Wafer transmission device

Abstract

The utility model provides a wafer transmission device which is used for transmitting wafers among a plurality of wafer processing mechanisms, the wafer transmission device comprises a plurality of clamping mechanisms, each clamping mechanism comprises a support frame and a clamping piece, the clamping piece is used for clamping the wafers and is connected to the support frame, the number of the clamping mechanisms is a plurality, and the clamping pieces are used for clamping the wafers and are connected to the support frame. The clamping mechanism is configured to be used for clamping a wafer from one wafer processing mechanism among the plurality of wafer processing mechanisms and transmitting the wafer to another wafer processing mechanism; wherein the multiple wafer processing mechanisms are arranged in the first direction, and the supporting frames of the multiple clamping mechanisms are arranged on the two sides of the multiple wafer processing mechanisms in the second direction respectively. According to the wafer transmission device provided by the utility model, the supporting frames of the plurality of clamping mechanisms are arranged on the two sides of the wafer processing mechanism, so that the arrangement of the wafer processing mechanism can be facilitated, the rationality of the layout can be improved, meanwhile, the clamping pieces of the adjacent clamping mechanisms can be prevented from colliding with each other, and the normal transmission of wafers can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, and particularly relates to a wafer transfer device. Background Art

[0002] In the existing wafer transfer device, the clamping component is unreasonably arranged, which causes the clamping parts of adjacent clamping components to easily collide with each other, thus being unfavorable for wafer transfer. Summary of the Utility Model

[0003] The utility model aims to at least solve one of the technical problems existing in the prior art. For this reason, the utility model provides a wafer transfer device, which can ensure the normal transfer of wafers.

[0004] According to an embodiment of the utility model, the wafer transfer device is used for transferring wafers between multiple wafer processing mechanisms. The wafer transfer device includes: a clamping mechanism, which includes a support frame and a clamping part. The clamping part is used for clamping the wafer and is connected to the support frame. The number of clamping mechanisms is multiple, and the clamping mechanisms are configured to clamp wafers from one wafer processing mechanism and transfer them to another wafer processing mechanism between multiple wafer processing mechanisms. Among them, multiple wafer processing mechanisms are arranged along a first direction, and the support frames of multiple clamping mechanisms are respectively arranged on both sides of multiple wafer processing mechanisms along a second direction, and the second direction intersects with the first direction.

[0005] According to the wafer transfer device of the utility model, arranging the support frames of multiple clamping mechanisms on both sides of the wafer processing mechanism can facilitate the layout of the wafer processing mechanism, improve the rationality of the layout. At the same time, it can also prevent the clamping parts of adjacent clamping mechanisms from colliding with each other, ensuring the normal transfer of wafers.

[0006] According to some embodiments of the utility model, in the first direction, the clamping parts of multiple clamping mechanisms located on both sides of the wafer processing mechanism are alternately arranged.

[0007] According to some alternative embodiments of the utility model, the number of clamping mechanisms is three, namely: a first clamping mechanism, a second clamping mechanism, and a third clamping mechanism. The first clamping mechanism and the third clamping mechanism are arranged on one side of the wafer processing mechanism in the second direction, and the second clamping mechanism is arranged on the other side of the wafer processing mechanism in the second direction.

[0008] According to some embodiments of the utility model, the clamping part of each clamping mechanism is configured to move between two adjacent wafer processing mechanisms.

[0009] According to some embodiments of the present utility model, the wafer processing mechanism includes a box body, an accommodation cavity is defined in the box body, a pick-and-place opening communicating with the accommodation cavity is formed at the top of the box body, and the pick-and-place opening extends in a strip shape along a second direction.

[0010] According to some embodiments of the present utility model, the multiple wafer processing mechanisms include: a temporary storage mechanism, at least one cleaning mechanism, and a drying mechanism, and the temporary storage mechanism, the cleaning mechanism, and the drying mechanism are arranged in sequence along the first direction.

[0011] According to some embodiments of the present utility model, the wafer transfer device includes: a controller, and the controller is electrically connected to the multiple clamping mechanisms to control the multiple clamping mechanisms to move independently or at least part of the clamping mechanisms to move synchronously.

[0012] According to some embodiments of the present utility model, the support frame includes: a first support frame, the clamping member can move relative to the first support frame along the first direction and the third direction, the first direction, the second direction, and the third direction intersect pairwise, and the third direction is the up-and-down direction.

