Heat dissipation module of computer graphics card

Abstract

The utility model discloses a heat dissipation module of a computer graphics card, and aims to solve the technical problem that the heat dissipation effect of the heat dissipation module is reduced due to the fact that dust attached to the surfaces of heat dissipation fins is not easy to clean due to the fact that the distance between the heat dissipation fins is small in the prior art. The heat dissipation module comprises a heat dissipation base, heat dissipation fins and heat pipes, the heat dissipation fins are installed on the upper surface of the heat dissipation base, the heat pipes are installed in the heat dissipation fins, connecting strips are connected to the upper surfaces of the heat dissipation fins, guide holes are formed in the surfaces of the connecting strips, and threaded rods are connected to the surface of the heat dissipation base. According to the heat dissipation module, the dust cover drives the guide rod to be inserted into the guide hole, at the moment, the threaded rod can penetrate through the round hole, then the fastening nut is connected to the surface of the threaded rod in a sleeving mode and rotates, the dust cover can be installed on the surfaces of the heat dissipation fins, and therefore dust attached to the heat dissipation fins and attached to the surfaces of the heat dissipation fins can be reduced; therefore, the heat dissipation effect of the heat dissipation fins becomes poor.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation of computer graphics cards, and in particular relates to a heat dissipation module of a computer graphics card. Background Art

[0002] Graphics card cooling module, as the name implies, is a module unit used for graphics card cooling. It is usually composed of cooling base, heat pipe, cooling fins, cooling fan and other components. Through efficient heat conduction and heat convection mechanism, the heat generated during the operation of the graphics card is quickly dissipated to maintain the normal working temperature of the graphics card.

[0003] During operation, graphics cards generate a lot of heat, which is first conducted to the heat sink and then quickly transferred to the heat sink fins through the heat pipe. At this time, the cooling fan starts to work, generating a strong airflow to take away the heat from the heat sink fins and dissipate it to the surrounding environment. In this way, the graphics card can be kept at a relatively low operating temperature, thus ensuring its stability and performance.

[0004] The existing heat dissipation module has the following problems during use:

[0005] When the existing heat dissipation module of the computer graphics card is in use, the spacing between the heat dissipation fins is small, which makes it difficult to clean the surface of the heat dissipation fins when dust adheres to the surface, thereby reducing the heat dissipation effect of the heat dissipation module. Utility Model Content

[0006] (1) Technical issues to be solved

[0007] In view of the deficiencies in the prior art, the purpose of the present utility model is to provide a heat dissipation module for a computer graphics card, which aims to solve the technical problem that the spacing between the heat dissipation fins in the prior art is small, which makes it difficult to clean the surface of the heat dissipation fins when dust adheres, thereby reducing the heat dissipation effect of the heat dissipation module.

[0008] (2) Technical solution

[0009] In order to solve the above technical problems, the utility model provides a heat dissipation module for a computer graphics card, which includes a heat dissipation base, heat dissipation fins and heat pipes. Heat dissipation fins are installed on the upper surface of the heat dissipation base, heat pipes are installed inside the heat dissipation fins, connecting strips are connected to the upper surfaces of the heat dissipation fins, guide holes are opened on the surfaces of the connecting strips, threaded rods are connected to the surface of the heat dissipation base, dust covers are sleeved on the surfaces of the heat dissipation fins, guide rods are connected to the surfaces of the dust covers near the guide holes, round holes are opened on the surfaces of the dust covers near the threaded rods, and fastening nuts are sleeved on the surfaces of the threaded rods.

[0010] When using the heat dissipation module of this technical solution, the dust cover drives the guide rod to insert into the inside of the guide hole. At this time, the dust cover can drive the round hole to sleeve on the surface of the threaded rod. Then, the fastening nut can be sleeved on the surface of the threaded rod and rotated, so that the dust cover can be installed on the surface of the heat dissipation fins. This can reduce the entry of dust into the gaps between the heat dissipation fins and adhere to the surface of the heat dissipation fins, thereby deteriorating the heat dissipation effect of the heat dissipation fins.

[0011] Preferably, the size of the dust cover matches the size of the heat dissipation fins. The side surface of the heat dissipation fins of the dust cover contacts the inner wall of the dust cover, and the dust cover completely fits on the side surface of the heat dissipation fins, so as to prevent dust from entering the gaps of the heat dissipation fins from the side surface.

[0012] Furthermore, the guide rod and the connecting bar form a sliding connection through the guide hole. The dust cover can drive the guide rod to insert into the inside of the guide hole, so that the dust cover can be prevented from shifting through the guide rod and the guide hole.

[0013] Furthermore, the dust cover and the threaded rod form a sliding connection through the round hole. The threaded rod and the fastening nut are in a threaded connection. The fastening nut is sleeved on the surface of the threaded rod and rotated, so that the dust cover can be installed on the surface of the heat dissipation fins.

