3D microcrystal heat dissipation device

Abstract

A 3D microcrystal heat dissipation device is provided with a capillary phase change heat conduction cavity and a liquid flow heat dissipation cavity which are attached to each other. The capillary phase change heat conduction cavity is of a sealed structure, and the liquid flow heat dissipation cavity is connected with a liquid inlet pipe and a liquid outlet pipe in a sealed mode. The liquid flow heat dissipation cavity is an immersed microcrystal structure liquid flow heat dissipation cavity; and a microcrystal copper powder electroplated layer is arranged on the bottom surface of the inner cavity of the immersed microcrystal structure liquid flow heat dissipation cavity. According to the 3D microcrystal heat dissipation device, gas-liquid phase change is carried out through the refrigerant in the capillary phase change heat conduction cavity, so that heat of a heating source is conducted to the liquid flow heat dissipation cavity, then the heat is brought out through the flowing refrigerant in the liquid flow heat dissipation cavity, and the efficient heat dissipation effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic products, in particular to a 3D microcrystalline heat dissipation device. Background Art

[0002] With the rapid development of computer technology, especially the development of artificial intelligence, automatic control and other technologies, the working performance of the modules, components or devices that match them has also been greatly improved. Taking AI technology chips as an example, in order to match the performance of artificial intelligence, the computing power of the chip has been greatly increased, and accordingly, the heat generation of the chip has also increased significantly. The heat dissipation problem for this large heat source has become an important research topic.

[0003] The heat dissipation method for the heat source is mainly to increase the heat dissipation area through the heat dissipation fins. In order to improve the heat dissipation efficiency, there is a method in the prior art to increase the heat exchange efficiency by adding air cooling. In addition, heat dissipation through liquid cooling is also one of the methods used in recent years for large heat sources. Liquid cooling uses the thermal conductivity of liquid to absorb and transfer heat to reduce the temperature of the equipment. However, the liquid cooling device and the heat source are mainly heat-conducted through metal plates. The heat of the heat source needs to be conducted to the refrigerant through the metal plate so that the heat can be taken away by the flow of the refrigerant. This metal plate has poor thermal conductivity, resulting in low overall heat dissipation efficiency, which cannot meet the requirements of technological development for heat dissipation efficiency.

[0004] With the development of technology, the concept of three-dimensional heat dissipation devices for electronic products with large heat sources has been proposed. In the prior art, three-dimensional heat dissipation devices usually have a heat-conducting seat in contact with the heat source, and multiple heat-dissipating columns or heat-dissipating pipes are distributed on the heat-conducting seat. The heat of the heat source is transferred through the heat-conducting seat and the heat source is dissipated through the heat-dissipating columns or heat-dissipating pipes.

[0005] Therefore, in view of the shortcomings of the existing technology, it is necessary to provide a 3D microcrystalline heat dissipation device that can be applied to large heat sources such as AI chips to solve the shortcomings of the existing technology. Utility Model Content

[0006] The utility model aims to avoid the shortcomings of the prior art and provide a 3D microcrystalline heat dissipation device. The 3D microcrystalline heat dissipation device conducts the heat of the heat source to the liquid flow heat dissipation cavity through the gas-liquid phase change of the capillary phase change heat conduction cavity, and then the liquid flow heat dissipation cavity quickly takes the heat out of the outside through the flowing refrigerant to achieve the heat dissipation effect.

[0007] The above-mentioned purpose of the utility model is achieved through the following technical measures:

[0008] Provided is a 3D microcrystalline heat dissipation device, which is provided with a capillary phase change heat conduction cavity and a liquid flow heat dissipation cavity which are fitted to each other.

[0009] The capillary phase change heat conduction cavity is a sealed structure, and the liquid flow heat dissipation cavity is sealedly connected with a liquid inlet pipe and a liquid outlet pipe.

[0010] Preferably, the above-mentioned liquid flow heat dissipation cavity is an immersed microcrystalline structure liquid flow heat dissipation cavity.

[0011] Preferably, a microcrystalline copper powder electroplating layer is provided at the bottom surface of the inner cavity of the above-mentioned immersed microcrystalline structure liquid flow heat dissipation cavity.