[0013] According to some alternative embodiments of the present utility model, the support frame includes: a second support frame, the second support frame is slidably arranged on the first support frame along the first direction; the clamping mechanism includes: a first motor, the first motor is used to drive the second support frame to move relative to the first support frame along the first direction; a support arm, the support arm is slidably arranged on the second support frame along the third direction, and the clamping member is arranged on the support arm; a second motor, the second motor is used to drive the support arm to move relative to the second support frame along the third direction.

[0014] According to some embodiments of the present utility model, it includes: a distance sensor, and the distance sensor is used to detect the distance between adjacent clamping members.

[0015] The additional aspects and advantages of the present utility model will be partly given in the following description, partly will become obvious from the following description, or will be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of a wafer transfer device according to an embodiment of the present utility model from one angle;

[0017] Figure 2 is Figure 1 a schematic diagram of the wafer transfer device shown in

[0018] Figure 3 is Figure 1Schematic diagram of the first embodiment of the wafer transfer device shown in;

[0019] Figure 4 is Figure 1 Schematic diagram of the second embodiment of the wafer transfer device shown in;

[0020] Figure 5 is Figure 1 Schematic diagram of the third embodiment of the wafer transfer device shown in;

[0021] Figure 6 is Figure 1 Schematic diagram of the fourth embodiment of the wafer transfer device shown in.

[0022] Reference numerals:

[0023] 100, wafer transfer device;

[0024] 10, wafer processing mechanism; 11, box body; 12, accommodating cavity; 13, pick-and-place opening;

[0025] 101, temporary storage mechanism; 102, cleaning mechanism; 103, drying mechanism;

[0026] 20, clamping mechanism; 21, first support frame; 22, second support frame; 23, support arm; 24, clamping member;

[0027] 201, first clamping mechanism; 202, second clamping mechanism; 203, third clamping mechanism;

[0028] 30, distance sensor. Detailed implementation manners

[0029] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0030] Below, refer to the attached Figures 1-6 Describe the wafer transfer device 100 according to the embodiments of the present invention.

[0031] Refer to Figure 1 , Figure 2 and Figure 3 , for the wafer transfer device 100 according to the embodiments of the present invention, the wafer transfer device 100 is used to transfer wafers between multiple wafer processing mechanisms, including: a clamping mechanism 20,

[0032] Specifically, the picking mechanism 20 includes a support frame and a clamping member 24. The clamping member 24 is used to clamp the wafer, and the clamping member 24 is connected to the support frame. The number of the picking mechanisms 20 is multiple, that is to say, the number of the picking mechanisms 20 can be two, three, four or more. The picking mechanism 20 is configured to pick up the wafer from one wafer processing mechanism 10 and transfer it to another wafer processing mechanism 10 among multiple wafer processing mechanisms 10. Among them, multiple wafer processing mechanisms 10 are arranged along the first direction (such as Figure 1 the front-back direction shown), and the number of the wafer processing mechanisms 10 is multiple, that is to say, the number of the wafer processing mechanisms 10 can be two, three, four or more; the support frames of multiple picking mechanisms 20 are respectively arranged on both sides of the wafer processing mechanism 10 along the second direction (such as Figure 1 the left-right direction shown), and the second direction intersects with the first direction. Figure 1 the left side and the right side of the wafer processing mechanism 10 shown).

[0033] For example, as Figure 1 , Figure 2 and Figure 3 shown, the number of the wafer processing mechanisms 10 is four, and the four wafer processing mechanisms 10 are arranged along the front-back direction. The number of the picking mechanisms 20 is three, and the three picking mechanisms 20 are respectively arranged on the left side and the right side of the wafer processing mechanism 10.

[0034] When using the wafer transfer device 100 to process the wafer, first transfer the wafer to one of the wafer processing mechanisms 10. After the wafer is processed in the wafer processing mechanism 10, then the clamping member 24 of the picking mechanism 20 takes out the wafer from the wafer processing mechanism 10, and then transfers the wafer to another wafer processing mechanism 10 for the next-step processing. Repeat the above steps until all the processing steps are completed. At this time, the wafer processing is completed.