[0014] Furthermore, a storage cylinder is fitted and installed inside the heat dissipation fins. A push plate is inserted into the inside of the storage cylinder. A rubber ring is connected to the side surface of the push plate. A threaded post is inserted into the inside of the push plate. A knob is connected to the top of the threaded post. A connecting pipe is connected to the bottom side of the storage cylinder, and the connecting pipe penetrates through the inside of the heat dissipation base.

[0015] Furthermore, the push plate and the inner wall of the storage cylinder form a sealed structure through the rubber ring. The storage cylinder and the connecting pipe form a communicating connection. The push plate driving the rubber ring to move downward can squeeze the thermal paste inside. The rubber ring being squeezed can enter the connecting pipe and be extruded from the end.

[0016] Furthermore, the threaded post and the push plate form a threaded connection. The knob drives the threaded post to rotate at the entrance of the push plate. The rotation of the threaded post can move downward through the threaded structure, so as to close the entrance of the storage cylinder.

[0017] (3) Beneficial effects

[0018] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0019] In this utility model, the dust cover drives the guide rod to insert into the interior of the guide hole. At this time, the dust cover can drive the round hole to sleeve on the surface of the threaded rod. Then, the fastening nut can be sleeved on the surface of the threaded rod and rotated, so that the dust cover can be installed on the surface of the heat dissipation fins, which can reduce the entry of dust into the gaps between the heat dissipation fins and adhere to the surface of the heat dissipation fins, resulting in a poor heat dissipation effect of the heat dissipation fins.

[0020] In this utility model, first, thermal paste is injected into the storage cylinder. The knob drives the threaded column to close the inlet of the storage cylinder. After the installation of the heat dissipation module is completed and the thermal conductivity becomes poor after use for a period of time, the knob can be squeezed. The squeezed knob can drive the push plate and the rubber ring to move downward through the threaded column. The rubber ring can enter the connecting pipe and be extruded from the end after being squeezed. The extruded thermal paste can fill the position where the heat dissipation base contacts the graphics card, so that the thermal conductivity of the heat dissipation module can be improved through the thermal paste. Description of the Drawings

[0021] Figure 1 is a schematic diagram of the main structure of a specific embodiment of the device of this utility model;

[0022] Figure 2 is an exploded view of the main structure of a specific embodiment of the device of this utility model;

[0023] Figure 3 is a schematic diagram of the dust cover structure of a specific embodiment of the device of this utility model;

[0024] Figure 4 is a top view of the heat dissipation module structure of a specific embodiment of the device of this utility model;

[0025] Figure 5 is a bottom view of the heat dissipation module structure of a specific embodiment of the device of this utility model;

[0026] Figure 6 is a schematic diagram of the connection structure of the storage cylinder of a specific embodiment of the device of this utility model.

[0027] The reference numerals in the drawings are: 1, heat dissipation base; 2, heat dissipation fins; 3, heat pipe; 4, guide hole; 5, threaded rod; 6, dust cover; 7, guide rod; 8, round hole; 9, fastening nut; 10, storage cylinder; 11, push plate; 12, rubber ring; 13, threaded column; 14, knob; 15, connecting pipe; 16, connecting strip. Specific Embodiment

[0028] This specific embodiment is a heat dissipation module of a computer graphics card, and its structural schematic diagram is as Figures 1-6As shown in the figure, the heat dissipation module includes a heat dissipation base 1, heat dissipation fins 2 and heat pipes 3. The heat dissipation fins 2 are installed on the upper surface of the heat dissipation base 1, and the heat pipes 3 are installed inside the heat dissipation fins 2. A connecting strip 16 is connected to the upper surface of the heat dissipation fins 2. A guiding hole 4 is formed on the surface of the connecting strip 16. A threaded rod 5 is connected to the surface of the heat dissipation base 1. A dust-proof cover 6 is sleeved on the surface of the heat dissipation fins 2. A guiding rod 7 is connected to the surface of the dust-proof cover 6 near the guiding hole 4. A round hole 8 is formed on the surface of the dust-proof cover 6 near the threaded rod 5. A fastening nut 9 is sleeved on the surface of the threaded rod 5.

[0029] Among them, the size of the dust-proof cover 6 matches the size of the heat dissipation fins 2. The side surface of the heat dissipation fins 2 of the dust-proof cover 6 contacts the inner wall of the dust-proof cover 6. The guiding rod 7 forms a sliding connection with the connecting strip 16 through the guiding hole 4. The dust-proof cover 6 is in a sliding connection with the threaded rod 5 through the round hole 8. The threaded rod 5 and the fastening nut 9 are in a threaded connection.

