PCB processing reflow oven

Abstract

The utility model relates to the field of reflow ovens, and discloses a PCB (printed circuit board) processing reflow oven which comprises a processing table; a conveying groove is formed in the upper surface of the machining table. A conveyor belt disposed inside the conveying trough; the furnace body is arranged above the machining table, and a cavity is formed in the furnace body; the through groove is formed in the furnace body, the through groove is parallel to the conveying groove, and a through air outlet is formed between the through groove and the cavity of the furnace body; the heating plate is arranged on the top plate of the cavity of the furnace body; the first springs are transversely arranged on the front side and the rear side in the furnace body cavity; the adjusting plate is arranged on one side close to the first spring; and the telescopic plate is perpendicular to the adjusting plate, one end of the telescopic plate is fixedly connected with the lower end of the adjusting plate, and the other end of the telescopic plate is arranged on a lower bottom plate of the furnace body cavity and tightly attached to the lower bottom plate. The PCB processing reflow oven solves the problem that heat of a heating plate is wasted due to the fact that the width of the heating plate of an existing device is fixed.

Description

Technical Field

[0001] The utility model belongs to the field of reflow soldering furnaces, and particularly relates to a reflow soldering furnace for PCB board processing. Background Art

[0002] PCB, whose Chinese name is printed circuit board and is also called printed wiring board, is an important electronic component, a support for electronic components, and a carrier for the electrical interconnection of electronic components. Since it is made by electronic printing technology, it is called a "printed" circuit board. Almost every electronic device, from small electronic watches and calculators to computers, communication electronic devices, and military weapon systems, as long as there are electronic components such as integrated circuits, printed boards are used to make the electrical interconnection between each component. With the increasing requirements for the quality and production efficiency of electronic products, the reflow soldering furnaces for PCB board processing are constantly improved and optimized in technology to meet the market demand. The distance between the heating device and the PCB of the existing reflow soldering furnaces for PCB board processing is fixed and not easy to adjust, thus affecting the heating efficiency. Moreover, the control panel of the existing reflow soldering furnaces for PCB board processing is fixedly installed and cannot be adjusted according to the height of employees. It is difficult for employees with lower height to operate the control panel, and the practicability is poor.

[0003] The Chinese utility model patent with the publication number of CN220761297U discloses a reflow soldering furnace for PCB board processing. By starting the electric telescopic rod, the rack fixedly connected to the output end of the electric telescopic rod moves left and right along the slide plate, so that the first gear meshed with the rack rotates, and then the first adjusting rod fixedly connected to the first gear rotates. Furthermore, the second adjusting rod fixedly connected to the first adjusting rod through the rotating shaft moves up and down as the first adjusting rod rotates, and the heating plate fixedly connected to the second adjusting rod can be adjusted up and down, so that the distance between the heating plate and the PCB board can be adjusted. The closer the distance, the higher the heating efficiency, and it has the advantage of improving the heating efficiency of the device. By starting the motor, the second gear fixedly connected to the output end of the motor rotates, so that the toothed plate meshed with the second gear moves up and down, and then the lifting plate fixedly connected to the toothed plate moves up and down, and the height of the control panel can be adjusted, which is convenient for employees of different heights to use, and the practicability is strong. However, this device still has some other problems. For example, the width of the heating plate of this device is fixed, resulting in no PCB board being arranged below some areas of the heating plate, thus causing waste of heat. Content of the Utility Model

[0004] The purpose of the utility model is to provide a reflow soldering furnace for PCB board processing to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the following technical solutions are provided: A reflow soldering furnace for PCB board processing, comprising:

[0006] Processing table, on the upper surface of which a conveying groove is provided;

[0007] Conveyor belt, disposed inside the conveying groove;

[0008] Furnace body, disposed above the processing table, and the interior of the furnace body is provided as a cavity;

[0009] Through groove, opened on the furnace body, and the through groove is arranged in parallel with the conveying groove, and a through air outlet is provided between the through groove and the cavity of the furnace body;

[0010] Heating plate, disposed on the top plate of the cavity of the furnace body;

[0011] First spring, horizontally arranged on the front and rear sides inside the cavity of the furnace body;

[0012] Adjusting plate, disposed on the side where the first springs are close to each other;

[0013] Expansion plate, arranged perpendicular to the adjusting plate, and one end of the expansion plate is fixedly connected to the lower end of the adjusting plate, and the other end of the expansion plate is in close contact with the lower bottom plate of the cavity of the furnace body.

