Micropore copper plating device for circuit board

Abstract

The utility model relates to a circuit board micropore copper plating device, which comprises a plurality of electroplating pools, PCB (printed circuit board) moving mechanisms are mounted on the electroplating pools, each PCB moving mechanism comprises a PCB hanger, a PCB moving component, a horizontal moving component and a vertical moving component, and each PCB moving component comprises a support plate, a support seat, a support column and a moving plate; the PCB hanging frame is placed on the electroplating pool, and the moving plate is matched with the PCB hanging frame. A plurality of PCBs are placed on the PCB hanging frame, the PCB moving assembly can move in the horizontal direction and the vertical direction on the horizontal moving assembly and the vertical moving assembly respectively, the moving plate can be clamped into the PCB hanging frame, the problem that when the PCBs are electroplated, only one PCB can be fixed by a clamp is solved, and the PCBs do not need to be subjected to copper plating after one copper plating technological process is completed in an electroplating pool. And electroplating of the next PCB can be carried out.

Description

Technical Field

[0001] The utility model relates to the technical field of copper plating for circuit boards, and particularly relates to a micro-hole copper plating device for circuit boards. Background Technique

[0002] In the production of circuit boards, copper plating is a very crucial step, which can bring excellent electrical conductivity to the circuit boards. Generally, the micro-hole copper plating process for circuit boards mainly includes water washing, degreasing, copper plating, water washing, etc. Among them, the circuit board is driven by a fixture to move to the corresponding tank for operation.

[0003] Chinese patent "CN217026119U" discloses a flexible adjustable structure of a fixture for PCB electroplating copper, including a chassis, a first sliding seat, a vertical frame, an intermediate beam, a cross beam, a sliding plate, a fixture, a first motor, a cam, a guide wheel, a fixed frame, a reciprocating mechanism, a vertical moving mechanism and a horizontal moving mechanism; the PCB board is fixed on the sliding plate through the fixture, the horizontal moving mechanism drives the PCB board to move horizontally through the first sliding seat, the vertical moving mechanism drives the PCB board to move vertically through the cross beam, immersing the PCB board in the electroplating tank, turning on the first motor, the first motor drives the cam to rotate through the rotating shaft, drives the sliding plate to slide relative to the cross beam through the rolling connection between the cam and the guide wheel, the reciprocating mechanism drives the sliding plate to reset, and the sliding plate drives the PCB board to move in the electroplating tank through the fixture, increasing the electroplating effect of the PCB board and the uniformity of PCB electroplating. However, when the PCB board is electroplated in this patent, the fixture can only fix one PCB board; and in the copper plating process of each PCB board, each step takes a certain amount of time. In this patent, only after the fixture drives the PCB board to complete a copper plating process in the electroplating tank can the electroplating of the next PCB board be carried out, resulting in low production efficiency and time consumption. Content of the Utility Model

[0004] The purpose of the utility model is to design a micro-hole copper plating device for circuit boards, which can realize copper plating of multiple circuit boards in the same time period and has high production efficiency, so as to solve the problems raised in the above background technique.

[0005] To achieve the above object, the present utility model provides the following technical solutions: A micro-hole copper plating device for a circuit board is provided, which includes a plurality of electroplating tanks. A PCB board moving mechanism is installed on the electroplating tanks. The PCB board moving mechanism includes a PCB board hanging rack, a PCB board moving component, a horizontal moving component, and a vertical moving component. The horizontal moving component is installed on the electroplating tanks. The vertical moving component is installed on the horizontal moving component. The PCB board moving component is installed on the vertical moving component. The PCB board moving component includes a support plate, a support seat, a support column, and a moving plate. The support seat is installed on the support plate. The support column passes through the support seat and is connected to the support seat. Moving plates are connected to both ends of the support column. The PCB board hanging rack is placed on the electroplating tank, and the moving plate cooperates with the PCB board hanging rack.

[0006] Further, the PCB board hanging rack includes a cross beam, a PCB board placing rack, and a fixed seat. Fixed seats are connected to both ends of the cross beam. A fixed block is installed at the upper end of the fixed seat, and the fixed block cooperates with the moving plate. The PCB board placing rack is installed at the lower end of the cross beam.

[0007] Further, the horizontal moving component includes a bracket, a slide rail, and a slide bar. The brackets are installed on both sides of the electroplating tank. The slide rail is installed on the brackets. The slide bar is connected to the slide rail, and the vertical moving component is installed on the slide bar.

[0008] Further, the vertical moving component includes a frame, a motor, a lead screw, and a nut seat. The frame is installed on the slide bar. The motor is installed on the frame. The output end of the motor is connected to the lead screw. The nut seat is threadedly connected to the lead screw. A fixing plate is installed on the nut seat, and the support plate is installed on the fixing plate.

[0009] Further, guide rods are installed on both sides of the lead screw on the frame. A guide seat is slidably connected to the guide rods, and the guide seat is connected to the fixing plate.

