Pressing and pasting equipment for resin film

Abstract

The utility model relates to pressing and pasting equipment for a resin film, which comprises a fixing seat for fixing a semiconductor part and a pressing head which is positioned above the fixing seat and drives the resin film to be pressed and pasted on the semiconductor part, the pressing head is also provided with a positioning table which is positioned with a carrier plate, the positioning table is provided with a fixing structure for fixing the resin film, and the carrier plate is provided with the resin film. According to the utility model, after the resin film is positioned on the carrier plate, and the carrier plate and the positioning table are positioned, the fixing structure on the positioning table fixes the resin film on the positioning table, then the fixation of the carrier plate and the positioning table is released, and the pressure head is driven to move downwards, so that the resin film is driven to move downwards, and the resin film is pressed on a semiconductor part; in the whole process, through positioning of the positioning table and the carrier and the position relation of the positioning table and the fixing base, the accuracy of the position of the resin film in the pressing process is guaranteed, meanwhile, due to the arrangement of the positioning table, the fixing base and the carrier, operation of workers is facilitated, and therefore the resin film pressing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor part manufacturing, especially to the field of semiconductor part film sticking technology, and specifically refers to a resin film pressing device. Background Art

[0002] In the field of semiconductor part manufacturing, since the resin film has the functions of anti-corrosion, isolating air and moisture, thus playing a role in protecting semiconductor part components, pressing a resin film on certain semiconductor parts is an essential process.

[0003] However, since the resin film is a thin sheet only dozens of micrometers thick, it is extremely easy to deform, flex or misalign during the pressing process. The current method of pressing the resin film is to use tweezers to place the resin film on the pressure head, and then correct the position by comparing with the human eye. This method not only has low efficiency but also is prone to errors. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides a resin film pressing device to ensure that the resin film is accurately pressed on the semiconductor part, and improve the efficiency and accuracy of resin film pressing.

[0005] The utility model is realized by the following technical solutions. A resin film pressing device includes a fixing base for fixing the semiconductor part, a pressure head located above the fixing base and driving the resin film to be pressed on the semiconductor part. The pressure head is also provided with a positioning table for positioning with the carrier plate. The positioning table is provided with a fixing structure for fixing the resin film, and the carrier plate is provided with the resin film.

[0006] When in use, after the resin film is positioned on the carrier plate, the carrier plate is positioned with the positioning table. The fixing structure on the positioning table fixes the resin film on the positioning table. Then, the fixing of the carrier plate and the positioning table is released, and the pressure head is driven to move downward, thereby driving the resin film to move downward and pressing the resin film onto the semiconductor part to realize the pressing of the resin film. The whole process ensures the accuracy of the resin film pressing position through the positioning between the positioning table and the carrier, and the positional relationship between the positioning table and the fixing base. At the same time, relying on the settings of the positioning table, the fixing base and the carrier, it is convenient for the staff to operate, thereby improving the efficiency of resin film pressing.

[0007] Preferably, the fixing structure includes a first suction hole opened on the positioning table and used for sucking the resin film. The first suction hole is connected to a first suction pump through a first air pipe, and a first valve is also provided on the first air pipe.

[0008] Through the settings of the first suction hole, the first air pipe and the first suction pump in this preferred solution, the resin film is sucked, thus facilitating the suction and release of the resin film.

[0009] Preferably, a positioning groove for cooperating with the positioning table is formed on the carrier board, and a second air suction hole is formed at the bottom of the positioning groove. The second air suction hole is connected to a second air suction pump through a second air pipe, and a second valve is further provided on the second air pipe.

[0010] In this preferred solution, through the arrangement of the second air suction hole, the second air pipe and the second air suction pump, the resin film is sucked, so as to facilitate the suction and release of the resin film.

[0011] Preferably, the first air suction hole and the second air suction hole are in the same extending direction as the resin film.

[0012] In this preferred solution, through the arrangement of the extending directions of the first air suction hole and the second air suction hole, the resin film is sucked along the length direction of the resin film, increasing the contact area with the resin film and preventing the resin film from warping.

[0013] Preferably, the positioning table is located directly above the fixing base, and the pressing head is slidably connected to the bracket in the height direction. Both the bracket and the base are arranged on the base.

[0014] In this preferred solution, through the arrangement of the positions of the positioning table and the fixing base, it is convenient for the pressing head to be positioned and docked with the fixing base.

[0015] Preferably, the pressing head is arranged on the slider, and a slide rail for cooperating with the slider is provided on the bracket.

[0016] In this preferred solution, through the arrangement of the slide rail, a guiding effect is given to the sliding of the pressing head, so as to ensure the docking of the positioning table and the fixing base.

[0017] Preferably, two operating handles are further provided on both sides of the slider. In this preferred solution, through the arrangement of the two operating handles, it is convenient for the staff to drive the slider to move along the slide rail.

[0018] Preferably, a baffle is further provided on the bracket and located directly above the slider. The baffle is connected to the slider through a spring.

[0019] In this preferred solution, through the arrangement of the baffle and the spring, it is convenient for the slider to move upward, so as to facilitate the reset of the slider.