[0014] In the above technical solution, further, the expansion plate is composed of a sleeve plate and a sliding plate. One side of the sleeve plate is fixedly connected to the inner wall of the cavity of the furnace body. An opening is provided at a position of the sleeve plate close to the adjusting plate. One end of a second spring is fixedly connected horizontally inside the opening, and the other end of the second spring is fixedly connected to the sliding plate. The sliding plate is slidably arranged inside the sleeve plate.

[0015] In any of the above technical solutions, further, adjusting mechanisms are provided on both sides of the processing table, and the adjusting mechanisms include:

[0016] U-shaped blocks, fixedly connected to both sides of the processing table;

[0017] Connecting plates, fixedly connected inside the U-shaped blocks;

[0018] Limiting plates, both ends of which are sleeved on the connecting plates;

[0019] Baffle plates, disposed on the upper surfaces of the limiting plates, and the baffle plates pass through the air outlet and extend between the two adjusting plates.

[0020] In any of the above technical solutions, further, a fixing device is provided at one end of the limiting plate close to the inlet of the through groove, and the fixing device includes:

[0021] The fixing frame is arranged on one side of the limiting plate close to the inlet of the through groove, and the fixing frame is sleeved on the connecting plate;

[0022] The fixing hole is opened at the lower end of the fixing frame;

[0023] The fixing bolt is arranged inside the fixing hole;

[0024] The handle is arranged at the upper end of the fixing frame.

[0025] In any of the above technical solutions, further, a heat insulation plate is arranged on one side of the adjusting plate and the telescopic plate close to the cavity of the furnace body.

[0026] In any of the above technical solutions, further, the lower surface of the limiting plate is closely attached to the upper surface of the conveyor belt.

[0027] The beneficial effects of the utility model are as follows:

[0028] 1. By providing a transfer groove on the upper surface of the processing table and a conveyor belt inside the transfer groove, the PCB board can be transferred. A furnace body is arranged directly above the processing table, and a through groove with the same width as the transfer groove is opened on the lower surface of the furnace body. Through the through groove, it is convenient to place the PCB board on the conveyor belt. The inside of the furnace body is a cavity, a heating plate is arranged on the upper top plate of the cavity, and a through air outlet is opened on the lower bottom plate of the cavity. In this way, the heat generated by the heating plate can be transferred to the PCB board on the conveyor belt through the air outlet for heating. In order to maximize the heat efficiency generated by the heating plate, a plurality of first springs are respectively and fixedly arranged on the front and rear side plates of the cavity. One end of the two springs close to each other is fixedly connected to an adjusting plate. By changing the distance between the two adjusting plates, the size of the air outlet can be controlled, so that all the heat generated by the entire heating plate flows out from the air outlet and is fully used on the PCB board. At the same time, a telescopic plate is arranged at the lower end of the adjusting plate, and the telescopic plate seals the air outlet and the through groove, thus preventing the heat generated by the heating plate from leaking out from the air outlet below the position where the adjusting plate is connected to the first spring, and increasing the heat energy loss.

[0029] 2. By fixedly arranging U-shaped blocks on the left and right sides of the processing table, a connecting plate is fixedly arranged inside the U-shaped blocks, and two limiting plates are arranged between the two connecting plates. A baffle is arranged on the upper surface of the limiting plate. By changing the position of the limiting plate on the connecting plate, the position of the baffle can be changed. The baffle passes through the air outlet and extends to the position of the adjusting plate. In this way, the distance between the two limiting plates can be changed according to the width of the PCB board, so that the baffle changes the distance between the two adjusting plates, thereby realizing the fixing of the PCB board and the adjustment of the size of the air outlet, and finally maximizing the heat efficiency of the heating plate. Description of the Drawings

[0030] Figure 1 is a schematic structural diagram of the present utility model;

[0031] Figure 2 is a schematic cross-sectional structural diagram of the present utility model;

[0032] Figure 3 is a schematic cross-sectional structural diagram of the present utility model;

[0033] Figure 4 is a schematic cross-sectional structural diagram of the telescopic plate of the present utility model;