[0035] For the wafer transfer device 100 of the present utility model, arranging the support frames of multiple picking mechanisms 20 on both sides of the wafer processing mechanism 10 can facilitate the arrangement of the wafer processing mechanism 10, improve the rationality of the layout, and can also prevent the clamping members 24 of adjacent picking mechanisms 20 from colliding with each other. Furthermore, it can ensure the normal transfer of the wafer. At the same time, compared with the solution in which multiple picking mechanisms 20 are arranged on one side of the wafer processing mechanism 10, the wafer transfer device 100 of the present application can reduce the occupied space of multiple picking mechanisms 20 and save the overall volume of the wafer transfer device 100. Moreover, controlling multiple picking mechanisms 20 to operate independently can improve the transfer efficiency of the wafer, thereby saving the time for processing the wafer and improving the processing efficiency.

[0036] The wafer transfer device 100 according to an embodiment of the present invention has the support frames of a plurality of clamping mechanisms 20 arranged on both sides of the wafer processing mechanism 10, which can facilitate the arrangement of the wafer processing mechanism 10, improve the rationality of the layout. At the same time, it can also prevent the clamping members 24 of adjacent clamping mechanisms 20 from colliding with each other, ensuring the normal transfer of the wafer.

[0037] According to some embodiments of the present invention, referring to Figure 1 and Figure 2 , in the first direction (such as the front-back direction shown in Figure 2 ), the clamping members 24 of a plurality of clamping mechanisms 20 located on both sides of the wafer processing mechanism 10 (such as the left and right sides of the wafer processing mechanism 10 shown in Figure 2 ) are alternately arranged. Thus, the rationality of the layout of the wafer processing mechanism 10 can be improved, and the clamping members 24 of adjacent wafer processing mechanisms 10 can be prevented from colliding with each other, thereby ensuring the normal operation of the wafer processing mechanism 10.

[0038] According to some alternative embodiments of the present invention, referring to Figure 1 and Figure 2 , the number of the clamping mechanisms 20 is three, namely: the first clamping mechanism 201, the second clamping mechanism 202, and the third clamping mechanism 203. The first clamping mechanism 201 and the third clamping mechanism 203 are arranged on one side of the wafer processing mechanism 10 in the second direction (such as the left-right direction shown in Figure 2 ) (such as the right side of the wafer processing mechanism 10 shown in Figure 2 ), and the second clamping mechanism 202 is arranged on the other side of the wafer processing mechanism 10 in the second direction (such as the left side of the wafer processing mechanism 10 shown in Figure 2 ).

[0039] In this way, the three clamping mechanisms 20 can effectively improve the efficiency of clamping the wafer. At the same time, the installation positions of the first clamping mechanism 201, the second clamping mechanism 202, and the third clamping mechanism 203 are reasonable. On the premise of effectively improving the efficiency of clamping the wafer, the clamping members 24 of adjacent clamping mechanisms 20 can be prevented from colliding with each other.

[0040] For example, as shown in Figure 1 and Figure 2 , the first clamping mechanism 201 and the third clamping mechanism 203 are arranged on the right side of the wafer processing mechanism 10, and the first clamping mechanism 201 and the third clamping mechanism 203 are arranged at intervals in the front-back direction. The second clamping mechanism 202 is arranged between the first clamping mechanism 201 and the third clamping mechanism 203, and the second clamping mechanism 202 is arranged on the left side of the wafer processing mechanism 10.

[0041] According to some embodiments of the present invention, referring to Figure 1 and Figure 2, the clamping members 24 of each clamping mechanism 20 are each configured to move between two adjacent wafer processing mechanisms 10. Thus, by defining the moving distance of the clamping mechanism 20, it is possible to effectively avoid the clamping members 24 of adjacent clamping mechanisms 20 from colliding with each other. At the same time, the clamping mechanism 20 can be adapted to the wafer processing mechanism 10, thereby ensuring the working range of the clamping mechanism 20 and effectively improving the efficiency of clamping wafers.

[0042] According to some embodiments of the present invention, referring to Figure 1 and Figure 2 , the wafer processing mechanism 10 includes a box body 11. An accommodation cavity 12 is defined inside the box body 11. A pick-and-place opening 13 communicating with the accommodation cavity 12 is formed at the top of the box body 11. The pick-and-place opening 13 extends in a long strip shape along the second direction (such as the left-right direction shown in Figure 2 ). Thus, the box body 11 can facilitate the placement of the wafer processing mechanism 10, thereby facilitating the fixing of the wafer processing mechanism 10. At the same time, the box body 11 can provide a layout position for the accommodation cavity 12 and the pick-and-place opening 13, thereby facilitating the layout of the accommodation cavity 12 and the pick-and-place opening 13. Furthermore, the long-strip-shaped pick-and-place opening 13 can facilitate the picking of wafers from the wafer processing mechanism 10, thereby improving the transfer efficiency of the wafers.