[0020] Preferably, the fixing base includes a frame body, a top plate for supporting the semiconductor part is provided on the frame body, a positioning post for cooperating with the positioning hole of the semiconductor part is provided on the top plate, and a plurality of positioning bolts for abutting against the side surface of the semiconductor part are further provided on the bracket.

[0021] In this preferred solution, through the arrangement of the positioning post and the positioning bolts, it is convenient for the fixing and positioning of the semiconductor part.

[0022] Preferably, a screw rod extending horizontally and vertically is also threadedly connected to the base. An adjusting plate through which the screw rod passes is provided on the bracket, and a nut located on the side of the adjusting plate is threadedly connected to the screw rod.

[0023] With the arrangement of the screw rod in this preferred solution, it is convenient to finely adjust the position of the bracket on the base, so that the pressing head can be more accurately aligned with the film - sticking part of the semiconductor part.

[0024] The beneficial effects of the present utility model are as follows: After the resin film is positioned on the carrier plate, and the carrier plate and the positioning table are positioned, the fixing structure on the positioning table fixes the resin film on the positioning table. Then, the fixing of the carrier plate and the positioning table is released, and the pressing head is driven to move downward, thereby driving the resin film to move downward and pressing the resin film onto the semiconductor part to achieve the pressing and pasting of the resin film. Through the positioning of the positioning table and the carrier, and the positional relationship between the positioning table and the fixing seat, the accuracy of the position during the pressing and pasting of the resin film is ensured. At the same time, relying on the settings of the positioning table, the fixing seat, and the carrier, it is convenient for the staff to operate, thereby improving the efficiency of the pressing and pasting of the resin film. Description of the Drawings

[0025] Figure 1 It is a schematic structural diagram of the present utility model;

[0026] Figure 2 It is a schematic structural diagram of the fixing seat;

[0027] Figure 3 It is a top - view schematic diagram of the semiconductor part;

[0028] Figure 4 It is a schematic diagram at the pressing head;

[0029] Figure 5 For Figure 4 the schematic diagram in the x - direction in

[0030] Figure 6 It is a schematic diagram at the carrier plate;

[0031] Figure 7 It is a schematic diagram of the resin film;

[0032] As shown in the figure:

[0033] 10. Resin film, 20. Base, 21. Screw rod, 22. Adjusting plate, 30. Fixing seat, 31. Positioning post, 32. Positioning bolt, 40. Semiconductor part, 41. Film - sticking part of the semiconductor part, 42. Positioning hole, 50. Pressing head, 51. First suction hole, 52. Positioning table, 60. Operating handle, 70. First valve, 71. Second valve, 80. Slide rail, 90. Bracket, 100. Carrier plate, 101. Positioning groove, 102. Second suction hole, 120. Handle. Detailed Embodiments

[0034] To clearly illustrate the technical features of this solution, the following will elaborate on this solution through specific implementation manners.

[0035] Refer to the attached Figure 1-7 , a pressing device for a resin film of the present utility model. Pressing refers to pressing the resin film onto the semiconductor part 40 to achieve the fitting connection between the resin film and the semiconductor part 40. The pressing device includes a base 20, a fixed seat 30 and a bracket 90 arranged on the base 20. A handle 120 is also fixedly connected to the base 20. The fixed seat 30 and the bracket 90 are arranged longitudinally. The fixed seat 30 includes a frame body bolted to the base 20. A top plate for supporting the semiconductor part 40 is provided on the frame body. Positioning columns 31 matching with the positioning holes 42 of the semiconductor part 40 are provided on the top plate. There are two positioning columns 31, and the two positioning columns 31 are located on a diagonal line of the semiconductor part 40. Three positioning bolts 32 pressing against the side surface of the semiconductor part 40 are also provided on the frame body. The three positioning bolts 32 are all threadedly connected to the frame body. Two positioning bolts 32 press against the semiconductor part 40 longitudinally, and the other positioning bolt 32 presses against the semiconductor part 40 transversely.

[0036] The bracket 90 includes a slide rail 80 extending in the height direction. A slider is slidably connected to the slide rail 80. A baffle is bolted to the bracket 90 above the slider. The baffle is connected to the slider through a spring. Two operating handles 60 are also provided on both sides of the slider.

[0037] A screw rod 21 extending transversely and longitudinally is also threadedly connected to the base 20. An adjusting plate 22 through which the screw rod 21 passes is provided on the bracket 90. A nut is threadedly connected to the screw rod 21 on the side of the adjusting plate 22. A U-shaped through hole through which the screw rod 21 passes is opened on the adjusting plate 22. The width of the U-shaped through hole is greater than the diameter of the screw rod 21.

[0038] A pressing head 50 located directly above the top plate is fixedly connected to the bottom surface of the slider. A positioning platform 52 protruding downward is fixedly connected to the bottom surface of the pressing head 50. A fixing structure for fixing the resin film is provided on the positioning platform 52. The fixing structure includes a first suction hole 51 for sucking the resin film. The first suction hole 51 is connected to a first suction pump through a first air pipe. A first valve 70 is also provided on the first air pipe.

