Multi-channel semiconductor detection equipment

Abstract

The utility model relates to a multichannel semiconductor detection device, which is used for semiconductor detection, and comprises a substrate, the substrate is fixedly connected with a plurality of storage assemblies, the plurality of storage assemblies are divided into two groups, and a detection assembly is arranged between the two groups of storage assemblies; the detection assembly comprises a detection plate fixedly arranged on the substrate, the detection plate is provided with a plurality of detection channels matched with the conveying assembly, and the detection plate is fixedly connected with a photographing assembly and a marking assembly which are matched with the semiconductor; the substrate is fixedly connected with a conveying assembly, and the conveying assembly drives the semiconductors to be conveyed from one set of storage assembly to the other set of storage assembly. Through cooperation of the photographing assembly and the marking assembly, the unqualified products can be systematically recorded and marked, the detection difficulty is reduced, and the detection efficiency is improved.

Description

Technical Field

[0001] The utility model relates to semiconductor processing, and more specifically, the utility model further relates to a multi-channel semiconductor detection device. Background Art

[0002] A semiconductor refers to a material with controllable conductivity, ranging from an insulator to a conductor. From the perspectives of science and technology and economic development, semiconductors affect people's daily work and life.

[0003] When detecting the appearance defects and material shortage of semiconductors (similar to resistors, inductors, etc.), the equipment often scans through, and then the system records the specific positions of unqualified products. Subsequently, manual inspection of local semiconductors is carried out, and the equipment only records without substantial marking. Therefore, if the materials are misaligned during subsequent placement, qualified products will be identified as unqualified, and unqualified products will be considered qualified, affecting subsequent production and processing efficiency. Summary of the Utility Model

[0004] To achieve the purpose of the utility model, the technical solution adopted by the utility model is as follows: A multi-channel semiconductor detection device for semiconductor detection, comprising: a substrate, the substrate is fixedly connected with a plurality of storage components, and the plurality of storage components are divided into two groups, and a detection component is arranged between the two groups of storage components;

[0005] The detection component includes: a detection board fixedly arranged on the substrate, the detection board is provided with a plurality of detection channels for cooperating with the conveying component, and the detection board is fixedly connected with a photographing component and a marking component for cooperating with the semiconductor;

[0006] The substrate is fixedly connected with a conveying component, and the conveying component drives the semiconductor to be transported from one group of storage components to another group of storage components.

[0007] Preferably, the conveying component includes: a plurality of conveying shafts rotatably arranged on the lower surface of the detection board, the conveying shafts are coaxially fixedly connected with a plurality of pinwheels, the detection channels are provided with conveying grooves for cooperating with the pinwheels, and a plurality of driving pins for cooperating with the semiconductor are arranged in a circumferential array on the pinwheels, and the substrate is fixedly connected with a driving motor for driving the conveying shafts to rotate.

[0008] Preferably, the plurality of conveying shafts are connected with a support frame through bearings, the support frame is fixedly connected with the substrate, and the conveying shafts pass through the support frame and are provided with handwheels.

[0009] Preferably, the photographing component includes: a plurality of positioning plates, the plurality of positioning plates are fixedly arranged on the upper surface and the lower surface of the detection board, each positioning plate is connected with a detection camera through an adjusting component, and an annular light source device fixed to the positioning plate is arranged directly below the detection camera.

[0010] Preferably, a sealing plate is fixedly connected to the upper surface of the detection plate, and the sealing plate is provided with through grooves that cooperate with the photographing assembly, the conveying assembly, and the marking assembly.

[0011] Preferably, the marking assembly includes: a support plate fixedly arranged on the substrate, the support plate is arranged between the detection plate and the substrate, a slide rail is fixedly connected to the upper surface of the support plate, the slide rail is fitted with a displacement plate through a slider, the support plate is fixedly connected with a displacement cylinder, and the telescopic rod of the displacement cylinder is fixedly connected to the bottom of the displacement plate. A marking plate is arranged directly above the detection plate, and the marking plate is fixedly connected to the displacement plate through a connecting plate; a plurality of marking cylinders are fixedly connected to the marking plate, and the marking plate is further provided with a paper tape assembly. The telescopic rod of the marking cylinder cooperates with the paper tape assembly to drive the semiconductor for marking.

[0012] Preferably, the paper tape assembly includes: a plurality of rollers, a driving wheel, and a storage wheel. The paper tape passes through the plurality of rollers from the storage wheel and is wound around the driving wheel, and the plurality of rollers drive the paper tape to be arranged directly below the marking cylinder.

