SMD paster material gluing structure

Abstract

The utility model discloses an SMD paster material gluing structure which comprises a first label and gummed paper, the first label is connected with the gummed paper in a non-contact mode, one side of the gummed paper is connected with a second label, the second label is connected with the gummed paper in a tearable mode, and a dotted line notch is formed in the connecting position of the second label and the gummed paper. The first label is used for being adhered to the symmetrical top wall and side wall of the SMD package material and one side wall of the SMD package material, and the second label is used for being adhered to the top wall or the bottom wall of the SMD package material; the gummed paper is adhered to one outer wall, deviating from the second label, of the SMD patch roll material, and the gummed paper is used for packaging the material on the SMD patch roll material; according to the utility model, when the gummed paper is torn, no fault occurs between two SMD (Surface Mount Device) package materials, no pause occurs during material receiving, the situation that the SMD package materials need to be corrected manually by stopping equipment during material receiving is avoided, the material receiving efficiency is improved, the machine passing efficiency of a chip mounter is improved, the interface error report is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of SMD material loading technology, in particular to an SMD patch material adhesive structure. Background Art

[0002] In SMD technology, reel-mounted electronic patch materials are often used. During production, the patch materials are individually loaded into the SMD patch reel-mounted materials, and then some adhesive papers are used to independently encapsulate each electronic material into the placement holes of the SMD patch reel-mounted materials. The placed patch materials can be restricted in the placement holes by the adhesive papers.

[0003] Since the SMD patch reel-mounted material is wound into a reel-shaped material reel, the components to be installed on the PCB board are accommodated in the cavity of the SMD patch reel-mounted material. Therefore, when taking materials from the SMD patch reel-mounted material, the adhesive paper needs to be torn off, and the capacitor will be exposed from the cavity of the SMD patch reel-mounted material. After being exposed, subsequent patch installation can be carried out.

[0004] However, because the SMD patch reel-mounted materials are wound in reels, and the general SMD patch reel-mounted materials are only adhered to each other by one of the labels. Therefore, when tearing the adhesive paper, the SMD patch reel-mounted materials between each section will stick together, so that one of the SMD patch reel-mounted materials whose adhesive paper is being torn during material suction is misaligned with the next SMD patch reel-mounted material to be loaded, resulting in a pause in the loading process, prolonging the loading time, and requiring the equipment to be stopped for manual adjustment.

[0005] There is a prior SMT loading machine feeding mechanism with the document number CN211169111U, which is used to pull and feed the SMD patch reel-mounted materials and includes a pressure wheel group and a feeding table. In addition, there is an SMT loading machine automatic measurement mechanism with the document number CN211741414U, which can cooperate with the above SMT loading machine feeding mechanism to measure the resistance and capacitance on the SMD patch reel-mounted materials; the SMT loading machine automatic measurement mechanism includes a movable detection needle, and the detection needle can be used for measurement. Content of the Utility Model

[0006] The purpose of the utility model is to provide a tray adhesive structure and its loading method to overcome the deficiencies in the prior art.

[0007] To achieve the above purpose, the utility model provides the following technical solutions:

[0008] A material tray adhesive structure includes a first label and adhesive tape, wherein the first label is connected to the adhesive tape without contact, a second label is connected to one side of the adhesive tape, the second label is tornly connected to the adhesive tape, and a dotted line cut is provided at the connection between the second label and the adhesive tape; the first label is used to be bonded to the symmetrical top wall, side wall and one side wall of the SMD patch roll material, and the second label is used to be bonded to the top wall or bottom wall of the SMD patch roll material; the adhesive tape is bonded to an outer wall of the SMD patch roll material away from the second label, and the adhesive tape is used to encapsulate the material on the SMD patch roll material.

[0009] To further explain, the first label is provided with a pair of through hole groups arranged in a straight line, the through hole group passes through the first label, the SMD patch package material is provided with a plurality of plug holes arranged in a straight line, and after the first label is bonded to the SMD patch package material, the pair of through hole groups overlap with the plurality of plug holes one by one.

[0010] To further explain, the through hole group includes a plurality of through holes, and the plurality of through holes are coaxially arranged in one-to-one correspondence with the plurality of plug holes.

[0011] To further illustrate, the second label is provided with a connecting strip, the second label is connected to the adhesive tape via the connecting strip, and the connecting strip is provided with a dotted cut.

[0012] To further explain, the first label and the second label are respectively adhered to two opposite ends of the SMD patch roll material, and the first label and the second label are respectively arranged between two SMD patch roll materials.

[0013] To further explain, the through hole group includes a plurality of through holes, and the extended edges of the plurality of through holes respectively overlap with the extended edges of the plurality of plug holes in a one-to-one correspondence.