[0030] In addition, a storage cylinder 10 is fitted and installed inside the heat dissipation fins 2. A pushing plate 11 is inserted into the storage cylinder 10. A rubber ring 12 is connected to the side surface of the pushing plate 11. A threaded post 13 is inserted into the pushing plate 11. A knob 14 is connected to the top of the threaded post 13. A connecting pipe 15 is connected to the bottom side of the storage cylinder 10. The connecting pipe 15 penetrates through the inside of the heat dissipation base 1. The pushing plate 11 forms a sealed structure with the inner wall of the storage cylinder 10 through the rubber ring 12. The storage cylinder 10 and the connecting pipe 15 are in a communicating connection. The threaded post 13 and the pushing plate 11 are in a threaded connection.

[0031] Working principle: When using the device of this technical solution, first, the dust-proof cover 6 drives the guiding rod 7 to insert into the inside of the guiding hole 4. At this time, the dust-proof cover 6 can drive the round hole 8 to be sleeved on the surface of the threaded rod 5. Then, the fastening nut 9 can be sleeved on the surface of the threaded rod 5 and rotated, so that the dust-proof cover 6 can be installed on the surface of the heat dissipation fins 2, thereby reducing dust from adhering to the surface of the heat dissipation fins 2;

[0032] First, inject thermal paste into the storage cylinder 10 through the inlet of the pushing plate 11. Then, the knob 14 drives the threaded post 13 to rotate at the inlet of the pushing plate 11. The rotation of the threaded post 13 can move downward through the threaded structure, so that the inlet of the storage cylinder 10 can be closed. After the installation of the heat dissipation module is completed and the thermal conductivity becomes poor after using for a period of time, the knob 14 can be squeezed. The squeezed knob 14 can drive the pushing plate 11 to move downward through the threaded post 13. The pushing plate 11 drives the rubber ring 12 to move downward to squeeze the internal thermal paste. The squeezed rubber ring 12 can enter the connecting pipe 15 and be extruded from the end. The extruded thermal paste can fill the position where the heat dissipation base 1 contacts the graphics card.

[0033] All technical features in this embodiment can be freely combined according to actual needs.

[0034] The above embodiments are the preferred implementation solutions of the present utility model. In addition, the present utility model can also be implemented in other ways. Any obvious substitution without departing from the concept of the technical solution is within the protection scope of the present utility model.

Claims

1. A heat dissipation module for a computer graphics card, the heat dissipation module comprising a heat dissipation base (1), heat dissipation fins (2) and a heat pipe (3), characterized in that: The upper surface of the heat dissipation base (1) is provided with heat dissipation fins (2), the interior of the heat dissipation fins (2) is provided with heat pipes (3), the upper surface of the heat dissipation fins (2) is connected with connecting strips (16), the surface of the connecting strips (16) is provided with guide holes (4), the surface of the heat dissipation base (1) is connected with threaded rods (5), the surface of the heat dissipation fins (2) is sleeved with dust covers (6), the surface of the dust covers (6) near the guide holes (4) is connected with guide rods (7), the surface of the dust covers (6) near the threaded rods (5) is provided with round holes (8), and the surface of the threaded rods (5) is sleeved with fastening nuts (9).

2. A heat dissipation module for a computer graphics card according to claim 1, characterized in that: The size of the dust cover (6) matches the size of the heat dissipation fins (2), and the side surface of the heat dissipation fins (2) of the dust cover (6) contacts the inner wall of the dust cover (6).

3. The heat dissipation module of a computer graphics card according to claim 1, characterized in that: The guide rod (7) is slidably connected to the connecting strip (16) via the guide hole (4).

4. The heat dissipation module of a computer graphics card according to claim 1, characterized in that: The dust cover (6) is slidably connected to the threaded rod (5) through the circular hole (8), and the threaded rod (5) is threadedly connected to the fastening nut (9).

5. The heat dissipation module of a computer graphics card according to claim 1, characterized in that: A material storage barrel (10) is embedded and installed inside the heat dissipation fin (2), a material pushing plate (11) is inserted inside the material storage barrel (10), a rubber ring (12) is connected to the side surface of the material pushing plate (11), a threaded column (13) is inserted inside the material pushing plate (11), a knob (14) is connected to the top of the threaded column (13), and a connecting pipe (15) is connected to the bottom side of the material storage barrel (10), and the connecting pipe (15) runs through the interior of the heat dissipation base (1).

6. A heat dissipation module for a computer graphics card according to claim 5, characterized in that: The push plate (11) forms a sealing structure with the inner wall of the storage barrel (10) through the rubber ring (12), and the storage barrel (10) and the connecting pipe (15) are in communication with each other.

7. A heat dissipation module for a computer graphics card according to claim 6, characterized in that: The threaded column (13) and the push plate (11) form a threaded connection.

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