Bonding pad capable of preventing printing at empty bonding position

Abstract

The utility model discloses a bonding pad capable of preventing printing at an empty bonding position, which comprises a bonding pad body, a surface-mounting area, a non-surface-mounting area, an anti-printing protection frame and an anti-printing protection film, the surface-mounting area is arranged on the surface of the bonding pad body, a lead hole is arranged on the surface of the bonding pad body, and the non-surface-mounting area is arranged on the surface of the bonding pad body. The non-surface-mounting area is arranged on the surface of the bonding pad body on one side of the surface-mounting area, the anti-printing protection frame is arranged outside the non-surface-mounting area, a containing cavity is formed in the anti-printing protection frame, and the anti-printing protection film is arranged in the containing cavity. According to the utility model, the solder paste is not printed at the non-patch position of the empty bonding pad, so that the defect of multiple parts caused by abnormal patch is reduced, and the investment cost of products is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of pads, in particular to a pad for preventing printing on non - soldering positions. Background Technique

[0002] The pad is a basic component unit of surface - mount assembly. It is the metal - exposed area on the circuit board used to connect the circuits on the die to the pins of the package chip grid. The main function of the pad is to form the pad pattern of the circuit board, realizing functions such as electrical connection, device fixation, or both. Solder paste printing is a key process used in the final product assembly in the electronic manufacturing process. Its main function is to coat a layer of solder paste on the pads or pins of the printed board for the next step of component assembly and soldering work.

[0003] During solder paste printing, it is easy to have the problem of printing solder paste on non - soldering positions of empty pads, resulting in frequent mis - component problems at the empty - printed positions of the product, thereby increasing the defective rate of the product and the input cost of the product. Therefore, we propose a pad for preventing printing on non - soldering positions. Content of the Utility Model

[0004] The purpose of the utility model is to provide a pad for preventing printing on non - soldering positions to solve the problems raised in the above - mentioned background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A pad for preventing printing on non - soldering positions, including a pad body, a solder - required area, a non - solder area, a printing - prevention protection frame, and a printing - prevention protection film. The solder - required areas are all arranged on the surface of the pad body. There are lead holes on the surface of the pad body. The non - solder area is arranged on the surface of the pad body on one side of the solder - required area. The printing - prevention protection frame is arranged outside the non - solder area, and there is a receiving cavity inside the printing - prevention protection frame. The printing - prevention protection film is arranged inside the receiving cavity.

[0006] Preferably, the solder - required area is composed of soldering points.

[0007] Preferably, one end of the printing - prevention protection frame is fixed with a protection - frame end part, and the other ends of the printing - prevention protection frame are all fixed with protection - frame bumps, which is convenient for taking and placing the printing - prevention protection frame.

[0008] Preferably, there is a through - slot on one side of the surface of the printing - prevention protection frame, which is convenient for pinching and lifting the handle film.

[0009] Preferably, the lower surface of the printing - prevention protection film is tightly adsorbed and attached to the non - solder area through an electrostatic adsorption surface, so that the printing - prevention protection film is closely attached to the non - solder area.

[0010] Preferably, a handle film is provided at one end of the anti-printing protective film. The handle film is integrally formed with the anti-printing protective film. The handle film penetrates through the through groove and extends above the end of the protective frame, facilitating the removal of the anti-printing protective film.

[0011] Preferably, the size of the anti-printing protective film matches the accommodating cavity, and can comprehensively protect the non-patch area from printing.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] For the non-patch area, no solder paste is printed. By clamping the anti-printing protective frame outside the non-patch area, the anti-printing protective frame protects the non-patch area. Then, the anti-printing protective film is covered in the accommodating cavity inside the anti-printing protective frame. The anti-printing protective film is closely attached to the surface of the non-patch area through the electrostatic adsorption surface, covering and shielding the non-patch area. The handle film at one end of the anti-printing protective film passes through the through groove and is located above the end of the protective frame at one end of the non-patch area. When printing solder paste, due to the setting of the anti-printing protective frame and the anti-printing protective film, the non-patch area will not be printed with solder paste. This design does not print solder paste at the non-patch position of the open pad, thereby reducing multiple defects caused by abnormal soldering, and further reducing the product input cost. After printing, the anti-printing protective film is removed through the handle film, and then the entire anti-printing protective frame is removed. Description of the Drawings

[0014] Figure 1 is the front view structural schematic diagram of the present utility model;

[0015] Figure 2 is the structural schematic diagram of the patch area of the present utility model;

[0016] Figure 3 is the structural schematic diagram of the anti-printing protective frame of the present utility model;

[0017] Figure 4 is the side view sectional structural schematic diagram of the anti-printing protective frame of the present utility model;

[0018] Figure 5 is of the present utility model Figure 4 enlarged structural schematic diagram at A in.

