Semiconductor picking equipment

Abstract

The utility model discloses a semiconductor selecting device, which comprises a base; the first bearing disc is arranged on one side of the machine base, the first bearing disc is used for bearing a first semiconductor film, and a to-be-tested unit is fixed to the surface of the first semiconductor film; the second bearing disc is arranged on one side of the machine base, and the second bearing disc is used for bearing a second semiconductor film; the adsorption module is arranged on the machine base, and the adsorption module comprises a rotary driver and a first adsorber connected with the rotary driver; the first detection module is arranged on the adsorption module, and the first detection module is used for detecting the complete state of the to-be-detected units, the distribution state of the to-be-detected units on the first semiconductor film and the distribution state of the to-be-detected units on the second semiconductor film; a storage module; the adsorption module, the first detection module and the storage module are electrically connected with the control module; the semiconductor selecting equipment provided by the utility model can improve the sorting efficiency of the units to be detected.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, and particularly relates to a semiconductor sorting device. Background Art

[0002] Cutting semiconductors into particulate form is a key step in the semiconductor manufacturing process. This process involves cutting a complete sheet semiconductor into many independent units to be tested. Each unit to be tested is a separate integrated circuit, which can be packaged and used in electronic devices. Due to the limitations of the cutting process, after cutting the sheet semiconductor, some problems such as chipping, burrs or cracks may occur on the units to be tested. It is necessary to sort the good products and defective products, or classify and select the units under test with different test data after cutting. Therefore, it is necessary to select the units to be tested from the semiconductor film.

[0003] The existing semiconductor sorting devices usually use a single suction nozzle for sorting, and the sorting efficiency of the units to be tested is low. Summary of the Utility Model

[0004] The following is an overview of the subject matter described in detail in this article. This overview is not intended to limit the scope of protection of the claims.

[0005] The utility model provides a semiconductor sorting device, which can adjust the positions of the first carrier plate and the second carrier plate, so as to adjust the detection position of the first detection module and the suction position of the first adsorber.

[0006] The present utility model provides a semiconductor sorting device, comprising: a machine base; a first carrier plate disposed on one side of the machine base, the first carrier plate being used for carrying a first semiconductor film, and a unit to be tested being fixed on the surface of the first semiconductor film; a second carrier plate disposed on one side of the machine base, the second carrier plate being used for carrying a second semiconductor film, and the second carrier plate being parallel to the first carrier plate; an adsorption module disposed on the machine base, the adsorption module comprising a rotation driver and a first adsorber connected to the rotation driver, the first adsorber being located between the first carrier plate and the second carrier plate, the rotation driver being used for driving the first adsorber to rotate so that the adsorption end of the first adsorber faces the first semiconductor film or faces the second semiconductor film, the first adsorber comprising a first negative pressure machine and a plurality of first suction nozzles, each of the first suction nozzles being communicated with the first negative pressure machine through a pipeline, the first adsorber being used for sucking the unit to be tested located on the first semiconductor film or placing the sucked unit to be tested on the surface of the second semiconductor film; a first detection module disposed on the adsorption module, the first detection module being used for detecting the integrity state of the unit to be tested, the distribution state of the units to be tested on the first semiconductor film, and the distribution state of the units to be tested on the second semiconductor film; a storage module for storing the distribution state of the units to be tested on the first semiconductor film and the distribution state of the units to be tested on the second semiconductor film; a control module, and the adsorption module, the first detection module and the storage module are respectively electrically connected to the control module.

[0007] In some embodiments, a first lifting module and a second lifting module are further included, the first lifting module and the second lifting module are respectively electrically connected to the control module, the first lifting module is disposed on the side of the first carrier plate opposite to the adsorption module, the second lifting module is disposed on the side of the second carrier plate opposite to the adsorption module, the first lifting module is used for lifting the unit to be tested on the first semiconductor film, and the second lifting module is used for lifting the second semiconductor film.

[0008] In some embodiments, the first lifting module comprises a plurality of first ejector pins, the second lifting module comprises a plurality of second ejector pins, the first ejector pins are used for lifting the unit to be tested on the first semiconductor film, and the second ejector pins are used for lifting the second semiconductor film.

