Packaging substrate of double-sided packaging chip

Abstract

The packaging substrate comprises a substrate main body part, two groups of packaging cover plates, a plurality of limiting rotating shafts and a packaging chip, packaging grooves are formed in the upper surface and the lower surface of the substrate main body part, a plurality of pin grooves are formed in the packaging grooves, the plurality of packaging chips are clamped in the plurality of pin grooves respectively, and the two groups of packaging cover plates cover the upper surface and the lower surface of the substrate main body part respectively and abut against and limit the packaging chips. Rotating shaft grooves are formed in the left side and the right side of the base plate main body part respectively, and the limiting rotating shafts are clamped in the rotating shaft grooves; the limiting rotating shaft comprises a shaft sleeve, a shaft rod and a spring. According to the utility model, by designing the double-sided packaging substrate with the packaging cover plate, the packaging cover plate and the substrate main body part are matched to limit and fix the packaging chip to finally realize the packaging effect, and compared with the conventional welding packaging, the packaging is easier and more convenient; the utility model has the advantages of strong practicability and strong popularization significance.

Description

Technical Field

[0001] The utility model relates to a circuit board, in particular to a packaging substrate for double-sided packaged chips. Background Art

[0002] The packaging substrate, abbreviated as the substrate, is a substrate used to repackage multiple first-level packaged IC components to form a substrate with a higher density and capacity. It can provide functions such as electrical connection, protection, support, heat dissipation, and assembly for the chip, so as to achieve the purpose of multi-pin, reducing the volume of the packaged product, improving electrical performance and heat dissipation, ultra-high density or multi-chip modularization.

[0003] When assembling chips on the existing packaging substrate, the chips are usually welded to the surface of the substrate. However, the operation of welding and fixing is not only complex and cumbersome, but also when the packaging substrate is a double-sided packaging design, during the process of welding and assembling the chips on the second side, the protrusion of the chips on the first side will affect the fixed placement of the packaging substrate, thereby causing great obstacles to the welding operation. Summary of the Utility Model

[0004] Based on this, it is necessary to provide a packaging substrate for double-sided packaged chips in view of the deficiencies in the prior art.

[0005] A packaging substrate for double-sided packaged chips includes a substrate main body, two groups of packaging covers, a plurality of limiting rotating shafts and packaged chips. Packaging grooves are provided on both the upper and lower surfaces of the substrate main body, and a plurality of pin grooves are provided in the packaging grooves. A plurality of the packaged chips are respectively clamped and installed in the plurality of pin grooves. Two groups of the packaging covers are respectively covered on the upper and lower surfaces of the substrate main body and abut and limit the packaged chips. Rotating shaft grooves are respectively provided on the left and right sides of the substrate main body, and the limiting rotating shafts are clamped and installed in the rotating shaft grooves. The limiting rotating shaft includes a shaft sleeve, a shaft rod and a spring. The shaft sleeve is provided with a telescopic groove with an upper end opening, and its lower end is axially connected to the lower part of the rotating shaft groove and can rotate actively. The shaft rod and the spring are both inserted into the telescopic groove, and the upper end of the shaft rod also penetrates through the packaging cover.

[0006] Further, a limiting lock rod is provided at the lower end of the shaft rod, and a rotation limiting groove is correspondingly provided at the bottom of the rotating shaft groove. The limiting lock rod can be clamped in the rotation limiting groove to limit the shaft rod and the shaft sleeve.

[0007] Further, magnetic attraction sheets are also provided on both the substrate main body and the packaging cover. The magnetic attraction sheets on the substrate main body and the packaging cover are arranged corresponding to each other up and down and attract each other magnetically.

[0008] Further, a sealing ring is provided on the packaging cover, and a sealing groove is correspondingly provided around the packaging groove on the substrate main body. The sealing ring is clamped in the sealing groove.

[0009] Furthermore, a heat dissipation channel penetrating through the front and back is also provided on the substrate main body, and the encapsulation cover plate is made of a heat dissipation and heat conduction material.

