Liquid cooling runner plate and supercomputing device

Abstract

The utility model provides a liquid cooling flow channel plate and supercomputing equipment, the liquid cooling flow channel plate comprises a bottom plate and a cover plate, one side of the bottom plate is provided with a plurality of strip-shaped grooves which are connected in sequence side by side, a separation strip is formed between every two adjacent strip-shaped grooves, and the free end of each separation strip is located at the joint of every two adjacent strip-shaped grooves; a flow guide structure is arranged at the joint, the flow guide structure comprises a flow guide column and a first flow guide plate, the flow guide column is located in the extending direction of the dividing strip, and gaps are reserved between the flow guide column and the dividing strip and between the flow guide column and the groove wall of the strip-shaped groove where the dividing strip is located; at least one side, close to one strip-shaped groove, of the flow guide column is connected with a first flow guide plate, and the free end of the first flow guide plate extends towards the strip-shaped groove in the side where the first flow guide plate is located; the cover plate covers the bottom plate and is in lap joint with the separation strips and the flow guide columns, and medium flow channels are formed by all the strip-shaped grooves and the corresponding parts on the cover plate. According to the utility model, the flow velocity and the temperature uniformity of a medium in the width direction of the flow channel can be improved, and the structural strength and the anti-noise capability of the liquid cooling flow channel plate can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling, in particular to a liquid cooling flow channel plate and a supercomputer device. Background Art

[0002] With the increasing demand for data processing, a supercomputer device with extremely high computing power has emerged. Although this device has a large computing power, with the increase in computing power, the heat generation is also very serious. If these heats are not conducted out in time, it will affect the performance and service life of each computing power chip, and even cause the device to crash and the system to collapse.

[0003] In the existing supercomputer devices, in order to improve the heat dissipation effect of the supercomputer devices, some adopt the liquid cooling heat dissipation method. However, the heat dissipation effects at different positions in the width direction of the existing liquid cooling flow channels are quite different, resulting in inconsistent temperatures of each computing power chip in the width direction of the liquid cooling flow channel, especially at the bending connection of the liquid cooling flow channel. Summary of the Utility Model

[0004] Based on the above situation, the main purpose of the utility model is to provide a liquid cooling flow channel plate and a supercomputer device, which can increase the flow velocity and temperature uniformity in the width direction of the flow channel, as well as increase the structural strength and noise resistance of the liquid cooling flow channel plate, so as to improve the temperature consistency of each computing power chip at different positions in the width direction of the flow channel.

[0005] To achieve the above purpose, the technical scheme adopted by the utility model is as follows:

[0006] In the first aspect of the utility model, a liquid cooling flow channel plate for a supercomputer device is provided. The supercomputer device includes a computing power board and the liquid cooling flow channel plate. The computing power board includes computing power chips, and the computing power chips are arranged in multiple rows on the computing power board. The computing power board is installed on the outer side surface of the liquid cooling flow channel plate, and the computing power chips are attached to the outer side surface. It includes a bottom plate and a cover plate. On one side of the bottom plate, a plurality of strip-shaped grooves connected in sequence are arranged side by side. A partition strip is formed between adjacent two strip-shaped grooves, and the free end of the partition strip is located at the connection of the adjacent two strip-shaped grooves.

[0007] Wherein, a flow guiding structure is arranged at the connection. The flow guiding structure includes a flow guiding column and a first flow guiding plate. The flow guiding column is located in the extending direction of the partition strip, and there are intervals between the flow guiding column and the partition strip and the groove wall of the strip-shaped groove where it is located. At least one first flow guiding plate is connected to one side of the flow guiding column close to one of the strip-shaped grooves, and the free end of the first flow guiding plate extends towards the strip-shaped groove on its side.

[0008] The cover plate covers the bottom plate and overlaps on the partition strip and the flow guiding column. Each strip-shaped groove and the corresponding part on the cover plate form a medium flow channel.

[0009] Optionally, the first flow guiding plates are connected to both the upstream side and the downstream side of the flow guiding column, and each of the first flow guiding plates extends from the flow guiding column towards the end of the strip-shaped groove on its side that is away from the flow guiding column.

[0010] Optionally, a second flow guiding plate is arranged outside the first flow guiding plate. The second flow guiding plate is arranged in parallel with the first flow guiding plate, and the two divide the strip-shaped groove where they are located into three sub-channels arranged side by side.

[0011] Optionally, the length of the second flow guiding plate is greater than the length of the first flow guiding plate.

[0012] Optionally, the first flow guiding plates and the second flow guiding plates are arranged on both sides of the flow guiding column, and there is a gap between the two second flow guiding plates.

[0013] Optionally, both flow guiding surfaces of the first flow guiding plate are smooth convex curved surfaces, and both are in smooth transition with the flow guiding column.

[0014] Optionally, the first flow guiding plate has a structure with equal wall thickness, and the flow guiding column is a cylinder.

[0015] Optionally, the flow guiding column is an elliptical cylinder.