[0009] In one embodiment, a second detection module is further included, the second detection module is disposed on the adsorption module, and the second detection module is used for detecting the operating performance of the unit to be tested.

[0010] In some embodiments, a first moving module and a second moving module are provided on the machine base. The movable end of the first moving module is connected to the first carrier plate, and the fixed end of the first moving module is connected to the machine base. The first moving module is used to adjust the position of the first carrier plate. The movable end of the second moving module is connected to the second carrier plate, and the fixed end of the second moving module is connected to the machine base. The second moving module is used to adjust the position of the second carrier plate.

[0011] In some embodiments, a first fine adjustment screw is provided between the first adsorber and the rotary drive. The first fine adjustment screw is used to adjust the distance between the first adsorber and the rotary drive.

[0012] In some embodiments, a first elastic sheet is provided between the first adsorber and the rotary drive. The first elastic sheet is used to buffer and shock-proof the first adsorber.

[0013] In some embodiments, a first spring is provided between the first adsorber and the rotary drive. The first spring is used to buffer and shock-proof the first adsorber.

[0014] In some embodiments, the adsorption module further includes a second adsorber. The second adsorber is connected to the rotary drive. The second adsorber is located between the first carrier plate and the second carrier plate. The adsorption direction of the second adsorber is always opposite to that of the first adsorber. The second adsorber includes a second negative pressure machine and a plurality of second suction nozzles. Each of the second suction nozzles is respectively communicated with the second negative pressure machine through a pipeline. The second adsorber is used to suck the unit to be measured located on the first semiconductor film or place the sucked unit to be measured on the surface of the second semiconductor film.

[0015] In some embodiments, the first suction nozzle and the second suction nozzle are made of flexible materials.

[0016] The embodiments of the present application have at least the following beneficial effects: The semiconductor sorting device is provided with a first carrier plate and a second carrier plate. The first carrier plate is used to carry the first semiconductor film, and the to-be-tested units to be cut are pasted on the first semiconductor film. After the sheet-shaped semiconductor is cut into to-be-tested units, problems such as chipping, burrs or cracks may appear on the surface of the to-be-tested units. By setting the first detection module, the first detection module detects the to-be-tested units. When it is detected that the to-be-tested unit is complete, the first adsorber sucks the complete to-be-tested unit. When it is detected that the to-be-tested unit has defects, the first adsorber does not suck the to-be-tested unit. Thus, the complete to-be-tested units on the first semiconductor film can be successively and orderly sucked onto the second semiconductor film, and the defective to-be-tested units remain on the first semiconductor film, while the complete to-be-tested units are orderly placed on the second semiconductor film, thereby realizing the sorting work of the to-be-tested units. By setting the storage module, the storage module is used to store the distribution state of the to-be-tested units on the first semiconductor film and the distribution state of the to-be-tested units on the second semiconductor film. When the semiconductor sorting device is restarted, the detection position of the first detection module and the sucking position of the first adsorber can be automatically adjusted. The first detection module does not need to re-detect all the to-be-tested units on the first semiconductor film, and the first adsorber can also suck from the position of the to-be-tested units that have not been sucked, thereby improving the sorting efficiency of the semiconductor sorting device; moreover, a plurality of first suction nozzles are provided on the first adsorber, which can simultaneously adsorb multiple complete to-be-tested units on the first semiconductor film and place them on the second semiconductor film, so the sorting efficiency of the semiconductor sorting device can also be improved.

[0017] Other features and advantages of the present utility model will be described in the following description, and, in part, will be obvious from the description, or will be understood by implementing the present utility model. The objectives and other advantages of the present utility model can be achieved and obtained by the structures specifically pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings are used to provide a further understanding of the technical solutions of the present utility model, and constitute a part of the description. Together with the embodiments of the present utility model, they are used to explain the technical solutions of the present utility model, and do not constitute a limitation to the technical solutions of the present utility model.

