Efficient wafer grinding device for integrated circuit chip production

Abstract

The utility model relates to the technical field of integrated circuit chip production equipment, in particular to an efficient wafer grinding device for integrated circuit chip production. The wafer grinding device can perform multi-precision reciprocating grinding on the wafer, so that the grinding speed of the wafer is higher, and the grinding effect and efficiency of the wafer are improved. The device comprises a bottom frame, a screw rod, a motor I and the like, a lead screw is rotationally connected to the bottom frame, and a first motor is arranged on the bottom frame. A wafer is manually placed on the placing frame, then a motor I, a motor II, a motor III, three electric push rods and three motors IV are manually started, and two clamping plates can clamp the wafer, so that the wafer placed on the placing frame can be clamped, the wafer is more stable in subsequent processing, and the device can adapt to wafers of different sizes; and multi-precision reciprocating grinding can be carried out on the wafer, so that the grinding speed of the wafer is higher, and the grinding effect and efficiency of the wafer are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit chip production equipment, in particular to a high-efficiency wafer grinding device for integrated circuit chip production. Background Technique

[0002] A wafer refers to a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, that is, a wafer. In the production process of integrated circuit chips, a wafer grinding device is often required. Most of the existing grinding devices cannot perform multi-precision reciprocating grinding on the wafer. Each time of processing, the wafer needs to be moved under grinding plates with different precisions and then fixed again, which is likely to affect the grinding efficiency of the wafer and make the grinding speed of the wafer slower. Content of the Utility Model

[0003] In view of this, the utility model provides a high-efficiency wafer grinding device for integrated circuit chip production, which can perform multi-precision reciprocating grinding on the wafer, making the grinding speed of the wafer faster and improving the grinding effect and efficiency of the wafer.

[0004] The technical solution is: a high-efficiency wafer grinding device for integrated circuit chip production, including a chassis, a lead screw, a motor I, a sliding plate, a clamping component, a rotating component, and a grinding component. The upper part of the chassis is rotatably connected with the lead screw. One side of the chassis is provided with the motor I, and the output shaft of the motor I is fixedly connected with the lead screw. The upper part of the chassis is slidably connected with the sliding plate. The clamping component is arranged on the sliding plate. The rotating component is arranged on the chassis. The grinding component is arranged on the rotating component.

[0005] Further, the clamping component includes a fixed block, a motor II, a first threaded rod, a first guide rod, a slider, a clamping plate, and a placement rack. There are two fixed blocks on the sliding plate. One of the fixed blocks is provided with the motor II. A first threaded rod is rotatably connected between the two fixed blocks. There are two threads on the first threaded rod, and the two threads on the first threaded rod have opposite helix directions. The first threaded rod is fixedly connected with the output shaft of the motor II. Two first guide rods are arranged between the two fixed blocks. Two sliders are slidably connected between the two first guide rods. The two sliders are symmetrically arranged. The two sliders are threadedly connected with the first threaded rod. Clamping plates are provided on the upper parts of the two sliders. A placement rack is arranged on the upper part of the sliding plate. The placement rack is fixedly connected with the first threaded rod. The placement rack is fixedly connected with the two first guide rods. A circular groove is arranged on the upper part of the placement rack. The placement rack will contact the two clamping plates.

[0006] Further, the rotating member includes a support frame, a third motor, a turntable, and a long plate. The support frame is provided on the upper part of the chassis, the third motor is provided on the upper part of the support frame, the turntable is provided on the output shaft of the third motor, and three long plates are provided on the turntable. The three long plates are arranged in a circular array.

[0007] Further, the grinding member includes an electric push rod, a fixed frame, a fourth motor, a second threaded rod, a second guide rod, a coarse grinding block, a medium grinding block, and a fine grinding block. Electric push rods are provided on the three long plates, fixed frames are provided on the telescopic rods of the three electric push rods, a fourth motor is provided on one side of the three fixed frames, a second threaded rod is rotatably connected to the three fixed frames, and the second threaded rod is fixedly connected to the output shaft of the fourth motor. A second guide rod is provided on the three fixed frames, and a coarse grinding block, a medium grinding block, and a fine grinding block are respectively slidably connected to the bottoms of the three fixed frames. The coarse grinding block, the medium grinding block, and the fine grinding block are respectively threadedly connected to the three second threaded rods, and the coarse grinding block, the medium grinding block, and the fine grinding block are respectively slidably connected to the three second guide rods.