[0016] Optionally, a first mounting hole is arranged on the partition bar, a second mounting hole is arranged on the flow guiding column, and a third mounting hole corresponding to the first mounting hole and the second mounting hole is arranged on the cover plate.

[0017] Optionally, positioning posts are arranged on both the partition bar and the flow guiding column. The first mounting hole and the second mounting hole are arranged on the positioning posts; the third mounting hole is a positioning hole that is in positioning cooperation with the corresponding positioning post.

[0018] Optionally, it further includes heat dissipation fins. The heat dissipation fins are arranged in each strip-shaped groove, dividing the strip-shaped groove into multiple sub-channels; the heat dissipation fins extend along the extension direction of the strip-shaped groove where they are located, and there is a gap between the heat dissipation fins and the flow guiding structure; the bottom plate, each heat dissipation fin, and the first flow guiding plate are all connected to the cover plate by brazing.

[0019] Optionally, each heat dissipation fin includes a plurality of sub-sections arranged at intervals along the extension direction of the strip-shaped groove where it is located; a plurality of heat dissipation groups are arranged at intervals in the extension direction of each strip-shaped groove, and each heat dissipation group includes a sub-section of a plurality of heat dissipation fins arranged side by side.

[0020] Optionally, the first flow guiding plate is connected to the upstream side of the flow guiding column, and no first flow guiding plate is provided on the downstream side; the number of the heat dissipation fins in each of the strip-shaped grooves is equal;

[0021] Among the heat dissipation fins located on the upstream side of the flow guiding column, some are located radially outside the first flow guiding plate, denoted as outer fins. Each of the outer fins extends beyond the upstream end of the first flow guiding plate, and the ends are aligned; there is a gap between the downstream ends of the remaining heat dissipation fins and the upstream end of the first flow guiding plate;

[0022] Among the heat dissipation fins located on the downstream side of the flow guiding column, some heat dissipation fins that are mirror-symmetric with the outer fins about the central plane of the partition strip extend beyond the free end of the partition strip, and the ends are aligned; there is a distance between the upstream ends of the remaining heat dissipation fins and the free end of the partition strip, and the ends are aligned.

[0023] A second aspect of the present invention provides a supercomputing device, including a computing power board and the liquid cooling flow channel board as described in any one of the above. The computing power board includes computing power chips, and the computing power chips are arranged in multiple rows on the computing power board; the computing power board is installed on the outer side surface of the liquid cooling flow channel board, and the computing power chips are in contact with the area where the medium flow channels are located on the liquid cooling flow channel board.

[0024] Optionally, at least some of the computing power chips are located in the area corresponding to the first flow guiding plate on the liquid cooling flow channel board.

[0025] Optionally, each row of the computing power chips is connected in series. Each of the strip-shaped grooves corresponds to three rows of the computing power chips, and each of the computing power chips is in contact with the liquid cooling flow channel board through a heat conducting material.

[0026] For the liquid cooling flow channel plate of the present utility model, a flow guiding column and a first flow guiding plate are provided at the turning of the medium flow channel. The medium flow in the medium flow channel can flow through the turning along the two flow guiding surfaces of the first flow guiding plate and the flow guiding column, thereby reducing the impact of the medium flow on the side wall of the flow channel at the turning and the excessive change in the flow direction, and thus avoiding the generation of bubbles due to the medium flow generating bubbles at the turning, affecting the heat conduction effect. It improves the uniform flow of the medium flow channel everywhere, avoids too large a difference in the medium flow rate between the upstream and downstream sides at the turning, so that the heat conduction effects at all positions in the width direction of the flow channel are as consistent as possible. When the liquid cooling flow channel plate is used for cooling the computing power chips, it can make the cooling effects of each computing power chip in the width direction of the flow channel as the same as possible, improve the consistency of the temperatures of the computing power chips in the width direction, improve the working performance of the entire computing power board, and extend its service life. Moreover, by providing the flow guiding columns spaced apart by the partition strips, the present utility model can not only ensure that the flow area of the medium flow channel at the turning is basically equal to the flow area at other positions, but also support the cover plate, ensure the sealing performance of all parts of the medium flow channel, and the structural strength and noise resistance of the entire liquid cooling flow channel plate.

[0027] Other beneficial effects of the present utility model will be described in the specific implementation manners through the introduction of specific technical features and technical solutions. Those skilled in the art should be able to understand the beneficial technical effects brought by the said technical features and technical solutions through the introduction of these technical features and technical solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings.

[0029] Figure 1 It is a schematic structural diagram of a preferred embodiment of the liquid cooling flow channel plate provided by the present utility model;

[0030] Figure 2 It is an exploded view of a preferred embodiment of the liquid cooling flow channel plate provided by the present utility model;

[0031] Figure 3 For Figure 2 The partial enlarged view at I in

[0032] Figure 4 It is a partial sectional view of a preferred embodiment of the liquid cooling flow channel plate provided by the present utility model;

[0033] Figure 5 It is a front view of a preferred embodiment of the bottom plate in the liquid cooling flow channel plate provided by the present utility model;

[0034] Figure 6 It is a partial front view of a preferred embodiment of the bottom plate in the liquid cooling flow channel plate provided by the present utility model;

[0035] Figure 7 In the liquid cooling flow channel plate provided by the present utility model, it is a partial front view of another preferred embodiment of the bottom plate;

[0036] Figure 8 In the liquid cooling flow channel plate provided by the present utility model, it is a partial front view of yet another preferred embodiment of the bottom plate.

