Magnetic carrier for SMT (Surface Mount Technology) and solder paste printing device applying magnetic carrier
By using magnetic carriers in the SMT process and using magnetic suction to fix the FPC board, the problem that flexible FPC boards are prone to bulging in the process is solved, process quality and production efficiency are improved, and cost and resource waste are reduced.
Patent Information
- Application Number
- CN202421936756.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-12
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-12
AI Technical Summary
In the SMT process, the thinness and flexibility characteristics of the flexible FPC board cause it to prone to bulge in the process, resulting in an increase in process defect rate and low production efficiency.
A magnetic carrier for SMT process is designed to fix the FPC board to the carrier using the magnetic suction force between the magnetic sheet and the magnetic part to prevent the edges and corners from bulging.
Effectively prevent the edges and corners of the FPC board, improve the process quality and production efficiency of the SMT process, reduce work costs and reduce resource waste.
Smart Images
Figure CN222967181U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic assembly, and particularly to a magnetic carrier for SMT process and a solder paste printing device using the same. Background Art
[0002] In the electronic field, SMT refers to Surface Mount Technology. This is an extremely popular and stable mature process in the electronic assembly industry, mainly used for mounting leadless or short-lead surface mount components (referred to as SMC / SMD, also known as chip components in Chinese) on the surface of printed circuit boards or other substrates, and then connecting the circuits through methods such as reflow soldering and wave soldering. The SMT technology originated in the 1960s and gradually developed with the emergence of miniaturized electronic devices.
[0003] In the prior art, the SMT technology usually consists of the following steps: printing solder paste, placing components, fixing by soldering, inspection and repair, etc. Among them, the role of printing solder paste is crucial, which directly affects the subsequent component mounting quality and soldering reliability. With the development of technology, flexible printed circuit boards (Flexible Printed Circuit, referred to as FPC for short) are increasingly used as substrates. FPC boards are printed circuit boards made of polyimide or polyester film as the substrate, which are highly reliable and have excellent flexibility. Its main characteristics include high wiring density, light weight, thin thickness, good bendability, etc. These characteristics of FPC boards have made them widely used in various electronic devices that require high integration, light weight, and bendability.
[0004] Due to the flexible characteristics of FPC boards, their thickness is usually very thin, only about 0.1 mm, and it is extremely easy to bulge during each SMT process, posing a great challenge to the process quality yield of each SMT process. Traditional methods usually use mechanical jigs or adhesives to fix FPC boards on the carrier, but because FPC boards are too thin, these methods often have problems such as easy bulging at the corners, insecure fixation, and complex operation, resulting in an increase in the process defect rate and low production efficiency. At the same time, using tape to fix FPC boards requires multiple tapes to be pasted on both the upper and lower sides of each FPC board for fixation, and the manual operation efficiency is extremely low; more seriously, if the worker pastes the tape off-position, it will cover the pad position of the board, resulting in scrapping. Summary of the Invention
[0005] In view of the above deficiencies of the prior art, the present application designs a magnetic carrier for SMT process and a solder paste printing device using the same. The magnetic carrier uses magnetic force to fix the FPC board flat on the carrier, effectively preventing various process defects caused by bulging at the corners of the FPC board.
[0006] In the first aspect, the present application provides a magnetic carrier for SMT process, which is applied to solder paste printing of FPC boards in SMT process, including: a carrier body, a magnetic part is arranged inside the carrier body, a magnetic sheet is arranged on the surface of the carrier body, the middle of the magnetic sheet is hollowed out to form a printing space, the edge of the FPC board is pressed between the magnetic sheet and the carrier body, and the FPC board is fixed to the carrier body by the magnetic attraction between the magnetic sheet and the magnetic part. The magnetic carrier of the present application uses the magnetic attraction between the magnetic sheet and the magnetic part to steadily fix the flexible FPC sheet on the carrier, thereby eliminating the step of fixing the FPC board with high-temperature tape, greatly improving the working efficiency.