[0014] The material joining method applied to the material tray adhesive structure:

[0015] Step 1: Place the SMD patch reel material pad on the pressure wheel and feeding table of the SMT material receiving machine feeding mechanism;

[0016] Step 2: The SMD patch reel material and the first label, second label and adhesive tape adhered to the SMD patch reel material will be pulled together and sent to the automatic measurement mechanism of the SMT material receiving machine, and the detection needle will break the adhesive tape for the final measurement;

[0017] Step 3: The tape is sucked off the base film by the take-up assembly of the material receiving machine and the suction head, and attached to the interface of the SMD roll material.

[0018] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0019] The utility model adopts the first label and the second label to bond and fix the SMD patch roll materials. When tearing the adhesive tape, there will be no fault between the SMD patch roll materials and no pause when splicing the materials. It is avoided that the equipment needs to be stopped to manually correct the SMD patch roll materials when splicing the materials, thereby improving the splicing efficiency, increasing the passing efficiency of the patch machine, reducing interface errors, and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 This is a diagram of the use state of the utility model;

[0022] Figure 3 is a schematic diagram of another example;

[0023] Figure 4 It is a schematic diagram of the expansion of the third embodiment.

[0024] Notes on the attached drawings:

[0025] 1. First label; 2. Second label; 3. Adhesive tape; 4. Connecting strip; 5. Dotted line cutout; 6. SMD patch roll material; 7. Material. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. When the number of an element is referred to as "plurality", it may be any number of two or more. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this utility model belongs. The terms used in the description of this utility model herein are for the purpose of describing specific embodiments only and are not intended to limit this utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0029] The following provides a detailed description of this utility model in conjunction with the various embodiments shown in the drawings:

[0030] As Figures 1-3 shown, in this embodiment, a tray adhesive structure is provided, which includes a first label 1 and an adhesive tape 3. Generally, the SMD patch reel material 6 is made in a wound state, and the SMD patch reel material 6 is segmented. The SMD patch reel materials 6 are connected by the first label 1. However, when tearing the adhesive tape 3, since the adhesive tape 3 will adhere to the SMD patch reel material 6 and pull out the SMD patch reel material 6, because the first label 1 can only adhere to one side of the SMD patch reel material 6 and the other side is not adhered, if the adhesion force of the adhesive tape 3 is too large, the previous SMD patch reel material 6 and the next SMD patch reel material 6 to be torn with the adhesive tape 3 will be misaligned, and it is necessary to stop the machine for inspection.

[0031] In this embodiment, the first label 1 is not in contact connection with the adhesive tape 3. The first label 1 is used to bond to the top wall, side wall symmetrical to the SMD patch reel material 6, and one side wall of the SMD patch reel material 6, so that when the adhesive tape 3 is torn, one side of the SMD patch reel material 6 will not be affected under the fixation of the first label 1 and the SMD patch reel material 6 will not be misaligned. The first label 1 connects the two adjacent SMD patch reel materials 6. In this utility model, a second label 2 is pasted on the other side of the SMD patch reel material 6 to prevent the adhesive tape 3 from being misaligned when pulled. During production, the second label 2 is made together with the adhesive tape 3. The second label 2 is detachably connected to the adhesive tape 3, and a dotted line incision 5 is provided at the connection between the second label 2 and the adhesive tape 3. Therefore, when tearing the adhesive tape 3, it can be separated from the adhesive tape 3 due to the existence of the dotted line incision 5; during the process of tearing the adhesive tape 3, the second label 2 will gradually separate from the adhesive tape 3 and remain on the SMD patch reel material 6, and the second label 2 will hold the other side of the SMD patch reel material 6 that is not adhered.

[0032] Specifically, the first label 1 and the second label 2 are respectively adhered to the two ends opposite to the SMD patch roll material 6. Specifically, the first label 1 is attached to the top end of the SMD patch roll material, and the second label 2 needs to be attached to the bottom end of the SMD patch roll material. If they are arranged at the same end, it will not work. The first label 1 and the second label 2 are respectively arranged between the two SMD patch roll materials 6 to limit the position of the front and rear SMD patch roll materials 6. The rear SMD patch roll material 6 can tighten the SMD patch roll material 6 being spliced. The second label 2 cooperates with the first label 1 to stabilize the position of the front and rear SMD patch roll materials 6 to prevent misalignment.

[0033] In this embodiment, in order to save space and allow the SMD patch roll material 6 to accommodate other larger patch electronic components, the second label 2 is used to be bonded to the top wall or bottom wall of the SMD patch roll material 6; the adhesive tape 3 is bonded to an outer wall of the SMD patch roll material 6 away from the second label 2. The SMD patch roll material 6 is provided with a plurality of single-sided semi-open receiving grooves. In general, the adhesive tape 3 is used to encapsulate the material 7 on the SMD patch roll material 6, specifically, the material 7 is encapsulated in the receiving groove.