[0037] In the figure:

[0038] 10. Bottom plate; 11. Strip-shaped groove; 12. Partition strip; 13. Plate body; 14. Annular convex rib; 15. Medium inlet; 16. Medium outlet; 17. Positioning column;

[0039] 20. Cover plate;

[0040] 30. Flow guiding structure; 31. Flow guiding column; 32. First flow guiding plate; 33. Second flow guiding plate;

[0041] 40. Heat dissipation fins; 41. Sub-section. Specific embodiments

[0042] The following describes the present utility model based on embodiments, but the present utility model is not limited to these embodiments. In the following detailed description of the present utility model, some specific details are described in detail. In order to avoid confusing the essence of the present utility model, well-known methods, processes, flows, and components are not described in detail.

[0043] In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale.

[0044] Unless the context clearly requires otherwise, the words such as "including", "comprising", etc. throughout the specification and claims should be construed in an inclusive sense rather than an exclusive or exhaustive sense; that is, it is the meaning of "including but not limited to".

[0045] In the description of the present utility model, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. In addition, in the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0046] The present utility model provides a liquid cooling flow channel plate, which can be used to dissipate heat from the heat-generating components of electronic devices, such as heat-generating components. Specifically, when used in a supercomputer device, it dissipates heat from the heat-generating components, i.e., computing power chips, on its computing power board. Among them, the supercomputer device includes a computing power board and a liquid cooling flow channel plate. The computing power board includes computing power chips, and the computing power chips are arranged in multiple rows on the computing power board; the computing power board is installed on the outer side of the liquid cooling flow channel plate, and the computing power chips are in contact with the outer side.

[0047] refer to Figures 1-8 The liquid cooling channel plate includes a bottom plate 10 and a cover plate 20. A plurality of strip grooves 11 connected in sequence are arranged side by side on one side of the bottom plate 10. A partition bar 12 is formed between two adjacent strip grooves 11. The free end of the partition bar 12 is located at the connection between the two adjacent strip grooves 11. A guide structure 30 is arranged at the connection. The guide structure 30 includes a guide column 31 and a first guide plate 32. The guide column 31 is located in the extension direction of the partition bar 12, and there is a gap between the guide column 31 and the partition bar 12 and the groove wall of the strip groove 11 where it is located. The first guide plate 32 is connected to at least one side of the guide column 31 close to one of the strip grooves 11, and the free end of the first guide plate 32 extends toward the strip groove 11 on the side where it is located. The cover plate 20 covers the bottom plate 10 and overlaps the partition bar 12 and the guide column 31. Each strip groove 11 and the corresponding part on the cover plate 20 form a medium flow channel.

[0048] The above-mentioned liquid-cooled flow channel plate is provided with a guide column 31 and a first guide plate 32 at the turning point of the flow medium channel. The medium flow in the medium flow channel can flow through the turning point along the two guide surfaces of the first guide plate 32 and the guide column 31, thereby reducing or even eliminating the impact of the medium flow on the flow channel wall at the turning point and the generation of bubbles due to the large change in flow direction. Therefore, it is possible to avoid as much as possible the influence of bubbles generated by the medium flow at the turning point on the heat conduction effect, improve the uniformity of the medium flow channel at various points, avoid too large difference in the medium flow rate on the upstream and downstream sides of the turning point, so that the heat conduction effect of the medium flow at various points in the width direction of the flow channel is as consistent as possible; when the liquid-cooled flow channel plate is used to dissipate heat for the computing power chip, the heat dissipation effect of each computing power chip in the width direction of the flow channel can be made as similar as possible, improve the consistency of the temperature of each computing power chip in the width direction, improve the working performance of the entire computing power board, and extend its service life. Moreover, the utility model, through the guide columns 31 arranged at the intervals of the dividing strips 12, can not only ensure that the flow area of ​​the medium flow channel at the turning point is basically equal to the flow area at other positions, but also can support the cover plate 20, thereby ensuring the sealing of various parts of the medium flow channel, and the structural strength and noise resistance of the entire liquid cooling channel plate.

