Vacuum formic acid furnace

Abstract

The utility model relates to the technical field of vacuum furnaces, in particular to a vacuum formic acid furnace which comprises a second gate valve, a third gate valve, a fourth gate valve, a fifth gate valve, a plurality of baffle plates, a second preheating area, a welding area and a cooling area. The inlet end of the first preheating area is provided with the first gate valve, the inlet end of the second preheating area is provided with the second gate valve, the outlet end of the second preheating area is provided with the third gate valve, the inlet end of the welding area is provided with the third gate valve, the outlet end of the welding area is provided with the fourth gate valve, and the inlet end of the cooling area is provided with the fourth gate valve. The fifth gate valve is arranged at the outlet end of the cooling area, and the baffle plates are arranged at the inlet and outlet ends of the second preheating area and the welding area. The shielding plate is arranged at the inlet and outlet to shield infrared light, light leakage is reduced, and the heating rate is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum furnaces, in particular to a vacuum formic acid furnace. Background Art

[0002] A vacuum gate valve is a valve used to isolate a vacuum pipeline and block the flow of air, and is an important vacuum component. When semiconductor chips are packaged, it needs to be carried out in a vacuum environment, which can generally be achieved by adopting the form of a vacuum reflow soldering furnace. The vacuum reflow soldering furnace is provided with multiple temperature zones, which are divided into a preheating zone, a soldering zone and a cooling zone. Among them, the preheating zone is protected by nitrogen and is not a completely low-oxygen environment; the soldering zone is a vacuum environment. After the chips are soldered, the door connecting the soldering zone and the cooling zone is opened, and the chips enter the cooling zone from the soldering zone. At the same time, the door connecting the soldering zone and the preheating zone is opened, and the preheated chips are sent into the soldering zone for soldering. The existing vacuum sintering furnace has a slow heating rate. Summary of the Invention

[0003] The utility model provides a vacuum formic acid furnace to solve the problem of slow heating rate of the existing vacuum sintering furnace.

[0004] The utility model provides a vacuum formic acid furnace, which includes a second gate valve, a third gate valve, a fourth gate valve, a fifth gate valve, a plurality of baffle plates, a second preheating zone, a soldering zone and a cooling zone; the second gate valve is arranged at the inlet end of the second preheating zone, the third gate valve is arranged at the outlet end of the second preheating zone, the third gate valve is arranged at the inlet end of the soldering zone, the fourth gate valve is arranged at the outlet end of the soldering zone, the fourth gate valve is arranged at the inlet end of the cooling zone, the fifth gate valve is arranged at the outlet end of the cooling zone, and the baffle plates are arranged at the inlet and outlet ends of the second preheating zone and the soldering zone.

[0005] According to the vacuum formic acid furnace of the utility model, it further includes a plurality of inlet and outlet roller assemblies. The inlet and outlet roller assemblies are arranged at the inlet and outlet ends of the second preheating zone and the soldering zone. The inlet and outlet roller assemblies include rollers, roller shafts and support seats. The support seats are arranged at the inlet and outlet ends of the second preheating zone and the soldering zone. The roller shafts penetrate through the support seats. One side of the roller shaft is provided with the rollers, and the other side of the rollers is provided with baffle plate holes penetrating through the baffle plates.

[0006] According to the vacuum formic acid furnace of the utility model, it further includes a first gate valve and a first preheating zone. The first preheating zone is arranged in the previous working station area of the second preheating zone. The first gate valve is arranged at the inlet end of the first preheating zone, and the second gate valve is arranged at the outlet end of the first preheating zone.

[0007] The vacuum formic acid furnace according to the present utility model further includes a lifting mechanism, and the lifting mechanism is arranged below the cooling zone.

[0008] The vacuum formic acid furnace according to the present utility model further includes a driving wheel and a guiding wheel, and the driving wheel and the guiding wheel are arranged on both inner sides of the first preheating zone, the second preheating zone, the welding zone and the cooling zone.

[0009] The vacuum formic acid furnace according to the present utility model further includes a transmission mechanism, and the transmission mechanism is arranged on both outer sides of the first preheating zone, the second preheating zone, the welding zone and the cooling zone, and the transmission mechanism drives the driving wheel.

[0010] For the vacuum formic acid furnace according to the present utility model, the transmission mechanism is a roller, a gear, a belt or a chain.