[0013] Preferably, the storage assembly includes: a material rack fixedly connected to the substrate, the material rack is fixedly connected with a conveying motor, the output shaft of the conveying motor is detachably connected with a material reel, and the material reel is provided with a plurality of winding stations corresponding to the detection channels.

[0014] Preferably, a guide wheel is fixedly connected to one side of the material rack close to the substrate.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0016] 1. By the cooperation of the photographing assembly and the marking assembly, not only can unqualified products be systematically recorded, but also unqualified products can be marked, reducing the detection difficulty and improving the detection efficiency.

[0017] 2. The semiconductor is displaced in the detection channel by the pin wheel, and the overall conveying accuracy is improved through the cooperation of the driving pins and the semiconductor.

[0018] 3. The hand wheel drives the conveying shaft to rotate, and drives the pin wheel to rotate, which is convenient for driving the driving pins of the pin wheel to contact the semiconductor, reducing the phenomenon of knocking when the pin wheel contacts the semiconductor, and improving the conveying accuracy.

[0019] 4. The sealing plate can seal the detection channel, reducing the phenomenon that the semiconductor disengages from the driving pins during the conveying process.

[0020] 5. The marking cylinder drives the paper tape assembly to mark unqualified semiconductors, reducing the detection difficulty and improving the detection efficiency.

[0021] 6. The guide wheels guide the semiconductor materials, reducing the phenomenon of the semiconductor hitting when entering the detection channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 FIG. 1 is a schematic diagram of the overall structure of the multi-channel semiconductor detection device of the present utility model;

[0023] Figure 2 FIG. 2 is a schematic diagram of a partial structure of the multi-channel semiconductor detection device of the present utility model Figure 1 ;

[0024] Figure 3 FIG. 3 is a schematic diagram of a partial structure of the multi-channel semiconductor detection device of the present utility model Figure 2 ;

[0025] Figure 4 FIG. 4 is an enlarged view of the structure at A of the multi-channel semiconductor detection device of the present utility model Figure 3 of the present utility model.

[0026] In the figure: 1, substrate; 2, detection board; 201, detection channel; 3, conveying shaft; 4, pinwheel; 5, driving motor; 6, support frame; 7, handwheel; 8, positioning board; 9, detection camera; 10, annular light source device; 11, sealing board; 12, support board; 13, slide rail; 14, displacement board; 15, displacement cylinder; 16, marking board; 17, marking cylinder; 18, roller; 19, driving wheel; 20, storage wheel; 21, material rack; 22, conveying motor; 23, material reel; 24, guide wheel. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present

[0028] utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0029] Figures 1 to 4 As shown in FIG. 1, the present utility model provides a technical solution: a multi-channel semiconductor detection device for semiconductor detection, mainly for simultaneous detection of multiple semiconductors, including: a substrate 1, the substrate 1 is fixedly connected with a plurality of storage components, and the plurality of storage components are divided into two groups, and a detection component is arranged between the two groups of storage components.

[0030] The detection component includes: a detection board 2 fixedly arranged on the substrate 1, and the detection board 2 is provided with a plurality of detection channels 201 cooperating with the conveying component.

[0031] Two sets of storage components are respectively arranged on both sides of the substrate 1. The storage component includes: a material rack 21 fixedly connected to the substrate 1, a conveying motor 22 fixedly connected to the material rack 21, a material reel 23 detachably connected to the output shaft of the conveying motor 22. The material reel 23 is provided with a plurality of winding stations corresponding to the detection channel 201. A positioning plate 8 is fixedly connected to the output shaft of the conveying motor 22. The output shaft positions the material reel 23 through the positioning plate 8, and at the same time, the output shaft drives the material reel 23 through positioning.

[0032] One side of the material rack 21 close to the substrate 1 is fixedly connected with a guiding wheel 24. The guiding wheel 24 guides the semiconductor material to reduce the phenomenon of the semiconductor being bumped when entering the detection channel 201.

[0033] The semiconductor is transported from one set of material receiving components to another set of material receiving components, so as to facilitate driving the semiconductor to pass through the detection component for appearance and material shortage detection.

[0034] The substrate 1 is fixedly connected with a conveying component. The conveying component drives the semiconductor to be transported from one set of storage components to another set of storage components.