[0008] The beneficial effects are as follows: First, the wafer is manually placed on the placement rack, and then the first motor, the second motor, the third motor, the three electric push rods, and the three fourth motors are manually started. The two clamping plates will clamp the wafer. The third motor drives the coarse grinding block, the medium grinding block, and the fine grinding block to rotate in sequence and grind the wafer in sequence. In this way, the wafer placed on the placement rack can be clamped, making the wafer more stable in subsequent processing, and can adapt to wafers of different sizes. It can also perform multi-precision reciprocating grinding on the wafer, making the grinding speed of the wafer faster and improving the grinding effect and efficiency of the wafer. Description of the Drawings

[0009] Figure 1 It is the first three-dimensional structural schematic diagram of the present invention.

[0010] Figure 2 It is the second three-dimensional structural schematic diagram of the present invention.

[0011] Figure 3 For the present invention Figure 2 The enlarged three-dimensional structural schematic diagram at I in it.

[0012] Reference numerals in the drawings: 1 - chassis, 2 - lead screw, 3 - first motor, 4 - slide plate, 51 - fixed block, 52 - second motor, 53 - first threaded rod, 54 - first guide rod, 55 - slider, 56 - clamping plate, 57 - placement rack, 61 - support frame, 62 - third motor, 63 - turntable, 64 - long plate, 71 - electric push rod, 72 - fixed frame, 73 - fourth motor, 74 - second threaded rod, 75 - second guide rod, 76 - coarse grinding block, 77 - medium grinding block, 78 - fine grinding block. Detailed Embodiment

[0013] The present utility model will be further described below in conjunction with the drawings and embodiments.

[0014] Embodiment 1: A high-efficiency wafer grinding device for integrated circuit chip production, as Figures 1 - 3 shown, includes a chassis, a lead screw, a first motor, a slide plate, a clamping component, a rotating component, and a grinding component. The upper part of the chassis is rotatably connected to the lead screw. A first motor is welded to one side of the chassis, and the output shaft of the first motor is fixedly connected to the lead screw. The upper part of the chassis is slidably connected to the slide plate. The clamping component is arranged on the slide plate. The rotating component is arranged on the chassis. The grinding component is arranged on the rotating component.

[0015] Furthermore, the clamping component includes a fixed block, a second motor, a first threaded rod, a first guide rod, a slider, a clamping plate, and a placement rack. Two fixed blocks are connected to the slide plate by bolts. A second motor is welded to one of the fixed blocks. A first threaded rod is rotatably connected between the two fixed blocks. There are two threads on the first threaded rod, and the two threads on the first threaded rod have opposite helix directions. The first threaded rod is fixedly connected to the output shaft of the second motor. Two first guide rods are arranged between the two fixed blocks. Two sliders are slidably connected between the two first guide rods. The two sliders are symmetrically arranged. The two sliders are threadedly connected to the first threaded rod. Clamping plates are provided on the upper parts of the two sliders. A placement rack is arranged on the upper part of the slide plate. The placement rack is fixedly connected to the first threaded rod and the two first guide rods. A circular groove is provided on the upper part of the placement rack, and the placement rack will contact the two clamping plates.

[0016] Furthermore, the rotating component includes a support frame, a third motor, a turntable, and a long plate. A support frame is arranged on the upper part of the chassis. A third motor is arranged on the upper part of the support frame. A turntable is arranged on the output shaft of the third motor. Three long plates are arranged on the turntable, and the three long plates are arranged in an annular array.