[0010] Compared with the prior art, the beneficial effects of the present utility model are:

[0011] The utility model realizes the transformation of the copper plating process of the PCB board through a PCB board hanger. Multiple PCB boards are placed on the PCB board hanger, and the PCB board moving assembly can move in the horizontal direction and the vertical direction on the horizontal moving assembly and the vertical moving assembly respectively. When the PCB board needs to go to the next process, the PCB board moving assembly moves downward until the support column and the moving plate are located at the PCB board hanger. Then the PCB board moving assembly moves in the horizontal direction until the moving plate is clamped into the PCB board hanger. The PCB board moving assembly moves upward, driving the PCB board hanger and the PCB board to move upward. Then the PCB board moving assembly moves in the horizontal direction, driving the PCB board hanger and the PCB board to move into the electroplating tank of the next process. Finally, the PCB board hanger is immersed in the electroplating tank, thus realizing the transformation of the copper plating process of the PCB board. It solves the problem that only one PCB board can be fixed by the fixture during the electroplating of the PCB board. In the copper plating process of each PCB board, they can be carried out alternately, without the need for a PCB board to complete a copper plating process flow in the electroplating tank before the electroplating of the next PCB board can be carried out. It improves the production efficiency and saves time. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0013] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0014] Figure 2 It is a schematic diagram of the structure of the PCB board moving assembly and the vertical moving assembly of the present utility model;

[0015] Figure 3 It is a schematic diagram of the structure of the PCB board hanger of the present utility model.

[0016] The names of the components marked in the figure are as follows:

[0017] 1, electroplating tank; 2, PCB board hanger; 3, PCB board moving assembly; 4, horizontal moving assembly; 5, vertical moving assembly; 6, support plate; 7, support seat; 8, support column; 9, moving plate; 10, cross beam; 11, PCB board placement rack; 12, fixed seat; 13, fixed block; 14, bracket; 15, slide rail; 16, slide bar; 17, frame; 18, motor; 19, lead screw; 20, nut seat; 21, fixing plate; 22, guide rod; 23, guide seat. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] To further elaborate on the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following, in conjunction with the accompanying drawings and preferred embodiments, details the specific implementation manners, structures, features, and effects of the present invention as follows.

[0019] Embodiment: Refer to Figures 1-3 , a micro-hole copper plating device for a circuit board, including a hanging rack 2, a PCB board moving assembly 3, a horizontal moving assembly 4, and a vertical moving assembly 5. The horizontal moving assembly 4 is installed on the electroplating tank 1, the vertical moving assembly 5 is installed on the horizontal moving assembly 4, and the PCB board moving assembly 3 is installed on the vertical moving assembly 5. A plurality of PCB boards are placed on the PCB board hanging rack 2, and the PCB board moving assembly 3 can move in the horizontal direction and the vertical direction on the horizontal moving assembly 4 and the vertical moving assembly 5 respectively.

[0020] The horizontal moving assembly 4 includes a bracket 14, a slide rail 15, and a slide bar 16. The bracket 14 is installed on both sides of the electroplating tank 1, the slide rail 15 is installed on the bracket 14, the slide bar 16 is connected to the slide rail 15, and the vertical moving assembly 5 is installed on the slide bar 16. The vertical moving assembly 5 and the PCB board moving assembly 3 on the vertical moving assembly 5 can move in the horizontal direction under the sliding action of the slide bar 16 and the slide rail 15.

[0021] The vertical moving assembly 5 includes a frame 17, a motor 18, a lead screw 19, and a nut seat 20. The frame 17 is installed on the slide bar 16, the motor 18 is installed on the frame 17, the output end of the motor 18 is connected to the lead screw 19, the nut seat 20 is threadedly connected to the lead screw 19, a fixing plate 21 is installed on the nut seat 20, and the PCB board moving assembly 3 is installed on the fixing plate 21. Guide rods 22 are installed on both sides of the lead screw 19 on the frame 17, a guide seat 23 is slidably connected to the guide rods 22, and the guide seat 23 is connected to the fixing plate 21. When the PCB board moving assembly 3 needs to move in the vertical direction, the motor 18 is started, the lead screw 19 rotates to drive the nut column to move up and down, and with the assistance of the guide rods 22, the fixing plate 21 and the PCB board moving assembly 3 are driven to move up and down.