[0035] The conveying component includes: a plurality of conveying shafts 3 rotatably arranged on the lower surface of the detection plate 2. The conveying shafts 3 are coaxially fixedly connected with a plurality of pinwheels 4. The detection channel 201 is provided with a conveying groove cooperating with the pinwheels 4. A plurality of driving pins cooperating with the semiconductor are arrayed in the circumferential direction of the pinwheels 4. The substrate 1 is fixedly connected with a driving motor 5 for driving the conveying shafts 3 to rotate.

[0036] The driving motor 5 drives the pinwheels 4 to rotate. The pinwheels 4 drive the semiconductor to be transported through the driving pins (the semiconductors are all connected together, and the semiconductor is provided with driving holes cooperating with the driving pins), so as to improve the transportation of the semiconductor from one side of the storage component to the other side of the storage component.

[0037] A plurality of conveying shafts 3 are connected to the support frame 6 through bearings. The support frame 6 is fixedly connected to the substrate 1. The conveying shafts 3 pass through the support frame 6 and are fitted with handwheels 7.

[0038] By driving the conveying shafts 3 to rotate through the handwheels 7 and driving the pinwheels 4 to rotate, it is convenient to drive the driving pins of the pinwheels 4 to contact the semiconductor, reduce the phenomenon of bumping when the pinwheels 4 contact the semiconductor, and improve the conveying accuracy.

[0039] The detection board 2 is fixedly connected with a photographing component and a marking component that cooperate with the semiconductor; the photographing component includes: a plurality of positioning plates 8, and the plurality of positioning plates 8 are fixedly arranged on the upper surface and the lower surface of the detection board 2. Each positioning plate 8 is connected with a detection camera 9 through an adjusting component, and a ring light source device 10 fixed to the positioning plate 8 is arranged directly below the detection camera 9. The adjusting component adopts the existing technology, mainly a structure of a screw driving a slider, driving the adjustment of the detection camera 9 in the height direction and the horizontal plane and the central direction of the ring light source device 10, mainly to solve the problem of calibrating the central position of the detection camera 9.

[0040] A sealing plate 11 is fixedly connected to the upper surface of the detection board 2, and the sealing plate 11 is provided with through grooves that cooperate with the photographing component, the conveying component and the marking component. The main function of the sealing plate 11 is to seal the detection channel 201 and reduce the phenomenon of misalignment during the subsequent semiconductor conveying process.

[0041] The marking component includes: a support plate 12 fixedly arranged on the substrate 1, the support plate 12 is arranged between the detection board 2 and the substrate 1, a slide rail 13 is fixedly connected to the upper surface of the support plate 12, the slide rail 13 is fitted with a displacement plate 14 through a slider, a displacement cylinder 15 is fixedly connected to the support plate 12, the telescopic rod of the displacement cylinder 15 is fixedly connected to the bottom of the displacement plate 14, and a marking plate 16 is arranged directly above the detection board 2. The marking plate 16 is fixedly connected to the displacement plate 14 through a connecting plate. The displacement cylinder 15 drives the displacement plate 14 to reciprocate, and also drives the marking plate 16 to reciprocate accordingly, so as to drive the marking component to cooperate with different detection channels 201.

[0042] A plurality of marking cylinders 17 are fixedly connected to the marking plate 16, and the marking plate 16 is also provided with a paper tape component. The telescopic rod of the marking cylinder 17 cooperates with the paper tape component to drive the semiconductor to be marked. When it is determined that there is a non-conforming semiconductor, the marking cylinder 17 drives the paper tape component to cooperate with the semiconductor and realizes semiconductor marking (by means of the existing detection system cooperating with the detection camera 9 to determine that the semiconductor is unqualified).

[0043] The paper tape component includes: a plurality of rollers 18, a driving wheel 19 and a storage wheel 20. The paper tape passes through the plurality of rollers 18 from the storage wheel 20 and is wound around the driving wheel 19 (the plurality of rollers 18, the driving wheel 19 and the storage wheel 20 form a complete paper tape conveying). The plurality of rollers 18 drive the paper tape to be arranged directly below the marking cylinder 17, and the marking cylinder 17 continuously drives the paper tape to cooperate with the semiconductor.

[0044] During operation, the semiconductor reel and the output shaft position the material reel 23 through the positioning plate 8, and at the same time, the output shaft drives the material reel 23 through positioning.