[0007] Furthermore, in order to ensure that the suction force of the magnetic member does not suck up the components on the surface of the FPC board after mounting, a first safety distance is set between the edge of the magnetic member and the components, and the first safety distance is ≥5mm.
[0008] Furthermore, in order to prevent the appearance of steps, which may lead to excessive application of solder paste and poor soldering of the product, a second safety distance is set between the edge of the magnetic sheet and the pad position, and the second safety distance is ≥3mm.
[0009] Furthermore, in order to facilitate the installation of the magnetic component, a first countersunk hole is provided on a side of the carrier body facing away from the FPC board, and the magnetic component is embedded in the first countersunk hole.
[0010] Furthermore, in order to facilitate the production of magnetic parts, the magnetic sheet is made of steel, and the thickness of the sheet is ≤0.1 mm.
[0011] Furthermore, in order to ensure the magnetic attraction effect, the magnetic member is arranged at an outer edge position corresponding to the magnetic sheet.
[0012] Furthermore, in order to reduce the manufacturing cost of the magnetic member, the magnetic member includes a plurality of circular magnets, and the magnets are arranged in at least one row at intervals corresponding to the outer edge of the magnetic sheet.
[0013] Furthermore, in order to facilitate the positioning of the magnetic sheet, a second countersunk hole is provided on a side of the carrier body facing the FPC board, and the magnetic sheet is arranged in the second countersunk hole.
[0014] Furthermore, in order to facilitate positioning of the FPC board on the carrier, a first positioning hole is provided on the magnetic sheet, and a second positioning hole is provided on the FPC board corresponding to the first positioning hole.
[0015] In a second aspect, the present application provides a solder paste printing device, which includes the magnetic carrier of the first aspect.
[0016] The beneficial effects of the present application are as follows:
[0017] 1. It improves the bulging phenomenon that occurs in the traditional tooling process of fixing FPC boards with tape due to the thin and soft nature of the FPC boards, providing enhanced safety for SMT co-process production;
[0018] 2. It effectively improves the operation efficiency of the workstation and liberates human resources;
[0019] 3. In the traditional FPC fixing process, the tape is used once and cannot be recycled, resulting in significant waste. In the present application, by introducing a magnetic carrier, it can be reused multiple times, effectively reducing cost waste. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 According to some embodiments of the present application, a schematic diagram of the cooperation structure between the magnetic carrier and the FPC sheet is shown;
[0021] Figure 2 According to some embodiments of the present application, a schematic diagram of the structure of the carrier body in the magnetic carrier is shown;
[0022] Figure 3 According to some embodiments of the present application, a schematic diagram of the structure of the magnetic sheet in the magnetic carrier is shown. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] The following further describes the technical features and advantages of the present application in more detail with reference to the drawings, so that the advantages and features of the present application can be more easily understood by those skilled in the art, thereby making the scope of protection of the present invention more clearly defined.
[0024] It should be noted that in the description of the present application, the terms indicating directions or positional relationships such as "upper", "lower", "left", "right", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings. This is only for convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.
[0025] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the importance of the indicated technical features.
[0026] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0027] Please refer to Figures 1 - 3 , an embodiment of this application provides a magnetic carrier for FPC board solder paste printing in the SMT process, including a carrier body 1. A magnetic member 3 is arranged inside the carrier body 1. A magnetic thin sheet 2 is provided on the upper surface of the carrier body 1. A printing area 201 for solder paste printing is formed by hollowing out the middle of the magnetic thin sheet 2. The FPC board 4 is arranged between the magnetic thin sheet 2 and the carrier body 1. The magnetic thin sheet 2 just presses on the edge position of the FPC board 4. The FPC board 4 is flatly fixed on the carrier by the magnetic attraction force between the magnetic member 3 and the magnetic thin sheet 2, thereby effectively improving the accuracy and stability of the solder paste printing of the FPC board 4, while improving the production efficiency and reducing the manual operation cost.