[0010] To sum up, the beneficial effects of the encapsulation substrate for a double-sided encapsulated chip of the present utility model are as follows: By designing a double-sided encapsulation substrate with an encapsulation cover plate, the encapsulated chip is limited and fixed by the cooperation of the encapsulation cover plate and the substrate main body to finally achieve the encapsulation effect, which is more convenient and easier than the conventional welding encapsulation; moreover, the chip encapsulated inside the board can ensure that the surface of the circuit board remains flat, which can not only protect the chip on the first side from pressure, but also avoid affecting the encapsulation of the chip on the second side; the sealing ring designed on the encapsulation cover plate can prevent water vapor, dust, etc. from entering the encapsulation groove and affecting the operation of the chip, and the heat dissipation structure of the substrate main body improves the heat dissipation effect of the encapsulated chip; the present utility model has strong practicability and has strong promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic structural diagram of an encapsulation substrate for a double-sided encapsulated chip of the present utility model;

[0012] Figure 2 is Figure 1 the exploded structural diagram of;

[0013] Figure 3 is Figure 2 the schematic structural diagram of the substrate main body in;

[0014] Figure 4 is Figure 2 the schematic structural diagram of the encapsulation cover plate in;

[0015] Figure 5 is Figure 2 the cross-sectional structural diagram of the limiting rotating shaft in;

[0016] Figure 6 is Figure 5 the exploded structural diagram of. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] In order to make the objectives, technical solutions and advantages of the utility model more clear and understandable, the following further details the utility model in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model.

[0018] As Figures 1 to 6As shown in the figure, the present utility model provides a packaging substrate 100 for double-sided packaging of a chip 40, which includes a substrate main body portion 10, two groups of packaging cover plates 20, a plurality of limiting rotating shafts 30, and a packaging chip 40. Packaging grooves 11 are provided on both the upper and lower surfaces of the substrate main body portion 10, and a plurality of pin grooves 12 are provided in the packaging grooves 11. A plurality of the packaging chips 40 are respectively snap-fitted into the plurality of pin grooves 12. The two groups of packaging cover plates 20 are respectively covered on the upper and lower surfaces of the substrate main body portion 10 and abut and limit the packaging chips 40. Rotating shaft grooves 13 are further provided on the left and right sides of the substrate main body portion 10, and the limiting rotating shafts 30 are snap-fitted into the rotating shaft grooves 13.

[0019] The limiting rotating shaft 30 includes a shaft sleeve 31, a shaft rod 32, and a spring 33. The shaft sleeve 31 is provided with a telescopic groove 311 with an upper end opening, and its lower end is pivotally connected to the lower part of the rotating shaft groove 13 and can rotate actively. The shaft rod 32 and the spring 33 are both disposed in the telescopic groove 311, and the upper end of the shaft rod 32 also passes through the packaging cover plate 20. When it is necessary to package the chip 40 in the circuit board, first lift the packaging cover plate 20 covered on the substrate main body portion 10 upward. At this time, the limiting rotating shaft 30 will also extend synchronously. Then rotate the packaging cover plate 20 and the limiting rotating shaft 30 to one side so that the packaging cover plate 20 stands vertically on one side of the substrate main body portion 10. Then sequentially snap the chips into the pin grooves 12, and finally reset and cover the packaging cover plate 20 again to fixedly install the packaging chip 40 in the packaging groove 11.

[0020] A limiting lock rod 321 is further provided at the lower end of the shaft rod 32, and a rotation limiting groove 312 is correspondingly provided at the bottom of the rotating shaft groove 13. The limiting lock rod 321 can be snap-fitted into the rotation limiting groove 312 to limit the shaft rod 32 and the shaft sleeve 31. The limiting lock rod 321 can pass through the rotation limiting groove 312 by rotating an angle to limit and lock the shaft rod 32 and the shaft sleeve 31, thereby avoiding the problem of upward springing and loosening when the packaging cover plate 20 is covered on the substrate main body portion 10 due to external vibration.

[0021] Magnetic attraction sheets 50 are also provided on both the substrate main body portion 10 and the packaging cover plate 20. The magnetic attraction sheets 50 on the substrate main body portion 10 and the packaging cover plate 20 are arranged corresponding to each other up and down and attract each other magnetically. One side of the substrate main body portion 10 and the packaging cover plate 20 is limited and locked by the limiting rotating shaft 30, and the magnetically attracted magnetic attraction sheets 50 can assist in fixing the other side of the substrate main body portion 10 and the packaging cover plate 20, making the covering and fixing of the two more firm and reliable.