[0012] The lower wall surface of the liquid flow heat dissipation cavity is partially or entirely provided with a microcrystalline copper powder electroplating layer, and the upper wall surface of the liquid flow heat dissipation cavity is not provided with a microcrystalline copper powder electroplating layer;

[0013] or

[0014] The lower wall surface of the liquid flow heat dissipation cavity is partially or entirely provided with a microcrystalline copper powder electroplating layer, and the upper wall surface of the liquid flow heat dissipation cavity is partially or entirely provided with a microcrystalline copper powder electroplating layer.

[0015] The 3D microcrystalline heat dissipation device of the utility model is provided with a lower cover, a middle partition and an upper cover, wherein the middle partition is sealed and covered on the lower cover to form the capillary phase change heat conduction cavity, and the upper cover is sealed and fastened to the middle partition from above to form the liquid flow heat dissipation cavity.

[0016] Preferably, the above-mentioned middle partition is provided with a plate body and a plurality of baffles for slowing down the flow rate of the refrigerant and increasing the heat dissipation area, all of the baffles are fixedly connected to the upper surface of the plate body, and the baffles are located inside the liquid flow heat dissipation cavity.

[0017] Preferably, part or all of the plate body is provided with a microcrystalline copper powder electroplating layer, and all or part of the outer surfaces of the baffle are provided with a microcrystalline copper powder electroplating layer.

[0018] Preferably, the middle partition is further provided with a first scooped-tooth heat sink, which is fixedly connected to the upper surface of the plate body of the middle partition, and is located inside the liquid flow heat dissipation cavity.

[0019] Preferably, the upper cover is provided with a cover body and a baffle for slowing down the flow rate of the refrigerant, the baffle is welded or integrally connected to the upper surface of the plate body, and the baffle is located inside the liquid flow heat dissipation cavity.

[0020] Preferably, part or all of the cover body is provided with a microcrystalline copper powder electroplating layer, and the outer surface of all or part of the baffle is provided with or not provided with a microcrystalline copper powder electroplating layer.

[0021] Preferably, the upper cover is further provided with a second skived-tooth heat sink, and the second skived-tooth heat sink is fixedly connected to the upper surface of the cover body of the upper cover.

[0022] The 3D microcrystalline heat dissipation device of the utility model is also provided with a heat pipe for heat dissipation. The heat pipe is fixedly connected to the inside of the liquid flow heat dissipation cavity, the two ends of the heat pipe are closed, the inner wall surface of the heat pipe is provided with a microcrystalline copper powder electroplating layer, and the interior of the heat pipe is in a vacuum state and filled with refrigerant.

[0023] Preferably, the outer surface of the heat pipe is provided with a microcrystalline copper powder electroplating layer; or the outer surface of the heat pipe is not provided with a microcrystalline copper powder electroplating layer.

[0024] Preferably, the inner wall surface of the capillary phase change heat conduction cavity is provided with a microcrystalline copper powder electroplating layer, and the interior of the capillary phase change heat conduction cavity is in a vacuum state and filled with a refrigerant.

[0025] The utility model discloses a 3D microcrystalline heat dissipation device, which is provided with a capillary phase change heat conduction cavity and a liquid flow heat dissipation cavity that fit each other; the capillary phase change heat conduction cavity is a sealed structure, and the liquid flow heat dissipation cavity is sealed and connected with a liquid inlet pipe and a liquid outlet pipe. The utility model discloses a 3D microcrystalline heat dissipation device, which conducts the heat of the heat source to the liquid flow heat dissipation cavity by the refrigerant inside the capillary phase change heat conduction cavity undergoing gas-liquid phase change, and then takes the heat out of the liquid flow heat dissipation cavity through the flowing refrigerant, thereby achieving an efficient heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention is further described with reference to the accompanying drawings, but the contents in the accompanying drawings do not constitute any limitation to the present invention.

[0027] Figure 1 It is a three-dimensional schematic diagram of a 3D microcrystalline heat dissipation device.

[0028] Figure 2 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 1.

[0029] Figure 3 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 2.

[0030] Figure 4 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 3.

[0031] Figure 5 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 4.

[0032] Figure 6 It is a three-dimensional schematic diagram of a middle partition in which the baffle is a rectangular parallelepiped.

[0033] Figure 7 It is a three-dimensional schematic diagram of a middle partition in which the baffle is a prism.

