Radian stamping equipment for IGBT (Insulated Gate Bipolar Translator) integrated circuit substrate

Abstract

The utility model discloses radian stamping equipment for an IGBT (Insulated Gate Bipolar Transistor) integrated circuit substrate, which relates to the technical field of radian stamping and comprises a base, a first servo press and a second servo press are arranged on the base, and each of the first servo press and the second servo press comprises a frame which is converged into a shape like a Chinese character'fang '. Hydraulic lifting columns are fixed to the top in the rack, a length-direction radian mold and a coining radian mold are arranged in the first servo press and the second servo press correspondingly, the length-direction radian mold and the coining radian mold are arranged, and the radian data of mass production of products are controlled in a mold pressing mode, so that the production and use cost is reduced, and the production efficiency is improved. Good heat conductivity between the metal base plate and the radiator is guaranteed, the manufacturing cost is low, the accuracy rate is improved through die stamping, the module quality is better guaranteed, the circuit substrate and the radiating metal substrate do not need to be manufactured separately and do not need secondary welding, and meanwhile the device is easy to operate, low in input cost and high in stamping qualification rate.

Description

Technical Field

[0001] The utility model relates to the technical field of radian stamping, in particular to a radian stamping device for an IGBT integrated circuit substrate. Background Art

[0002] At present, in order to better dissipate heat, most PCB metal substrates need to be mounted on a radiator during product assembly so that the PCB metal substrate can operate stably and reliably. The heat dissipation performance of the substrate is crucial. And to ensure the close contact between the PCB metal bottom plate and the heat sink, the bottom plate of the metal substrate will be deliberately bent during the manufacturing process to ensure the close fit between the bottom plate and the heat sink when the fixing screws are tightened. The laminate of the PCB metal substrate consists of a top-layer wiring copper layer, an intermediate ceramic insulation layer, and a bottom heat-dissipating metal layer. Poor control of the curvature process during the overall radian production will cause the intermediate metal insulation layer to crack. After research and exploration by our company, a complete manufacturing process has been invented.

[0003] The prior art is that in the current IGBT industry, the circuit substrate and the heat-dissipating metal substrate are manufactured separately. First, the circuit substrate is manufactured, and after the metal substrate is made into a radian, the circuit substrate is welded to the heat-dissipating metal. This manufacturing method is prone to producing defective products, increasing the risk of voids, increasing the thermal resistance, and reducing the heat dissipation effect.

[0004] The prior art has the following disadvantages: manufacturing the circuit substrate and the heat-dissipating metal substrate separately is slow and inefficient, which is not conducive to batch operation. Secondly, secondary soldering is prone to poor soldering. Moreover, an additional solder paste layer is added in the middle, increasing the thermal resistance and reducing the heat dissipation effect of the IGBT module. Also, the finished circuit substrate is flat, and the heat-dissipating metal substrate has a radian. After such superposition, under the condition of CTE mismatch in the high and low temperature fusion environment, the upper and lower layers will be pulled, reducing the service life of the product. Additionally, when the integrated substrate is not made into a radian, there will be a gap between the bottom plate and the heat sink when the substrate is installed on the radiator and the fixing screws are tightened, and the thermal grease cannot be completely filled, affecting the heat dissipation effect. Finally, in the way of the roller leveling machine, the radian value is uncontrollable, and there are quality hazards in batch production of products. Therefore, the current circuit substrate radian production device is not easy to operate, has a high input cost, and a low qualification rate. Therefore, we propose a radian stamping device for an IGBT integrated circuit substrate to solve the above problems. Summary of the Utility Model

[0005] The utility model provides a radian stamping device for an IGBT integrated circuit substrate, which solves the technical problems that the current circuit substrate radian stamping device is not easy to operate, has a high input cost, and a low qualification rate.

[0006] To solve the above technical problems, a radian stamping device for an IGBT integrated circuit substrate provided by the utility model includes a base, on which a first servo press and a second servo press are arranged. Both the first servo press and the second servo press include a frame assembled into a "C" shape. Hydraulic lifting columns are fixed at the top inside the frame, and threaded holes are opened at the bottom inside the frame. A first radian mold and a fine pressing radian mold are respectively arranged inside the first servo press and the second servo press.

