Integrated circuit board

Abstract

The utility model discloses an integrated circuit board, which is characterized in that a first conductive layer is provided with a first open slot, the first open slot penetrates through the first conductive layer, the first open slot is located between a first wiring terminal and a second wiring terminal, a second conductive layer is provided with a second open slot, and the second conductive layer is provided with a second wiring terminal. The second open slot penetrates through the second conductive layer, is positioned between the first wiring terminal and the second wiring terminal, and can block a static horizontal transmission path, so that induced current generated by electrostatic discharge bypasses the shortest transmission path and is transmitted from the first wiring terminal to the second wiring terminal; therefore, the length of a transmission path of static electricity of the circuit board body is increased, and interference on the signal receiving device is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and particularly relates to an integrated circuit board. Background Art

[0002] In the related art, a terminal provided at one end of an integrated circuit board is electrically connected to the input end of a high-speed signal trace, and a signal receiving device provided at the other end of the integrated circuit board is electrically connected to the output end of the high-speed signal trace. When the high-speed signal trace transmits a signal, electrostatic discharge is likely to occur at the position on the integrated circuit board that is electrically connected to the input end of the high-speed signal trace, resulting in a change in the instantaneous voltage on the high-speed signal trace, interfering with the signal receiving device, and causing abnormal operation of the signal receiving device. Summary of the Utility Model

[0003] Embodiments of the present application provide an integrated circuit board to improve the problem of abnormal operation of the signal receiving device caused by interference to the signal receiving device due to electrostatic discharge.

[0004] Embodiments of the present application provide an integrated circuit board, including a circuit board body, a first wiring terminal provided at the first end of the circuit board body, and a second wiring terminal provided at the second end of the circuit board body. The circuit board body includes:

[0005] An insulating layer;

[0006] A first conductive layer, the first conductive layer is provided on one side of the insulating layer, a first opening groove is provided on the first conductive layer, the first opening groove penetrates the first conductive layer, and the first opening groove is located between the first wiring terminal and the second wiring terminal;

[0007] A second conductive layer, the second conductive layer is provided on the other side of the insulating layer, a second opening groove is provided on the second conductive layer, the second opening groove penetrates the second conductive layer, and the second opening groove is located between the first wiring terminal and the first wiring terminal;

[0008] Wherein, the first wiring terminal is provided on the first conductive layer, the second wiring terminal is provided on the first conductive layer, or, the first wiring terminal is provided on the second conductive layer, and the second wiring terminal is provided on the second conductive layer.

[0009] Further, in the top view of the integrated circuit board, the distance from the center of the first opening groove to the first wiring terminal is less than the distance from the center of the first opening groove to the second wiring terminal, and the distance from the center of the second opening groove to the first wiring terminal is less than the distance from the center of the second opening groove to the second wiring terminal.

[0010] Further, in the top view of the integrated circuit board, at least a part of the first opening slot overlaps with the second opening slot.

[0011] Further, in the top view of the integrated circuit board, the first opening slot does not overlap with the second opening slot.

[0012] Further, in the width direction of the integrated circuit board, a first electrostatic protection device is provided between the first opening slot and the long side of the circuit board body.

[0013] Further, in the width direction of the integrated circuit board, a second electrostatic protection device is provided between the second opening slot and the long side of the circuit board body.

[0014] Further, the first electrostatic protection device includes a first resistor and a first capacitor. The first resistor is connected in parallel to the first conductive layer, and the first capacitor is connected in parallel to the first conductive layer. The second electrostatic protection device includes a second resistor and a second capacitor. The second resistor is connected in parallel to the second conductive layer, and the second capacitor is connected in parallel to the second conductive layer.

[0015] Further, the length of the side wall of the first opening slot on the side close to the first terminal is less than the length of the side wall of the first opening slot on the side far from the first terminal.

[0016] Further, the length of the side of the second opening slot close to the first terminal is less than the length of the side of the second opening slot far from the first terminal.

[0017] Further, the integrated circuit board further includes a signal receiving device and a signal line. The signal receiving device is electrically connected to the second terminal. One end of the signal line is electrically connected to the signal receiving device, and the other end of the signal line is electrically connected to the first terminal.

