Radiator applied to PCB (Printed Circuit Board) and assembly structure of radiator and PCB

Abstract

The utility model relates to a radiator applied to a PCB (printed circuit board) and an assembly structure of the radiator and the PCB, the radiator comprises a radiating fin, one surface of the radiating fin is a plane, the other surface of the radiating fin is a radiating surface, the planes at two ends of the radiating fin are respectively and vertically connected with a support body, and the two support bodies are oppositely arranged in parallel. The opposite faces of the two supporting bodies are each provided with a slot parallel to the plane of the cooling fin, and the two slots are matched with the edges of the two ends of the PCB respectively. The radiator for the PCB is adopted in the assembling structure of the radiator and the PCB, the edges of the two ends of the PCB are inserted into the two inserting grooves of the radiator respectively, and insulation heat dissipation silica gel is poured between the PCB and the plane of the cooling fins. According to the utility model, the support bodies are arranged at the two ends of the radiating fins of the radiator, the slots are respectively arranged on the opposite surfaces of the two support bodies, and the slots are clamped with the edges of the two ends of the PCB to replace the traditional screw connection, so that the technical problems that the PCB is warped when being connected with the radiator, the utilization rate of the surface of the PCB is low and the like are effectively solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of printed circuits, and in particular relates to a radiator applied to a PCB board and an assembly structure of the radiator and the PCB board. Background Art

[0002] As the functions of integrated circuit components are enhanced, the heat generated by PCB boards (also known as "circuit boards") is also increasing. More and more high-performance PCB boards need to use heat sinks to dissipate heat in order to reduce their operating temperature and maintain the working safety of electronic components.

[0003] Traditional PCB boards are connected to heat sinks through screws. This connection method requires holes to be drilled in the PCB board, which requires avoiding the hole location when designing the circuit, increasing the difficulty of designing the circuit on the PCB board and reducing the board utilization rate. Moreover, when screws are used to connect the PCB board, the PCB board will warp due to the tightening force of the screws, which will have a negative impact on the stability of the electronic components. The screws may also interfere with the electronic components on the board. Therefore, it is necessary to design a heat sink for PCB boards to solve the above technical problems. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a heat sink applied to a PCB board, so as to solve the technical problem that a traditional heat sink needs screws to be reliably connected to the PCB board.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: a heat sink applied to a PCB board includes a heat sink, one side of the heat sink is a plane, and the other side is a heat dissipation surface provided with grooves and ridges arranged in sequence at intervals, and the planes at both ends of the heat sink are respectively vertically connected to support bodies, and the two support bodies are arranged parallel to each other, and a slot parallel to the plane of the heat sink is respectively opened on the facing surfaces of the two support bodies, and the two slots are respectively adapted to the two end edges of the PCB board.

[0006] As a preferred solution, the two support bodies include "L"-shaped bases arranged facing each other and a clamping strip arranged above the horizontal edge of the base, a slot is formed between the clamping strip and the horizontal edge of the base, and the clamping strip is located in the middle of the vertical edge of the base.

[0007] As a preferred solution, the thickness of the horizontal side of the base is greater than the height of the components on the side of the PCB board facing the heat sink.

[0008] As a preferred solution, two ends of the heat sink extend outward to form connecting parts, and the two connecting parts are respectively provided with connecting holes perpendicular to the heat sink.

[0009] As a preferred solution, there are multiple connecting holes on any connecting part, and each connecting hole is an oblong hole.

[0010] The utility model further aims to solve the technical problem of providing an assembly structure of a heat sink and a PCB board, so as to solve the technical problem that a conventional heat sink needs screws to be reliably connected to the PCB board.

[0011] In order to solve the above technical problems, the technical solution adopted by the utility model is: an assembly structure of a radiator and a PCB board, adopting the above-mentioned radiator for a PCB board, the two end edges of the PCB board are respectively inserted into the two slots of the radiator, and insulating heat dissipation silicone is poured between the PCB board and the heat sink plane.

[0012] As a preferred solution, the edges at both ends of the PCB board are tightly fitted with the slots.

[0013] The beneficial effects of the utility model are as follows: the utility model provides support bodies at both ends of the heat sink of the radiator, and respectively provides slots on the facing surfaces of the two support bodies, and utilizes the slots to clamp the edges of both ends of the PCB board to replace the traditional screw connection, thereby effectively avoiding technical problems such as warping of the connection between the PCB board and the radiator, low utilization rate of the PCB board surface, and interference between the screws and the electronic components on the PCB board surface. The safety of the PCB board is greatly improved and its service life is extended. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings, wherein:

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the radiator of the utility model;

[0016] Figure 2 yes Figure 1 's side elevation view;

[0017] Figure 3 It is a schematic diagram of the assembly structure of the heat sink and the PCB board of the utility model;

[0018] Figure 1~Figure 3 In: 1. heat sink, 101. plane, 102. heat dissipation surface, 103. connection part, 2. groove, 3. ridge, 4. support body, 401. base, 402. card strip, 401a. horizontal edge, 401b. vertical edge, 5. slot, 6. PCB board, 7. connection hole, 8. insulating heat dissipation silicone. DETAILED DESCRIPTION

[0019] The specific implementation scheme of the utility model is described in detail below in conjunction with the accompanying drawings. Example 1

[0020] like Figure 1 and Figure 2 The heat sink shown in the figure is applied to a PCB board, and includes a heat sink 1, one side of the heat sink 1 is a plane 101, and the other side is a heat dissipation surface 102 provided with grooves 2 and ridges 3 arranged in sequence. Support bodies 4 are respectively vertically connected to the planes 101 at both ends of the heat sink 1, and the two support bodies are arranged parallel to each other. A slot 5 parallel to the plane 101 of the heat sink 1 is respectively opened on the facing surfaces of the two support bodies 4, and the two slots 5 are respectively adapted to the edges of the two ends of the PCB board 6.