[0007] Preferably, the long - direction radian mold includes a first upper jaw and a first lower jaw. The first upper jaw is arranged at the bottom of the hydraulic lifting column of the first servo press, and the first lower jaw is bolt - fixed inside the frame of the first servo press. A first radian protrusion is arranged at the bottom of the first upper jaw, and an arc groove matching the first radian protrusion is opened on the first lower jaw.

[0008] Adopting the above - mentioned technical solution: Since the long - direction radian mold includes a first upper jaw and a first lower jaw, the first upper jaw is arranged at the bottom of the hydraulic lifting column of the first servo press, the first lower jaw is bolt - fixed inside the frame of the first servo press, a first radian protrusion is arranged at the bottom of the first upper jaw, and an arc groove matching the first radian protrusion is opened on the first lower jaw. The circuit substrate is placed in the arc groove of the first lower jaw. By starting the first servo press and controlling the hydraulic lifting column to descend, the first upper jaw is pressed on the circuit substrate, thereby pressing the long - direction radian of the circuit substrate.

[0009] Preferably, the fine - pressing radian mold includes a second upper jaw and a second lower jaw. The second upper jaw is arranged at the bottom of the hydraulic lifting column of the second servo press, and the second lower jaw is bolt - fixed inside the frame of the second servo press. Second radian protrusions are arranged on both sides of the second upper jaw, and fixing grooves symmetrically distributed with the center of the second upper jaw are fixed on the second lower jaw.

[0010] Adopting the above - mentioned technical solution: Since the fine - pressing radian mold includes a second upper jaw and a second lower jaw, the second upper jaw is arranged at the bottom of the hydraulic lifting column of the second servo press, the second lower jaw is bolt - fixed inside the frame of the second servo press, second radian protrusions are arranged on both sides of the second upper jaw, and fixing grooves symmetrically distributed with the center of the second upper jaw are fixed on the second lower jaw. The circuit substrate after pressing the long - direction radian is placed on the second lower jaw, and the second upper jaw is used to finely press the circuit substrate after pressing the long - direction radian.

[0011] Preferably, fixing blocks are fixed on both sides of the second servo press. A sliding column is movably inserted into the fixing block. The bottom end of the sliding column is fixed with a fixing plate. The top end of the fixing plate is fixedly connected with the hydraulic lifting column, and the bottom end of the fixing plate is fixed with a clamping plate. The second upper jaw is clamped and fixed at the bottom of the clamping plate.

[0012] Adopting the above technical solution: Fixed blocks are provided on both sides of the second servo press. A sliding column is movably inserted into the fixed block. A fixed plate is fixed to the bottom end of the sliding column. The top end of the fixed plate is fixedly connected to the hydraulic lifting column. A clamping plate is fixed to the bottom end of the fixed plate. The second upper jaw is fixedly clamped to the bottom of the clamping plate, so that when the second upper jaw presses down, the sliding column slides down on the fixed block, making both ends of the fixed plate more stable and the pressing process smoother.

[0013] Preferably, positioning columns are fixed to the bottom of both sides of the clamping plate.

[0014] Adopting the above technical solution: By fixing positioning columns to the bottom of both sides of the clamping plate, precise stamping can be carried out.

[0015] Preferably, positioning holes are provided on both sides of the second lower jaw, and the positioning holes are inserted and connected with the positioning columns.

[0016] Adopting the above technical solution: By providing positioning holes on both sides of the second lower jaw and inserting and connecting the positioning holes with the positioning columns, when the second upper jaw presses down under the action of the hydraulic lifting column, precise stamping can be carried out on the second lower jaw to form a more precise stamping.

[0017] Preferably, a partition plate is fixed to the top of the base, and the partition plate is arranged between the first servo press and the second servo press.

[0018] Adopting the above technical solution: By fixing a partition plate to the top of the base and arranging the partition plate between the first servo press and the second servo press, the first servo press and the second servo press will not be affected during operation.