[0019] Figure 1 It is an optional structural schematic diagram of the semiconductor sorting device provided by the embodiment of the present utility model;

[0020] Figure 2 For the embodiment of the present utility model Figure 1 An optional structural schematic diagram of position A in

[0021] Figure 3 For the embodiment of the present utility model Figure 1An optional structural schematic diagram of position B;

[0022] Figure 4 Another optional structural schematic diagram of the semiconductor sorting device provided by the embodiment of the present utility model;

[0023] Figure 5 Provided by the embodiment of the present utility model Figure 4 An optional structural schematic diagram of position C;

[0024] Figure 6 Another optional structural schematic diagram of the semiconductor sorting device provided by the embodiment of the present utility model;

[0025] Figure 7 An optional system block diagram of the semiconductor sorting device provided by the embodiment of the present utility model. Detailed implementation manners

[0026] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present utility model and should not be construed as limiting the present utility model.

[0027] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

[0028] In the description of the present utility model, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If the first and second are described only for the purpose of distinguishing technical features, they should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence relationship of the indicated technical features.

[0029] In the description of the present utility model, unless otherwise clearly defined, terms such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.

[0030] In the existing sorting device for units to be tested, after sorting the units to be tested multiple times, the sorting device for units to be tested may perform the sorting process of the units to be tested again on the sorted positions on the semiconductor film, resulting in low sorting efficiency of the units to be tested.

[0031] In view of the problem that there may be alignment deviation or missed alignment between the sorting device for the unit under test and the unit under test, which is likely to cause waste of the unit under test, the present utility model provides a semiconductor sorting device, which includes: a machine base; a first carrier plate disposed on one side of the machine base, the first carrier plate being used for carrying a first semiconductor film, and the surface of the first semiconductor film being fixed with the unit under test; a second carrier plate disposed on one side of the machine base, the second carrier plate being used for carrying a second semiconductor film, and the second carrier plate being parallel to the first carrier plate; an adsorption module disposed on the machine base, the adsorption module including a rotation driver and a first adsorber connected to the rotation driver, the first adsorber being located between the first carrier plate and the second carrier plate, the rotation driver being used for driving the first adsorber to rotate so that the adsorption end of the first adsorber faces the first semiconductor film or the second semiconductor film, the first adsorber including a first negative pressure machine and a plurality of first suction nozzles, each of the first suction nozzles being communicated with the first negative pressure machine through a pipeline, the first adsorber being used for sucking the unit under test located on the first semiconductor film or placing the sucked unit under test on the surface of the second semiconductor film; a first detection module disposed on the adsorption module, the first detection module being used for detecting the integrity state of the unit under test, the distribution state of the units under test on the first semiconductor film, and the distribution state of the units under test on the second semiconductor film; a storage module for storing the distribution state of the units under test on the first semiconductor film and the distribution state of the units under test on the second semiconductor film; a control module, the adsorption module, the first detection module and the storage module being electrically connected to the control module respectively; According to the solution provided by the embodiment of the present utility model, the semiconductor sorting device is provided with a first carrier plate and a second carrier plate. The first carrier plate is used for carrying a first semiconductor film, and the units under test are pasted on the first semiconductor film. After the sheet semiconductor is cut into units under test, problems such as chipping, burrs or cracks may appear on the surface of the units under test. By setting the first detection module, the first detection module detects the units under test. When it is detected that the unit under test is complete, the first adsorber sucks the complete unit under test. When it is detected that the unit under test has defects, the first adsorber does not adsorb the unit under test. Thus, the complete units under test on the first semiconductor film can be successively and orderly sucked onto the second semiconductor film, the defective units under test are left on the first semiconductor film, and the complete units under test are orderly placed on the second semiconductor film, thereby realizing the sorting work of the units under test. By setting the storage module, the storage module is used for storing the distribution state of the units under test on the first semiconductor film and the distribution state of the units under test on the second semiconductor film. When the semiconductor sorting device is restarted, the detection position of the first detection module and the suction position of the first adsorber can be automatically adjusted. The first detection module does not need to re-detect all the units under test on the first semiconductor film, and the first adsorber can also suck from the position of the units under test that have not been sucked, thereby improving the sorting efficiency of the semiconductor sorting device.

[0032] The following further elaborates on the embodiments of the present utility model in conjunction with the accompanying drawings.

