility model. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model shall be included in the protection scope of the claims of the utility model.
Claims
1. An aluminum substrate that is good for heat dissipation, characterized in that: The invention comprises an aluminum substrate (1), a base layer (2) and a heat dissipation component (3); the base layer (2) is arranged at the top of the aluminum substrate (1), and a plurality of heat dissipation components (3) are evenly arrayed at the bottom of the aluminum substrate (1); each heat dissipation component (3) comprises a vertical plate (4), a first heat dissipation plate (5) and a second heat dissipation plate (6); the bottom of the vertical plate (4) is fixedly connected to the bottom of the aluminum substrate (1), two first heat dissipation plates (5) are respectively arranged on both sides of the vertical plate (4), and the bottom of the second heat dissipation plate (6) is fixedly connected to the top of the vertical plate (4).
2. The aluminum substrate that is conducive to heat dissipation according to claim 1, characterized in that: The base layer (2) comprises an insulating layer (7), a copper foil layer (8) and an anti-etching agent layer (9); the insulating layer (7) is arranged on the top of the aluminum substrate (1), the copper foil layer (8) is arranged on the top of the insulating layer (7), and the anti-etching agent layer (9) is arranged on the top of the copper foil layer (8).
3. The aluminum substrate that is conducive to heat dissipation according to claim 1, characterized in that: Each of the heat dissipation components (3) further comprises a semicircular groove (10), and a plurality of the semicircular grooves (10) are respectively opened on one side of each of the second heat dissipation plates (6).
4. The aluminum substrate that is conducive to heat dissipation according to claim 1, characterized in that: The vertical plate (4), the first heat sink (5) and the second heat sink (6) are respectively made of aluminum.
5. The aluminum substrate that is conducive to heat dissipation according to claim 1, characterized in that: The aluminum substrate (1) comprises a mounting plate (11) and mounting holes; a plurality of the mounting plates are respectively arranged on the end surfaces at both ends of the aluminum substrate (1), and a plurality of the mounting holes are respectively opened on the plurality of the mounting plates (11).
6. The aluminum substrate that is conducive to heat dissipation according to claim 1, characterized in that: The aluminum substrate (1) further comprises a semicircular through hole (12) and a circular through hole; the two semicircular through holes (12) are respectively opened on two sides of the aluminum substrate (1), and the two circular through holes are opened on the aluminum substrate (1) and are located on the inner sides of the two semicircular through holes (12).
7. The aluminum substrate that is beneficial to heat dissipation according to claim 6, characterized in that: Quick connectors (13) are respectively arranged at both ends of the two circular through holes.