[0019] Compared with the related technology, the utility model has the following beneficial effects:

[0020] 1. Compared with the traditional arc manufacturing equipment, the utility model is provided with a longitudinal arc mold and a fine pressing arc mold, and controls the arc data of mass production of products by using the mold pressing method. The application makes the arc of the metal substrate before installing the bottom plate to ensure that the metal base plate can maintain a certain arc after passing through the welding vacuum furnace and can be flatly installed after tightening the screws with the radiator, avoiding the failure of the PCB metal base plate, reducing the production and use cost, and at the same time ensuring good heat conductivity between the metal base plate and the radiator. The manufacturing cost is low, batch production can be carried out, the accuracy of mold stamping is improved, the quality of the module is more guaranteed, the circuit board and the heat dissipation metal substrate do not need to be separately manufactured, there is no need for secondary welding, no internal cavities will be generated, the circuit board and the heat dissipation metal substrate do not need to be separately manufactured, there is no solder paste layer in the middle, the thermal resistance is reduced, and the heat dissipation effect of the IGBT module is better. At the same time, the device is easy to operate, has a low input cost, and a high stamping qualification rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic structural diagram of a radian stamping device for an IGBT integrated circuit substrate;

[0022] Figure 2 It is a disassembled structure diagram of the first servo press and the long-side radian mold in a radian stamping device for an IGBT integrated circuit substrate;

[0023] Figure 3 It is a disassembled structure diagram of the second servo press and the fine-pressing radian mold in a radian stamping device for an IGBT integrated circuit substrate;

[0024] Figure 4 It is a side view of the long-side radian mold in a radian stamping device for an IGBT integrated circuit substrate;

[0025] Figure 5 It is a top view of the fine-pressing radian mold in a radian stamping device for an IGBT integrated circuit substrate.

[0026] Reference numerals in the figure: 1. Base; 2. First servo press; 3. Second servo press; 4. Frame; 5. Long-side radian mold; 51. First upper jaw; 52. First radian protrusion; 53. First lower jaw; 54. Arc groove; 6. Fixed block; 61. Sliding column; 62. Fixed plate; 63. Clamping plate; 64. Positioning column; 7. Fine-pressing radian mold; 71. Second upper jaw; 72. Second radian protrusion; 73. Second lower jaw; 74. Positioning hole; 75. Fixed groove; 8. Hydraulic lifting column; 9. Partition board. Specific embodiments

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] Embodiment 1

[0029] As Figures 1 - 5 shown, a radian stamping device for an IGBT integrated circuit substrate includes a base 1, on which a first servo press 2 and a second servo press 3 are arranged. Both the first servo press 2 and the second servo press 3 include frames 4 assembled into a "C" shape. Hydraulic lifting columns 8 are fixed at the top inside the frames 4, and threaded holes are opened at the bottom inside the frames 4. A long-side radian mold 5 and a fine-pressing radian mold 7 are respectively arranged inside the first servo press 2 and the second servo press 3;

[0030] A first servo press 2 and a second servo press 3 are arranged on a base 1. Both the first servo press 2 and the second servo press 3 include a frame 4 assembled into a "C" shape. A hydraulic lifting column 8 is fixed to the inner top of the frame 4, and threaded holes are formed in the inner bottom of the frame 4. A long-side arc mold 5 and a fine press arc mold 7 are respectively arranged in the first servo press 2 and the second servo press 3. By providing the long-side arc mold 5 and the fine press arc mold 7, the batch production arc data of the product is controlled by the mold pressing method. First, it is stamped on the long-side arc mold 5, and then fine pressed on the fine press arc mold 7. In this application, the arc of the metal substrate is made before the bottom plate is installed to ensure that the metal base plate can maintain a certain arc after passing through the welding vacuum furnace and can be flatly installed after being tightly screwed with the radiator, avoiding the failure of the PCB metal base plate, reducing the production and use cost, and at the same time ensuring good heat conductivity between the metal base plate and the radiator. The production cost is low, and batch production can be carried out. The mold stamping improves the accuracy rate, and the module quality is more guaranteed. The circuit board and the heat dissipation metal substrate do not need to be separately manufactured, and there is no need for secondary soldering, and no internal cavities will be generated. The circuit board and the heat dissipation metal substrate do not need to be separately manufactured, and there is no solder paste layer in the middle, reducing the thermal resistance, and the heat dissipation effect of the IGBT module is better. At the same time, the device is easy to operate, has a low input cost, and a high stamping qualification rate.

