Telescopic semiconductor heating plate

Abstract

The utility model discloses a telescopic semiconductor heating plate, which relates to the technical field of semiconductor heating plates and comprises a semiconductor heating plate, telescopic mechanisms are fixedly mounted on the left side and the right side of the semiconductor heating plate, and each telescopic mechanism comprises a control mechanism. Connecting plates are arranged on the sides, away from the semiconductor heating plate, of the two control mechanisms, mounting plates are arranged on the sides, away from the control mechanisms, of the two connecting plates, two mounting holes are formed in the front side and the rear side of each mounting plate in a left-right penetrating mode, and two mounting holes are formed in the upper side and the lower side of each mounting plate in a left-right penetrating mode; the two control boxes are fixedly installed on the left side and the right side of the semiconductor heating plate. Through mutual cooperation of the control mechanism and the connecting plate, the overall length of the semiconductor heating plate can be adjusted according to the control mechanism, so that the semiconductor heating plate can be conveniently fixed on the inner walls of heating devices with different sizes, and the applicability of the semiconductor heating plate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor heating plates, and particularly relates to a retractable semiconductor heating plate. Background Art

[0002] At present, indoor heating air conditioners have disadvantages such as slow heating speed, high power consumption, and high noise. Semiconductor heating plates have the following characteristics: no environmental pollution, small volume, light weight, simple structure, and easy operation; fast heating speed, and it is convenient to realize controllable adjustment through the magnitude of the working current; it can operate in extreme environments such as weightlessness or overweight. The following problems exist in the prior art:

[0003] Chinese patent document CN216244549U discloses a safe far-infrared semiconductor heating plate, which includes a protective shell, a heat energy conversion sheet, a heat preservation layer, a reflector, a rear plate, and a temperature controller. The heat energy conversion sheet is installed inside the protective shell. A heat preservation layer is provided on one side of the heat energy conversion sheet. A reflector is installed on the top of the heat preservation layer. The rear plate is threadedly connected to the top of the reflector. A temperature controller is installed inside the rear plate. By setting a resistance wire heater, the safe far-infrared semiconductor heating plate replaces the traditional electric heating wire, avoids generating additional electromagnetic waves, and solves the problem that the current heating plate uses an electric heating wire for heating, and the electric heating wire will generate additional electromagnetic waves when passing through alternating current, which is likely to have an adverse impact on the health of users.

[0004] Although the above-mentioned document uses a semiconductor heating plate to replace the electric heating wire and protects the health of users, there are still certain problems in actual use. Since the protective shell of the above-mentioned heating plate is a rectangular whole and cannot be adjusted, when the semiconductor heating plate needs to be installed in heating devices of different models and sizes, the applicability will be greatly reduced. Summary of the Utility Model

[0005] The utility model provides a retractable semiconductor heating plate to solve the problems raised in the above background art.

[0006] To solve the above technical problems, the technical solution adopted by the utility model is:

[0007] A retractable semiconductor heating plate includes a semiconductor heating plate. Telescopic mechanisms are fixedly installed on both the left and right sides of the semiconductor heating plate. Both of the telescopic mechanisms include control mechanisms. Connection plates are provided on the sides of both control mechanisms away from the semiconductor heating plate. Mounting plates are provided on the sides of both connection plates away from the control mechanisms. Four mounting holes are vertically and horizontally opened through the front and rear sides of both mounting plates.

[0008] A further improvement of the technical solution of the present utility model lies in that: both of the two control mechanisms include control boxes, both of the two control boxes are fixedly installed on the left and right sides of the semiconductor heating plate, a telescopic hole penetrating through to the inner cavity is formed on one side of each of the two control boxes away from the semiconductor heating plate, a positive and reverse threaded rod is movably installed on the rear side of the inner wall of each of the two control boxes, the front ends of both of the two positive and reverse threaded rods penetrate to the front sides of the two control boxes and are fixedly installed with adjusting knobs, threaded walls with opposite threads are formed on the front and rear sides of both of the two positive and reverse threaded rods, moving blocks are threadedly installed on the outer walls of both of the two threaded walls, a cross movable plate is movably installed on one side of each of the two moving blocks close to the telescopic hole, and one end of each of the two cross movable plates away from the moving block penetrates through the two telescopic holes and is movably connected to one side of the two connecting plates close to the control mechanism.