[0049] Specifically, the bottom plate 10 may include a plate body 13 and an annular rib 14. The annular rib 14 is connected to one side of the plate body 13. The partition strip 12 is disposed within the annular rib 14, that is, both the partition strip 12 and the annular rib 14 are connected to the same side of the plate body 13. One end of the partition strip 12 is connected to the inner wall of the annular rib 14, and the other end is not connected to the inner walls of various parts of the annular rib 14, forming a free end. A plurality of partition strips 12 may be provided, and these partition strips 12 divide the recessed area surrounded by the plate body 13 and the annular rib 14 into the above-mentioned interconnected strip-shaped grooves 11. When the liquid cooling channel plate is basically in a cuboid structure, the annular rib 14 may be in a rectangular ring structure, and the partition strip 12 may be connected to a short side of the rectangular ring structure, with a distance left between the free end and the other short side. When a plurality of partition strips 12 are provided, two adjacent partition strips 12 may be respectively connected to different short sides. Further, a medium inlet 15 and a medium outlet 16 may be provided on the short side, and the medium inlet 15 and the medium outlet 16 are respectively communicated with both ends of the medium flow channel.

[0050] Continuing to refer to Figure 2 、 Figure 3 , the flow guiding column 31 may be a cylinder, an ellipsoid cylinder, a free-form surface cylinder, or other columnar structures, as long as the flow guiding surface formed by its side can achieve a flow guiding effect. Among them, when the flow guiding column 31 is a cylinder, its side is a cylindrical surface. Adopting such a cylindrical structure can increase the strength of the flow guiding column 31, is convenient for processing, and can also improve the flow guiding effect of the flow guiding column 31; when the flow guiding column 31 is an ellipsoid cylinder, its side is an ellipsoidal cylinder surface; when the flow guiding column 31 is a free-form surface cylinder, its side is a free-form surface. Adopting such an ellipsoid cylinder structure can extend the guiding effect of the flow guiding column 31 on the medium flow, and further improve the flow velocity of the medium flow at the turning point.

[0051] The two flow guiding surfaces of the first flow guiding plate 32 are parallel to each other, that is, the first flow guiding plate is a structure with equal wall thickness. In this way, the velocity and temperature consistency of the medium flow in the flow channel width direction at the turning point of the medium flow channel (i.e., the connection of two strip-shaped grooves 11) can be increased.

[0052] Specifically, the first flow guiding plate 32 is a smooth convex curved plate, and its two flow guiding surfaces are both smooth convex curved surfaces. For example, the first flow guiding plate 32 may be an arc plate, a parabolic plate, a free-form surface plate and other various curved plates. Among them, when the first flow guiding plate 32 is an arc plate, both flow guiding surfaces are arc surfaces; when the first flow guiding plate 32 is a parabolic plate, both flow guiding surfaces are parabolic surfaces; when the first flow guiding plate 32 is a free-form surface plate, both flow guiding surfaces are free-form surfaces. In a preferred embodiment, the first flow guiding plate 32 is an arc plate, which may be a circular arc plate or an elliptical arc plate, and further preferably a circular arc plate, which can better increase the flow guiding effect of the entire flow guiding structure, avoid the impact of the medium flow directly on the inner wall of the medium flow channel to generate bubbles, and further improve the heat dissipation performance of the entire liquid cooling channel plate.

[0053] Furthermore, the two flow guiding surfaces of the same first flow guiding plate 32 are smoothly transitioned at the ends. That is to say, the first flow guiding plate 32 has an end surface connecting the two flow guiding surfaces, and this end surface is a smooth convex curved surface. That is, the two flow guiding surfaces and the end surface are smoothly connected. The same-side ends of the two flow guiding surfaces are non-acute-angle structures, and the two flow guiding surfaces are not connected by a plane perpendicular to these two flow guiding surfaces (i.e., a plane perpendicular to the tangent planes of these two flow guiding surfaces). By adopting the first flow guiding plate 32 of this embodiment, the flow guiding effect of the medium flow at the turning point can be further increased.

[0054] It should be noted that the flow guiding structure 30 can adopt a combination of any of the above-mentioned structures of the flow guiding column 31 and the first flow guiding plate 32. For example, the first flow guiding plate 32 has a constant wall thickness structure, and the flow guiding column 31 is a cylinder; or for another example, the first flow guiding plate 32 can adopt any of the above-mentioned structures, and the flow guiding columns 31 all adopt elliptical cylinders.

[0055] Wherein, the two sides of the flow guiding column 31 respectively refer to the side close to the strip-shaped groove 11 upstream in its radial direction and the side close to the strip-shaped groove 11 downstream. As Figures 5-8 shown, among the two connected strip-shaped grooves 11, the one located upstream is denoted as the upstream flow channel, and the one located downstream is denoted as the downstream flow channel. Then, the first side of the flow guiding column 31 refers to the side located in the upstream flow channel area, and the second side refers to the side located in the downstream flow channel area.

[0056] In one embodiment, the first flow guiding plate 32 is provided only on one side of the flow guiding column 31. As Figure 5 、 Figure 6 shown, the first flow guiding plate 32 can be provided only on the upstream side (i.e., the first side) of the flow guiding column 31. The first end of this first flow guiding plate 32 is connected to the flow guiding column 31, and the second end is a free end. In the direction of the medium flow, the second end is closer to the upstream end of the upstream-side strip-shaped groove 11 (i.e., the upstream flow channel) than the first end. Or the first flow guiding plate 32 can be provided only on the downstream side (i.e., the second side) of the flow guiding column 31. The first end of this first flow guiding plate 32 is connected to the flow guiding column 31, and the second end is a free end. In the direction of the medium flow, the second end is closer to the downstream end of the downstream-side strip-shaped groove 11 (i.e., the downstream flow channel) than the first end.