[0022] The PCB board moving assembly 3 includes a support plate 6, a support base 7, support columns 8 and a moving plate 9. The support base 7 is installed on the support plate 6. The support columns 8 pass through the support base 7 and are connected to the support base 7. The two ends of the support columns 8 are connected with the moving plate 9. The PCB board hanger 2 is placed on the electroplating bath 1, and the moving plate 9 cooperates with the PCB board hanger 2. The PCB board hanger 2 includes a cross beam 10, a PCB board placement rack 11 and a fixed base 12. The two ends of the cross beam 10 are connected with the fixed base 12. The upper end of the fixed base 12 is installed with a fixing block 13, and the fixing block 13 cooperates with the moving plate 9. The PCB board placement rack 11 is installed at the lower end of the cross beam 10. When the PCB board needs to move to the next process, the PCB board moving assembly 3 moves downward until the support columns 8 and the moving plate 9 are located at the position of the PCB board hanger 2. Then the PCB board moving assembly 3 moves horizontally until the moving plate 9 is clamped into the PCB board hanger 2. The PCB board moving assembly 3 moves upward, driving the PCB board hanger 2 and the PCB board to move upward. Then the PCB board moving assembly 3 moves horizontally, driving the PCB board hanger 2 and the PCB board to move into the electroplating bath 1 of the next process. Finally, the PCB board hanger 2 is immersed in the electroplating bath 1, thus realizing the transformation of the PCB board copper plating process. It solves the problem that only one PCB board can be fixed by the fixture when the PCB board is electroplated. In the copper plating process of each PCB board, they can be staggered without waiting for one PCB board to complete a copper plating process in the electroplating bath 1 before the next PCB board can be electroplated. It improves the production efficiency and saves time.

[0023] The working principle of this embodiment: When the PCB board needs to move to the next process, the motor 18 is started, the lead screw 19 rotates to drive the nut column to move downward. With the auxiliary action of the guide rod 22, it drives the fixed plate 21 and the PCB board moving assembly 3 to move downward until the support columns 8 and the moving plate 9 are located at the position of the PCB board hanger 2. Then the PCB board moving assembly 3 can move towards the PCB board hanger 2 under the sliding action of the slide bar 16 and the slide rail 15 until the moving plate 9 is clamped into the PCB board hanger 2. Then the PCB board moving assembly 3 moves upward, driving the PCB board hanger 2 and the PCB board to move upward. Finally, the PCB board moving assembly 3 moves horizontally, driving the PCB board hanger 2 and the PCB board to move into the electroplating bath 1 of the next process, thus realizing the transformation of the PCB board copper plating process.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "upper", "lower", "left", "right", "front", "rear" and similar expressions used in this article are only for the purpose of illustration.

[0025] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Although the present invention has been disclosed above with the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments of equivalent changes within the scope of the technical solution of the present invention by using the above-disclosed technical content. However, as long as it does not depart from the content of the technical solution of the present invention, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A circuit board micro-hole copper plating device, characterized in that: The invention comprises a plurality of electroplating pools (1), wherein a PCB board moving mechanism is installed on the electroplating pool (1), wherein the PCB board moving mechanism comprises a PCB board hanger (2), a PCB board moving assembly (3), a horizontal moving assembly (4) and a vertical moving assembly (5), wherein the horizontal moving assembly (4) is installed on the electroplating pool (1), the vertical moving assembly (5) is installed on the horizontal moving assembly (4), and the PCB board moving assembly (3) is installed on the vertical moving assembly (5); the PCB board moving assembly (3) comprises a support plate (6), a support seat (7), a support column (8) and a moving plate (9), wherein the support seat (7) is installed on the support plate (6), the support column (8) passes through the support seat (7) and is connected to the support seat (7), and the two ends of the support column (8) are connected to the moving plate (9); the PCB board hanger (2) is placed on the electroplating pool (1), and the moving plate (9) cooperates with the PCB board hanger (2).

2. The circuit board micro-hole copper plating device according to claim 1, characterized in that: The PCB board hanger (2) comprises a crossbeam (10), a PCB board placement frame (11), and a fixed seat (12); the two ends of the crossbeam (10) are connected to the fixed seat (12); a fixed block (13) is installed at the upper end of the fixed seat (12); the fixed block (13) cooperates with the movable plate (9); and the PCB board placement frame (11) is installed at the lower end of the crossbeam (10).

3. The circuit board micro-hole copper plating device according to claim 1, characterized in that: The horizontal moving component (4) comprises a bracket (14), a slide rail (15), and a slide bar (16); the bracket (14) is installed on both sides of the electroplating pool (1); the slide rail (15) is installed on the bracket (14); the slide bar (16) is connected to the slide rail (15); and the vertical moving component (5) is installed on the slide bar (16).

4. The circuit board micro-hole copper plating device according to claim 3, characterized in that: The vertical moving assembly (5) comprises a frame (17), a motor (18), a screw rod (19) and a nut seat (20); the frame (17) is mounted on the slide bar (16); the motor (18) is mounted on the frame (17); the output end of the motor (18) is connected to the screw rod (19); the nut seat (20) is threadedly connected to the screw rod (19); a fixing plate (21) is mounted on the nut seat (20); and the support plate (6) is mounted on the fixing plate (21).

5. The circuit board micro-hole copper plating device according to claim 4, characterized in that: Guide rods (22) are installed on the frame (17) at both sides of the screw rod (19), and guide seats (23) are slidably connected to the guide rods (22), and the guide seats (23) are connected to the fixing plate (21).

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