[0018] Advantages of the present application:

[0019] The present application provides an integrated circuit board. By providing a first opening slot on the first conductive layer, the first opening slot penetrates the first conductive layer, the first opening slot is located between the first terminal and the second terminal, a second opening slot is provided on the second conductive layer, the second opening slot penetrates the second conductive layer, and the second opening slot is located between the first terminal and the first terminal, the static electricity input from one side of the circuit board body is bypassed from the shortest transmission path, thereby increasing the length of the transmission path of the static electricity of the circuit board body and reducing the interference received by the signal receiving device. Description of the Drawings

[0020] Figure 1 It is a schematic diagram of the first structure of the integrated circuit board of the present application;

[0021] Figure 2 It is a schematic diagram of the second structure of the integrated circuit board of the present application;

[0022] Figure 3 It is a schematic diagram of the third structure of the integrated circuit board of the present application;

[0023] Figure 4 It is a schematic diagram of the integrated circuit board of the present application with a first electrostatic protection device provided on the first conductive layer;

[0024] Figure 5 It is a schematic diagram of the integrated circuit board of the present application with a first electrostatic protection device provided on the first conductive layer and a second electrostatic protection device provided on the second conductive layer.

[0025] 100 - Circuit board body, 110 - Insulating layer, 120 - First conductive layer, 121 - First opening groove, 130 - Second conductive layer, 131 - Second opening groove; 200 - First terminal; 300 - Second terminal; 400 - First electrostatic protection device, 410 - First resistor, 420 - First capacitor; 500 - Second electrostatic protection device, 510 - Second resistor, 520 - Second capacitor; 600 - Signal receiving device; 700 - Signal line; 800 - Conductive hole. Detailed implementation manners

[0026] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application. The technical solutions described below are only used to explain and illustrate the idea of the present application, and should not be regarded as a limitation on the protection scope of the present application.

[0027] In addition, terms such as "first", "second" and similar words do not represent any order, quantity or importance, but are only used to distinguish different technical features. Terms such as "a plurality of" and similar words mean two or more, unless otherwise clearly defined.

[0028] In the related art, a terminal provided at one end of the integrated circuit board is electrically connected to the input end of the high - speed signal trace, and a signal receiving device provided at the other end of the integrated circuit board is electrically connected to the output end of the high - speed signal trace. When the high - speed signal trace transmits a signal, static electricity discharge is likely to occur at the position on the integrated circuit board that is electrically connected to the input end of the high - speed signal trace, resulting in a change in the instantaneous voltage on the high - speed signal trace, interfering with the signal receiving device and causing abnormal operation of the signal receiving device.

[0029] Embodiments of the present application provide an integrated circuit board, refer toFigure 1 and Figure 2 , the integrated circuit board includes a circuit board body 100, a first terminal 200 provided at the first end of the circuit board body 100, and a second terminal 300 provided at the second end of the circuit board body 100. The circuit board body 100 includes an insulating layer 110, a first conductive layer 120, and a second conductive layer 130.

[0030] Specifically, the first conductive layer 120 is provided on one side of the insulating layer 110. A first opening groove 121 is provided on the first conductive layer 120. The first opening groove 121 penetrates the first conductive layer 120. The first opening groove 121 is located between the first terminal 200 and the second terminal 300. The second conductive layer 130 is provided on the other side of the insulating layer 110. A second opening groove 131 is provided on the second conductive layer 130. The second opening groove 131 penetrates the second conductive layer 130. The second opening groove 131 is located between the first terminal 200 and the first terminal 200.

[0031] By providing the first opening groove 121 on the first conductive layer 120, the first opening groove 121 penetrates the first conductive layer 120, the first opening groove 121 is located between the first terminal 200 and the second terminal 300, the second conductive layer 130 is provided with a second opening groove 131, the second opening groove 131 penetrates the second conductive layer 130, and the second opening groove 131 is located between the first terminal 200 and the first terminal 200, the static electricity input from one side of the circuit board body is bypassed from the shortest transmission path, thereby increasing the length of the transmission path of the static electricity of the circuit board body 100 and reducing the interference received by the signal receiving device.

[0032] In this embodiment, the first terminal 200 is provided on the first conductive layer 120, and the second terminal 300 is provided on the first conductive layer 120.

[0033] In this embodiment, the first terminal 200 is provided on the second conductive layer 130, and the second terminal 300 is provided on the second conductive layer 130.

[0034] In this embodiment, the first conductive layer 120 is electrically connected to the second conductive layer 130 through a conductive hole 800 penetrating the insulating layer 110.

[0035] In this embodiment, refer to Figure 1, in the top view of the integrated circuit board, the distance S1 from the center O of the first opening slot 121 to the first terminal 200 is less than the distance S2 from the center O of the first opening slot 121 to the second terminal 300. By setting the distance S1 from the center O of the first opening slot 121 to the first terminal 200 to be less than the distance S2 from the center O of the first opening slot 121 to the second terminal 300, compared with the solution where the distance from the center of the first opening slot 121 to the first terminal 200 is greater than the distance from the center of the first opening slot 121 to the second terminal 300, it is possible to reduce the induced current generated by electrostatic discharge, thereby reducing the interference received by the signal receiving device.

