Processing device for multi-layer PCB (Printed Circuit Board)

Abstract

The utility model relates to a multi-layer PCB processing device, which comprises a base and a polishing robot, the polishing robot is arranged on one side of the base, a placing seat is arranged above the base through a first driving mechanism arranged on the base, the first driving mechanism is used for driving the placing seat to rotate and change the surface, a through inner groove is arranged on the placing seat, and the polishing robot is arranged in the through inner groove. Clamping plates are symmetrically arranged on the two sides in the inner grooves, a second driving mechanism is arranged in the placement base and used for driving the two inner grooves to be close to each other or away from each other, and when the multiple layers of PCBs are placed between the two clamping plates, the second driving mechanism works to drive the two inner grooves to be close to each other. The multi-layer PCB is arranged between the two clamping plates in the inner groove, the second driving mechanism works to drive the two clamping plates to be close to each other, the multi-layer PCB can be clamped and fixed, the polishing robot is used for polishing the surface of the multi-layer PCB, traditional manual handheld polishing is replaced, the stability degree is high, the polishing quality is improved, and time and labor are saved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing, in particular to a processing device for multi-layer PCB boards. Background Art

[0002] A multi-layer PCB board is a complex circuit board structure, which contains multiple layers of electrical connections inside. It is usually composed of multiple layers of resin layers reinforced with fiberglass and copper foil layers. This design enables the multi-layer PCB to accommodate more circuit connections and functions within the same area, and is suitable for applications that require high-density wiring and complex functions. During the manufacturing process of the circuit board, a layer of oxide film will form on the copper foil in the air. This oxide film may affect the soldering process or electrical conductivity, so it is necessary to polish and remove the oxide film.

[0003] The traditional method for polishing the oxide film on the outer surface of a multi-layer circuit board is to hold the multi-layer circuit board close to the polishing head for polishing. Holding and polishing is dangerous, time-consuming and laborious. In addition, when polishing by hand, there is a situation of shaking, which is not stable enough and affects the polishing quality. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a processing device for multi-layer PCB boards with high polishing quality, which effectively solves the problems put forward in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solutions.

[0006] A processing device for multi-layer PCB boards includes a base and a polishing robot. The polishing robot is arranged on one side of the base. Above the base, a placing seat is provided through a first driving mechanism arranged on it. The first driving mechanism is used to drive the placing seat to rotate and change the surface. A through inner groove is provided on the placing seat. On both sides of the inner groove, clamping plates are symmetrically arranged. A second driving mechanism is arranged in the placing seat. The second driving mechanism is used to drive the two inner grooves to approach or move away from each other. When the multi-layer PCB board is placed between the two clamping plates, by the operation of the second driving mechanism to drive the two inner grooves to approach each other, the multi-layer PCB board can be clamped and fixed. A dust suction mechanism is also provided on the placing seat.

[0007] It can be seen that by placing the multi-layer PCB board between two clamping plates in the inner groove and using the second driving mechanism to drive the two clamping plates to approach each other, the multi-layer PCB board can be clamped and fixed. Then, the surface of the multi-layer PCB board can be polished by the polishing robot, replacing the traditional manual hand-held polishing. This method has a high stability, improves the polishing quality, and saves time and effort. After one large surface of the multi-layer PCB board is polished, the first driving mechanism works to drive the placement seat and the multi-layer PCB board to rotate half a week, realizing the surface replacement of the multi-layer PCB board, adjusting the polished surface downward, and then continuing to polish the other surface of the multi-layer PCB board by the polishing robot. Without disassembling and readjusting the multi-layer PCB board, the double-sided polishing process can be completed, making the polishing work more efficient.

[0008] Further, the second driving mechanism includes a bidirectional threaded rod, a second driving motor, a pair of nut seats, a pair of guide rods and a pair of connecting arms. A driving groove is provided on one side of the inner groove in the placement seat. Side grooves are respectively provided on both sides of the inner groove in the placement seat. Guide holes are respectively provided on the inner walls of the two side grooves close to each other, and both guide holes communicate with the inner groove. The two guide rods are respectively slidably installed through the guide holes. The two clamping plates are respectively installed on the ends of the guide rods extending into the inner groove. The bidirectional threaded rod is rotatably installed in the driving groove. The second driving motor is fixed on the side of the placement seat. The output shaft of the second driving motor penetrates and extends into the driving groove and is fixedly connected to one end of the bidirectional threaded rod. The two nut seats are threadedly sleeved on both sides of the bidirectional threaded rod. The two connecting arms are respectively installed on the sides of the nut seats. The ends of the two guide rods located in the side grooves are respectively fixedly connected to the corresponding connecting arms on the same side.