[0057] Continuing to refer to Figure 5 and Figure 6 , a first flow guiding plate 32 is connected to the upstream side of the flow guiding column 31, and no first flow guiding plate 32 is provided on the downstream side; the number of heat dissipation fins in each strip-shaped groove 11 is equal. Among them, the heat dissipation fins located on the upstream side of the flow guiding column 30 (i.e., Figure 6In the heat dissipation fins located in the lower flow channel, a part is located radially outside the first flow guiding plate 32, and this part of the heat dissipation fins is denoted as the outer fins. Each outer fin extends beyond the upstream end of the first flow guiding plate 32, and the ends are aligned; there is a gap between the downstream ends of the remaining heat dissipation fins 40 and the upstream end of the first flow guiding plate 32. Projecting along the width direction of the strip-shaped groove 11 (i.e., perpendicular to the extending direction of the strip-shaped groove 11 or the extending direction of the partition strip), there is an overlapping area between the projection of the first flow guiding plate 32 and the projection of the outer fins. Among the heat dissipation fins 40 located on the downstream side of the flow guiding column 31, some of the heat dissipation fins 40 that are mirror-symmetric with the outer fins about the central plane of the partition strip 12 extend beyond the free end of the partition strip 12, and the ends are aligned; there is a distance between the upstream ends of the remaining heat dissipation fins 40 and the free end of the partition strip 12, or they are flush with the free end of the partition strip 12, and the ends of each heat dissipation fin 40 are aligned, that is Figure 6 Among the heat dissipation fins 40 located in the upper flow channel, multiple upper heat dissipation fins 40 (the two upper heat dissipation fins in the upper strip-shaped groove in the figure) extend beyond the free end of the partition strip 12, and the lower heat dissipation fins 40 (the two lower heat dissipation fins in the upper strip-shaped groove in the figure) do not extend beyond the free end of the partition strip 12, or are flush with the free end of the partition strip, or there is a gap between them and the free end of the partition strip 12. Through the arrangement between the flow guiding structure 30 and the adjacent heat dissipation fins, the flow guiding effect of the medium flow at the turning point can be further improved, the flow rate difference of the medium flow in the upstream and downstream strip-shaped grooves at the turning point can be reduced, and thus the consistency of heat dissipation at various parts of the entire liquid cooling flow channel plate can be better increased.

[0058] In another embodiment, first flow guiding plates 32 are connected to both the upstream side and the downstream side of the flow guiding column 31, and each first flow guiding plate 32 extends from the flow guiding column 31 towards the end of the strip-shaped groove 11 on its side away from the flow guiding column 31. As Figure 7 shown, the flow guiding structure 30 includes two first flow guiding plates 32, which are respectively arranged on both sides of the flow guiding column 31. That is, a first flow guiding plate 32 is connected to the upstream side (the first side) of the flow guiding column 31. The first end of this first flow guiding plate 32 is connected to the flow guiding column 31, and the second end (i.e., the free end) extends towards the upstream end of the strip-shaped groove 11 where it is located (i.e., the upstream flow channel); another first flow guiding plate 32 is connected to the downstream side (i.e., the second side) of the flow guiding column 31. The first end of this first flow guiding plate 32 is connected to the flow guiding column 31, and the second end (i.e., the free end) extends towards the downstream end of the strip-shaped groove 11 where it is located (i.e., the downstream flow channel). By simultaneously arranging the first flow guiding plates 32 on both sides of the flow guiding column 31, the flow guiding path length of the flow guiding structure 30 for the medium flow can be extended, a better flow guiding effect can be achieved, and thus it can be ensured that the medium flow can still achieve a stable flow rate at the turning point of the medium flow channel, improving the flow rate and temperature consistency in the width direction of the medium flow channel at this point, and further enhancing the heat dissipation performance of the entire liquid cooling flow channel plate.

[0059] In another embodiment, the guide structure 30 further includes a second guide plate 33, and the second guide plate 33 and the first guide plate 32 at the same position are arranged side by side along the width direction of the medium flow channel, that is, the second guide plate 33 is arranged outside the first guide plate 32, and the second guide plate 33 is arranged parallel to the first guide plate 32, and the two divide the strip groove 11 where they are located into three side-by-side sub-flow channels, such as Figure 8 As shown, a first guide plate 32 and a second guide plate 33 are arranged on the same side of the guide column 31. The first guide plate 32 and the second guide plate 33 are arranged at intervals in the width direction of the medium flow channel at this location, and the two are parallel. The first guide plate 32 and the second guide plate 33 divide the medium flow channel into three sub-flow channels at this location. Furthermore, the flow areas of the three sub-flow channels are basically equal. In this way, the flow equalization effect of the medium flow channel in the width direction at this location is further increased, thereby improving the consistency of the flow velocity and temperature of the medium flow in the width direction of the medium flow channel.