[0034] Figure 8 It is a three-dimensional schematic diagram of a middle partition in which the baffle is a cylinder.

[0035] Fig. 9 It is a three-dimensional schematic diagram of the middle partition with the baffle in an irregular state.

[0036] Fig.10 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 5.

[0037] Fig.11 It is a three-dimensional schematic diagram of the upper cover.

[0038] Fig.12 This is a cross-sectional schematic diagram of the 3D microcrystalline heat dissipation device of Example 6.

[0039] Fig.13 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 7.

[0040] Fig.14 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 8.

[0041] Fig.15 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 9.

[0042] Fig.16 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 10.

[0043] Fig.17 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 11.

[0044] Fig.18 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 11.

[0045] Fig.19 Schematic cross-sectional view of the 3D microcrystalline heat dissipation device of Example 12.

[0046] exist Figures 1 to 19 Including:

[0047] Capillary phase change heat conduction cavity 10, liquid flow heat dissipation cavity 20,

[0048] The upper cover 100, the cover body 110, the liquid inlet pipe 120, the liquid outlet pipe 130, the baffle 140, the second skived heat sink 150,

[0049] The middle partition 200 , the plate body 210 , the baffle 220 , the first skived-tooth heat sink 230 , the lower cover 300 , the heat pipe 400 , and the microcrystalline copper powder electroplating layer 500 . DETAILED DESCRIPTION

[0050] The technical solution of the utility model is further described in conjunction with the following embodiments.

[0051] Example 1

[0052] A 3D microcrystalline heat dissipation device, Figure 1 and Figure 2 As shown, a capillary phase change heat conduction cavity 10 and a liquid flow heat dissipation cavity 20 are provided which are fitted to each other; the capillary phase change heat conduction cavity 10 is a sealed structure, and the liquid flow heat dissipation cavity 20 is sealedly connected with a liquid inlet pipe 120 and a liquid outlet pipe 130 .

[0053] The 3D microcrystalline heat dissipation device is provided with a lower cover 300, a middle partition 200 and an upper cover 100. The middle partition 200 is sealed and covered on the lower cover 300 to form a capillary phase change heat conduction cavity 10, and the upper cover 100 is sealed and fastened to the middle partition 200 from above to form a liquid flow heat dissipation cavity 20.

[0054] The function of the liquid heat dissipation cavity 20 of the present invention is to quickly take away the heat of the middle partition 200 through the flowing refrigerant. The refrigerant in the liquid heat dissipation cavity 20 of the present invention can be water, alcohol, acetone, R12, Freon or other components. In this embodiment, the refrigerant of the liquid heat dissipation cavity 20 is specifically Freon, and the refrigerant of the capillary phase change heat conduction cavity 10 is specifically water. The refrigerant in the liquid heat dissipation cavity 20 and the refrigerant in the capillary phase change heat conduction cavity 10 can be the same or different, depending on the actual situation.

[0055] It should be noted that when the 3D microcrystalline heat dissipation device of the present invention is in use, the lower surface of the lower cover 300 is in contact with the heat source.

[0056] The inner wall surface of the capillary phase change heat conduction cavity 10 is provided with a microcrystalline copper powder electroplating layer 500 , and the interior of the capillary phase change heat conduction cavity 10 is in a vacuum state and filled with a refrigerant.

[0057] It should be noted that the microcrystalline copper powder electroplating layer 500 of the utility model is made of the copper powder metal plating layer, metal substrate, energy-saving and anti-explosion 3D microcrystalline heat dissipation device and its preparation process of CN107557825B. In addition, a column or support rib is also arranged inside the capillary phase change heat conduction cavity 10, and the column and the support rib are welded or integrally connected to the inner surface of the capillary phase change heat conduction cavity 10. The heat dissipation principle of the capillary phase change heat conduction cavity 10 of the utility model is the same as that of CN107557825B, that is, when not heated, the refrigerant liquid of the capillary phase change heat conduction cavity 10 is immersed in the copper powder metal plating layer and is basically in a saturated state. When the capillary phase change heat conduction cavity 10 is heated by a heat source, the refrigerant of the copper powder metal coating of the lower cover 300 is heated and evaporated, part of the vapor reaches the middle partition 200 and is cooled, and part of the vapor encounters the copper powder metal coating on the surface of the column or support rib and is cooled, condenses and refluxes along the column or support rib to the lower cover 300, and the heat is continuously circulated from the lower wall to the upper wall to achieve heat dissipation. The structure of the capillary phase change heat conduction cavity 10 of the utility model is not the focus of the invention, and is specifically the same as the copper powder metal coating with refrigerant gas-liquid phase change function and the inner cavity of the 3D microcrystalline heat dissipation device in the prior art. The utility model is based on this 3D microcrystalline heat dissipation device and adds a liquid flow heat dissipation cavity 20.