[0009] Further, the first driving mechanism includes a vertical frame, a shaft rod and a first driving motor. The vertical frame is vertically fixed on the upper surface of the base. The shaft rod is rotatably installed on the side of the vertical frame. The placement seat is fixed on the end of the shaft rod. The first driving motor is fixed on the vertical frame, and the output shaft is fixedly connected to the end of the shaft rod.

[0010] Further, the dust suction mechanism includes a three-way pipe, a dust suction pipe, a pair of rectangular boxes and a pair of connecting pipes. One of the rectangular boxes is fixed around the inner groove on one large surface of the placement seat, and the other rectangular box is fixed around the inner groove on the other large surface of the placement seat. Frame-shaped cavities distributed around the inner groove are provided in both rectangular boxes. Dust suction holes are evenly distributed on the four side surfaces of the two rectangular boxes close to the inner groove, and each dust suction hole communicates with the frame-shaped cavity correspondingly. The two connecting pipes are correspondingly and communicatively connected to the sides of the two rectangular boxes and communicate with the frame-shaped cavities correspondingly. Two ends of the three-way pipe are respectively communicatively connected to the two connecting pipes, and the other end is rotatably connected to the dust suction pipe and communicates with it. The dust suction pipe is coaxially arranged with the shaft rod, and the end of the dust suction pipe is communicatively connected to an industrial vacuum cleaner.

[0011] Furthermore, two receiving grooves are respectively provided on the inner walls of both sides of the inner groove, a micro electric push cylinder is installed in each receiving groove, a support plate is fixed to the end of the telescopic rod of each micro electric push cylinder, and when the micro electric push cylinder is in a fully retracted state, the support plate is correspondingly received in the receiving groove.

[0012] Furthermore, rubber pads are fixed on the clamping surfaces of the two clamping plates, and the rubber pads have anti-slip patterns.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows.

[0014] 1. In the present utility model, by placing the multi-layer PCB board between the two clamping plates in the inner groove and using the second driving mechanism to drive the two clamping plates to approach each other, the multi-layer PCB board can be clamped and fixed, and then the surface of the multi-layer PCB board can be polished by the polishing robot, instead of the traditional manual hand-held polishing. It has a high degree of stability, improves the polishing quality, and saves time and effort.

[0015] 2. After one large surface of the multi-layer PCB board is polished, by operating the first driving mechanism, the placement seat and the multi-layer PCB board are driven to rotate half a circle, so as to realize the surface change of the multi-layer PCB board, adjust the polished surface downward, and then continue to polish the other surface of the multi-layer PCB board by the polishing robot. Without disassembling and readjusting the multi-layer PCB board, the double-sided polishing process can be completed, making the polishing work more efficient.

[0016] 3. In the present utility model, by operating the industrial vacuum cleaner to generate suction, the dust debris is sucked into the frame cavity through the suction holes, and then successively sucked into the industrial vacuum cleaner through the connecting pipe, the three-way pipe and the suction pipe, so as to realize the collection of the dust debris, ensure the environmental quality of the processing site. The rectangular box is arranged on the upper and lower surfaces of the placement seat and surrounds the inner groove. The frame cavity and the suction holes on the rectangular box also surround the inner groove, improving the capture effect on the dust debris and thus enhancing the suction effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a three-dimensional schematic diagram of the overall structure of the present utility model;

[0018] Figure 2 is a partial structural schematic diagram of the surface of the placement seat in the present utility model;

[0019] Figure 3 is one of the partial structural sectional views of the present utility model;

[0020] Figure 4 is another partial structural sectional view of the present utility model;

[0021] Figure 5 is the third partial structural sectional view of the present utility model.