[0045] The handwheel 7 drives the conveying shaft 3 to rotate, and drives the pinwheel 4 to rotate, which is convenient for driving the driving pins of the pinwheel 4 to contact the semiconductor. After the semiconductor contacts the pinwheel 4, the driving motor 5 drives the pinwheel 4 to rotate and drives the semiconductor to be conveyed. Another set of material reels 23 wind and store the detected and marked semiconductors.

[0046] During the semiconductor detection process, it is necessary to take pictures through the detection camera 9 for judgment. If it is determined that the semiconductor is unqualified, the marking cylinder 17 drives the telescopic rod to descend and drives the paper tape to be pasted on the semiconductor, which is convenient for subsequent detection difficulty and improves work efficiency.

[0047] The embodiments disclosed in the present utility model are preferred embodiments, but not limited thereto. Those of ordinary skill in the art can easily understand the spirit of the present utility model according to the above embodiments and make different extensions and changes. However, as long as they do not depart from the spirit of the present utility model, they are within the protection scope of the present utility model.

Claims

1. A multi-channel semiconductor testing device for semiconductor testing, characterized in that: include: A base plate, wherein the base plate is fixedly connected with a plurality of storage components, and the plurality of storage components are divided into two groups, and a detection component is arranged between the two groups of storage components; The detection component includes: a detection plate fixedly arranged on a substrate, the detection plate is provided with a plurality of detection channels cooperating with the conveying component, and the detection plate is fixedly connected with a photographing component and a marking component cooperating with the semiconductor; The substrate is fixedly connected with a conveying assembly, and the conveying assembly drives the semiconductor from one group of storage assemblies to another group of storage assemblies.

2. The multi-channel semiconductor testing device according to claim 1, characterized in that: The conveying assembly includes: multiple conveying shafts rotatably arranged on the lower surface of the detection plate, the conveying shafts are coaxially fixedly connected with multiple pin wheels, the detection channel is provided with a conveying groove cooperating with the pin wheels, the circumferential array of the pin wheels has multiple driving needles cooperating with the semiconductor, and the substrate is fixedly connected with a driving motor that drives the conveying shafts to rotate.

3. The multi-channel semiconductor testing device according to claim 2, characterized in that: The plurality of conveying shafts are connected to the support frame via bearings, the support frame is fixedly connected to the base plate, and the conveying shaft passes through the support frame and is matched with a hand wheel.

4. The multi-channel semiconductor testing device according to claim 1, characterized in that: The photographing assembly includes: a plurality of positioning plates, which are fixedly arranged on the upper surface and the lower surface of the detection plate, each positioning plate is connected to a detection camera through an adjustment assembly, and a ring light source fixed to the positioning plate is provided directly below the detection camera.

5. The multi-channel semiconductor testing device according to claim 1, characterized in that: A sealing plate is fixedly connected to the upper surface of the detection plate, and the sealing plate is provided with a through groove that cooperates with the photographing component, the conveying component and the marking component.

6. The multi-channel semiconductor testing device according to claim 1, characterized in that: The marking assembly includes: a support plate fixedly arranged on the base plate, the support plate is arranged between the detection plate and the base plate, a slide rail is fixedly connected to the upper surface of the support plate, the slide rail is matched with a displacement plate through a slider, the support plate is fixedly connected to a displacement cylinder, the telescopic rod of the displacement cylinder is fixedly connected to the bottom of the displacement plate, a marking plate is arranged directly above the detection plate, and the marking plate is fixedly connected to the displacement plate through a connecting plate; a plurality of marking cylinders are fixedly connected to the marking plate, and the marking plate is also provided with a paper tape assembly, and the telescopic rod of the marking cylinder cooperates with the paper tape assembly to drive the semiconductor for marking.

7. The multi-channel semiconductor testing device according to claim 6, characterized in that: The paper tape assembly comprises: a plurality of rollers, a driving wheel and a receiving wheel. The paper tape passes through the receiving wheel and is wound on the driving wheel. The plurality of rollers drive the paper tape to be arranged directly below the marking cylinder.

8. The multi-channel semiconductor testing device according to claim 1, characterized in that: The storage assembly includes: a material rack fixedly connected to the base plate, the material rack fixedly connected to a conveying motor, the output shaft of the conveying motor detachably connected to a material reel, and the material reel is provided with a plurality of winding stations corresponding to the detection channels.

9. The multi-channel semiconductor testing device according to claim 8, characterized in that: A guide wheel is fixedly connected to one side of the material rack close to the base plate.

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