[0011] The vacuum formic acid furnace according to the present utility model further includes an upper heating pipe and a lower heating pipe; the upper heating pipe is arranged inside the sealing cavity upper cover of the first preheating zone, the second preheating zone and the welding zone, and the lower heating pipe is arranged inside the lower cavity of the first preheating zone, the second preheating zone and the welding zone.

[0012] The vacuum formic acid furnace according to the present utility model further includes a power semiconductor tray assembly, and the power semiconductor tray assembly is arranged inside the second preheating zone, the welding zone and the cooling zone. The power semiconductor tray assembly includes at least one workpiece and a power semiconductor tray, the workpiece is arranged on the power semiconductor tray, and the power semiconductor tray is of a hollow structure.

[0013] For the vacuum formic acid furnace according to the present utility model, the power semiconductor tray includes a tray frame, at least two support legs and at least one workpiece limiting block. The support legs are symmetrically arranged on both sides of the tray frame, the workpiece limiting block is arranged on both sides of the tray frame, the support legs support the workpiece, and the workpiece limiting block limits and guides the workpiece.

[0014] For the vacuum formic acid furnace according to the present utility model, the first preheating zone is used to provide a vacuum environment, an inert gas environment or a reducing gas environment during the workpiece preheating stage;

[0015] The second preheating zone is used to provide a vacuum environment, an inert gas environment or a reducing gas environment during the workpiece preheating stage;

[0016] The welding zone is used to provide a vacuum environment, an inert gas environment or a reducing gas environment during the workpiece welding stage;

[0017] The cooling zone is used to provide a vacuum environment, an inert gas environment or a reducing gas environment during the workpiece cooling stage.

[0018] The utility model arranges a plurality of limiting components on both sides of the fixture in the cooling area. When the lifting mechanism lifts and lowers the fixture, it limits the fixture and increases buffering during the lifting process to reduce the impact on the workpiece on the fixture. The shielding plate is arranged at the inlet and outlet to block infrared rays, reduce light leakage, and improve the heating rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following-described drawings are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a schematic front view structure diagram of the vacuum formic acid furnace;

[0021] Figure 2 It is a schematic perspective view structure diagram of the cooling area;

[0022] Figure 3 It is a schematic perspective view structure diagram of the lower cavity of the cooling area;

[0023] Figure 4 It is a schematic front view structure diagram of the limiting component;

[0024] Figure 5 It is a schematic sectional view structure diagram of the limiting component;

[0025] Figure 6 It is a schematic structure diagram of the lower cavity of the welding area;

[0026] Figure 7 It is a schematic enlarged view of partial area A;

[0027] Figure 8 It is a schematic perspective view structure diagram of the shielding plate

[0028] Figure 9 It is a schematic perspective view structure diagram of the power semiconductor tray assembly;

[0029] Figure 10 It is a schematic perspective view structure diagram of the power semiconductor tray;

[0030] Reference numerals: 1, first plug valve; 2, second plug valve; 3, third plug valve; 4, fourth plug valve; 5, fifth plug valve; 6, first preheating zone; 7, second preheating zone; 8, welding zone; 9, cooling zone; 10, power semiconductor tray assembly; 61, baffle plate; 62, roller; 63, roller shaft; 64, baffle plate hole; 65, support base; 91, cooling plate; 92, upper cover of the sealing cavity; 93, lower cavity; 94, lifting mechanism; 95, driving wheel; 96, guide wheel; 97, heat dissipation water tank; 98, limiting assembly; 981, limiting seat; 982, nut; 983, spring; 984, bolt; 9811, groove; 101, power semiconductor tray; 102, workpiece; 1011, tray frame; 1012, support leg; 1013, workpiece limiting block. Detailed implementation manners

[0031] The following further describes in detail the implementation manners of the present utility model in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0032] In the description of the embodiments of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the embodiments of the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0033] In the description of the embodiments of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific situations.

[0034] In the embodiments of the present utility model, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply indicates that the horizontal height of the first feature is less than that of the second feature.