[0058] It should be noted that the refrigerant enters the liquid heat dissipation cavity 20 from the liquid inlet pipe 120 and then is discharged from the liquid outlet pipe 130, and the heat absorbed by the capillary phase change heat conduction cavity 10 from the heat source is quickly taken away. Compared with the 3D microcrystalline heat dissipation device in the prior art that only has a microcrystalline copper powder electroplating layer 500, the heat dissipation effect of the present invention is further improved.

[0059] The 3D microcrystalline heat dissipation device conducts the heat of the heat source to the liquid flow heat dissipation cavity 20 through the gas-liquid phase change of the refrigerant inside the capillary phase change heat conduction cavity 10, and then carries the heat out to the outside through the flowing refrigerant in the liquid flow heat dissipation cavity 20, thereby achieving an efficient heat dissipation effect.

[0060] Example 2

[0061] A 3D microcrystalline heat dissipation device, such as Figure 3 As shown, other features are the same as those of Example 1, and also have the following features: the liquid flow heat dissipation cavity 20 of this embodiment is an immersed microcrystalline structure liquid flow heat dissipation cavity; a microcrystalline copper powder electroplating layer 500 is provided at the bottom surface of the inner cavity of the immersed microcrystalline structure liquid flow heat dissipation cavity.

[0062] Specifically, in this embodiment, the lower wall surface of the liquid flow heat dissipation cavity 20 is partially or entirely provided with a microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid flow heat dissipation cavity 20 is not provided with a microcrystalline copper powder electroplating layer 500. In this embodiment, specifically, the lower wall surface of the liquid flow heat dissipation cavity 20 is entirely provided with a microcrystalline copper powder electroplating layer 500.

[0063] It should be noted that, since the microcrystalline copper powder electroplating layer 500 of the present embodiment has many gaps, these gaps absorb refrigerant. When the middle partition 200 absorbs heat, the capillary phenomenon of the microcrystalline copper powder electroplating layer 500 will discharge the refrigerant outward, push the refrigerant to move, and make the refrigerant flow to the outside and be discharged from the liquid outlet. New refrigerant is replenished into the gaps inside the microcrystalline copper powder electroplating layer 500, so the heat of the middle partition 200 can be quickly taken away.

[0064] It has been verified through implementation that, under the same other conditions, the heat dissipation efficiency of the 3D microcrystalline heat dissipation device in this embodiment is improved by 35% compared with the 3D microcrystalline heat dissipation device in Embodiment 1.

[0065] Example 3

[0066] A 3D microcrystalline heat dissipation device, such as Figure 4 As shown, other features are the same as those of Example 2, and also have the following features: the lower wall surface of the liquid flow heat dissipation cavity 20 is entirely provided with a microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid flow heat dissipation cavity 20 is entirely provided with a microcrystalline copper powder electroplating layer 500.

[0067] Compared with Example 2, in this embodiment, microcrystalline copper powder electroplating layers 500 are disposed on both the upper and lower walls of the liquid heat dissipation cavity 20, so the coverage area of ​​the microcrystalline copper powder electroplating layers 500 is further expanded, further improving the heat dissipation effect.

[0068] Example 4

[0069] A 3D microcrystalline heat dissipation device, such as Figure 5 As shown, other features are the same as those of Example 1, and also have the following features: the middle partition 200 is provided with a plate body 210 and a plurality of baffles 220 for slowing down the flow rate of the refrigerant and increasing the heat dissipation area, all baffles 220 are welded or integrally connected to the upper surface of the plate body 210, and the baffles 220 are located inside the liquid flow heat dissipation cavity 20. The baffles 220 of this embodiment are specifically integrally connected to the upper surface of the plate body 210, the lower wall surface of the liquid flow heat dissipation cavity 20 is all provided with a microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid flow heat dissipation cavity 20 is not provided with a microcrystalline copper powder electroplating layer 500. In this embodiment, the plate body 210 is all provided with a microcrystalline copper powder electroplating layer 500, and the outer surface of all baffles 220 is provided with a microcrystalline copper powder electroplating layer 500.