[0022] In the figure: 1, base; 2, first driving mechanism; 21, vertical frame; 22, shaft rod; 23, first driving motor; 3, placing seat; 31, inner groove; 32, clamping plate; 321, rubber pad; 4, second driving mechanism; 401, driving groove; 402, side groove; 403, guide hole; 41, bidirectional threaded rod; 42, second driving motor; 43, nut seat; 44, guide rod; 45, connecting arm; 5, dust suction mechanism; 51, rectangular box; 52, frame cavity; 53, dust suction hole; 54, connecting pipe; 55, tee pipe; 56, dust suction pipe; 6, storage groove; 61, micro electric push cylinder; 62, support plate. Specific implementation mode

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] Please refer to Figures 1 - 5 , a processing device for multi-layer PCB boards provided by the present invention includes a base 1 and a grinding robot (using existing technology, not shown in the figure). The grinding robot is arranged on one side of the base 1. Above the base 1, a placing seat 3 is provided through a first driving mechanism 2 arranged thereon. The first driving mechanism 2 is used to drive the placing seat 3 to rotate and change the surface. A through inner groove 31 is provided on the placing seat 3. On both sides of the inner groove 31, clamping plates 32 are symmetrically arranged. A second driving mechanism 4 is provided in the placing seat 3. The second driving mechanism 4 is used to drive the two inner grooves 31 to approach or move away from each other. When the multi-layer PCB board is placed between the two clamping plates 32, by the operation of the second driving mechanism 4 to drive the two inner grooves 31 to approach each other, the multi-layer PCB board can be clamped and fixed.

[0025] When using this device to grind a multi - layer PCB board, first place the multi - layer PCB board between two clamping plates 32 in the inner groove 31. By the operation of the second driving mechanism 4, the two clamping plates 32 are driven to approach each other, and the multi - layer PCB board can be clamped and fixed. Subsequently, use a grinding robot to grind the surface of the multi - layer PCB board. After one large surface of the multi - layer PCB board is ground, through the operation of the first driving mechanism 2, the placing seat 3 and the multi - layer PCB board are driven to rotate half a turn, realizing the surface change of the multi - layer PCB board, adjusting the ground surface downward, and then continue to use the grinding robot to grind the other surface of the multi - layer PCB board. Without disassembling and readjusting the multi - layer PCB board, double - sided grinding processing can be completed. After grinding, through the operation of the second driving mechanism 4, the two clamping plates 32 are driven to move away from each other, canceling the clamping of the multi - layer PCB board, and then the ground multi - layer PCB board can be taken off, and that's it.

[0026] Specifically, the second driving mechanism 4 includes a bidirectional threaded rod 41, a second driving motor 42, a pair of nut seats 43, a pair of guide rods 44, and a pair of connecting arms 45. A driving groove 401 is provided on one side of the inner groove 31 in the placing seat 3. Side grooves 402 are respectively provided on both sides of the inner groove 31 in the placing seat 3. Guide holes 403 are respectively provided on the inner walls of the two side grooves 402 close to each other. Both guide holes 403 communicate with the inner groove 31. The two guide rods 44 are respectively slidably installed through the guide holes 403. The two clamping plates 32 are respectively installed on the ends of the guide rods 44 extending into the inner groove 31. The bidirectional threaded rod 41 is rotatably installed in the driving groove 401. The second driving motor 42 is fixed on the side of the placing seat 3. The output shaft of the second driving motor 42 penetrates and extends into the driving groove 401 and is fixedly connected to one end of the bidirectional threaded rod 41. The two nut seats 43 are threadedly sleeved on both sides of the bidirectional threaded rod 41. The two connecting arms 45 are respectively installed on the sides of the nut seats 43. The ends of the two guide rods 44 located in the side grooves 402 are respectively fixedly connected to the corresponding connecting arms 45 on the same side. By the operation of the second driving motor 42, the bidirectional threaded rod 41 is driven to rotate in the driving groove 401. The rotating bidirectional threaded rod 41 thread - drives the two nut seats 43 to move away from or approach each other. Under the connection action of the guide rods 44 and the connecting arms 45 on both sides, the two clamping plates 32 on both sides are driven to move synchronously, providing drive for the clamping and releasing actions of the two clamping plates 32.

[0027] Specifically, the first driving mechanism 2 includes a vertical frame 21, a shaft rod 22, and a first driving motor 23. The vertical frame 21 is vertically fixed on the upper surface of the base 1. The shaft rod 22 is rotatably installed on the side of the vertical frame 21. The placing seat 3 is fixed on the end of the shaft rod 22. The first driving motor 23 is fixed on the vertical frame 21, and the output shaft is fixedly connected to the end of the shaft rod 22. By the operation of the first driving motor 23, its output shaft drives the shaft rod 22 to rotate, and then drives the placing seat 3 to rotate, providing drive for the surface change of the multi - layer PCB board.