[0028] Please refer to Figure 2 , the carrier body 1, as the support of the overall structure in this embodiment, can be made of high-strength composite stone material or aluminum alloy material to ensure its sufficient rigidity and stability.
[0029] To reduce costs, the magnetic carrier of this embodiment can also be obtained by modifying an existing carrier. Specifically, a first counterbore 101 is opened on the surface of the carrier body 1 facing away from the FPC, and the magnetic member 3 is embedded in the first counterbore 101, so that the carrier can generate a magnetic attraction force on the magnetic thin sheet 2. To provide sufficient magnetic attraction force, the embedding depth of the magnetic member 3 and the volume of the magnetic member 3 can be determined according to parameters such as the thickness and material of the carrier body 1 and the area of the magnetic thin sheet 2.
[0030] To facilitate the positioning and installation of the magnetic thin sheet 2, a second counterbore 102 can be opened on the upper surface of the carrier body 1. The size of the second counterbore 102 matches the outer edge size of the magnetic thin sheet 2. Embedding the magnetic thin sheet 2 into the second counterbore 102 can achieve the positioning and installation of the magnetic thin sheet 2.
[0031] The magnetic member 3 is used to provide a magnetic force. In order to enable the magnetic member 3 to generate a magnetic suction force on the magnetic thin sheet 2 without affecting the printing and assembly of the components 5 on the FPC board 4, the magnetic member 3 can be designed as an integral structure that matches the outer edge structure of the magnetic thin sheet 2 and has a certain width dimension. Or, in order to reduce the manufacturing cost of the magnetic member 3, multiple magnetic members 3 can be arranged at intervals according to the outer edge shape of the magnetic thin sheet 2. In this embodiment, a plurality of circular neodymium iron boron magnets are evenly arranged inside the carrier body 1 as the magnetic member 3. The circular magnets can be arranged in multiple rows in parallel to generate sufficient magnetic suction force.
[0032] In this embodiment, in order to ensure that the magnetic suction force of the magnetic member 3 does not suck up the components 5 on the surface of the FPC board 4 after mounting, it is necessary to ensure that there is a first safety distance D1 between the magnetic member 3 and the components 5. According to the actual application of the applicant, the above first safety distance D1 ≥ 5 mm.
[0033] Please refer to Figure 3 , the magnetic thin sheet 2 is used to cooperate with the magnetic member 3 to fix the FPC board 4. A printing space 201 is formed by hollowing out the middle of the magnetic thin sheet 2. The size of the printing space 201 is determined according to the printing area size of the FPC board 4. The magnetic thin sheet 2 can press the edges of the FPC board 4 against the carrier body 1, thereby realizing the flat fixation of the FPC board 4. Since the edges of the FPC board 4 are evenly pressed on the carrier body 1, no bulging phenomenon will occur in each process of SMT, effectively ensuring the production quality and production efficiency.
[0034] The magnetic thin sheet 2 can be made of magnetic steel. In order to prevent the appearance of steps, the magnetic thin sheet 2 should be made as thin as possible. In this embodiment, the magnetic thin sheet 2 is made of 0.06 mm thick steel. Further, the edge of the magnetic thin sheet 2 should maintain a second safety distance D2 from the pad position of the FPC board 4 to prevent excessive solder paste application and cause poor soldering. Through the actual application of the applicant, the above second safety distance D2 can be ≥ 3 mm to fully ensure the solder paste printing quality.
[0035] In order to facilitate the positioning of the FPC board 4, a first positioning hole 202 can be designed on the magnetic thin sheet 2. The above first positioning hole 202 can be arranged at the four corner positions of the magnetic thin sheet 2. The FPC board 4 can also be designed with corresponding second positioning holes. During installation, align the first positioning hole 202 on the magnetic thin sheet 2 with the corresponding second positioning hole on the FPC board 4.