[0021] In this embodiment, the two supporting bodies 4 respectively include an "L"-shaped base 401 disposed opposite to each other and a clamping strip 402 disposed above the horizontal edge 401a of the base 401, a slot 5 is formed between the clamping strip 402 and the horizontal edge 401a of the base 401, and the clamping strip 402 is located in the middle of the vertical edge 401b of the base 401. This design allows the opening size of the clamping slot 5 to be reduced by applying pressure towards the top ends of the two bases 401 after the two ends of the PCB are inserted into the slot 5, so that the clamping slot 5 clamps the PCB 6.

[0022] As an improvement to the above technology, the horizontal side thickness of the base 401 in this embodiment is greater than the height of the components on the side of the PCB board 6 facing the heat sink 1. This ensures that when both ends of the PCB board 6 are inserted into the slot 5, the electronic components on the PCB board 6 will not interfere with the heat sink 1.

[0023] The PCB board 6 needs to be installed in the device eventually. In order to facilitate the assembly of the PCB board 6 and the device and eliminate the warping of the board surface caused by the connection of the PCB board and the device through screws, the present embodiment further extends outwards at both ends of the heat sink 1 to form connecting parts 103, and the two connecting parts 103 are respectively provided with connecting holes 7 perpendicular to the heat sink 1. The PCB board 6 can be connected to the device through the connecting parts 103 at both ends of the heat sink 1.

[0024] In order to improve the connection reliability, this embodiment also provides a plurality of connection holes 7 on any connection portion 103, and each connection hole 7 is an oblong hole, and the long axis directions of all the connection holes 7 are parallel to each other, so as to improve the compatibility of the heat sink and the device. Example 2

[0025] like Figure 3 As shown, this embodiment adopts the heat sink described in Example 1 to demonstrate the assembly structure of the heat sink and the PCB board. The two end edges of the PCB board 6 are respectively inserted into the two slots 5 of the heat sink, and insulating heat dissipation silicone 8 is poured between the PCB board 6 and the plane of the heat sink 1.

[0026] In order to prevent the PCB board 6 from moving in the slot 5 when the insulating heat dissipation silica gel 8 is poured, the edges at both ends of the PCB board 6 are preferably tightly fitted with the slot 5.

[0027] The working principle of the utility model is as follows: the utility model sets support bodies 4 at both ends of the heat sink 1 of the radiator, and respectively opens slots 5 on the facing surfaces of the two support bodies 4, and uses the slots 5 to clamp the edges of both ends of the PCB board 6 to replace the traditional screw connection, thereby effectively avoiding technical problems such as warping of the connection between the PCB board 6 and the radiator, low utilization rate of the PCB board 6, and interference between the screws and the electronic components on the board of the PCB board 6. The safety of the PCB board 6 is greatly improved, and its service life is extended.

[0028] The above embodiments are only illustrative of the principles and effects of the invention, as well as some embodiments of its application, and are not intended to limit the invention. It should be pointed out that a person skilled in the art can make several modifications and improvements without departing from the inventive concept of the invention, and all of these belong to the protection scope of the invention.

Claims

1. A heat sink applied to a PCB board, characterized in that: The heat sink (1) comprises a heat sink (1), one side of which is a plane (101), and the other side of which is a heat sink surface (102) provided with grooves (2) and ridges (3) arranged in sequence at intervals, the planes (101) at both ends of the heat sink (1) are respectively vertically connected to support bodies (4), the two support bodies are arranged parallel to each other, and the facing surfaces of the two support bodies (4) are respectively provided with a slot (5) parallel to the plane (101) of the heat sink (1), and the two slots (5) are respectively adapted to the edges of the two ends of a PCB board (6).

2. The heat sink applied to a PCB board according to claim 1, characterized in that: The two support bodies (4) comprise "L"-shaped bases (401) arranged opposite to each other and a clamping strip (402) arranged above a horizontal edge (401a) of the base (401), a slot (5) being formed between the clamping strip (402) and the horizontal edge (401a) of the base (401), and the clamping strip (402) being located in the middle of a vertical edge (401b) of the base (401).

3. The heat sink applied to a PCB board according to claim 2, characterized in that: The thickness of the horizontal side of the base (401) is greater than the height of the components on the side of the PCB board (6) facing the heat sink (1).

4. The heat sink applied to a PCB board according to claim 1, characterized in that: Both ends of the heat sink (1) extend outwards to form connecting portions (103), and connecting holes (7) perpendicular to the heat sink (1) are respectively provided on the two connecting portions (103).

5. The heat sink applied to a PCB board according to claim 4, characterized in that: There are a plurality of connection holes (7) on any connection portion (103), each connection hole (7) is an oblong hole, and the major axis directions of all the connection holes (7) are parallel to each other.

6. The assembly structure of the heat sink and the PCB board is characterized in that: The radiator is any one of claims 1 to 5, the two end edges of the PCB board (6) are respectively inserted into two slots (5) of the radiator, and insulating heat dissipation silica gel (8) is poured between the PCB board (6) and the plane of the heat sink (1).

7. The assembly structure of the heat sink and the PCB board according to claim 6, characterized in that: The edges at both ends of the PCB board (6) are tightly fitted with the slot (5).

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