[0028] During grinding, dust and debris will be generated. To prevent the dust and debris from floating around and polluting the processing site environment, a dust suction mechanism 5 is also provided on the placement base 3 in the present utility model. The dust suction mechanism 5 includes a tee pipe 55, a dust suction pipe 56, a pair of rectangular boxes 51 and a pair of connecting pipes 54. One of the rectangular boxes 51 is fixed around the inner groove 31 on one of the large surfaces of the placement base 3, and the other rectangular box 51 is fixed around the inner groove 31 on the other large surface of the placement base 3. Frame-shaped cavities 52 distributed around the inner groove 31 are provided in both rectangular boxes 51. Dust suction holes 53 are evenly distributed on the four side surfaces of both rectangular boxes 51 adjacent to the inner groove 31. Each dust suction hole 53 is correspondingly connected to the frame-shaped cavity 52 in communication. The two connecting pipes 54 are correspondingly connected to the sides of the two rectangular boxes 51 in communication, and are correspondingly connected to the frame-shaped cavity 52 in communication. Two ends of the tee pipe 55 are respectively connected to the two connecting pipes 54 in communication, and the other end is rotatably connected to the dust suction pipe 56 and in communication. The dust suction pipe 56 is coaxially arranged with the shaft rod 22. The end of the dust suction pipe 56 is connected to an industrial vacuum cleaner in communication. When the industrial vacuum cleaner works, it generates suction force, sucks the dust and debris into the frame-shaped cavity 52 through the dust suction holes 53, and then sucks them into the industrial vacuum cleaner through the connecting pipe 54, the tee pipe 55 and the dust suction pipe 56 in sequence, realizing the collection of the dust and debris and ensuring the environmental quality of the processing site.

[0029] The rectangular boxes 51 are arranged on the upper and lower surfaces of the placement base 3 and are arranged around the inner groove 31. The frame-shaped cavities 52 and the dust suction holes 53 on the rectangular boxes 51 are also arranged around the inner groove 31, improving the capturing effect on the dust and debris, and thus enhancing the dust suction effect.

[0030] The dust suction pipe 56 is coaxially arranged with the shaft rod 22, and the dust suction pipe 56 is rotatably connected to the tee pipe 55, which enables the dust suction pipe 56 and the placement base 3 to have the ability of relative rotation to adapt to the surface-changing adjustment.

[0031] Specifically, two storage grooves 6 are respectively provided on the inner side walls of both sides of the inner groove 31. A micro electric push cylinder 61 is installed in each storage groove 6. A support plate 62 is fixed on the end of the telescopic rod of each micro electric push cylinder 61. When the micro electric push cylinder 61 is in a fully retracted state, the support plate 62 is correspondingly stored in the storage groove 6. Before clamping the multi-layer PCB board between the two clamping plates 32, the micro electric push cylinder 61 extends to work, pushing the support plate 62 into the inner groove 31, placing the multi-layer PCB board on the support plate 62. The support plate 62 can provide support for the multi-layer PCB board before being clamped, preventing it from falling from the clamping plate 32 to the lower part. After clamping the multi-layer PCB board, the micro electric push cylinder 61 retracts to work, driving the support plate 62 to retract and be stored in the storage groove 6, avoiding the influence on the surface grinding of the multi-layer PCB board caused by the support plate 62 coming out.

[0032] Specifically, rubber pads 321 are fixed on the clamping surfaces of the two clamping plates 32. When clamping, they play a buffering and protecting effect on the multi-layer PCB board, avoiding damage to the multi-layer PCB board due to excessive clamping. The rubber pads 321 have anti-slip patterns, increasing the friction between the clamping plates 32 and the side of the multi-layer PCB board, and improving the firmness during clamping.

[0033] The above is a detailed description of the present utility model in combination with specific embodiments. It cannot be determined that the specific implementation manners of the present invention are only limited to these descriptions. For those of ordinary skill in the technical field to which the present utility model belongs, without departing from the concept of the present invention, several equivalent substitutions or obvious modifications are made, and if the performance or use is the same, they should all be regarded as belonging to the patent protection scope determined by the claims submitted for the present utility model.