[0035] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0036] The following combines Figure 1-10 Describe a vacuum formic acid furnace according to an embodiment of the present utility model, including a second plug valve 2, a third plug valve 3, a fourth plug valve 4, a fifth plug valve 5, a limit component 98, a plurality of baffle plates 61, a second preheating zone 7, a welding zone 8, and a cooling zone 9; a second plug valve 2 is arranged at the inlet end of the second preheating zone 7, a third plug valve 3 is arranged at the outlet end of the second preheating zone 7, a third plug valve 3 is arranged at the inlet end of the welding zone 8, a fourth plug valve 4 is arranged at the outlet end of the welding zone 8, a fourth plug valve 4 is arranged at the inlet end of the cooling zone 9, a fifth plug valve 5 is arranged at the outlet end of the cooling zone 9, and the limit component 98 is arranged on both sides inside the cooling zone 9. Baffle plates 61 are arranged at the inlet and outlet ends of the second preheating zone 7 and the welding zone 8.

[0037] In some embodiments, it further includes a plurality of inlet and outlet roller assemblies. Inlet and outlet roller assemblies are arranged at the inlet and outlet ends of the second preheating zone 7 and the welding zone 8. The inlet and outlet roller assemblies include rollers 62, roller shafts 63, and support seats 65. The support seats 65 are arranged at the inlet and outlet ends of the second preheating zone 7 and the welding zone 8. The roller shafts 63 pass through the support seats 65. A roller 62 is arranged on one side of the roller shaft 63, and a baffle plate hole 64 passing through the baffle plate is arranged on the other side of the roller 62. The baffle plate 61 is arranged to block infrared light at the inlet and outlet, reducing light leakage and improving the heating rate.

[0038] In some embodiments, the limiting assembly 98 includes a limiting seat 981, a bolt 984, a nut 982, and an elastic member 983; the elastic member is preferably a spring 983. The limiting seat 981 is fixedly arranged on both sides inside the cooling zone 9. The nut 982 is arranged above the limiting seat 981. The bolt 984 is arranged below the limiting seat 981 and passes through the limiting seat 981 to be connected with the nut 982. A groove 9811 is arranged on the limiting seat 981 at the position where the bolt 984 passes through. The elastic member 983 is sleeved on the bolt 984 and partially arranged in the groove 9811. A heat dissipation water tank 97 is arranged around the outside of the lower cavity of the cooling zone 9. A fan is arranged inside the sealing cavity upper cover 92 of the cooling zone 92. When the lifting mechanism 94 lifts the power semiconductor tray assembly 10, i.e., the jig, the limiting assembly 98 plays a role in limiting and buffering.

[0039] In some embodiments, it further includes a first plug valve 1 and a first preheating zone 6. The first preheating zone 6 is arranged in the previous station area of the second preheating zone 7. A first plug valve 1 is arranged at the inlet end of the first preheating zone 6, and a second plug valve 2 is arranged at the outlet end of the first preheating zone 6. According to the requirements of the process, more preheating zones or more cooling zones can also be arranged.

[0040] In some embodiments, it further includes a lifting mechanism 94, and the lifting mechanism 94 is arranged below the cooling zone 9.

[0041] In some embodiments, it further includes a driving wheel 95 and a guiding wheel 96. The driving wheel 95 and the guiding wheel 96 are arranged on both sides inside the first preheating zone 6, the second preheating zone 7, the welding zone 8, and the cooling zone 9. Quartz heating plates are arranged inside the first preheating zone 6, the second preheating zone 7, and the welding zone 8.

[0042] In some embodiments, it further includes a transmission mechanism. The transmission mechanism is arranged on both sides outside the first preheating zone 6, the second preheating zone 7, the welding zone 8, and the cooling zone 9, and the transmission mechanism drives the driving wheel 95.

[0043] In some embodiments, the transmission mechanism is a roller, a gear, a belt, or a chain.

[0044] In some embodiments, it further includes an upper heating pipe and a lower heating pipe; the upper heating pipe is arranged inside the sealing cavity upper cover of the first preheating zone 6, the second preheating zone 7, and the welding zone 8, and the lower heating pipe is arranged inside the lower cavity of the first preheating zone 6, the second preheating zone 7, and the welding zone 8.

[0045] In some embodiments, it further includes a power semiconductor tray assembly 10. The power semiconductor tray assembly 10 is disposed inside the second preheating zone 7, the welding zone 8, and the cooling zone 9. The power semiconductor tray assembly 10 circulates in the first preheating zone 6, the second preheating zone 7, the welding zone 8, and the cooling zone 9 according to the working process. The power semiconductor tray assembly 10 includes at least one workpiece 102 and a power semiconductor tray 101. The workpiece 102 is disposed on the power semiconductor tray 101, and the power semiconductor tray 101 is a hollow structure.