[0060] Specifically, the first guide plate 32 and the second guide plate 33 can be simultaneously arranged only on one side of the guide column 31, such as the first guide plate 32 and the second guide plate 33 are simultaneously arranged only on the upstream side of the guide column 31, or the first guide plate 32 and the second guide plate 33 are simultaneously arranged only on the downstream side of the guide column 31. In a preferred embodiment, the first guide plate 32 and the second guide plate 33 are arranged on both sides of the guide column 31, and a gap is left between the two second guide plates 33, that is, the two second guide plates 33 are not connected, and are respectively located on both sides of the guide column 31. By simultaneously arranging the first guide plate 32 and the second guide plate 33 on both sides of the guide column 31, the guiding effect at the turning point of the medium flow channel can be better improved, and the interval arrangement of the two second guide plates 33 can avoid the occurrence of turbulence at the turning point due to the long path of the guide structure, thereby further improving the flow velocity and temperature consistency of the medium flow at this point, and increasing the heat dissipation performance of the entire liquid cooling channel plate.

[0061] The structure of the second guide plate 33 can refer to the structure of the first guide plate 32, and its two guide surfaces and end surfaces, as well as the connection method between the two guide surfaces and the end surfaces can all adopt the setting method of the first guide plate 32, so it is not repeated here. It should be noted that the first guide plate 32 and the second guide plate 33 can be set to structures with different lengths, or they can be set to structures with the same length. Preferably, the length of the first guide plate 32 is less than the length of the second guide plate 33, so as to increase the guide path on the radial outside of the turning point and further improve the guide effect there.

[0062] Continue to refer Figure 2 and Figure 3, the liquid cooling channel plate further includes heat dissipation fins 40. Heat dissipation fins 40 are arranged in each strip-shaped groove 11, dividing the strip-shaped groove 11 into multiple sub-channels; the heat dissipation fins 40 extend along the extending direction of the strip-shaped groove 11 where they are located, and there is a gap between the heat dissipation fins 40 and the flow guiding structure 30, that is, there is a gap between each heat dissipation fin 40 and the flow guiding column 31 and the first flow guiding plate 32. In the embodiment provided with the second flow guiding plate 33, there is also a gap between each heat dissipation fin 40 and the second flow guiding plate 33. By arranging heat dissipation fins 40 in the strip-shaped groove 11, the heat dissipation fins 40 can squeeze the medium flow, thereby increasing the flow velocity of the medium flow channel. And by setting gaps between the heat dissipation fins 40 and the flow guiding column 31 and the first flow guiding plate 32, it can also avoid turbulence at the turning points while increasing the flow velocity, further improving the flow velocity and temperature consistency of the medium flow, and enhancing the heat dissipation performance of the entire liquid cooling channel plate.

[0063] The heat dissipation fins 40 are in the shape of strip plates. In each strip-shaped groove 11, two, three or more heat dissipation fins 40 can be arranged side by side, such as Figure 2 and Figure 3 shown, five heat dissipation fins 40 are arranged side by side in the flow channel width direction in each strip-shaped groove 11. The spaces between two adjacent heat dissipation fins 40 in the width direction, the space between the innermost heat dissipation fin 40 and the side wall of the flow channel on the same side of the strip-shaped groove 11 where it is located, and the space between the outermost heat dissipation fin 40 and the side wall of the flow channel on the same side of the strip-shaped groove 11 where it is located respectively form a sub-channel.

[0064] Among them, multiple strip-shaped grooves 11 can be arranged parallel to each other, that is, arranged side by side along their respective width directions, with equal cross-sectional areas, and the cross-sectional area at the turning point of the medium flow channel is also basically equal to that of other sections.

[0065] Each heat dissipation fin 40 in the strip-shaped groove 11 can be a whole strip arranged in the entire area along the extending direction of the strip-shaped groove 11, or can be multiple sub-sections arranged discontinuously. That is to say, each heat dissipation fin 40 includes multiple sub-sections 41 arranged at intervals along the extending direction of the strip-shaped groove 11 where it is located; multiple heat dissipation groups are arranged at intervals in the extending direction of each strip-shaped groove 11, and each heat dissipation group includes a sub-section 41 of a plurality of heat dissipation fins 40 arranged side by side, such as Figure 2 , Figure 3 shown. In the same strip-shaped groove 11, the multiple sub-sections 41 of different heat dissipation fins 40 form multiple heat dissipation groups, and each heat dissipation group includes a sub-section 41 of a different heat dissipation fin 40. By arranging multiple sub-sections at intervals, the turbulence phenomenon in the strip-shaped groove 11 can be further avoided, and the heat dissipation performance and anti-noise ability of the entire medium flow channel can be improved.