Claims

1. A multi-layer PCB processing device, comprising a base (1) and a polishing robot, wherein the polishing robot is arranged on one side of the base (1), and is characterized in that: A placement seat (3) is provided above the base (1) via a first driving mechanism (2) arranged thereon, wherein the first driving mechanism (2) is used to drive the placement seat (3) to rotate and change surfaces; The placement seat (3) is provided with a through inner groove (31), and clamping plates (32) are symmetrically arranged on both sides of the inner groove (31). A second driving mechanism (4) is provided in the placement seat (3), and the second driving mechanism (4) is used to drive the two inner grooves (31) to move closer to each other or away from each other; When a multi-layer PCB is placed between the two clamping plates (32), the second driving mechanism (4) drives the two inner grooves (31) to approach each other, thereby clamping and fixing the multi-layer PCB; The placement seat (3) is also provided with a dust collection mechanism (5).

2. The multi-layer PCB processing device according to claim 1, characterized in that: The second driving mechanism (4) comprises a bidirectional threaded rod (41), a second driving motor (42), a pair of nut seats (43), a pair of guide rods (44) and a pair of connecting arms (45); A driving groove (401) is provided in the placement seat (3) on one side of the inner groove (31), and side grooves (402) are provided in the placement seat (3) on both sides of the inner groove (31), and guide holes (403) are provided on inner walls of the two side grooves (402) adjacent to each other, respectively, and both guide holes (403) are in communication with the inner groove (31); The two guide rods (44) are respectively slidably installed in the guide holes (403), and the two clamping plates (32) are respectively installed on the ends of the guide rods (44) extending into the inner groove (31); The bidirectional threaded rod (41) is rotatably mounted in the driving groove (401), the second driving motor (42) is fixed to the side of the placement seat (3), and the output shaft of the second driving motor (42) extends through the driving groove (401) and is fixedly connected to one end of the bidirectional threaded rod (41); The two nut seats (43) are thread-matched and sleeved on both sides of the bidirectional threaded rod (41); The two connecting arms (45) are respectively mounted on the side of the nut seat (43), and the ends of the two guide rods (44) located in the side groove (402) are respectively fixedly connected to the connecting arms (45) on the same side.

3. The processing device for a multi-layer PCB according to claim 1, characterized in that: The first driving mechanism (2) comprises a stand (21), a shaft (22) and a first driving motor (23); The stand (21) is vertically fixed on the upper surface of the base (1), the shaft (22) is rotatably mounted on the side of the stand (21), and the placement seat (3) is fixed on the end of the shaft (22); The first drive motor (23) is fixed on the stand (21), and the output shaft is fixedly connected to the end of the shaft rod (22).

4. The processing device for a multi-layer PCB according to claim 3, characterized in that: The dust suction mechanism (5) comprises a three-way pipe (55), a dust suction pipe (56), a pair of rectangular boxes (51) and a pair of connecting pipes (54); One of the rectangular boxes (51) surrounds the inner groove (31) and is fixed on one of the large surfaces of the placement seat (3), and the other rectangular box (51) surrounds the inner groove (31) and is fixed on the other large surface of the placement seat (3); The two rectangular boxes (51) are each provided with a frame-shaped cavity (52) distributed around the inner groove (31); the four side surfaces of the two rectangular boxes (51) adjacent to the inner groove (31) are respectively provided with dust suction holes (53); each of the dust suction holes (53) is correspondingly connected to the frame-shaped cavity (52); The two connecting pipes (54) are connected to the sides of the two rectangular boxes (51) in a one-to-one correspondence and are in communication with the frame-shaped cavity (52) in a corresponding manner; Two ends of the three-way pipe (55) are respectively connected to the two connecting pipes (54), and the other end is rotatably connected to the dust suction pipe (56) and communicates with each other; The dust suction pipe (56) is coaxially arranged with the shaft (22); The end of the dust suction pipe (56) is connected to an industrial dust collector.

5. The processing device for a multi-layer PCB according to claim 1, characterized in that: Two receiving grooves (6) are respectively provided on the inner walls on both sides of the inner groove (31), a micro electric push cylinder (61) is installed in each of the receiving grooves (6), and a support plate (62) is fixed to the end of the telescopic rod of each of the micro electric push cylinders (61); When the micro electric push cylinder (61) is in a fully retracted state, the support plate (62) is correspondingly received in the receiving groove (6).

6. The processing device for a multi-layer PCB according to claim 1, characterized in that: Rubber pads (321) are fixed on the clamping surfaces of the two clamping plates (32), and the rubber pads (321) have anti-slip patterns.

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