[0046] In some embodiments, the power semiconductor tray 101 includes a tray frame 1011, at least two support legs 1012, and at least one workpiece limiting block 1013. The support legs 1012 are symmetrically disposed on both sides of the tray frame 1011. The workpiece limiting blocks 1013 are disposed on both sides of the tray frame 1011. The support legs 1012 support the workpiece, and the workpiece limiting blocks 1013 limit and guide the workpiece 102.

[0047] In some embodiments, the first preheating zone 6 is used to provide a vacuum environment, an inert gas environment, or a reducing gas environment during the workpiece preheating stage;

[0048] The second preheating zone 7 is used to provide a vacuum environment, an inert gas environment, or a reducing gas environment during the workpiece preheating stage;

[0049] The welding zone 8 is used to provide a vacuum environment, an inert gas environment, or a reducing gas environment during the workpiece welding stage;

[0050] The cooling zone 9 is used to provide a vacuum environment, an inert gas environment, or a reducing gas environment during the workpiece cooling stage.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A vacuum formic acid furnace, characterized in that: It includes a second gate valve, a third gate valve, a fourth gate valve, a fifth gate valve, a plurality of baffles, a second preheating zone, a welding zone and a cooling zone; the second gate valve is arranged at the inlet end of the second preheating zone, the third gate valve is arranged at the outlet end of the second preheating zone, the third gate valve is arranged at the inlet end of the welding zone, the fourth gate valve is arranged at the outlet end of the welding zone, the fourth gate valve is arranged at the inlet end of the cooling zone, the fifth gate valve is arranged at the outlet end of the cooling zone, and the baffles are arranged at the inlet and outlet ends of the second preheating zone and the welding zone.

2. The vacuum formic acid furnace according to claim 1, characterized in that: It also includes multiple import and export roller assemblies, which are arranged at the import and export ends of the second preheating zone and the welding zone, and the import and export roller assemblies include rollers, roller shafts and support seats, and the support seats are arranged at the import and export ends of the second preheating zone and the welding zone, the roller shaft passes through the support seat, the roller is arranged on one side of the roller shaft, and a baffle plate hole passing through the baffle plate is arranged on the other side of the roller.

3. The vacuum formic acid furnace according to claim 1, characterized in that: It also includes a first gate valve and a first preheating zone, wherein the first preheating zone is arranged in the upper station zone of the second preheating zone, the first gate valve is arranged at the inlet end of the first preheating zone, and the second gate valve is arranged at the outlet end of the first preheating zone.

4. The vacuum formic acid furnace according to claim 1, characterized in that: It also includes a lifting mechanism, which is arranged below the cooling zone.

5. The vacuum formic acid furnace according to claim 3, characterized in that: It also includes a power wheel and a guide wheel, and the power wheel and the guide wheel are arranged on both sides of the inside of the first preheating zone, the second preheating zone, the welding zone and the cooling zone.

6. The vacuum formic acid furnace according to claim 5, characterized in that: It also includes a transmission mechanism, and the transmission mechanism is arranged on both sides of the outside of the first preheating zone, the second preheating zone, the welding zone and the cooling zone, and the transmission mechanism drives the power wheel.

7. The vacuum formic acid furnace according to claim 6, characterized in that: The transmission mechanism is a roller, a gear, a belt or a chain.

8. The vacuum formic acid furnace according to claim 3, characterized in that: It also includes an upper heating tube and a lower heating tube; the upper heating tube is arranged inside the upper cover of the sealed cavity of the first preheating zone, the second preheating zone and the welding zone, and the lower heating tube is arranged inside the lower cavity of the first preheating zone, the second preheating zone and the welding zone.

9. The vacuum formic acid furnace according to claim 3, characterized in that: It also includes a power semiconductor tray assembly, which is arranged inside the second preheating zone, the welding zone and the cooling zone. The power semiconductor tray assembly includes at least one workpiece and a power semiconductor tray. The workpiece is arranged on the power semiconductor tray, and the power semiconductor tray is a hollow structure.

10. The vacuum formic acid furnace according to claim 9, characterized in that: The power semiconductor tray includes a tray frame, at least two supporting legs and at least one workpiece limiting block. The supporting legs are symmetrically arranged on both sides of the tray frame. The workpiece limiting blocks are arranged on both sides of the tray frame. The supporting legs support the workpiece, and the workpiece limiting blocks limit and guide the workpiece.

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