[0033] Referring to Figures 1 to 5 , the embodiments of the present utility model provide a semiconductor selection device, including:

[0034] A base 100;

[0035] A first carrier plate 210, arranged on one side of the base 100, the first carrier plate 210 is used to carry a first semiconductor film, and a unit to be measured is fixed on the surface of the first semiconductor film;

[0036] A second carrier plate 220, arranged on one side of the base 100, the second carrier plate 220 is used to carry a second semiconductor film, and the second carrier plate 220 is parallel to the first carrier plate 210;

[0037] An adsorption module 300, arranged on the base 100, the adsorption module 300 includes a rotation driver 310 and a first adsorber 320 connected to the rotation driver 310. The first adsorber 320 is located between the first carrier plate 210 and the second carrier plate 220. The rotation driver 310 is used to drive the first adsorber 320 to rotate so that the adsorption end of the first adsorber 320 faces the first semiconductor film or the second semiconductor film. The first adsorber 320 includes a first negative pressure machine 321 and a plurality of first suction nozzles 322. Each of the first suction nozzles 322 is respectively communicated with the first negative pressure machine 321 through a pipeline. The first adsorber 320 is used to suck the unit to be measured on the first semiconductor film or place the sucked unit to be measured on the surface of the second semiconductor film;

[0038] A first detection module 410, arranged on the adsorption module 300, the first detection module 410 is used to detect the integrity state of the unit to be measured, the distribution state of the units to be measured on the first semiconductor film, and the distribution state of the units to be measured on the second semiconductor film;

[0039] A storage module 500, used to store the distribution state of the units to be measured on the first semiconductor film and the distribution state of the units to be measured on the second semiconductor film;

[0040] A control module 600, the adsorption module 300, the first detection module 410, and the storage module 500 are respectively electrically connected to the control module 600.

[0041] Based on this, the semiconductor selection device is provided with a first carrier plate 210 and a second carrier plate 220. The first carrier plate 210 is used to carry the first semiconductor film, and the to-be-tested units to be cut are pasted on the first semiconductor film. After the sheet semiconductor is cut into to-be-tested units, problems such as chipping, burrs or cracks may appear on the surface of the to-be-tested units. By setting the first detection module 410, the first detection module 410 detects the to-be-tested units. When it is detected that the to-be-tested unit is intact, the first adsorber 320 sucks up the intact to-be-tested unit. When it is detected that the to-be-tested unit has defects, the first adsorber 320 does not adsorb the to-be-tested unit. Thus, the intact to-be-tested units on the first semiconductor film can be successively sucked onto the second semiconductor film, and the defective to-be-tested units remain on the first semiconductor film, while the intact to-be-tested units are orderly placed on the second semiconductor film, thereby realizing the selection work of the to-be-tested units. By setting the storage module 500, the storage module 500 is used to store the distribution state of the to-be-tested units on the first semiconductor film and the distribution state of the to-be-tested units on the second semiconductor film. When the semiconductor selection device is restarted, the detection position of the first detection module 410 and the sucking position of the first adsorber 320 can be automatically adjusted. The first detection module 410 does not need to re-detect all the to-be-tested units on the first semiconductor film, and the first adsorber 320 can also suck from the position of the to-be-tested units that have not been sucked, thereby improving the selection efficiency of the semiconductor selection device.

[0042] Specifically, the sheet semiconductor is specifically a wafer, and the to-be-tested unit is specifically a die obtained by cutting the wafer.

[0043] In a specific embodiment, the first detection module 410 includes a first camera. The lens direction of the first camera is the same as the orientation of the first adsorber 320. When the semiconductor selection device starts to operate, the first adsorber 320 faces the first semiconductor film, and the first camera takes a picture of the first semiconductor film. The control module 600 analyzes the image obtained by the first camera. When the to-be-tested unit is damaged, the first adsorber 320 does not adsorb the to-be-tested unit. When the to-be-tested unit has good quality, the first adsorber 320 adsorbs the to-be-tested unit to make the to-be-tested unit detach from the first semiconductor film. The rotation driver 310 drives the first adsorber 320 to rotate. The first adsorber 320 faces the second semiconductor film and places the to-be-tested unit on the second semiconductor film. Then the first camera takes a picture of the second semiconductor film again to record the distribution state of the to-be-tested units on the second semiconductor film. The rotation driver 310 drives the first adsorber 320 to rotate again to make the first adsorber 320 face the first semiconductor film, and the above steps are repeatedly executed until all the to-be-tested units on the first semiconductor film are selected.