[0009] A further improvement of the technical solution of the present utility model lies in that: positioning grooves are formed in the middle of one side of each of the two connecting plates away from the control mechanism, positioning plates are fixedly installed in the middle of one side of each of the two mounting plates close to the connecting plates, clamping grooves are formed on the front, rear, left and right sides of the tops of both of the two positioning plates, and the two positioning plates are respectively clamped with the two positioning grooves.

[0010] A further improvement of the technical solution of the present utility model lies in that: control cabins are formed in the interiors of both of the two connecting plates, and both of the two connecting plates are located above the positioning grooves. Threaded rods are movably installed on the bottom of the inner wall of each of the two control cabins, the top ends of both of the two threaded rods are fixedly connected with rotating rods, the top ends of both of the two rotating rods penetrate to the tops of the connecting plates and are fixedly installed with knobs, lifting plates are threadedly installed on the outer walls of both of the two threaded rods, the left and right sides of both of the two lifting plates are lapped with the left and right sides of the inner wall of each of the two control cabins, through grooves are formed on the front, rear, left and right sides of the bottom of the inner wall of each of the two control cabins, both of the two through grooves communicate with the inner cavity of the positioning groove, clamping blocks are fixedly installed on the front and rear sides of the bottom of both of the two lifting plates, and the two clamping blocks respectively penetrate through the through grooves and are clamped with the two clamping grooves.

[0011] Due to the adoption of the above technical solution, the technical progress obtained by the present utility model compared with the prior art is as follows:

[0012] 1. The present utility model provides a telescopic semiconductor heating plate. Through the mutual cooperation of the control mechanism and the connecting plate, the overall length of the semiconductor heating plate can be telescoped according to the adjustment of the control mechanism, so as to be conveniently fixed on the inner walls of heating devices of different sizes, and the applicability of the semiconductor heating plate is improved.

[0013] 2. The present utility model provides a telescopic semiconductor heating plate. Through the mutual cooperation of the connecting plate and the mounting plate, the connecting plate and the mounting plate can be quickly separated, and then the semiconductor heating plate can be conveniently and quickly disassembled and assembled directly by using the telescoping of the connecting plate, and the maintenance efficiency of the semiconductor heating plate is improved. Brief Description of the Drawings

[0014] Figure 1 It is an overall schematic diagram of the structure of the present utility model;

[0015] Figure 2 It is a schematic diagram of the telescopic mechanism of the structure of the present utility model;

[0016] Figure 3 It is a schematic diagram of the control mechanism of the structure of the present utility model;

[0017] Figure 4 It is an exploded schematic diagram of the connecting plate and the mounting plate of the structure of the present utility model;

[0018] Figure 5 It is an enlarged schematic diagram of the middle section of the connecting plate of the structure of the present utility model.

[0019] In the figure: 1, semiconductor heating plate; 2, telescopic mechanism; 21, control mechanism; 211, control box; 212, telescopic hole; 213, left - right threaded rod; 214, adjusting knob; 215, moving block; 216, cross - movable plate; 22, connecting plate; 221, positioning groove; 222, control cabin; 223, threaded rod; 224, rotating rod; 225, knob; 226, lifting plate; 227, clamping block; 228, through - slot; 23, mounting plate; 231, positioning plate; 232, clamping groove; 24, mounting hole. Detailed Description of the Preferred Embodiment

[0020] In order to make the technical means, creative features, achieving purposes and functions of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0021] As Figure 1 、 Figure 2 shown, the present utility model provides a telescopic semiconductor heating plate, including a semiconductor heating plate 1. Telescopic mechanisms 2 are fixedly installed on both the left and right sides of the semiconductor heating plate 1. Each of the two telescopic mechanisms 2 includes a control mechanism 21. Connecting plates 22 are arranged on the sides of the two control mechanisms 21 away from the semiconductor heating plate 1. Mounting plates 23 are arranged on the sides of the two connecting plates 22 away from the control mechanisms 21. Four mounting holes 24 are respectively and vertically and horizontally penetrated and opened on the front, back, left and right sides of the two mounting plates 23;

[0022] The semiconductor heating plate 1 can control the telescoping of the connecting plate 22 through the control mechanism, so that the mounting plate 23 can be extended and retracted at will, which is convenient for directly attaching tightly to the left and right inner walls of different heating devices, and thus convenient for fixing by screwing through the mounting holes 24.