[0022] A sealing ring 21 is also provided on the encapsulation cover plate 20. A sealing groove 14 is correspondingly provided around the encapsulation groove 11 on the substrate main body 10, and the sealing ring 21 is clamped in the sealing groove 14. The cooperation between the sealing ring 21 and the sealing groove 14 makes the encapsulation groove 11 a sealed cavity, which can effectively prevent external water vapor, dust, etc. from entering the groove and affecting the normal operation of the chip.

[0023] A heat dissipation channel 15 penetrating through the front and back is also provided on the substrate main body 10, and the material of the encapsulation cover plate 20 is a heat dissipation and heat conduction material. The heat dissipation channel 15 can improve the air flow efficiency inside the circuit board, and then make the heat accumulated inside the circuit board dissipate to the outside faster. The encapsulation cover plate 20 made of heat dissipation and heat conduction material greatly improves the heat dissipation effect on the outer surface side of the circuit board.

[0024] In summary, the beneficial effects of the packaging substrate 100 of the double-sided packaged chip 40 of the present utility model are as follows: By designing a double-sided packaging substrate with an encapsulation cover plate 20, the encapsulation cover plate 20 and the substrate main body 10 cooperate to limit and fix the packaged chip 40 to finally achieve the encapsulation effect, which is easier and simpler than the conventional welding encapsulation; moreover, the chip encapsulated inside the board can ensure that the surface of the circuit board remains flat, which can not only protect the chip on the first side from pressure, but also avoid the influence on the encapsulation of the chip on the second side; The sealing ring 21 designed on the encapsulation cover plate 20 can prevent water vapor, dust, etc. from entering the encapsulation groove 11 and affecting the operation of the chip, and the heat dissipation structure of the substrate main body 10 improves the heat dissipation effect of the packaged chip 40; The present utility model has strong practicability and has strong popularization significance.

[0025] The above embodiments only represent one implementation manner of the utility model, and the description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A packaging substrate for double-sided packaging chips, characterized in that: It includes a substrate main body, two groups of packaging cover plates, a number of limiting rotating shafts and packaging chips; the upper and lower surfaces of the substrate main body are provided with packaging grooves, and the packaging grooves are provided with a number of pin grooves, and the packaging chips are respectively snap-fitted and installed in the number of pin grooves, the two groups of packaging cover plates are respectively covered on the upper and lower surfaces of the substrate main body and limit the packaging chips, the left and right sides of the substrate main body are also respectively provided with rotating shaft grooves, and the limiting rotating shaft is snap-fitted and installed in the rotating shaft groove; the limiting rotating shaft includes a shaft sleeve, a shaft rod and a spring, the shaft sleeve is provided with a telescopic groove with an upper end opening, and its lower end is axially connected to the lower part of the rotating shaft groove and can rotate movably, the shaft rod and the spring are both penetrated in the telescopic groove, and the upper end of the shaft rod is also penetrated on the packaging cover plate.

2. The double-sided chip packaging substrate according to claim 1, characterized in that: A limiting lock rod is also provided at the lower end of the shaft rod, and a rotation limiting groove is correspondingly provided at the bottom of the rotating shaft groove. The limiting lock rod can be engaged in the rotation limiting groove to limit the shaft rod and the shaft sleeve.

3. The packaging substrate for double-sided packaging chip according to claim 1, characterized in that: The substrate main body and the packaging cover are both provided with magnetic attraction sheets, and the magnetic attraction sheets on the substrate main body and the packaging cover are arranged correspondingly up and down and are magnetically attracted to each other.

4. The packaging substrate for double-sided packaging chip according to claim 1, characterized in that: The packaging cover plate is also provided with a sealing ring, and a sealing groove is correspondingly provided at the periphery of the packaging groove on the main body of the substrate, and the sealing ring is engaged in the sealing groove.

5. The packaging substrate for double-sided packaging chip according to claim 1, characterized in that: The substrate main body is also provided with a heat dissipation channel running through the front and back, and the packaging cover is made of a heat dissipation and heat-conducting material.

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