[0066] In a preferred embodiment, a first mounting hole is provided on the partition bar 12, and a second mounting hole is provided on the flow guiding column 31. The cover plate 20 is mounted on the bottom plate 10 through the first mounting hole and the second mounting hole. That is to say, the first mounting hole and the second mounting hole are respectively provided on the partition bar 12 and the flow guiding column 31, and a third mounting hole corresponding to the first mounting hole and the second mounting hole is provided on the cover plate 20. After the cover plate 20 is covered with the bottom plate 10, the first mounting hole, the second mounting hole and the third hole are correspondingly arranged. With this structure, the flow guiding column 31 is reused as the mounting structure of the cover plate 20 and the bottom plate 10, which can avoid the excessive reduction of the flow area at the turning point due to the extension of the partition bar 12. Therefore, relatively speaking, the flow area of the medium flow channel at the turning point is increased, and the space utilization rate of the whole liquid cooling flow channel plate is improved.

[0067] Further, positioning columns 17 are provided on both the partition bar 12 and the flow guiding column 31, and the first mounting hole and the second mounting hole are provided on the positioning columns 17; the third mounting hole is a positioning hole that is positioned and matched with the corresponding positioning column. Through the arrangement of the positioning column and the positioning hole, the positioning accuracy between the cover plate 20 and the bottom plate 10 is increased, and further the positioning accuracy of the whole liquid cooling flow channel plate and other components such as the computing power board is increased. Among them, the first mounting hole and the second mounting hole can be used to further increase the connection reliability between the cover plate 20 and the bottom plate 10, and in an embodiment where a computing power board (detailed below) is provided on the side of the cover plate 20 facing away from the bottom plate 10, the computing power board can also be directly matched with the first mounting hole and the second mounting hole through a locking member passing through the third mounting hole, so as to realize the installation of the computing power board.

[0068] Reference Figures 1-4 , the flow guiding structure 30 and the heat dissipation fins 40 can be integrally formed with the bottom plate 10, and then covered and connected with the cover plate 20, and both the flow guiding structure 30 and the heat dissipation fins 40 are in sealing contact with the cover plate 20. The cover plate 20 and the bottom plate 10 can be directly sealed and connected, such as by a sealing strip and screw locking. In a preferred embodiment, the cover plate 20 and the bottom plate 10 are connected by brazing. Specifically, the bottom plate 10, each heat dissipation fin 40, and the first flow guiding plate 32 are all connected to the cover plate 20 by brazing. In an embodiment where a second flow guiding plate 32 is provided, the second flow guiding plate 32 is also brazed to the cover plate 20. By this method, the gaps between the bottom shell 10, the flow guiding structure 30, the heat dissipation fins 40 and the cover plate 20 can be filled with solder, and the sealing performance of each part of the medium flow channel is increased.

[0069] The present invention also provides a supercomputer device, including the liquid cooling flow channel plate described in any of the above embodiments.

[0070] The supercomputing device further includes computing power boards, each of which includes computing power chips arranged in multiple rows on the board. The computing power boards are installed on the outer side of the liquid cooling channel board, and the computing power chips are in contact with the area where the medium channels are located on the liquid cooling channel board; among them, at least some of the computing power chips are located in the area corresponding to the first flow guiding plate 32 on the liquid cooling channel board. Adopting this arrangement can improve the heat dissipation efficiency of the liquid cooling channel board for the computing power boards. Specifically, the computing power boards can be installed on the side of the cover plate 20 away from the bottom plate 10, or on the side of the bottom plate 10 away from the cover plate 20, or computing power boards are installed on both sides of the liquid cooling channel board.

[0071] Among them, the computing power chips in each row are connected in series. The same strip-shaped groove 11 corresponds to three rows of computing power chips, that is, the area on the outer side of the liquid cooling channel board corresponding to the same strip-shaped groove 11 is in contact with three rows of computing power chips at the same time, so as to improve the heat dissipation efficiency of the liquid cooling channel board for the computing power boards.

[0072] Furthermore, each computing power chip can be in contact with the liquid cooling channel board through a heat-conducting material to enhance the heat transfer effect between the computing power chip and the liquid cooling channel board. Among them, the heat-conducting silicone grease can include any one or a combination of several of heat-conducting silicone grease, heat-conducting gel, or heat-conducting pad, etc.

[0073] Those skilled in the art can understand that, on the premise of no conflict, the above preferred solutions can be freely combined and superimposed.

[0074] It should be understood that the above embodiments are exemplary rather than restrictive. Without departing from the basic principles of the present invention, various obvious or equivalent modifications or substitutions made by those skilled in the art to the above details will be included within the scope of the claims of the present invention.