[0031] Embodiment 2

[0032] As Figures 1 - 5As shown in the figure, the long-side arc mold 5 includes a first upper jaw 51 and a first lower jaw 53. The first upper jaw 51 is arranged at the bottom of the hydraulic lifting column 8 of the first servo press 2. The lower jaw of the long-side arc mold 5 is bolted and fixed inside the frame 4 of the first servo press 2. A first arc protrusion 52 is arranged at the bottom of the first upper jaw 51, and an arc groove 54 that matches the first arc protrusion 52 is formed on the first lower jaw 53. The fine pressing arc mold 7 includes a second upper jaw 71 and a second lower jaw 73. The second upper jaw 71 is arranged at the bottom of the hydraulic lifting column 8 of the second servo press 3. The second lower jaw 73 is bolted and fixed inside the frame 4 of the second servo press 3. Second arc protrusions 72 are arranged on both sides of the second upper jaw 71, and fixed grooves 75 that are symmetrically distributed with the center of the second upper jaw 71 as the center are fixed on the second lower jaw 73. Fixed blocks 6 are fixed on both sides of the second servo press 3. Slide columns 61 are movably inserted into the fixed blocks 6. The bottom end of the slide column 61 is fixed with a fixing plate 62. The top end of the fixing plate 62 is fixedly connected to the hydraulic lifting column 8. The bottom end of the fixing plate 62 is fixed with a clamping plate 63. The bottom of the clamping plate 63 is clamped and fixed with the second upper jaw 71. Positioning columns 64 are fixed at the bottom of both sides of the clamping plate 63. Positioning holes 74 are formed on both sides of the second lower jaw 73, and the positioning holes 74 are inserted and connected with the positioning columns 64. When the second upper jaw 71 is pressed down under the action of the hydraulic lifting column 8, precise stamping can be carried out on the second lower jaw 73 to form a more precise stamping. A partition 9 is fixed on the top of the base 1. The partition 9 is arranged between the first servo press 2 and the second servo press 3, so that the first servo press 2 and the second servo press 3 will not be affected during operation;

[0033] The long-side arc mold 5 includes a first upper jaw 51 and a first lower jaw 53. The first upper jaw 51 is arranged at the bottom of the hydraulic lifting column 8 of the first servo press 2. The lower jaw of the long-side arc mold 5 is bolted and fixed inside the frame 4 of the first servo press 2. A first arc protrusion 52 is arranged at the bottom of the first upper jaw 51, and an arc groove 54 that matches the first arc protrusion 52 is formed on the first lower jaw 53. The circuit board is arranged on the arc groove 54 of the first lower jaw 53. By starting the first servo press 2, the hydraulic lifting column 8 is controlled to descend, so that the first upper jaw 51 presses on the circuit board, thereby pressing the long-side arc of the circuit board;

[0034] The fine pressing arc mold 7 includes a second upper jaw 71 and a second lower jaw 73. The second upper jaw 71 is arranged at the bottom of the hydraulic lifting column 8 of the second servo press 3. The second lower jaw 73 is bolted and fixed inside the frame 4 of the second servo press 3. Second arc protrusions 72 are arranged on both sides of the second upper jaw 71, and fixed grooves 75 that are symmetrically distributed with the center of the second upper jaw 71 as the center are fixed on the second lower jaw 73. The circuit board that has been pressed with the long-side arc is placed on the second lower jaw 73, and the second upper jaw 71 is used to finely press the circuit board that has been pressed with the long-side arc.