[0034] Description of reference numerals: 100, processing table; 110, conveying groove; 120, conveyor belt; 200, furnace body; 210, through groove; 220, air outlet; 230, heating plate; 240, first spring; 250, adjusting plate; 260, telescopic plate; 261, sleeve plate; 262, sliding plate; 263, opening; 264, second spring; 300, adjusting mechanism; 310, U-shaped block; 320, connecting plate; 330, limiting plate; 340, baffle; 350, fixing device; 351, fixing frame; 352, fixing hole; 353, fixing bolt; 354, handle. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0036] In the description of the present application, it should be noted that the terms used herein are only for describing specific implementation manners and are not intended to limit the exemplary embodiments of the present application. For the convenience of description, the sizes of the various parts shown in the drawings are not drawn in actual proportional relationship. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0037] As Figures 1-4 shown, this embodiment provides a reflow oven for PCB board processing, including:

[0038] Processing table 100, a transfer groove 110 is provided on the upper surface of the processing table 100;

[0039] Conveyor belt 120, disposed inside the transfer groove 110;

[0040] Furnace body 200, disposed above the processing table 100, and the interior of the furnace body 200 is set as a cavity;

[0041] Through groove 210, opened on the furnace body 200, and the through groove 210 is arranged in parallel with the transfer groove 110, and a through air outlet 220 is provided between the through groove 210 and the cavity of the furnace body 200;

[0042] Heating plate 230, disposed on the top plate of the cavity of the furnace body 200;

[0043] First spring 240, horizontally disposed on the front and rear sides inside the cavity of the furnace body 200;

[0044] Adjusting plate 250, disposed on the side where the first spring 240 is close to each other;

[0045] Telescopic plate 260, disposed perpendicular to the adjusting plate 250, and one end of the telescopic plate 260 is fixedly connected to the lower end of the adjusting plate 250, and the other end of the telescopic plate 260 is in close contact with the lower bottom plate of the cavity of the furnace body 200.

[0046] In this technical solution, in order to maximize the thermal efficiency of the heating plate 230, a conveying groove 110 is provided on the upper surface of the processing table 100, and a conveyor belt 120 is arranged inside the conveying groove 110, so as to be able to convey the PCB board. A furnace body 200 is arranged directly above the processing table 100. A through groove 210 with the same width as the conveying groove 110 is provided on the lower surface of the furnace body 200. Through the through groove 210, it is convenient to place the PCB board on the conveyor belt 120. The inside of the furnace body 200 is set as a cavity. A heating plate 230 is arranged on the upper top plate of the cavity. A through air outlet 220 is provided on the lower bottom plate of the cavity. In this way, the heat generated by the heating plate 230 can be transferred to the PCB board on the conveyor belt 120 through the air outlet 220 for heating. In order to maximize the heat efficiency generated by the heating plate 230, a plurality of first springs 240 are respectively and fixedly arranged on the front and rear side plates of the cavity. One ends of the two springs close to each other are fixedly connected to an adjusting plate 250. In this way, by changing the distance between the two adjusting plates 250, the size of the air outlet 220 can be controlled, so that the heat generated by the entire heating plate 230 can flow out from the air outlet 220, and all the heat can be used on the PCB board. At the same time, a telescopic plate 260 is arranged at the lower end of the adjusting plate 250. The telescopic plate 260 seals the air outlet 220 and the through groove 210, so as to prevent the heat generated by the heating plate 230 from leaking out from the air outlet 220 below the connection position of the adjusting plate 250 and the first spring 240, increasing the heat energy loss.

[0047] This embodiment provides a reflow soldering furnace for PCB board processing. In addition to including the technical solution of the above embodiment, it also has the following technical features.

[0048] As Figures 1-4 shown, in this embodiment, the telescopic plate 260 is composed of a sleeve plate 261 and a sliding plate 262. One side of the sleeve plate 261 is fixedly connected to the inner wall of the cavity of the furnace body 200. An opening 263 is provided at a position of the sleeve plate 261 close to the adjusting plate 250. One end of a second spring 264 is fixedly connected horizontally inside the opening 263, and the other end of the second spring 264 is fixedly connected to the sliding plate 262. The sliding plate 262 is slidably arranged inside the sleeve plate 261.