Claims

1. A liquid-cooled runner plate for a supercomputing device, the supercomputing device comprising a computing board and the liquid-cooled runner plate, the computing board comprising computing chips, the computing chips being arranged in multiple rows on the computing board; the computing board is mounted on the outer side of the liquid-cooled runner plate, and the computing chips are in contact with the outer side; characterized in that: It comprises a bottom plate and a cover plate, wherein one side of the bottom plate is provided with a plurality of strip grooves connected in sequence, a separator bar is formed between two adjacent strip grooves, and a free end of the separator bar is located at the connection of two adjacent strip grooves; Wherein, a guide structure is provided at the connection, and the guide structure includes a guide column and a first guide plate, the guide column is located in the extension direction of the partition strip, and there is a gap between the guide column and the partition strip and the groove wall of the strip groove where it is located; the first guide plate is connected to at least one side of the guide column close to one of the strip grooves, and the free end of the first guide plate extends toward the strip groove on the side where it is located; The cover plate covers the bottom plate and overlaps the partition strip and the guide column. Each of the strip grooves and the corresponding part on the cover plate forms a medium flow channel.

2. The liquid cooling channel plate according to claim 1, characterized in that: The first guide plates are connected to both the upstream side and the downstream side of the guide column, and each of the first guide plates extends from the guide column to an end of the strip groove on the side thereof away from the guide column.

3. The liquid cooling channel plate according to claim 1, characterized in that: A second guide plate is arranged outside the first guide plate. The second guide plate is arranged parallel to the first guide plate, and the second guide plate and the first guide plate divide the strip groove where they are located into three side-by-side sub-channels.

4. The liquid cooling channel plate according to claim 3, characterized in that: The length of the second guide plate is greater than the length of the first guide plate.

5. The liquid cooling channel plate according to claim 3, characterized in that: The first guide plate and the second guide plate are arranged on both sides of the guide column, and a gap is left between the two second guide plates.

6. The liquid cooling channel plate according to claim 1, characterized in that: Both guide surfaces of the first guide plate are smooth convex curved surfaces, and both have smooth transitions with the guide posts.

7. The liquid cooling channel plate according to claim 1, characterized in that: The first guide plate is a structure with uniform wall thickness, and the guide column is a cylinder.

8. The liquid cooling channel plate according to claim 1, characterized in that: The guide column is an elliptical column.

9. The liquid cooling channel plate according to claim 1, characterized in that: The partition bar is provided with a first mounting hole, the guide column is provided with a second mounting hole, and the cover plate is provided with a third mounting hole corresponding to the first mounting hole and the second mounting hole.

10. The liquid cooling channel plate according to claim 9, characterized in that: The partition strip and the guide column are both provided with positioning columns, and the first mounting hole and the second mounting hole are provided on the positioning columns; the third mounting hole is a positioning hole that is positioned and matched with the corresponding positioning column.

11. The liquid cooling channel plate according to any one of claims 1 to 10, characterized in that: It also includes heat dissipation fins, each of which is provided in the strip grooves, dividing the strip grooves into a plurality of sub-channels; the heat dissipation fins extend along the extension direction of the strip grooves in which they are located, and a gap is left between the heat dissipation fins and the guide structure; the bottom plate, each of the heat dissipation fins, and the first guide plate are all connected to the cover plate by brazing.

12. The liquid cooling channel plate according to claim 11, characterized in that: Each of the heat dissipating fins includes a plurality of subsections spaced apart along the extension direction of the strip groove in which it is located; each of the strip grooves includes a plurality of heat dissipating groups spaced apart in the extension direction thereof, and each of the heat dissipating groups includes a subsection of a plurality of heat dissipating fins spaced apart.

13. The liquid cooling channel plate according to claim 11, characterized in that: The first guide plate is connected to the upstream side of the guide column, and the first guide plate is not provided on the downstream side; the number of the heat dissipation fins in each of the strip grooves is equal; Among the heat dissipation fins located on the upstream side of the guide column, some are located radially outside the first guide plate, which are denoted as outer fins, and each of the outer fins extends out of the upstream end of the first guide plate, and the ends are aligned; the downstream ends of the remaining heat dissipation fins are spaced from the upstream end of the first guide plate; Among the heat dissipating fins located on the downstream side of the guide column, some heat dissipating fins that are mirror-distributed with the outer fins about the center plane of the dividing strip all extend out of the free end of the dividing strip, and the ends are aligned; a distance is left between the upstream ends of the remaining heat dissipating fins and the free end of the dividing strip, or they are flush with the free end, and the ends of the heat dissipating fins are aligned.

14. A supercomputing device, characterized in that: It comprises a computing board and the liquid-cooled runner plate according to any one of claims 1 to 13, wherein the computing board comprises computing chips, and the computing chips are arranged in multiple rows on the computing board; the computing board is installed on the outer side of the liquid-cooled runner plate, and the computing chips are in contact with the area where the medium flow channel on the liquid-cooled runner plate is located.

15. The supercomputing device according to claim 14, characterized in that: At least part of the computing power chip is located in the area corresponding to the first guide plate on the liquid-cooling channel plate.

16. The supercomputer device according to claim 14 or 15, characterized in that: Each row of the computing chips is connected in series, and the same strip groove corresponds to three rows of the computing chips. Each computing chip is bonded to the liquid-cooling channel plate through a heat-conducting material.

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