[0017] Furthermore, the grinding component includes an electric push rod, a fixed frame, a fourth motor, a second threaded rod, a second guide rod, a coarse grinding block, a medium grinding block, and a fine grinding block. Electric push rods are arranged on the three long plates. Fixed frames are arranged on the telescopic rods of the three electric push rods. A fourth motor is arranged on one side of each of the three fixed frames. A second threaded rod is rotatably connected to each of the three fixed frames. The second threaded rod is fixedly connected to the output shaft of the fourth motor. Second guide rods are arranged on the three fixed frames. A coarse grinding block, a medium grinding block, and a fine grinding block are respectively slidably connected to the bottoms of the three fixed frames. The coarse grinding block, the medium grinding block, and the fine grinding block are respectively threadedly connected to the three second threaded rods and slidably connected to the three second guide rods.

[0018] First, manually place the wafer on the placement rack, and then manually start Motor 1, Motor 2, Motor 3, three electric push rods, and three Motor 4s. The output shaft of Motor 2 drives the rotation of the first threaded rod. The rotation of the first threaded rod drives two sliders and two clamping plates to move towards each other. The two clamping plates will contact the placement rack and clamp the wafer. Since the thickness of the two clamping plates is relatively thin, the height of the wafer will be higher than the height of the two clamping plates. The output shaft of Motor 1 drives the rotation of the lead screw. The rotation of the lead screw drives the sliding plate, two fixed blocks, Motor 2, the first threaded rod, two first guide rods, two sliders, two clamping plates, and the placement rack to move towards the support frame. When the wafer moves directly below the rough grinding block, the telescopic rod of one of the electric push rods on the rough grinding block will extend. The telescopic rod of one of the electric push rods on the rough grinding block will drive one of the fixed frames on the rough grinding block, one of the Motor 4s on the rough grinding block, one of the second threaded rods on the rough grinding block, one of the second guide rods on the rough grinding block, and the rough grinding block to move downward. The rough grinding block contacts the wafer. The output shaft of one of the Motor 4s on the rough grinding block drives the reciprocating rotation of one of the second threaded rods on the rough grinding block. The rotation of one of the second threaded rods on the rough grinding block drives the rough grinding block to reciprocate. The rough grinding block will initially grind the wafer.

[0019] Then, the telescopic rod of one of the electric push rods on the rough grinding block will contract. The telescopic rod of one of the electric push rods on the rough grinding block will drive one of the fixed frames on the rough grinding block, one of the Motor 4s on the rough grinding block, one of the second threaded rods on the rough grinding block, one of the second guide rods on the rough grinding block, and the rough grinding block to move upward. The rough grinding block separates from the wafer, and one of the Motor 4s on the rough grinding block stops rotating. Then, the output shaft of Motor 3 drives the rotation of the turntable, three long plates, three electric push rods, three fixed frames, three Motor 4s, the second threaded rods, three second guide rods, the rough grinding block, the medium grinding block, and the fine grinding block by a certain distance, so that the medium grinding block rotates directly above the wafer. Then, the telescopic rod of one of the electric push rods on the medium grinding block will extend. The telescopic rod of one of the electric push rods on the medium grinding block will drive one of the fixed frames on the medium grinding block, one of the Motor 4s on the medium grinding block, one of the second threaded rods on the medium grinding block, one of the second guide rods on the medium grinding block, and the medium grinding block to move downward. The medium grinding block contacts the wafer. The output shaft of one of the Motor 4s on the medium grinding block drives the reciprocating rotation of one of the second threaded rods on the medium grinding block. The rotation of one of the second threaded rods on the medium grinding block drives the medium grinding block to reciprocate. The medium grinding block will grind the wafer again.