[0019] In the figure: 1, pad body; 2, lead hole; 3, area to be patched; 301, patching point; 4, non-patch area; 5, anti-printing protective frame; 6, accommodating cavity; 7, anti-printing protective film; 8, handle film; 9, end of the protective frame; 10, protective frame bump; 11, electrostatic adsorption surface; 12, through groove. Detailed Embodiment

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to Figures 1-5 , an embodiment provided by the present invention: A solder pad for preventing printing at the non-pasting position includes a solder pad body 1, a paste-applying area 3, a non-paste area 4, an anti-printing protection frame 5, and an anti-printing protection film 7. The paste-applying areas 3 are all arranged on the surface of the solder pad body 1. A lead hole 2 is arranged on the surface of the solder pad body 1. The non-paste area 4 is arranged on the surface of the solder pad body 1 on one side of the paste-applying area 3;

[0022] The anti-printing protection frame 5 is arranged outside the non-paste area 4, and an accommodation cavity 6 is arranged inside the anti-printing protection frame 5. The anti-printing protection film 7 is arranged inside the accommodation cavity 6;

[0023] Specifically, the anti-printing protection frame 5 is clamped outside the non-paste area 4. The anti-printing protection frame 5 protects the non-paste area 4. Then, the anti-printing protection film 7 is covered in the accommodation cavity 6 inside the anti-printing protection frame 5. The anti-printing protection film 7 is closely attached to the surface of the non-paste area 4 through the electrostatic adsorption surface 11 to shield and cover the non-paste area 4. One end of the anti-printing protection film 7, the hand-held film 8, passes through the through groove 12 and is located above the protection frame end 9 at one end of the non-paste area 4;

[0024] When printing solder paste, due to the settings of the anti-printing protection frame 5 and the anti-printing protection film 7, the non-paste area 4 will not be printed with solder paste. This design does not print solder paste at the non-pasting position of the open solder pad, thereby reducing multiple-piece defects caused by abnormal pasting, and further reducing the product input cost;

[0025] The paste-applying area 3 is composed of paste points 301;

[0026] One end of the anti-printing protection frame 5 is fixed with a protection frame end 9, and the other ends of the anti-printing protection frames 5 are all fixed with protection frame protrusions 10;

[0027] One side of the surface of the anti-printing protection frame 5 is provided with a through groove 12;

[0028] The lower surface of the anti-printing protection film 7 is closely adsorbed and attached to the non-paste area 4 through the electrostatic adsorption surface 11;

[0029] One end of the anti-printing protection film 7 is provided with a hand-held film 8. The hand-held film 8 is integrally formed with the anti-printing protection film 7. The hand-held film 8 passes through the through groove 12 and extends above the protection frame end 9;

[0030] Specifically, the anti-printing protective film 7 is removed by lifting the handle film 8, and then the anti-printing protection frame 5 is removed as a whole;

[0031] The size of the anti-printing protective film 7 matches the accommodating cavity 6.

[0032] In the use of the embodiment of the present application: First, the pad body 1 is divided into two regions, namely the area 3 to be pasted and the area 4 not to be pasted. Among them, the area 4 not to be pasted is not printed with solder paste. Specifically, the anti-printing protection frame 5 is clamped outside the area 4 not to be pasted. The anti-printing protection frame 5 protects the area 4 not to be pasted. Then, the anti-printing protective film 7 is covered in the accommodating cavity 6 inside the anti-printing protection frame 5. The anti-printing protective film 7 is closely attached to the surface of the area 4 not to be pasted through the electrostatic adsorption surface 11, covering and shielding the area 4 not to be pasted. One end of the handle film 8 of the anti-printing protective film 7 passes through the through groove 12 and is located above the end 9 of the protection frame at one end of the area 4 not to be pasted. When printing solder paste, due to the setting of the anti-printing protection frame 5 and the anti-printing protective film 7, the area 4 not to be pasted will not be printed with solder paste. This design does not print solder paste at the non-pasting position of the open pad, thereby reducing the multiple defects caused by abnormal pasting, and further reducing the product input cost. Then, after printing, the anti-printing protective film 7 is removed by lifting the handle film 8, and then the anti-printing protection frame 5 is removed as a whole.

[0033] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

Claims

1. A solder pad for preventing empty position printing, characterized in that: The invention comprises a pad body (1), a patch area (3), a non-patch area (4), an anti-printing protection frame (5) and an anti-printing protection film (7), wherein the patch area (3) is arranged on the surface of the pad body (1), the surface of the pad body (1) is provided with a lead hole (2), the non-patch area (4) is arranged on the surface of the pad body (1) on one side of the patch area (3), the anti-printing protection frame (5) is arranged outside the non-patch area (4), and a receiving cavity (6) is arranged inside the anti-printing protection frame (5), and the anti-printing protection film (7) is arranged inside the receiving cavity (6).

2. A solder pad for preventing empty position printing according to claim 1, characterized in that: The patching area (3) is composed of patching points (301).

3. A solder pad for preventing empty position printing according to claim 1, characterized in that: A protection frame end portion (9) is fixed to one end of the anti-printing protection frame (5), and a protection frame protrusion (10) is fixed to the other end of the anti-printing protection frame (5).

4. A solder pad for preventing empty position printing according to claim 1, characterized in that: A through groove (12) is provided on one side of the surface of the anti-printing protection frame (5).

5. A solder pad for preventing empty position printing according to claim 4, characterized in that: The lower surface of the anti-printing protective film (7) is tightly adsorbed and adhered to the non-patterning area (4) via the electrostatic adsorption surface (11).

6. A solder pad for preventing empty position printing according to claim 1, characterized in that: A portable film sheet (8) is provided at one end of the anti-printing protective film (7), the portable film sheet (8) and the anti-printing protective film (7) are integrally formed, and the portable film sheet (8) passes through the through slot (12) and extends to the top of the end portion (9) of the protection frame.

7. A solder pad for preventing empty position printing according to claim 1, characterized in that: The size of the anti-printing protective film (7) matches the accommodating cavity (6).

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