[0044] It should be noted that each time the first adsorber 320 faces the first semiconductor film, the control module 600 stores the distribution state of the units to be measured on the first semiconductor film in the storage module 500. Each time the first adsorber 320 faces the second semiconductor film, the control module 600 stores the distribution state of the units to be measured on the second semiconductor film in the storage module 500. The distribution state of the units to be measured on the first semiconductor film includes the positions of the units to be measured that have been adsorbed, the positions of the units to be measured that have not been adsorbed, and the positions of the damaged units to be measured. The distribution state of the units to be measured on the first semiconductor film includes the positions of the units to be measured that have been placed and the positions of the units to be measured that have not been placed.

[0045] Referring Figure 7 , some embodiments of the present invention further include a first lifting module 710 and a second lifting module 720. The first lifting module 710 and the second lifting module 720 are respectively electrically connected to the control module 600. The first lifting module 710 is disposed on the opposite side of the first carrier plate 210 from the adsorption module 300, and the second lifting module 720 is disposed on the opposite side of the second carrier plate 220 from the adsorption module 300. The first lifting module 710 is used to lift the units to be measured on the first semiconductor film, and the second lifting module 720 is used to lift the second semiconductor film.

[0046] In a specific embodiment, the semiconductor sorting device further includes a third moving module (not shown in the figure) and a fourth moving module (not shown in the figure). The fixed end of the third moving module is connected to the machine base 100, the movable end of the third moving module is connected to the first lifting module 710, and the third moving module is electrically connected to the control module 600. The third moving module is used to adjust the position of the first lifting module 710 so that the first lifting module 710 is aligned with the units to be measured on the first semiconductor film. The fixed end of the fourth moving module is connected to the machine base 100, the movable end of the fourth moving module is connected to the second lifting module 720, and the fourth moving module is electrically connected to the control module 600. The fourth moving module is used to adjust the position of the second lifting module 720.

[0047] Specifically, when the first adsorber 320 faces the first semiconductor film, the third moving module adjusts the position of the first lifting module 710 so that the first lifting module 710, the unit to be measured, and the first adsorber 320 are aligned in sequence. The first lifting module 710 ejects the unit to be measured towards the first adsorber 320, and the first adsorber 320 sucks out the unit to be measured. When the first adsorber 320 faces the second semiconductor film, the fourth moving module adjusts the position of the second lifting module 720 so that the second lifting module 720 is aligned with the first adsorber 320. The second lifting module 720 ejects the second semiconductor film towards the unit to be measured on the first adsorber 320 so that the unit to be measured is placed on the second semiconductor film.

[0048] Based on this, by setting the first lifting module 710, the first lifting module 710 ejects the unit under test on the first semiconductor film, which is beneficial for the first adsorber 320 to suck out the unit under test. The second lifting module 720 ejects the second semiconductor film, which is beneficial for the first adsorber 320 to place the unit under test at a specific position on the second semiconductor film.

[0049] In some embodiments of the present invention, the first lifting module 710 includes a plurality of first ejector pins (not shown in the figure), and the second lifting module 720 includes a plurality of second ejector pins (not shown in the figure). The first ejector pins are used to lift the unit under test on the first semiconductor film, and the second ejector pins are used to lift the second semiconductor film.

[0050] In a specific embodiment, the first lifting module 710 further includes a third negative pressure machine 711 and a first needle cavity 712. The first ejector pins are arranged in the first needle cavity 712. The first needle cavity 712 is connected to the third negative pressure machine 711 through a pipeline. The third negative pressure machine 711 is electrically connected to the control module 600. A needle outlet and a gas outlet are arranged on one side of the first needle cavity 712 close to the first carrier plate 210. The area of the needle outlet is equal to the cross-sectional area of the first ejector pin. When the first adsorber 320 faces the first semiconductor film, the third moving module moves the first lifting module 710 close to the unit under test. The third negative pressure machine 711 controls the first needle cavity 712 to be in a vacuum state, so that the first needle cavity 712 adsorbs the first semiconductor film. At the same time, the first ejector pins eject the unit under test from the needle outlet. After the first adsorber 320 sucks the unit under test, the third negative pressure machine 711 controls the first needle cavity 712 to exit the low-pressure state, and the third moving module controls the first lifting module 710 to move away from the first semiconductor film.