[0070] It should be noted that, the baffle 220 of the present embodiment may also be provided with the microcrystalline copper powder electroplating layer 500 only partially, while the other part is not provided with the microcrystalline copper powder electroplating layer 500.

[0071] It should be noted that the function of the microcrystalline copper powder electroplating layer 500 of the liquid flow heat dissipation cavity 20 is the same as that of Example 2. The function of the flow blocker 220 of this embodiment is to block the refrigerant, prolong the flow time of the refrigerant in the liquid flow heat dissipation cavity 20, and the flow blocker 220 can also increase the surface area of ​​the middle partition 200, thereby improving the heat conduction effect with the refrigerant.

[0072] The shape of the flow-blocking member 220 of this embodiment is specifically cylindrical. It should also be noted that the shape of the flow-blocking member 220 of the utility model is not limited to the cylindrical shape in this embodiment, and can be cylindrical, prism-shaped, rectangular, or other irregular shapes, such as Figures 6 to 9 As shown, any shape that can block the flow of the refrigerant can be used as the shape of the blocking member 220 of the present invention.

[0073] Compared with Example 2, this embodiment prolongs the flow time of the refrigerant inside the liquid flow heat dissipation cavity 20 and increases the contact time between the refrigerant and the liquid flow heat dissipation cavity 20 by adding the baffle 220; at the same time, adding the baffle 220 can increase the surface area and increase the contact area with the refrigerant, thereby further improving the heat dissipation effect.

[0074] Example 5

[0075] A 3D microcrystalline heat dissipation device, such as Fig.10 and Fig.11 As shown, other features are the same as those of Example 1, and also have the following features: the upper cover 100 is provided with a cover body 110 and a baffle 140 for slowing down the flow rate of the refrigerant, the baffle 140 is fixedly connected to the upper surface of the inner side of the cover body 110, and the baffle 140 is located inside the liquid flow heat dissipation cavity 20.

[0076] It should be noted that the baffle 140 has a function of blocking the refrigerant and prolonging the time the refrigerant flows through the liquid heat dissipation cavity 20 .

[0077] Compared with Example 1, this embodiment prolongs the flow time of the refrigerant inside the liquid flow heat dissipation cavity 20 by adding a baffle 140, and increases the contact time between the refrigerant and the liquid flow heat dissipation cavity 20, thereby further improving the heat dissipation effect.

[0078] Example 6

[0079] A 3D microcrystalline heat dissipation device, such as Fig.12 As shown, other features are the same as those of embodiment 1, and also have the following features: the upper cover 100 is also provided with a second shovel-tooth heat sink 150 , and the second shovel-tooth heat sink 150 is fixedly connected to the upper surface of the cover body 110 of the upper cover 100 .

[0080] It should be noted that the second skived heat sink 150 has a plurality of parallel metal sheets and is prepared by a skived machine. The second skived heat sink 150 increases the surface area of ​​the upper cover 100 and allows heat to be quickly transferred to the external environment.

[0081] In this embodiment, a second skived-tooth heat sink 150 is added to the upper cover 100 so that the liquid heat sink can take away heat not only through the flowing refrigerant but also through the air cooling effect of the second skived-tooth heat sink 150 .

[0082] Example 7

[0083] A 3D microcrystalline heat dissipation device, such as Fig.13 As shown, other features are the same as those of Example 1, and also have the following features: the middle partition 200 is provided with a plate body 210, a plurality of baffles 220 for slowing down the flow rate of the refrigerant and increasing the heat dissipation area, and a first shovel-tooth heat sink 230, all baffles 220 are welded to the upper surface of the plate body 210, and the baffles 220 are located inside the liquid flow heat dissipation cavity 20, the first shovel-tooth heat sink 230 is fixedly connected to the lower surface of the plate body 210 of the middle partition 200, and the first shovel-tooth heat sink 230 is located inside the liquid flow heat dissipation cavity 20.