[0036] In this embodiment, the distance from the center of the second opening slot 131 to the first terminal 200 is less than the distance from the center of the second opening slot 131 to the second terminal 300. By setting the distance from the center of the second opening slot 131 to the first terminal 200 to be less than the distance from the center of the second opening slot 131 to the second terminal 300, compared with the solution where the distance from the center of the second opening slot 131 to the first terminal 200 is greater than the distance from the center of the second opening slot 131 to the second terminal 300, it is possible to reduce the induced current generated by electrostatic discharge, thereby reducing the interference received by the signal receiving device.

[0037] In this embodiment, in the top view of the integrated circuit board, at least a part of the first opening slot 121 overlaps with the second opening slot 131.

[0038] In this embodiment, the first opening slot 121 and the second opening slot 131 have the same shape and unequal areas.

[0039] In this embodiment, the first opening slot 121 and the second opening slot 131 have different shapes and equal areas.

[0040] In this embodiment, in the top view of the integrated circuit board, the first opening slot 121 overlaps with the second opening slot 131.

[0041] In this embodiment, the first opening slot 121 and the second opening slot 131 have the same shape and equal areas.

[0042] In this embodiment, in the top view of the integrated circuit board, the first opening slot 121 does not overlap with the second opening slot 131.

[0043] In this embodiment, refer to Figures 1 - 5, in the width direction X of the integrated circuit board, a first electrostatic protection device 400 is provided between the first opening groove 121 and the long side of the circuit board body 100. By providing the first electrostatic protection device 400 between the first opening groove 121 and the long side of the circuit board body 100, when static electricity is transmitted from the first terminal 200 towards the second terminal 300, the first electrostatic protection device 400 can consume the energy generated due to electrostatic discharge, thereby reducing the interference amplitude of static electricity on the signal receiving device 600.

[0044] In this embodiment, the first electrostatic protection device 400 includes a first resistor 410 and a first capacitor 420. The first resistor 410 is connected in parallel to the first conductive layer 120, and the first capacitor 420 is connected in parallel to the first conductive layer 120. By providing that the first electrostatic protection device 400 includes a first resistor 410 and a first capacitor 420, the first resistor 410 is connected in parallel to the first conductive layer 120, and the first capacitor 420 is connected in parallel to the first conductive layer 120, compared with the scheme using diodes, the production cost can be reduced under the condition of reducing the interference received by the signal receiving device.

[0045] In this embodiment, the resistance value of the first resistor 410 is 1K ohms, and the capacitance of the first capacitor 420 is 100 nF.

[0046] In this embodiment, referring to Figure 5 , in the width direction X of the integrated circuit board, a second electrostatic protection device 500 is provided between the second opening groove 131 and the long side of the circuit board body 100. By providing the first electrostatic protection device 400 between the second opening groove 131 and the long side of the circuit board body 100, when static electricity is transmitted from the first terminal 200 towards the second terminal 300, the second electrostatic protection device 500 can consume the energy generated due to electrostatic discharge, thereby reducing the interference amplitude of static electricity on the signal receiving device 600.

[0047] In this embodiment, the second electrostatic protection device 500 includes a second resistor 510 and a second capacitor 520. The second resistor 510 is connected in parallel to the second conductive layer 130, and the second capacitor 520 is connected in parallel to the second conductive layer 130. By providing that the second electrostatic protection device 500 includes a second resistor 510 and a second capacitor 520, the second resistor 510 is connected in parallel to the second conductive layer 130, and the second capacitor 520 is connected in parallel to the second conductive layer 130, compared with the scheme using diodes, the production cost can be reduced under the condition of reducing the interference received by the signal receiving device.

[0048] In this embodiment, the resistance value of the first resistor 410 is 1K ohms, and the capacitance of the first capacitor 420 is 100 nF.

[0049] In this embodiment, with reference to Figure 3 , the length of the side wall of the first opening groove 121 on the side close to the first terminal 200 is less than the length of the side wall of the first opening groove 121 on the side far from the first terminal 200.

[0050] In this embodiment, the length of the second opening groove 131 on the side close to the first terminal 200 is less than the length of the second opening groove 131 on the side far from the first terminal 200.

[0051] In this embodiment, in the top view of the integrated circuit board, the connection line between the first terminal 200 and the second terminal 300 passes through the center O of the first opening groove 121.

[0052] In this embodiment, the integrated circuit board further includes a signal receiving device 600 and a signal line 700. The signal receiving device 600 is electrically connected to the second terminal 300. One end of the signal line 700 is electrically connected to the signal receiving device 600, and the other end of the signal line 700 is electrically connected to the first terminal 200.