[0034] In this embodiment, the first label 1 is provided with a pair of through-hole groups arranged in a straight line, the through-hole groups penetrate the first label 1, and the SMD patch package material 6 is provided with a plurality of plug-in holes arranged in a straight line. After the first label 1 is bonded to the SMD patch package material 6, the pair of through-hole groups overlap with the plurality of plug-in holes one by one. The through-hole group includes a plurality of through-holes, and after the first label 1 is bonded to the SMD patch package material 6, the plurality of through-holes are arranged coaxially with the plurality of plug-in holes one by one. The first label 1 is coated on the symmetrical two side walls of the SMD patch package material 6, so the pair of through-hole groups mentioned above are symmetrically closed at the two end faces of the plug-in holes.

[0035] In another embodiment, a connecting strip 2 is optionally provided, and the second label 2 is provided with a connecting strip 4, and the second label 2 is connected to the adhesive tape 3 through the connecting strip 4. Specifically, there is a pair of connecting strips 4, and the connecting strips 4 are provided with a dotted line cutout 5. When the adhesive tape 3 is torn, the connecting strip 4 will be disconnected, and the adhesive tape 3 will not be connected to the second label 2. The connecting strip 4 is capable of

[0036] It is worth mentioning that the plug-in hole of the SMD patch package material 6 can be of other different shapes, and the shape of the through hole of the first label needs to correspond to the plug-in hole, such as Figure 4As shown, the shape of the through hole is elliptical in order to correspond to the first label 1 provided with the elliptical plug-in hole. That is to say, when the first label 1 is bonded to the SMD patch roll material 6, the edges of each through hole correspond to and overlap with the edges of each plug-in hole. Figure 4 One of the through-hole groups (see the through-hole group below) is opened at the edge of the first label 1, rather than a complete elliptical shape. However, when the first label 1 is bonded to the SMD patch roll material, the edges of the through-holes in this through-hole group also overlap with the corresponding plug-in holes.

[0037] The material joining method applied to the material tray adhesive structure:

[0038] Step 1: Place the SMD patch reel material 6 on the pressure wheel and feeding table of the SMT material receiving machine feeding mechanism; the pressure wheel will rotate under the drive of the driving member to pull the SMD patch reel material 6 forward.

[0039] Step 2: The SMD patch roll material 6 and the first label 1, the second label 2 and the adhesive tape 3 adhered to the SMD patch roll material 6 are pulled together to the automatic measurement mechanism of the SMT material receiving machine, and the detection needle breaks the adhesive tape 3 for the final measurement, which can determine the value of the electronic components on the SMD patch roll material 6;

[0040] Step 3: After measuring the value, the adhesive tape 3 is sucked off the base film by the reel assembly and suction head of the material receiving machine and attached to the SMD roll material interface. The electronic components originally packaged in the receiving slot will fall down, thus achieving the purpose of receiving the material.

[0041] The material splicing method can solve the problem of SMD patch roll materials tipping over and bouncing.

[0042] The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification. For ordinary technicians in this field, they can make several modifications and improvements without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An SMD patch material adhesive structure, characterized in that: It includes a first label and adhesive tape, the first label is connected to the adhesive tape without contact, a second label is connected to one side of the adhesive tape, the second label is tornly connected to the adhesive tape, and a dotted incision is provided at the connection between the second label and the adhesive tape; the first label is used to be bonded to the symmetrical top wall, side wall and one side wall of the SMD patch roll material, and the second label is used to be bonded to the top wall or bottom wall of the SMD patch roll material; the adhesive tape is bonded to an outer wall of the SMD patch roll material away from the second label, and the adhesive tape is used to encapsulate the material on the SMD patch roll material.

2. The SMD patch material adhesive structure according to claim 1, characterized in that: The first label is provided with a pair of through hole groups arranged in a straight line, and the through hole groups penetrate the first label. The SMD patch roll material is provided with a plurality of plug holes arranged in a straight line. After the first label is bonded to the SMD patch roll material, the pair of through hole groups overlap with the plurality of plug holes one by one.

3. The SMD patch material adhesive structure according to claim 2, characterized in that: The through hole group includes a plurality of through holes, and the plurality of through holes are arranged coaxially with the plurality of plug holes in a one-to-one correspondence.

4. The SMD patch material adhesive structure according to claim 1, characterized in that: The second label is provided with a connecting strip, the second label is connected to the adhesive tape via the connecting strip, and the connecting strip is provided with a dotted line cutout.

5. The SMD patch material adhesive structure according to claim 1, characterized in that: The first label and the second label are respectively adhered to two ends opposite to the SMD patch roll package material, and the first label and the second label are respectively arranged between the two SMD patch roll package materials.

6. The SMD patch material adhesive structure according to claim 2, characterized in that: The through hole group includes a plurality of through holes, and the extended edges of the plurality of through holes respectively overlap with the extended edges of the plurality of plug holes in a one-to-one correspondence.

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