[0084] The lower wall surface of the liquid heat dissipation cavity 20 is provided with a microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid heat dissipation cavity 20 is not provided with a microcrystalline copper powder electroplating layer 500. Specifically, the lower wall surface of the liquid heat dissipation cavity 20 except the first skived heat sink 230 is uniformly provided with a microcrystalline copper powder electroplating layer 500, and the outer surface of the baffle 220 is also provided with a microcrystalline copper powder electroplating layer 500.

[0085] The first skived heat sink 230 of this embodiment has a plurality of parallel metal sheets, and the first skived heat sink 230 is prepared by a skiving machine. The first skived heat sink 230 has a blocking effect on the refrigerant, prolongs the flow time of the refrigerant in the liquid heat dissipation cavity 20, and increases the surface area of ​​the middle partition 200. However, the outer surface of the first skived heat sink 230 of this embodiment is not provided with a microcrystalline copper powder electroplating layer 500.

[0086] In this embodiment, a baffle 220 and a first shovel-tooth heat sink 230 are simultaneously provided inside the liquid flow heat dissipation cavity 20, so that the flow time of the refrigerant in the liquid flow heat dissipation cavity 20 is prolonged by the baffle 220 and the first shovel-tooth heat sink 230, thereby improving the heat exchange time with the refrigerant.

[0087] Example 8

[0088] A 3D microcrystalline heat dissipation device, such as Fig.14As shown, other features are the same as those of Example 1, and also have the following features: the upper cover 100 is provided with a cover body 110 and a baffle 140 for slowing down the flow rate of the refrigerant, the baffle 140 is fixedly connected to the upper surface of the inner side of the cover body 110, and specifically, the baffle 140 is located inside the liquid flow heat dissipation cavity 20.

[0089] The middle partition 200 is provided with a plate body 210 and a plurality of baffles 220 for slowing down the flow rate of the refrigerant and increasing the heat dissipation area. All baffles 220 are fixedly connected to the upper surface of the plate, and the baffles 220 are located inside the liquid flow heat dissipation cavity 20.

[0090] The present embodiment further provides a heat pipe 400 for heat dissipation, the heat pipe 400 is fixedly connected to the interior of the liquid heat dissipation cavity 20, the two ends of the heat pipe 400 are closed, the inner wall surface of the heat pipe 400 is provided with a microcrystalline copper powder electroplating layer 500, the interior of the heat pipe 400 is in a vacuum state and filled with a refrigerant. The lower wall surface of the liquid heat dissipation cavity 20 is entirely provided with a microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid heat dissipation cavity 20 is not provided with a microcrystalline copper powder electroplating layer 500.

[0091] The outer surface of the heat pipe 400 of the present invention is provided with a microcrystalline copper powder electroplating layer 500, or the outer surface of the heat pipe 400 is not provided with a microcrystalline copper powder electroplating layer 500. In this embodiment, the outer surface of the heat pipe 400 is provided with a microcrystalline copper powder electroplating layer 500. Compared with not providing the microcrystalline copper powder electroplating layer 500, adding the microcrystalline copper powder electroplating layer 500 on the outer surface of the heat pipe 400 can further improve the coverage of the microcrystalline copper powder electroplating layer 500, thereby further improving the heat dissipation effect.

[0092] It should be noted that the lower wall surface of the liquid heat dissipation cavity 20 of this embodiment is entirely provided with a microcrystalline copper powder electroplating layer 500. It should also be noted that the heat pipe 400 of this embodiment has a flow-blocking effect on the refrigerant, prolonging the flow time of the refrigerant in the liquid heat dissipation cavity 20, and the heat pipe 400 can also bring the heat of the heat source to the refrigerant in the capillary phase change heat conduction cavity 10 through the gas-liquid phase change of the refrigerant, just like the capillary phase change heat conduction cavity 10.

[0093] In this embodiment, a baffle 220 and a heat pipe 400 are simultaneously provided inside the liquid flow heat dissipation cavity 20, so that the flow time of the refrigerant in the liquid flow heat dissipation cavity 20 is prolonged by the baffle 220 and the heat pipe 400, thereby increasing the heat exchange time with the refrigerant, and performing a gas-liquid phase change of the refrigerant inside the heat pipe 400, thereby further improving the heat dissipation effect.