[0049] In this technical solution, in order to enable the telescopic plate 260 to change its length along with the adjusting plate 250 when the adjusting plate 250 changes its position, the telescopic plate 260 is composed of a sleeve plate 261 and a sliding plate 262. One end of the sleeve plate 261 is fixed to the side wall of the cavity of the furnace body 200. An opening 263 is formed on the side of the sleeve plate 261 close to the adjusting plate 250. One end of a second spring 264 is fixedly connected horizontally inside the opening 263, and the other end of the second spring 264 is fixedly connected to one end of the sliding plate 262. The sliding plate 262 slides in the sleeve plate 261. The end of the sliding plate 262 away from the second spring 264 is fixedly connected to the lower end of the adjusting plate 250. In this way, when the push plate changes the position of the adjusting plate 250, the telescopic plate 260 can change its length along with the adjusting plate 250 at will, so as to ensure that the heat generated by the heating plate 230 can be used to heat the PCB board through the air outlet 220 between the two adjusting plates 250, thereby improving the efficiency and reducing the heat consumption.

[0050] This embodiment provides a reflow soldering furnace for PCB board processing. In addition to including the technical solutions of the above embodiments, it also has the following technical features.

[0051] As Figures 1-3 shown, in this embodiment, adjusting mechanisms 300 are arranged on both sides of the processing table 100. The adjusting mechanism 300 includes:

[0052] U-shaped blocks 310, fixedly connected to both sides of the processing table 100;

[0053] Connecting plates 320, fixedly connected inside the U-shaped blocks 310;

[0054] Limiting plates 330, with both ends of the limiting plates 330 sleeved on the connecting plates 320;

[0055] Baffle plates 340, arranged on the upper surface of the limiting plates 330, and the baffle plates 340 pass through the air outlet 220 and extend between the two adjusting plates 250.

[0056] In this technical solution, in order to facilitate changing the position of the adjusting plate 250, adjusting mechanisms 300 are provided on the left and right sides of the processing table 100. The U-shaped blocks 310 of the adjusting mechanisms 300 are fixedly arranged on the left and right sides of the processing table 100. A connecting plate 320 is fixedly arranged inside the U-shaped block 310. Two limiting plates 330 are arranged between the two connecting plates 320. A baffle 340 is arranged on the upper surface of the limiting plate 330. By changing the position of the limiting plate 330 on the connecting plate 320, the position of the baffle 340 can be changed. The baffle 340 passes through the air outlet 220 and extends to the position of the adjusting plate 250. In this way, the distance between the two limiting plates 330 can be changed according to the width of the PCB board, so that the baffle 340 changes the distance between the two adjusting plates 250, thereby realizing the fixation of the PCB board and the adjustment of the size of the air outlet 220, and finally maximizing the efficiency of the heat of the heating plate 230.

[0057] This embodiment provides a reflow soldering furnace for PCB board processing. In addition to including the technical solution of the above embodiment, it also has the following technical features.

[0058] As Figures 1-3 shown, in this embodiment, a fixing device 350 is arranged at one end of the limiting plate 330 close to the inlet of the through groove 210. The fixing device 350 includes:

[0059] A fixing frame 351, arranged on the side of the limiting plate 330 close to the inlet of the through groove 210. The fixing frame 351 is sleeved on the connecting plate 320;

[0060] A fixing hole 352, opened at the lower end of the fixing frame 351;

[0061] A fixing bolt 353, arranged inside the fixing hole 352;

[0062] A handle 354, arranged at the upper end of the fixing frame 351.

[0063] In this technical solution, in order to conveniently change the position of the limiting plate 330 and fix the limiting plate 330 at a certain position on the connecting plate 320, fixing devices 350 are provided at both ends of the limiting plate 330. The fixing frames 351 of the fixing devices 350 are arranged at both ends of the limiting plate 330. The fixing frames 351 are sleeved on the connecting plate 320, and the installation slots of the fixing frames 351 are larger than the connecting plate 320. In this way, the position can be changed along the direction of the connecting plate 320 through the fixing frames 351. Fixing holes 352 are fixedly opened at the lower ends of the fixing frames 351, and are fixed through fixing bolts 353 inside the fixing holes 352. Tightening the fixing bolts 353 can fix the fixing frames 351 at any position on the connecting plate 320. At the same time, in order to conveniently pull the fixing frames 351, a handle 354 is fixedly arranged above the fixing frames 351. Through the handle 354, the limiting plate 330 can be conveniently pulled directly, so as to adjust the air outlet 220 and fix the PCB board.

[0064] This embodiment provides a reflow oven for PCB board processing. In addition to including the technical solutions of the above embodiments, it also has the following technical features.

[0065] As Figures 1-3 shown, in this embodiment, heat insulation plates are arranged on the sides of the adjusting plate 250 and the telescopic plate 260 close to the cavity of the furnace body 200.