[0043] According to some embodiments of the present invention, referring to Figure 1 and Figure 2 , a plurality of wafer processing mechanisms 10 include: a temporary storage mechanism 101, at least one cleaning mechanism 102, and a drying mechanism 103. That is to say, the plurality of wafer processing mechanisms 10 may include one, two, three or more cleaning mechanisms 102. The temporary storage mechanism 101, the cleaning mechanism 102, and the drying mechanism 103 are arranged in sequence along the first direction (such as the front-back direction shown in Figure 1 ).

[0044] In this way, the temporary storage mechanism 101 can temporarily store wafers in the wafer processing mechanism 10. The cleaning mechanism 102 can clean the wafers to remove dirt on the surface of the wafers, thereby improving the cleanliness of the wafers. The drying mechanism 103 can dry the liquid on the surface of the wafers, thereby preventing the wafers from being eroded by the liquid.

[0045] For example, as shown in Figure 1 and Figure 2As shown, the wafer processing mechanism 10 includes a cuboid box body 11. An accommodating cavity 12 with an open upper side is provided at the top of the box body 11. The multiple wafer processing mechanisms 10 include: a temporary storage mechanism 101, two cleaning mechanisms 102, and a drying mechanism 103. The drying mechanism 103, the two cleaning mechanisms 102, and the temporary storage mechanism 101 are arranged in sequence in the front-rear direction. The temporary storage mechanism 101 is located at the rearmost side, and the drying mechanism 103 is located at the foremost side. A long strip-shaped pick-and-place opening 13 extending in the left-right direction is provided at the top of the drying mechanism 103.

[0046] According to some embodiments of the present invention, referring to Figure 1 and Figure 2 , the wafer transfer device 100 may include: a controller, and the controller is electrically connected to a plurality of clamping mechanisms 20 to control the independent movement of the plurality of clamping mechanisms 20 respectively or the synchronous movement of at least some of the clamping mechanisms 20. That is to say, the plurality of clamping mechanisms 20 are configured to be independently movable respectively, or at least some of the clamping mechanisms 20 are configured to be synchronously movable. Thus, the controller can control the clamping mechanism 20, thereby ensuring that each clamping mechanism 20 can work properly.

[0047] According to some embodiments of the present invention, referring to Figure 1 and Figure 2 , the support frame includes: a first support frame 21, and the clamping member 24 can move relative to the first support frame 21 in a first direction (such as Figure 1 the front-rear direction shown) and a third direction. The first direction, the second direction (such as Figure 1 the left-right direction shown) and the third direction intersect pairwise, and the third direction is the up-down direction.

[0048] In this way, when the clamping member 24 moves in the first direction, the clamping member 24 can move between two adjacent wafer processing devices. When the clamping member 24 moves in the third direction, the clamping member 24 can pick up the wafer from the accommodating cavity 12. It can be understood that when the clamping member 24 moves in the third direction, the clamping member 24 is directly above the pick-and-place opening 13 of the accommodating cavity 12.

[0049] According to some alternative embodiments of the present invention, referring to Figure 1 and Figure 2 , the support frame includes: a second support frame 22, and the second support frame 22 is slidably arranged on the first support frame 21 along a first direction (such as Figure 1 the front-rear direction shown); the clamping mechanism 20 includes: a support arm 23, a first motor, and a second motor. The first motor is used to drive the second support frame 22 to move relative to the first support frame 21 along the first direction; the support arm 23 is along a third direction (such as Figure 1The upper and lower directions shown) are slidably provided on the second support frame 22, and the clamping member 24 is provided on the support arm 23; the second motor is used to drive the support arm 23 to move relative to the second support frame 22 in the third direction.

[0050] In this way, the second support frame 22 can move relative to the first support frame 21 in the front-back direction, so that the clamping member 24 can move in the first direction. At the same time, the first motor drives the second support frame 22 to move, without manual operation, thus improving the automation degree of the wafer transfer device 100. The support arm 23 can move relative to the second support frame 22 in the up-down direction, so that the clamping member 24 can move in the third direction. At the same time, the second motor drives the support arm 23 to move, without manual operation, thus improving the automation degree of the wafer transfer device 100.