[0053] The technical solution of the present application is specifically as follows:

[0054] When a high-speed signal trace transmits a signal, static electricity is likely to be generated at the position on the integrated circuit board that is electrically connected to the input end of the high-speed signal trace, resulting in a change in the instantaneous voltage on the high-speed signal trace, interfering with the signal receiving device 600 and causing abnormal operation of the signal receiving device 600.

[0055] Therefore, in the technical solution of the present application, the first opening groove 121 is provided at a position on the first conductive layer 120 close to the first terminal 200, and the second opening groove 131 is provided at a position on the second conductive layer 130 close to the first terminal 200, so as to change the transmission path of the induced current generated by static electricity discharge, block the short-distance transmission path of the induced current, increase the length of the static electricity transmission path of the circuit board body 100, and reduce the interference received by the signal receiving device; further, a first resistor 410 and a first capacitor 420 are connected in parallel on the first conductive layer 120, or a second resistor 510 and a second capacitor 520 are connected in parallel on the second conductive layer 130, so that when static electricity is transmitted from the first terminal 200 to the second terminal 300, the first electrostatic protection device 400 can consume the energy generated by static electricity discharge, thereby reducing the interference amplitude of static electricity on the signal receiving device 600 and protecting the interfered signal receiving device 600.

[0056] The above has made a detailed description of the specific implementation manners of the present application. The above-described implementation manners disclosed in the present application are only the preferred implementation manners of the present application. For those of ordinary skill in the art, many variations and improvements can be made without departing from the concept of the present application. These variations and improvements all fall within the protection scope defined by the claims of the present application.

Claims

1. An integrated circuit board, characterized in that: The circuit board body comprises a circuit board body, a first connection terminal arranged at a first end of the circuit board body, and a second connection terminal arranged at a second end of the circuit board body. The circuit board body comprises: Insulation layer; a first conductive layer, the first conductive layer being disposed on one side of the insulating layer, the first conductive layer being provided with a first opening groove, the first opening groove penetrating the first conductive layer, and the first opening groove being located between the first wiring terminal and the second wiring terminal; a second conductive layer, the second conductive layer being disposed on the other side of the insulating layer, the second conductive layer being provided with a second opening groove, the second opening groove penetrating the second conductive layer, and the second opening groove being located between the first wiring terminal and the first wiring terminal; The first connection terminal is arranged on the first conductive layer, and the second connection terminal is arranged on the first conductive layer, or the first connection terminal is arranged on the second conductive layer, and the second connection terminal is arranged on the second conductive layer.

2. The integrated circuit board according to claim 1, characterized in that: The distance from the center of the first opening groove to the first terminal is smaller than the distance from the center of the first opening groove to the second terminal, and the distance from the center of the second opening groove to the first terminal is smaller than the distance from the center of the second opening groove to the second terminal.

3. The integrated circuit board according to claim 1, characterized in that: The first opening groove and the second opening groove at least partially overlap.

4. The integrated circuit board according to claim 1, characterized in that: The first opening slot does not overlap with the second opening slot.

5. The integrated circuit board according to claim 1, characterized in that: In the width direction of the integrated circuit board, a first electrostatic protection device is provided between the first opening groove and the long side of the circuit board body.

6. The integrated circuit board according to claim 5, characterized in that: In the width direction of the integrated circuit board, a second electrostatic protection device is provided between the second opening groove and the long side of the circuit board body.

7. The integrated circuit board according to claim 6, characterized in that: The first electrostatic protection device includes a first resistor and a first capacitor, the first resistor is connected in parallel to the first conductive layer, and the first capacitor is connected in parallel to the first conductive layer. The second electrostatic protection device includes a second resistor and a second capacitor, the second resistor is connected in parallel to the second conductive layer, and the second capacitor is connected in parallel to the second conductive layer.

8. The integrated circuit board according to claim 1, characterized in that: The length of the side wall of the first opening groove close to the first connecting terminal is smaller than the length of the side wall of the first opening groove away from the first connecting terminal.

9. The integrated circuit board according to claim 8, characterized in that: The length of a side of the second opening groove close to the first wiring terminal is smaller than the length of a side of the second opening groove away from the first wiring terminal.

10. The integrated circuit board according to claim 1, characterized in that: The integrated circuit board further includes a signal receiving device and a signal line. The signal receiving device is electrically connected to the second wiring terminal, one end of the signal line is electrically connected to the signal receiving device, and the other end of the signal line is electrically connected to the first wiring terminal.

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