[0094] Example 9

[0095] A 3D microcrystalline heat dissipation device, such as Fig.15As shown, other features are the same as those of Example 1, and also have the following features: the upper cover 100 is provided with a cover body 110, a baffle 140 for slowing down the flow rate of the refrigerant, and a second shovel-tooth heat sink 150, the baffle 140 is fixedly connected to the inner upper surface of the cover body 110, and the baffle 140 is located inside the liquid flow heat dissipation cavity 20; the second shovel-tooth heat sink 150 is fixedly connected to the upper surface of the cover body 110 of the upper cover 100.

[0096] The middle partition 200 is provided with a plate body 210 and a plurality of flow-blocking members 220 for slowing down the flow rate of the refrigerant and increasing the heat dissipation area, all of which are fixedly connected to the upper surface of the plate, and the flow-blocking members 220 are located inside the liquid heat dissipation cavity 20. The lower wall surface of the liquid heat dissipation cavity 20 is entirely provided with a microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid heat dissipation cavity 20 is not provided with a microcrystalline copper powder electroplating layer 500.

[0097] It has been verified through implementation that, under the same other conditions, the heat dissipation efficiency of the 3D microcrystalline heat dissipation device in this embodiment is improved by more than 68% compared with the 3D microcrystalline heat dissipation device in Embodiment 1.

[0098] Example 10

[0099] A 3D microcrystalline heat dissipation device, such as Fig.16 As shown, other features are the same as those of Example 1, and also have the following features: the upper cover 100 is provided with a cover body 110 and a second shovel-tooth heat sink 150, the spoiler 140 is fixedly connected to the lower surface of the cover body 110, and the second shovel-tooth heat sink 150 is fixedly connected to the upper surface of the cover body 110 of the upper cover 100.

[0100] The middle partition 200 is provided with a plate body 210 and a plurality of flow-blocking members 220 for slowing down the flow rate of the refrigerant and increasing the heat dissipation area, all of which are fixedly connected to the upper surface of the plate, and the flow-blocking members 220 are located inside the liquid heat dissipation cavity 20. The lower wall surface of the liquid heat dissipation cavity 20 is entirely provided with a microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid heat dissipation cavity 20 is not provided with a microcrystalline copper powder electroplating layer 500.

[0101] In this embodiment, a second skived-tooth heat sink 150 is added to the upper cover 100 so that the liquid heat sink can take away heat not only through the flowing refrigerant but also through the air cooling effect of the second skived-tooth heat sink 150 .

[0102] Embodiment 11

[0103] A 3D microcrystalline heat dissipation device, such as Fig.17 As shown, other features are the same as those of embodiment 9, except that the lower surface of the lower cover 300 of the utility model can be flat or can be protruding downward, and the protruding portion can be in contact with the heat source, such as Fig.17The lower surface of the lower cover 300 is concave upward, such as Fig.18 The recessed portion can be embedded with the heat source. The specific shape of the lower cover 300 of the utility model can be determined according to the actual application scenario so as to fit the heat source and ensure the heat dissipation effect.

[0104] The lower cover 300 of this embodiment can be adjusted accordingly according to the position of the heat source, so as to fit the heat source conveniently.

[0105] Example 12

[0106] A 3D microcrystalline heat dissipation device, such as Fig.19 As shown, other features are the same as those of Example 9, except that: the outer surface of all or part of the baffles 140 of the utility model is provided with a microcrystalline copper powder electroplating layer 500. In this embodiment, all the baffles 140 are provided with a microcrystalline copper powder electroplating layer 500. Compared with the microcrystalline copper powder electroplating layer 500 being provided on part of the baffles 140, the microcrystalline copper powder electroplating layer 500 is provided on all the baffles 140, which can further improve the coverage of the microcrystalline copper powder electroplating layer 500 and further improve the heat dissipation effect.

[0107] The lower wall surface of the liquid flow heat dissipation cavity 20 is entirely provided with a microcrystalline copper powder electroplating layer 500 , and the upper wall surface of the liquid flow heat dissipation cavity 20 is entirely provided with a microcrystalline copper powder electroplating layer 500 .