[0051] For example, as Figure 1 and Figure 2 shown, the first support frame 21 extends in the front-back direction, the second support frame 22 extends in the up-down direction, the upper end of the second support frame 22 is connected to the first support frame 21. Taking the first clamping mechanism 201 as an example, the support arm 23 extends in the left-right direction, the left end of the support arm 23 is connected to the clamping member 24, and the right end of the support arm 23 is connected to the second support frame 22.

[0052] According to some embodiments of the present invention, referring to Figure 1 and Figure 2 , the wafer transfer device 100 includes: a distance sensor 30, and the distance sensor 30 is used to detect the distance between adjacent clamping members 24. Thus, adjacent clamping members 24 can be effectively prevented from colliding with each other, thereby ensuring the normal function of the wafer transfer device 100.

[0053] For example, as Figure 1 and Figure 2 shown, a distance sensor 30 is respectively arranged on the front and rear sides of the second clamping mechanism 202, so that the distance between the clamping member 24 of the first clamping mechanism 201 and the clamping member 24 of the second clamping mechanism 202, and the distance between the clamping member 24 of the third clamping mechanism 203 and the clamping member 24 of the second clamping mechanism 202 can be detected.

[0054] Next, refer to Figures 1-6 to describe the wafer transfer device 100 according to the embodiments of the present invention.

[0055] The wafer transfer device 100 according to the embodiments of the present invention, as Figure 1 shown, includes: four wafer processing mechanisms 10, three clamping mechanisms 20 and a controller.

[0056] Specifically, the wafer processing mechanism 10 includes a box body 11, and an accommodation cavity 12 is defined inside the box body 11. The wafer processing mechanism 10 includes: a temporary storage mechanism 101, two cleaning mechanisms 102, and a drying mechanism 103. The temporary storage mechanism 101, the two cleaning mechanisms 102, and the drying mechanism 103 are arranged in sequence from back to front. A pick-and-place opening 13 communicating with the accommodation cavity 12 is formed at the top of the box body 11 of the drying mechanism 103, and the pick-and-place opening 13 extends in a long strip shape in the left-right direction.

[0057] The picking mechanisms 20 are respectively: a first picking mechanism 201, a second picking mechanism 202, and a third picking mechanism 203. The first picking mechanism 201 and the third picking mechanism 203 are arranged on the right side of the wafer processing mechanism 10, and the second picking mechanism 202 is arranged on the left side of the wafer processing mechanism 10. In the front-rear direction, the clamping members 24 of the first picking mechanism 201, the second picking mechanism 202, and the third picking mechanism 203 are alternately arranged. The controller is electrically connected to the first picking mechanism 201, the second picking mechanism 202, and the third picking mechanism 203.

[0058] The first picking mechanism 201 moves between the temporary storage mechanism 101 and the first cleaning mechanism 102, the second picking mechanism 202 moves between the two cleaning mechanisms 102, and the third picking mechanism 203 moves between the second cleaning mechanism 102 and the drying mechanism 103.

[0059] The picking mechanism 20 includes: a support frame, a first motor, a support arm 23, a clamping member 24, and a second motor. The support frame includes: a first support frame 21 and a second support frame 22. The first support frame 21 extends in the front-rear direction, the second support frame 22 extends in the up-down direction, the upper end of the second support frame 22 is connected to the first support frame 21, and the support arm 23 extends in the left-right direction. Taking the first picking mechanism 201 as an example, the left end of the support arm 23 is connected to the clamping member 24, and the right end of the support arm 23 is connected to the second support frame 22. The first motor is used to drive the second support frame 22 to move relative to the first support frame 21 in the front-rear direction, and the second motor is used to drive the support arm 23 to move relative to the second support frame 22 in the up-down direction.

[0060] For the wafer transfer device 100 of the present utility model, arranging the support frames of multiple picking mechanisms 20 on both sides of the wafer processing mechanism 10 can facilitate the layout of the wafer processing mechanism 10, improve the rationality of the layout. At the same time, it can also prevent the clamping members 24 of adjacent picking mechanisms 20 from colliding with each other, ensuring the normal transfer of wafers.