[0066] In this technical solution, in order to reduce the consumption of heat generated by the heating plate 230, heat insulation plates are arranged on the sides of the adjusting plate 250 and the telescopic plate 260 close to the inner cavity of the furnace body 200. In this way, the heat generated by the heating plate 230 can be retained inside the cavity of the furnace body 200 by the heat insulation plates, so that most of the heat is transferred from the air outlet 220 to the PCB board to heat the PCB board.

[0067] This embodiment provides a reflow oven for PCB board processing. In addition to including the technical solutions of the above embodiments, it also has the following technical features.

[0068] As Figures 1-3 shown, in this embodiment, the lower surface of the limiting plate 330 is closely attached to the upper surface of the conveyor belt 120.

[0069] In this technical solution, in order to enable the limiting plate 330 to limit the PCB board, the lower surface of the limiting plate 330 is set to be flush with the upper surface of the conveyor belt 120. In this way, the PCB board can be transferred on the conveyor belt 120 between the two limiting plates 330, which facilitates the heating of the PCB board.

[0070] The embodiments of the present application have been described above in conjunction with the accompanying drawings. Without conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative rather than restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them fall within the protection scope of the present application.

Claims

1. A PCB board processing reflow furnace, characterized in that: include: A processing table (100), wherein a conveying groove (110) is provided on an upper surface of the processing table (100); A conveyor belt (120) is arranged inside the conveyor trough (110); A furnace body (200) is arranged above the processing table (100), and the interior of the furnace body (200) is configured as a cavity; A through groove (210) is provided on the furnace body (200), and the through groove (210) is arranged in parallel with the conveying groove (110), and an air outlet (220) is provided between the through groove (210) and the cavity of the furnace body (200); A heating plate (230) is arranged on the top plate of the cavity of the furnace body (200); A first spring (240) is transversely arranged at the front and rear sides of the cavity of the furnace body (200); an adjustment plate (250), disposed on a side close to the first spring (240); The telescopic plate (260) is arranged perpendicular to the adjustment plate (250), and one end of the telescopic plate (260) is fixedly connected to the lower end of the adjustment plate (250), and the other end of the telescopic plate (260) is arranged to fit tightly to the lower bottom plate of the cavity of the furnace body (200).

2. A PCB board processing reflow furnace according to claim 1, characterized in that: The telescopic plate (260) is composed of a sleeve plate (261) and a sliding plate (262). One side of the sleeve plate (261) is fixedly connected to the inner wall of the cavity of the furnace body (200). The sleeve plate (261) is provided with an opening (263) near the adjusting plate (250). One end of a second spring (264) is transversely fixedly connected to the inside of the opening (263). The other end of the second spring (264) is fixedly connected to the sliding plate (262). The sliding plate (262) is slidably arranged inside the sleeve plate (261).

3. A PCB board processing reflow furnace according to claim 1, characterized in that: Adjustment mechanisms (300) are provided on both sides of the processing table (100), and the adjustment mechanisms (300) include: A U-shaped block (310) fixedly connected to two sides of the processing table (100); A connecting plate (320) fixedly connected to the interior of the U-shaped block (310); a limiting plate (330), wherein both ends of the limiting plate (330) are sleeved on the connecting plate (320); A baffle (340) is arranged on the upper surface of the limiting plate (330), and the baffle (340) passes through the air outlet (220) and extends between the two adjustment plates (250).

4. A PCB board processing reflow furnace according to claim 3, characterized in that: A fixing device (350) is provided at one end of the limiting plate (330) close to the inlet of the through slot (210), and the fixing device (350) comprises: A fixing frame (351) is arranged on a side of the limiting plate (330) close to the entrance of the through slot (210), and the fixing frame (351) is sleeved on the connecting plate (320); A fixing hole (352) is formed at the lower end of the fixing frame (351); A fixing bolt (353) is disposed inside the fixing hole (352); A handle (354) is arranged at the upper end of the fixing frame (351).

5. The PCB board processing reflow furnace according to claim 1, characterized in that: A heat insulation plate is provided on one side of the adjustment plate (250) and the telescopic plate (260) close to the cavity of the furnace body (200).

6. A PCB board processing reflow furnace according to claim 3, characterized in that: The lower surface of the limiting plate (330) is tightly fitted to the upper surface of the conveyor belt (120).

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