[0023] As Figure 3As shown in the figure, both of the two control mechanisms 21 include control boxes 211. The two control boxes 211 are both fixedly installed on the left and right sides of the semiconductor heating plate 1. On one side of each of the two control boxes 211 away from the semiconductor heating plate 1, a telescopic hole 212 penetrating through to the inner cavity is provided. On the rear side of the inner walls of the two control boxes 211, reverse threaded rods 213 are movably installed. The front ends of the two reverse threaded rods 213 both penetrate to the front sides of the two control boxes 211 and are fixedly installed with adjusting knobs 214. Threaded walls with opposite threads are provided on the front and rear sides of the two reverse threaded rods 213. Moving blocks 215 are threadedly installed on the outer walls of the two threaded walls. On one side of each of the two moving blocks 215 close to the telescopic hole 212, a cross moving plate 216 is movably installed. One end of each of the two cross moving plates 216 away from the moving block 215 penetrates through the two telescopic holes 212 and is movably connected to one side of the two connecting plates 22 close to the control mechanism 21;

[0024] When installing the semiconductor heating plate 1, by rotating the adjusting knobs 214 on the front sides of the two control boxes 211, the reverse threaded rods 213 in the inner cavities of the two control boxes 211 are driven to rotate, so that the moving blocks 215 on the outer walls of the reverse threaded walls on the front and rear sides of the reverse threaded rods 213 approach each other, thereby squeezing the cross moving plates 216, and causing the two connecting plates 22 connected to the ends of the two cross moving plates 216 away from the control boxes 211 on the left and right sides of the semiconductor heating plate 1 to move to the left and right sides respectively, so as to extend. Finally, the mounting plates 23 on the sides of the two connecting plates 22 away from the control boxes 211 are tightly attached to the left and right sides of the inner wall of the heating device, so as to be conveniently applicable to heating devices of different sizes.

[0025] As Figure 4 、 Figure 5 shown in the figure, positioning grooves 221 are provided in the middle of one side of each of the two connecting plates 22 away from the control mechanism 21. Positioning plates 231 are fixedly installed in the middle of one side of each of the two mounting plates 23 close to the connecting plates 22. Clamping grooves 232 are provided on the front and rear sides of the top of the two positioning plates 231. The two positioning plates 231 are respectively clamped with the two positioning grooves 221. Control cabins 222 are provided inside the two connecting plates 22, and the two connecting plates 22 are both located above the positioning grooves 221. Threaded rods 223 are movably installed at the bottom of the inner walls of the two control cabins 222. The top ends of the two threaded rods 223 are fixedly connected with rotating rods 224. The top ends of the two rotating rods 224 both penetrate to the top of the connecting plates 22 and are fixedly installed with knobs 225. Lifting plates 226 are threadedly installed on the outer walls of the two threaded rods 223. The left and right sides of the two lifting plates 226 are in contact with the left and right sides of the inner walls of the two control cabins 222. Through grooves 228 are provided on the front and rear sides of the bottom of the inner walls of the two control cabins 222. The two through grooves 228 are both communicated with the inner cavity of the positioning groove 221. Clamping blocks 227 are fixedly installed on the front and rear sides of the bottom of the two lifting plates 226. The two clamping blocks 227 respectively penetrate through the through grooves 228 and are clamped with the two clamping grooves 232;

[0026] When it is necessary to remove the semiconductor heating plate 1, just rotate the knob 225 at the top of the connecting plate 22, which can drive the rotating rod 224 and the threaded rod 223 to rotate, so that the lifting plate 226 on the outer wall of the threaded rod 223 moves upward in the inner cavity of the control cabin 222 until the two clamping blocks 227 disengage from the two clamping grooves 232 at the top of the positioning plate 231, and after passing through the through groove 228, they are retracted into the inner cavity of the control cabin 222, then the limit on the positioning plate 231 can be released. Reverse the adjustment knob 214 to drive the forward and reverse threaded rod 213 to reverse, so that the connecting plate 22 retracts, and then the semiconductor heating plate 1 can be removed, improving the disassembly and assembly speed of the semiconductor heating plate 1.

[0027] Next, the working principle of the retractable semiconductor heating plate will be specifically described.