[0051] Similarly, the second lifting module 720 further includes a fourth negative pressure machine 721 and a second needle cavity 722. The second ejector pins are arranged in the second needle cavity 722. The second needle cavity 722 is connected to the fourth negative pressure machine 721 through a pipeline. The fourth negative pressure machine 721 is electrically connected to the control module 600. A needle outlet and a gas outlet are arranged on one side of the second needle cavity 722 close to the second carrier plate 220. The area of the needle outlet is equal to the cross-sectional area of the second ejector pin. When the first adsorber 320 faces the second semiconductor film, the fourth moving module moves the second lifting module 720 close to the second semiconductor film. The fourth negative pressure machine 721 controls the second needle cavity 722 to be in a vacuum state, so that the second needle cavity 722 adsorbs the second semiconductor film. At the same time, the second ejector pins eject the second semiconductor film, and the first adsorber 320 places the unit under test on the second semiconductor film. After the unit under test adheres to the second semiconductor film, the fourth negative pressure machine 721 controls the second needle cavity 722 to exit the low-pressure state, and the fourth moving module controls the second lifting module 720 to move away from the second semiconductor film.

[0052] It should be noted that the first thimble and the second thimble are both arranged in a rectangular alignment. Horizontally, the distance between any two first thimbles is an integer multiple of the width of the unit under test, and the distance between any two second thimbles is an integer multiple of the width of the unit under test; vertically, the distance between any two first thimbles is an integer multiple of the length of the unit under test, and the distance between any two second thimbles is an integer multiple of the length of the unit under test.

[0053] Referring to Figure 7 , some embodiments of the present invention further include a second detection module 420. The second detection module 420 is disposed on the adsorption module 300, and the second detection module 420 is used to detect the operating performance of the unit under test.

[0054] Specifically, the second detection module 420 is used to classify the unit under test according to different test data, assign a grade to the unit under test. The second semiconductor film is sequentially placed on the second carrier film, and the adsorption module sequentially adsorbs and places the unit under test on the corresponding second semiconductor film, so as to sort the unit under test according to the operating performance and test data of the unit under test.

[0055] It should be noted that classifying the unit under test according to different test data belongs to the prior art and will not be elaborated here.

[0056] In a specific embodiment, the second detection module 420 applies a preset test voltage to the unit under test, obtains the test result of the unit under test, and classifies the unit under test according to the test result.

[0057] Referring again to Figure 7 , some embodiments of the present invention, the machine base 100 is provided with a first moving module 230 and a second moving module 240. The movable end of the first moving module 230 is connected to the first carrier tray 210, the fixed end of the first moving module 230 is connected to the machine base 100, and the first moving module 230 is used to adjust the position of the first carrier tray 210. The movable end of the second moving module 240 is connected to the second carrier tray 220, the fixed end of the second moving module 240 is connected to the machine base 220, and the second moving module 240 is used to adjust the position of the second carrier tray 220.

[0058] In a specific embodiment, when the rotary drive 310 drives the first adsorber 320 to rotate towards the first carrier tray 210, the first moving module 230 adjusts the position of the first carrier tray 210 so that the unit under test is aligned with the first adsorber 320 in sequence. When the rotary drive drives the first device to rotate towards the second carrier tray 220, the second moving module 240 adjusts the position of the second carrier tray 220 so that the unit under test is placed on the second semiconductor film in an orderly manner.

[0059] Based on this, by setting the first moving module 230 and the second moving module 240, the positions of the first carrier plate 210 and the second carrier plate 220 can be automatically adjusted, thereby improving the automation level of the semiconductor picking device and enhancing the picking efficiency of the semiconductor picking device.

[0060] Referring to Figure 5 , in some embodiments of the present utility model, a first fine-tuning screw 311 is provided between the first adsorber 320 and the rotary driver 310, and the first fine-tuning screw 311 is used to adjust the distance between the first adsorber 320 and the rotary driver 310.