[0039] The resin film is arranged on a carrier plate 100. A positioning groove 101 for cooperating with the positioning platform 52 is opened on the carrier plate 100. A second suction hole 102 is opened at the bottom of the positioning groove 101. The second suction hole 102 is connected to a second suction pump through a second air pipe. A second valve 71 is also provided on the second air pipe. Both the first valve 70 and the second valve 71 are ball valves. The first suction hole 51 and the second suction hole 102 are in the same extending direction as the resin film.

[0040] Specifically, referring to the attached Figure 1 , the x-direction is horizontal and the y-direction is vertical.

[0041] When the present utility model is in use, first place the semiconductor part 40 on the fixed seat 30, so that the positioning post 31 passes through the positioning hole 42, and then rotate the positioning bolt 32 to press against the semiconductor part 40, thereby realizing the fixation of the semiconductor part 40;

[0042] Place the resin film at the bottom of the positioning groove 101. The second suction hole 102 sucks the resin film under the action of the suction pump, thereby realizing the fixation of the resin film. Then insert the positioning table 52 into the positioning groove 101, close the second valve 71, open the first valve 70, so that the first suction hole 51 on the positioning table 52 sucks the resin film, and then remove the carrier plate 100; drive the slider to slide downward through the operating handle 60, thereby driving the resin film to move downward and pressing the resin film onto the semiconductor part 40 to realize the pressing of the resin film. The entire process is based on the positioning of the positioning table 52 and the carrier, and the positional relationship between the positioning table 52 and the fixed seat 30, thereby ensuring the accuracy of the position when the resin film is pressed. At the same time, relying on the settings of the positioning table 52, the fixed seat 30, and the carrier, it is convenient for the staff to operate, thereby improving the efficiency of resin film pressing.

[0043] Of course, the above description is not limited to the above examples. The technical features not described in the present utility model can be realized by or adopt the prior art, and will not be elaborated here; the above embodiments and the accompanying drawings are only used to illustrate the technical solutions of the present utility model and are not limitations on the present utility model. The present utility model has been described in detail with reference to the preferred embodiments. Those of ordinary skill in the art should understand that any changes, modifications, additions, or substitutions made by those of ordinary skill in the art within the scope of the essence of the present utility model do not depart from the purpose of the present utility model and should also fall within the scope of the protection of the claims of the present utility model.

Claims

1. A resin film pressing device, characterized in that: The invention comprises a fixing seat (30) for fixing a semiconductor component (40), a pressing head (50) located above the fixing seat (30) and driving a resin film to be pressed against the semiconductor component (40), the pressing head (50) also being provided with a positioning platform (52) for positioning with a carrier (100), the positioning platform (52) being provided with a fixing structure for fixing the resin film, and the carrier (100) being provided with a resin film.

2. The resin film laminating device according to claim 1, characterized in that: The fixing structure comprises a first suction hole (51) opened on the positioning platform (52) and used to suck the resin film. The first suction hole (51) is connected to a first suction pump via a first air pipe. The first air pipe is also provided with a first valve (70).

3. The resin film laminating device according to claim 2, characterized in that: The carrier plate (100) is provided with a positioning groove (101) that cooperates with the positioning platform (52), and a second air suction hole (102) is provided at the bottom of the positioning groove (101). The second air suction hole (102) is connected to a second air suction pump via a second air pipe, and the second air pipe is also provided with a second valve (71).

4. The resin film laminating device according to claim 3, characterized in that: The first air intake hole (51) and the second air intake hole (102) are in the same extension direction as the resin film.

5. The resin film laminating device according to claim 1, characterized in that: The positioning platform (52) is located directly above the fixing seat (30), the pressure head (50) is slidably connected to the bracket (90) along the height direction, and the bracket (90) and the base (20) are both arranged on the base (20).

6. The resin film laminating device according to claim 5, characterized in that: The pressure head (50) is arranged on a slide block, and the bracket (90) is provided with a slide rail (80) that cooperates with the slide block.

7. The resin film laminating device according to claim 6, characterized in that: Two operating handles (60) are also provided on both sides of the sliding block.

8. The resin film laminating device according to claim 6, characterized in that: The bracket (90) is also provided with a baffle plate located directly above the slider, and the baffle plate is connected to the slider via a spring.

9. The resin film laminating device according to claim 1, characterized in that: The fixing seat (30) comprises a frame body, the frame body is provided with a top plate supporting the semiconductor part (40), the top plate is provided with a positioning column (31) cooperating with a positioning hole (42) of the semiconductor part (40), and the bracket (90) is also provided with a plurality of positioning bolts (32) that are pressed against the side of the semiconductor part (40).

10. The resin film laminating device according to claim 5, characterized in that: The base (20) is also threadedly connected to a screw rod (21) extending transversely and longitudinally, the bracket (90) is provided with an adjustment plate (22) for the screw rod (21) to pass through, and the screw rod (21) is threadedly connected to a nut located on the side of the adjustment plate (22).

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