[0108] Compared with Example 3, this embodiment can increase the flow time of the refrigerant through the baffle 140, and the baffle 140 of this embodiment is also provided with a microcrystalline copper powder electroplating layer 500, so the coverage area of ​​the microcrystalline copper powder electroplating layer 500 is further expanded, further improving the heat dissipation effect.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit the protection scope of the utility model. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. A 3D microcrystalline heat dissipation device, characterized in that: A capillary phase change heat conduction cavity and a liquid flow heat dissipation cavity are provided which fit each other; The capillary phase change heat conduction cavity is a sealed structure, and the liquid flow heat dissipation cavity is sealedly connected with a liquid inlet pipe and a liquid outlet pipe.

2. The 3D microcrystalline heat dissipation device according to claim 1, characterized in that: The liquid flow heat dissipation cavity is an immersed microcrystalline structure liquid flow heat dissipation cavity; A microcrystalline copper powder electroplating layer is arranged at the bottom surface of the inner cavity of the immersed microcrystalline structure liquid flow heat dissipation cavity.

3. The 3D microcrystalline heat dissipation device according to claim 2, characterized in that: The lower wall surface of the liquid flow heat dissipation cavity is partially or entirely provided with a microcrystalline copper powder electroplating layer, and the upper wall surface of the liquid flow heat dissipation cavity is not provided with a microcrystalline copper powder electroplating layer; or The lower wall surface of the liquid flow heat dissipation cavity is partially or entirely provided with a microcrystalline copper powder electroplating layer, and the upper wall surface of the liquid flow heat dissipation cavity is partially or entirely provided with a microcrystalline copper powder electroplating layer.

4. The 3D microcrystalline heat dissipation device according to any one of claims 1 to 3, characterized in that: A lower cover, a middle partition and an upper cover are provided. The middle partition is sealed and covered on the lower cover to form the capillary phase change heat conduction cavity. The upper cover is sealed and buckled on the middle partition from above to form the liquid flow heat dissipation cavity.

5. The 3D microcrystalline heat dissipation device according to claim 4, characterized in that: The middle partition is provided with a plate body and a plurality of flow-blocking members for slowing down the flow rate of the refrigerant and increasing the heat dissipation area, the flow-blocking members are welded or integrally connected to the upper surface of the plate body, and the flow-blocking members are located inside the liquid flow heat dissipation cavity; A microcrystalline copper powder electroplating layer is provided on part or all of the plate body, and a microcrystalline copper powder electroplating layer is provided on the outer surface of all or part of the baffle.

6. The 3D microcrystalline heat dissipation device according to claim 4, characterized in that: The middle partition is also provided with a first scooped-tooth heat sink, which is fixedly connected to the upper surface of the plate body of the middle partition, and is located inside the liquid flow heat dissipation cavity.

7. The 3D microcrystalline heat dissipation device according to claim 4, characterized in that: A heat pipe for heat dissipation is also provided, the heat pipe is fixedly connected to the inside of the liquid heat dissipation cavity, the two ends of the heat pipe are closed, the inner wall surface of the heat pipe is provided with a microcrystalline copper powder electroplating layer, the interior of the heat pipe is in a vacuum state and filled with a refrigerant; The outer surface of the heat pipe is provided with a microcrystalline copper powder electroplating layer; or the outer surface of the heat pipe is not provided with a microcrystalline copper powder electroplating layer.

8. The 3D microcrystalline heat dissipation device according to claim 4, characterized in that: The upper cover is provided with a cover body and a baffle for slowing down the flow rate of the refrigerant, the baffle is fixedly connected to the upper surface of the inner side of the cover body, and the baffle is located inside the liquid flow heat dissipation cavity; The cover body is partially or entirely provided with a microcrystalline copper powder electroplating layer, and the outer surface of all or part of the baffle is provided with or not provided with a microcrystalline copper powder electroplating layer.

9. The 3D microcrystalline heat dissipation device according to claim 4, characterized in that: The upper cover is also provided with a second scooped-tooth heat sink, and the second scooped-tooth heat sink is fixedly connected to the upper surface of the cover body of the upper cover.

10. The 3D microcrystalline heat dissipation device according to any one of claims 1 to 3, characterized in that: The inner wall surface of the capillary phase change heat conduction cavity is provided with a microcrystalline copper powder electroplating layer, and the interior of the capillary phase change heat conduction cavity is in a vacuum state and filled with a refrigerant.

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