[0061] The wafer transfer device 100 has multiple working modes. Different picking mechanisms 20 can be independently controlled and can move independently respectively, thereby being able to improve the transfer efficiency of wafers and meet different application requirements.

[0062] Embodiment 1

[0063] As Figure 3 shown, after the wafers in the drying mechanism 103 are dried and taken out, and after the wafers in the two cleaning mechanisms 102 are brushed, the first clamping mechanism 201, the second clamping mechanism 202, and the third clamping mechanism 203 move synchronously and respectively. The first clamping mechanism 201 moves to the temporary storage mechanism 101 to clamp a wafer, the second clamping mechanism 202 moves to the rear cleaning mechanism 102 to clamp a wafer, and the third clamping mechanism 203 moves to the front cleaning mechanism 102 to clamp a wafer. After clamping the wafers, the first clamping mechanism 201, the second clamping mechanism 202, and the third clamping mechanism 203 move synchronously and respectively. The first clamping mechanism 201 moves to the rear cleaning mechanism 102 to place the wafer, the second clamping mechanism 202 moves to the front cleaning mechanism 102 to place the wafer, and the third clamping mechanism 203 moves to the drying mechanism 103 to place the wafer. At the same time, the next set of cleaning and drying processes is started. The manipulator puts another polished wafer on the vacant wafer support in the temporary storage mechanism 101. Repeating this way, the transfer unit only needs one synchronous control to complete the transfer of three wafers.

[0064] Embodiment 2,

[0065] As Figure 4 shown, the first clamping mechanism 201 and the second clamping mechanism 202 are coupled and run synchronously. After the wafers in the drying mechanism 103 are dried and taken out, and after the wafers in the front cleaning mechanism 102 are brushed, the third clamping mechanism 203 moves to the front cleaning mechanism 102 to clamp a wafer. After the third clamping mechanism 203 clamps the wafer, it moves to the drying mechanism to place the wafer and starts the drying process. After the wafers in the rear cleaning mechanism 102 are brushed, the first clamping mechanism 201 and the second clamping mechanism 202 move synchronously and respectively. The first clamping mechanism 201 moves to the temporary storage mechanism 101 to clamp a wafer, and the second clamping mechanism 202 moves to the rear cleaning mechanism 102 to clamp a wafer. After clamping the wafers, the first clamping mechanism 201 and the second clamping mechanism 202 move synchronously and respectively. The first clamping mechanism 201 moves to the rear cleaning mechanism 102 to place the wafer, and the second clamping mechanism 202 moves to the front cleaning mechanism 102 to place the wafer. The next set of cleaning processes is started. The manipulator puts another polished wafer on the vacant wafer support in the temporary storage mechanism 101 and repeats this way.

[0066] Embodiment 3,

[0067] As Figure 5As shown, the second clamping mechanism 202 and the third clamping mechanism 203 are coupled and run synchronously. After the wafers in the drying mechanism 103 are dried and taken out, and after the wafer brushing in the two cleaning mechanisms 102 is completed, the second clamping mechanism 202 and the third clamping mechanism 203 move synchronously and separately. The second clamping mechanism 202 moves to the cleaning mechanism 102 at the rear to clamp the wafer, and the third clamping mechanism 203 moves to the cleaning mechanism 102 at the front to clamp the wafer. After clamping the wafers, the second clamping mechanism 202 and the third clamping mechanism 203 move simultaneously and separately. The second clamping mechanism 202 moves to the cleaning mechanism 102 at the front to place the wafer, and the third clamping mechanism 203 moves to the drying mechanism 103 to place the wafer. The second cleaning and drying process is started. The first clamping mechanism 201 moves to the temporary storage mechanism 101 to clamp the wafer and then moves to the cleaning mechanism 102 at the rear to place the wafer, starting the first cleaning process. The manipulator places another polished wafer on the vacant wafer support in the temporary storage mechanism 101, and so on.

[0068] Embodiment 4

[0069] As Figure 6 shown, after the wafers in the drying mechanism 103 are dried and taken out, and after the wafer brushing in the cleaning mechanism 102 at the front is completed, the third clamping mechanism 203 moves to the cleaning mechanism 102 at the front to clamp the wafer and then moves to the drying mechanism 103 to place the wafer, starting the drying process. After the wafer brushing in the cleaning mechanism 102 at the rear is completed, the second clamping mechanism 202 moves to the cleaning mechanism 102 at the rear to clamp the wafer and then moves to the cleaning mechanism 102 at the front to place the wafer, starting the second cleaning process. The first clamping mechanism 201 moves to the temporary storage mechanism 101 to clamp the wafer and then moves to the cleaning mechanism 102 at the rear to place the wafer, starting the first cleaning process. The manipulator places another polished wafer on the vacant wafer support in the temporary storage mechanism 101, and so on.