[0020] Then, the telescopic rod of one of the electric push rods on the medium grinding block will contract. The telescopic rod of one of the electric push rods on the medium grinding block will drive one of the fixed frames on the medium grinding block, one of the motors IV on the medium grinding block, one of the threaded rods II on the medium grinding block, one of the guide rods II on the medium grinding block, and the medium grinding block to move upward. The medium grinding block will be separated from the wafer. One of the motors IV on the medium grinding block will stop rotating. Then, the motor III will rotate again, and the fine grinding block will rotate to directly above the wafer. One of the electric push rods and one of the motors IV on the fine grinding block will drive the fine grinding block to further grind the wafer. When the wafer grinding is completed, the output shaft of the motor I will start to rotate in the reverse direction. The output shaft of the motor I will drive the lead screw to rotate in the reverse direction. The rotation of the lead screw will drive the slide plate, two fixed blocks, the motor II, the threaded rod I, two guide rods I, two sliders, two clamping plates, and the placement rack to move away from the support frame. The output shaft of the motor II will start to rotate in the reverse direction. The output shaft of the motor II will drive the threaded rod I to rotate in the reverse direction. The rotation of the threaded rod I will drive the two sliders and the two clamping plates to move away from each other. The two clamping plates will be separated from the placement rack. The two clamping plates will no longer clamp the wafer. Then, the wafer will be removed manually. By repeating this process, the wafer placed on the placement rack can be clamped, making the wafer more stable in subsequent processing, and it can adapt to wafers of different sizes. It can also perform multi-precision reciprocating grinding on the wafer, making the grinding speed of the wafer faster and improving the grinding effect and efficiency of the wafer.

[0021] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A wafer high-efficiency grinding device for integrated circuit chip production, characterized in that: The invention comprises a base frame, a screw rod, a motor 1, a slide plate, a clamping component, a rotating component and a grinding component. The upper part of the base frame is rotatably connected with the screw rod, a motor 1 is arranged on one side of the base frame, an output shaft of the motor 1 is fixedly connected with the screw rod, the upper part of the base frame is slidably connected with the slide plate, the clamping component is arranged on the slide plate, the rotating component is arranged on the base frame, and the grinding component is arranged on the rotating component.

2. The high-efficiency wafer grinding device for integrated circuit chip production according to claim 1, characterized in that: The clamping component includes a fixed block, a second motor, a threaded rod, a guide rod, a slider, a clamp and a placement rack. Two fixed blocks are provided on the skateboard, one of which is provided with a second motor. A threaded rod is rotatably connected between the two fixed blocks. The threaded rod is provided with two threads, and the two threads on the threaded rod are rotated in opposite directions. The threaded rod is fixedly connected to the output shaft of the second motor. Two guide rods are provided between the two fixed blocks. Two sliders are slidably connected between the two guide rods. The two sliders are symmetrically arranged. The two sliders are connected to the threaded rod by threads. Clamps are provided on the upper parts of the two sliders. A placement rack is provided on the upper part of the skateboard. The placement rack is fixedly connected to the threaded rod, and the placement rack is fixedly connected to the two guide rods. A circular groove is provided on the upper part of the placement rack, and the placement rack will contact the two clamps.

3. The wafer high-efficiency grinding device for integrated circuit chip production according to claim 1, characterized in that: The rotating parts include a support frame, a motor three, a turntable and a long plate. The support frame is arranged on the upper part of the base frame, the motor three is arranged on the upper part of the support frame, the turntable is arranged on the output shaft of the motor three, and three long plates are arranged on the turntable, and the three long plates are arranged in a circular array.

4. The high-efficiency wafer grinding device for integrated circuit chip production according to claim 1, characterized in that: The grinding components include an electric push rod, a fixed frame, a motor four, a threaded rod two, a guide rod two, a coarse grinding block, a medium grinding block and a fine grinding block. The three long plates are each provided with an electric push rod, the telescopic rods of the three electric push rods are each provided with a fixed frame, one side of the three fixed frames is provided with a motor four, the three fixed frames are rotatably connected with a threaded rod two, the threaded rod two is fixedly connected to the output shaft of the motor four, the three fixed frames are provided with a guide rod two, the bottom of the three fixed frames are respectively slidably connected with a coarse grinding block, a medium grinding block and a fine grinding block, the coarse grinding block, the medium grinding block and the fine grinding block are respectively threadedly connected to the three threaded rods two, and the coarse grinding block, the medium grinding block and the fine grinding block are respectively slidably connected to the three guide rods two.

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