[0061] Based on this, by providing a first fine-tuning screw 311 between the first adsorber 320 and the rotary driver 310, the distance between the first adsorber 320 and the rotary driver 310 is adjusted by the first fine-tuning screw 311, so as to adjust the distances between the first adsorber 320 and the first semiconductor film and the second semiconductor film respectively. By controlling the distance between the first adsorber 320 and the unit to be measured on the first semiconductor film, the adsorption force of the first adsorber 320 on the unit to be measured can be adjusted. By controlling the distance between the first adsorber 320 and the second semiconductor film, the unit to be measured can be effectively pasted on the second semiconductor film, avoiding the detachment of the unit to be measured and also avoiding scratching of the second semiconductor film or the first semiconductor film by the first adsorber 320.

[0062] Referring again to Figure 5 , in some embodiments of the present utility model, a first elastic sheet 312 is provided between the first adsorber 320 and the rotary driver 310, and the first elastic sheet 312 is used to buffer and shock-proof the first adsorber 320.

[0063] In some embodiments of the present utility model, a first spring 313 is provided between the first adsorber 320 and the rotary driver 310, and the first spring 313 is used to buffer and shock-proof the first adsorber 320.

[0064] Based on this, by providing the first elastic sheet 312 and the first spring 313 between the first adsorber 320 and the rotary driver 310, it is possible to prevent the unit to be measured from falling off the first adsorber 320 when the rotary driver 310 rotates the first adsorber 320, thereby improving the stability of the semiconductor picking device and enhancing the efficiency of the semiconductor picking device.

[0065] Referring to Figure 1 and Figure 4, in some embodiments of the present utility model, the adsorption module 300 further includes a second adsorber 330. The second adsorber 330 is connected to the rotation driver 310. The second adsorber 330 is located between the first carrier plate 210 and the second carrier plate 220. The adsorption direction of the second adsorber 330 is always opposite to that of the first adsorber 320. The second adsorber 330 is used to pick up the unit under test located on the first semiconductor film or place the picked-up unit under test on the surface of the second semiconductor film.

[0066] In a specific embodiment, when the first adsorber 320 faces the first semiconductor film and picks up the unit under test from the first semiconductor film, the second adsorber 330 faces the second semiconductor film and places the unit under test on the second semiconductor film.

[0067] It can be understood that a second fine-tuning screw 314, a second elastic sheet 315 and a second spring 316 are provided between the second adsorber 330 and the rotation driver 310.

[0068] In a specific embodiment, the first detection module 410 further includes a second camera. The lens direction of the second camera is the same as the orientation of the second adsorber 330.

[0069] It can be understood that the working principle and process of the second adsorber 330 are similar to those of the first adsorber 320 and have similar beneficial effects as those of the first adsorber 320 described above, which will not be elaborated here.

[0070] Refer again to Figure 2 , in some embodiments of the present utility model, the second adsorber 330 includes a second negative pressure machine 331 and a plurality of second suction nozzles 332. Each of the second suction nozzles 332 is respectively communicated with the second negative pressure machine 331 through a pipeline. The second negative pressure machine 331 is electrically connected to the control module 600.

[0071] It should be noted that both the first suction nozzle 322 and the second suction nozzle 332 are arranged in a rectangular alignment. Horizontally, the distance between any two first suction nozzles 322 is an integer multiple of the width of the unit under test, and the distance between any two second suction nozzles 332 is an integer multiple of the width of the unit under test; vertically, the distance between any two first suction nozzles 322 is an integer multiple of the length of the unit under test, and the distance between any two second suction nozzles 332 is an integer multiple of the length of the unit under test.

[0072] In some embodiments of the present utility model, the first suction nozzle 322 and the second suction nozzle 332 are made of flexible materials.

[0073] Based on this, by providing a first suction nozzle 322 made of a flexible material on the first adsorber 320 and a second suction nozzle 332 made of a flexible material on the second adsorber 330, it is possible to avoid scratching the unit under test by the first suction nozzle 322 or the second suction nozzle 332 during the suction and transfer processes.