[0070] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0071] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more unless otherwise specifically defined.

[0072] In the present utility model, unless otherwise clearly specified and defined, terms such as "installed", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or a communication connection; it may be directly connected, or indirectly connected through an intermediate medium, and may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0073] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0074] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the claims and their equivalents.

Claims

1. A wafer transfer device (100), the wafer transfer device (100) being used to transfer wafers between a plurality of wafer processing mechanisms (10), characterized in that: include: A clamping mechanism (20), the clamping mechanism (20) comprising a support frame and a clamping member (24), the clamping member (24) being used to clamp a wafer, and the clamping member (24) being connected to the support frame, the number of the clamping mechanisms (20) being multiple, and the clamping mechanism (20) being configured to clamp a wafer from one wafer processing mechanism (10) and transfer it to another wafer processing mechanism (10) among the multiple wafer processing mechanisms (10); The plurality of wafer processing mechanisms (10) are arranged along a first direction, and the support frames of the plurality of clamping mechanisms (20) are respectively arranged on both sides of the plurality of wafer processing mechanisms (10) along a second direction, and the second direction intersects with the first direction.

2. The wafer transfer device (100) according to claim 1, characterized in that: In a first direction, the clamping members (24) of the plurality of clamping mechanisms (20) located on both sides of the wafer processing mechanism (10) are arranged alternately.

3. The wafer transfer device (100) according to claim 2, characterized in that: The number of the clamping mechanisms (20) is three and they are: a first clamping mechanism (201), a second clamping mechanism (202) and a third clamping mechanism (203); the first clamping mechanism (201) and the third clamping mechanism (203) are arranged on one side of the wafer processing mechanism (10) in the second direction, and the second clamping mechanism (202) is arranged on the other side of the wafer processing mechanism (10) in the second direction.

4. The wafer transfer device (100) according to any one of claims 1 to 3, characterized in that: The clamping member (24) of each clamping mechanism (20) is configured to move between two adjacently arranged wafer processing mechanisms (10).

5. The wafer transfer device (100) according to any one of claims 1 to 3, characterized in that: The wafer processing mechanism (10) comprises a box body (11), a receiving cavity (12) is defined in the box body (11), a top of the box body (11) is formed with a take-in / take-out opening (13) connected to the receiving cavity (12), and the take-in / take-out opening (13) extends in a second direction in a long strip shape.

6. The wafer transfer device (100) according to any one of claims 1 to 3, characterized in that: The plurality of wafer processing mechanisms (10) include: a temporary storage mechanism (101), at least one cleaning mechanism (102) and a drying mechanism (103); the temporary storage mechanism (101), the cleaning mechanism (102) and the drying mechanism (103) are arranged in sequence along the first direction.

7. The wafer transfer device (100) according to any one of claims 1 to 3, characterized in that: include: A controller is electrically connected to the plurality of clamping mechanisms (20) to control the plurality of clamping mechanisms (20) to move independently or to control at least some of the clamping mechanisms (20) to move synchronously.

8. The wafer transfer device (100) according to any one of claims 1 to 3, characterized in that: The support frame comprises: a first support frame (21); the clamping member (24) can move relative to the first support frame (21) along the first direction and a third direction; the first direction, the second direction and the third direction intersect each other; and the third direction is an up-down direction.

9. The wafer transfer device (100) according to claim 8, characterized in that: The support frame comprises: a second support frame (22), the second support frame (22) being slidably disposed on the first support frame (21) along the first direction; The clamping mechanism (20) comprises: a first motor, the first motor being used to drive the second support frame (22) to move relative to the first support frame (21) along the first direction; A support arm (23), the support arm (23) being slidably disposed on the second support frame (22) along the third direction, and the clamping member (24) being disposed on the support arm (23); A second motor, the second motor is used to drive the support arm (23) to move along the third direction relative to the second support frame (22).

10. The wafer transfer device (100) according to claim 1, characterized in that: include: A distance sensor (30) is used to detect the distance between adjacent clamping members (24).

Images