[0036] The specific use steps of the magnetic carrier in this embodiment are as follows:
[0037] 1. Fabrication of the vehicle body 1: Select high-strength aluminum alloy material to fabricate the vehicle body 1 (or use an existing vehicle), ensure that it has sufficient rigidity and stability, and form a first counterbore 101 and a second counterbore 102 on the vehicle body 1;
[0038] 2. Arrangement of the magnetic parts 3: Uniformly install a plurality of circular neodymium iron boron magnets as the magnetic parts 3 in the first counterbore 101 of the vehicle body 1 to generate sufficient magnetic attraction force;
[0039] 3. Fixation of the FPC board 4: Gently place the edge of the FPC board 4 on the vehicle body 1 to ensure that the FPC board 4 is flat without bulging;
[0040] 4. Installation of the magnetic thin sheet 2: Place the magnetic thin sheet 2 in the second counterbore 102 of the vehicle body 1, adjust the installation position of the FPC board 4 through the first positioning hole 202 and the second positioning hole, and achieve automatic adsorption and fixation through magnetic force, ensuring that the FPC board 4 is fixed flat without bulging between the vehicle body 1 and the magnetic thin sheet 2;
[0041] 5. Solder paste printing: Use a solder paste printer to perform solder paste printing on the printing area of the FPC board 4. Since the FPC board 4 is firmly fixed, the printing accuracy and stability are significantly improved.
[0042] Certainly, this magnetic vehicle can also be used in other processes in the SMT process, such as component placement, soldering and fixation, inspection, and repair, etc., and can stably fix the FPC board on the vehicle.
[0043] In the description of this specification, the description referring to terms such as "some embodiments", "some examples", "exemplarily", "examples", "preferably", or "further" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.
[0044] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. All equivalent structural or equivalent process transformations made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are equally included in the patent protection scope of the present application.
Claims
1. A magnetic carrier for SMT process, applied to the solder paste printing process of FPC board in SMT process, characterized in that: include: A carrier body, wherein magnetic parts are arranged inside the carrier body, a magnetic sheet is arranged on the surface of the carrier body, the middle of the magnetic sheet is hollowed out to form a printing space, the edge of the FPC board is pressed between the magnetic sheet and the carrier body, and the FPC board is fixed to the carrier body by the magnetic attraction between the magnetic sheet and the magnetic parts.
2. The magnetic carrier according to claim 1, characterized in that: A first safety distance is set between the edge of the magnetic part and the component, and the first safety distance is ≥5mm.
3. The magnetic carrier according to claim 1, characterized in that: A second safety distance is set between the edge of the magnetic sheet and the welding pad position, and the second safety distance is ≥3mm.
4. The magnetic carrier according to claim 1, characterized in that: A first countersunk hole is arranged on a side of the carrier body away from the FPC board, and the magnetic component is embedded in the first countersunk hole.
5. The magnetic carrier according to claim 1, characterized in that: The magnetic sheet is made of steel, and the thickness of the magnetic sheet is ≤0.1 mm.
6. The magnetic carrier according to claim 1, characterized in that: The magnetic member is arranged corresponding to the outer edge shape of the magnetic sheet.
7. The magnetic carrier according to claim 1, characterized in that: The magnetic member comprises a plurality of circular magnets, and the plurality of magnets are arranged at intervals corresponding to the outer edge positions of the magnetic sheet.
8. The magnetic carrier according to claim 1, characterized in that: A second countersunk hole is arranged on a side of the carrier body facing the FPC board, and the magnetic sheet is arranged in the second countersunk hole.
9. The magnetic carrier according to claim 1, characterized in that: The magnetic sheet is provided with a first positioning hole, and the FPC board is provided with a second positioning hole corresponding to the first positioning hole.
10. A solder paste printing device, characterized in that: A magnetic carrier comprising any one of claims 1 to 9.