[0074] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge scope of those of ordinary skill in the art.

Claims

1. A semiconductor selection device, characterized in that: include: Machine base; A first carrier plate is arranged on one side of the base, the first carrier plate is used to carry a first semiconductor film, a unit to be tested is fixed on the surface of the first semiconductor film, wherein the unit to be tested is obtained by cutting a sheet semiconductor on the first semiconductor film; A second carrier plate, disposed on one side of the base, the second carrier plate is used to carry a second semiconductor film, and the second carrier plate is parallel to the first carrier plate; An adsorption module is arranged on the machine base, the adsorption module comprises a rotary drive and a first adsorber connected to the rotary drive, the first adsorber is located between the first carrier plate and the second carrier plate, the rotary drive is used to drive the first adsorber to rotate so that the adsorption end of the first adsorber faces the first semiconductor film or the second semiconductor film, the first adsorber comprises a first negative pressure machine and a plurality of first suction nozzles, each of the first suction nozzles is connected to the first negative pressure machine through a pipeline, and the first adsorber is used to absorb the unit to be tested located on the first semiconductor film or place the absorbed unit to be tested on the surface of the second semiconductor film; a first detection module, arranged on the adsorption module, the first detection module being used to detect the complete state of the unit to be tested, the distribution state of the unit to be tested on the first semiconductor film, and the distribution state of the unit to be tested on the second semiconductor film; A storage module, used for storing the distribution state of the units to be tested on the first semiconductor film and the distribution state of the units to be tested on the second semiconductor film; A control module, the adsorption module, the first detection module and the storage module are electrically connected to the control module respectively.

2. The semiconductor selection device according to claim 1, characterized in that It also includes a first lifting module and a second lifting module, the first lifting module and the second lifting module are electrically connected to the control module respectively, the first lifting module is arranged on the side of the first carrying plate opposite to the adsorption module, and the second lifting module is arranged on the side of the second carrying plate opposite to the adsorption module, the first lifting module is used to lift the unit to be tested on the first semiconductor film, and the second lifting module is used to lift the second semiconductor film.

3. The semiconductor selection device according to claim 2, characterized in that: The first lifting module includes a plurality of first lift pins, and the second lifting module includes a plurality of second lift pins. The first lift pins are used to lift the unit under test on the first semiconductor film, and the second lift pins are used to lift the second semiconductor film.

4. The semiconductor selection device according to claim 1, characterized in that: It also includes a second detection module, which is arranged on the adsorption module and is used to detect the operating performance of the unit to be tested.

5. The semiconductor selection device according to claim 1, characterized in that The base is provided with a first movable module and a second movable module, the movable end of the first movable module is connected to the first carrying plate, the fixed end of the first movable module is connected to the base, the first movable module is used to adjust the position of the first carrying plate, the movable end of the second movable module is connected to the second carrying plate, the fixed end of the second movable module is connected to the base, and the second movable module is used to adjust the position of the second carrying plate.

6. The semiconductor selection device according to claim 1, characterized in that A first fine-tuning screw is provided between the first adsorber and the rotary driver, and the first fine-tuning screw is used to adjust the distance between the first adsorber and the rotary driver.

7. The semiconductor selection device according to claim 1, characterized in that: A first elastic sheet is arranged between the first adsorber and the rotary driver, and the first elastic sheet is used for buffering and shockproofing the first adsorber.

8. The semiconductor selection device according to claim 1, characterized in that A first spring is arranged between the first adsorber and the rotary driver, and the first spring is used for buffering and shockproofing the first adsorber.

9. The semiconductor selection device according to claim 1, characterized in that: The adsorption module also includes a second adsorber, which is connected to the rotary driver and located between the first carrier plate and the second carrier plate. The adsorption direction of the second adsorber is always opposite to that of the first adsorber. The second adsorber includes a second negative pressure machine and a plurality of second suction nozzles, each of which is connected to the second negative pressure machine through a pipe. The second adsorber is used to absorb the unit to be tested on the first semiconductor film or place the absorbed unit to be tested on the surface of the second semiconductor film.

10. The semiconductor selection device according to claim 9, characterized in that The first suction nozzle and the second suction nozzle are made of flexible material.

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