[0028] As Figures 1-5 shown, when installing the semiconductor heating plate 1, rotate the adjustment knobs 214 on the front sides of the two control boxes 211, which can drive the forward and reverse threaded rods 213 in the inner cavities of the two control boxes 211 to rotate, so that the moving blocks 215 on the outer walls of the opposite threads on the front and rear sides of the forward and reverse threaded rods 213 approach each other, thereby squeezing the cross movable plate 216, and making the two cross movable plates 216 at the left and right sides of the semiconductor heating plate 1 move respectively to the left and right sides at the ends connected to the two connecting plates 22 away from the control boxes 211, so as to extend. Finally, the mounting plates 23 on the sides of the two connecting plates 22 away from the control boxes 211 are tightly attached to the left and right sides of the inner wall of the heating device, and then the screws can be used to pass through the mounting holes 24 for fixation. When it is necessary to remove the semiconductor heating plate 1, just rotate the knob 225 at the top of the connecting plate 22, which can drive the rotating rod 224 and the threaded rod 223 to rotate, so that the lifting plate 226 on the outer wall of the threaded rod 223 moves upward in the inner cavity of the control cabin 222 until the two clamping blocks 227 disengage from the two clamping grooves 232 at the top of the positioning plate 231, and after passing through the through groove 228, they are retracted into the inner cavity of the control cabin 222, then the limit on the positioning plate 231 can be released, and then reverse the adjustment knob 214 to drive the forward and reverse threaded rod 213 to reverse, so that the connecting plate 22 retracts, and thus the semiconductor heating plate 1 can be successfully removed, which is convenient for maintenance.

[0029] The above has generally described the present invention in detail, but based on the present invention, some modifications or improvements can be made, which are obvious to those of ordinary skill in the art. Therefore, the modifications or improvements made without departing from the spirit of the present invention are all within the protection scope of the present invention.

Claims

1. A retractable semiconductor heating panel, comprising a semiconductor heating panel (1), characterized in that: Telescopic mechanisms (2) are fixedly installed on both left and right sides of the semiconductor heating plate (1), and both telescopic mechanisms (2) include a control mechanism (21). A connecting plate (22) is provided on the side of the two control mechanisms (21) away from the semiconductor heating plate (1), and a mounting plate (23) is provided on the side of the two connecting plates (22) away from the control mechanism (21). The front and rear sides of the two mounting plates (23) are both provided with two mounting holes (24) on the left and right sides.

2. A retractable semiconductor heating panel according to claim 1, characterized in that: The two control mechanisms (21) each comprise a control box (211), the two control boxes (211) are fixedly mounted on the left and right sides of the semiconductor heating plate (1), a telescopic hole (212) penetrating to the inner cavity is provided on the side of the two control boxes (211) away from the semiconductor heating plate (1), a positive and negative threaded rod (213) is movably mounted on the rear side of the inner wall of the two control boxes (211), the front ends of the two positive and negative threaded rods (213) penetrate to the front sides of the two control boxes (211) and are fixedly mounted An adjusting knob (214), threaded walls with opposite threads are provided on the front and rear sides of the two forward and reverse threaded rods (213), and movable blocks (215) are threadedly installed on the outer walls of the two threaded walls. A cross movable plate (216) is movably installed on one side of the two movable blocks (215) close to the telescopic hole (212), and one end of the two cross movable plates (216) away from the movable blocks (215) passes through the two telescopic holes (212) and is movably connected to one side of the two connecting plates (22) close to the control mechanism (21).

3. The retractable semiconductor heating panel according to claim 1, characterized in that: A positioning groove (221) is provided in the middle of one side of the two connecting plates (22) away from the control mechanism (21); a positioning plate (231) is fixedly installed in the middle of one side of the two mounting plates (23) close to the connecting plate (22); and clamping grooves (232) are provided on both the front and rear sides of the top of the two positioning plates (231); the two positioning plates (231) are clamped with the two positioning grooves (221) respectively.

4. A retractable semiconductor heating panel according to claim 3, characterized in that: A control cabin (222) is provided inside the two connecting plates (22), and the two connecting plates (22) are located above the positioning groove (221). The bottom of the inner wall of the two control cabins (222) is movably installed with a threaded rod (223), the top of the two threaded rods (223) is fixedly connected with a rotating rod (224), the top of the two rotating rods (224) passes through the top of the connecting plate (22) and is fixedly installed with a knob (225), and the outer wall of the two threaded rods (223) is threadedly installed with a lifting screw. The left and right sides of the two lifting plates (226) are overlapped with the left and right sides of the inner walls of the two control cabins (222); the inner walls of the two control cabins (222) are provided with through grooves (228) on both the front and rear sides of the bottom, and the two through grooves (228) are connected with the inner cavity of the positioning groove (221); the front and rear sides of the bottom of the two lifting plates (226) are fixedly installed with clamping blocks (227), and the two clamping blocks (227) respectively penetrate the through grooves (228) and are clamped with the two clamping grooves (232).

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