[0035] Working principle: As shown in Figures 1 - 5As shown, according to the radian of the module radiator, the module radian is calculated, and then the required radian range of the substrate is calculated according to the aspect ratio to verify whether it is within the limit value of the substrate radian. The specification size is determined according to the measured length and width dimensions of the PCB metal substrate. The die accessories drawings are drawn by CAD, and the die body, each part accessory and the installation hole positions are made by lathe according to the CAD drawings. First, the long-side die is assembled and installed on the machine, and then the fine-pressing radian die is assembled. First, the IGBT integrated substrate is placed on the equipment equipped with the long-side radian die 5. The equipment parameters are set according to the height of the upper and lower dies and the thickness of the product. There is a first radian protrusion 52 at the bottom of the first upper jaw 51, and an arc groove 54 matching the first radian protrusion 52 is opened on the first lower jaw 53. The circuit substrate is arranged in the arc groove 54 of the first lower jaw 53. The first servo press 2 is started to control the hydraulic lifting column 8 to descend, so that the first upper jaw 51 presses on the circuit substrate, thereby pressing the long-side radian of the circuit substrate. After the pressure value reaches the set value, the upper die automatically rises; then the IGBT integrated substrate is placed on the equipment equipped with the fine-pressing radian die. There are second radian protrusions 72 on both sides of the second upper jaw 71, and fixed grooves 75 symmetrically distributed with the second upper jaw 71 as the center are fixed on the second lower jaw 73. The circuit substrate that has completed the long-side radian pressing is placed on the second lower jaw 73, and the second upper jaw 71 performs fine pressing on the circuit substrate that has completed the long-side pressing. After the pressure value reaches the set value, the upper die automatically rises. After the die pressing is completed, the radian tester made by our company with the patent number CN220524861U is used to measure whether the radian in the XY direction meets the requirements for installing the heat dissipation suction cup.

[0036] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A curvature stamping device for an IGBT integrated circuit substrate, comprising a base (1), on which a first servo press (2) and a second servo press (3) are arranged, characterized in that: The first servo press (2) and the second servo press (3) both include a frame (4) in the shape of a "C", a hydraulic lifting column (8) is fixed to the inner top of the frame (4), threaded holes are formed in the inner bottom of the frame (4), and a long arc mold (5) and a fine pressing arc mold (7) are respectively arranged in the first servo press (2) and the second servo press (3).

2. The arc stamping equipment for IGBT integrated circuit substrate according to claim 1, characterized in that: The long arc mold (5) includes a first upper jaw (51) and a first lower jaw (53). The first upper jaw (51) is arranged at the bottom of the hydraulic lifting column (8) of the first servo press (2), the first lower jaw (53) is bolted and fixed inside the frame (4) of the first servo press (2), a first arc protrusion (52) is arranged at the bottom of the first upper jaw (51), and an arc groove (54) that matches the first arc protrusion (52) is formed in the first lower jaw (53).

3. The arc stamping equipment for IGBT integrated circuit substrate according to claim 1, characterized in that: The fine pressing arc mold (7) includes a second upper jaw (71) and a second lower jaw (73). The second upper jaw (71) is arranged at the bottom of the hydraulic lifting column (8) of the second servo press (3), the second lower jaw (73) is bolted and fixed inside the frame (4) of the second servo press (3), second arc protrusions (72) are arranged on both sides of the second upper jaw (71), and fixing grooves (75) symmetrically distributed with the second upper jaw (71) as the center are fixed on the second lower jaw (73).

4. The arc stamping equipment for IGBT integrated circuit substrate according to claim 1, characterized in that: Fixed blocks (6) are fixed on both sides of the second servo press (3). A sliding column (61) is movably inserted into the fixed blocks (6). The bottom end of the sliding column (61) is fixed with a fixing plate (62). The top end of the fixing plate (62) is fixedly connected to the hydraulic lifting column (8). The bottom end of the fixing plate (62) is fixed with a clamping plate (63). The second upper jaw (71) is clamped and fixed at the bottom of the clamping plate (63).

5. The arc stamping equipment for IGBT integrated circuit substrate according to claim 4, characterized in that: Positioning columns (64) are fixed to the bottom of both sides of the clamping plate (63).

6. The arc stamping equipment for IGBT integrated circuit substrate according to claim 3, characterized in that: Positioning holes (74) are formed in both sides of the second lower jaw (73). The positioning holes (74) are inserted and connected with the positioning columns (64).

7. The arc stamping equipment for IGBT integrated circuit substrate according to claim 3, characterized in that: A partition plate (9) is fixed to the top of the base (1). The partition plate (9) is arranged between the first servo press (2) and the second servo press (3).

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