Efficient heat dissipation type aluminum substrate for PCB (Printed Circuit Board)

Abstract

The utility model relates to an efficient heat dissipation type aluminum substrate for a PCB (Printed Circuit Board), which belongs to the technical field of aluminum substrates and comprises an aluminum substrate body, a heat dissipation structure is arranged at the top of the aluminum substrate body, and the heat dissipation structure is arranged at the top of the aluminum substrate body through a locking mechanism. The beneficial effects of the utility model are that through the arrangement of the heat dissipation structure, during use, the second heat conduction plate is attached to the top surface of the aluminum substrate, the heat conduction paste is embedded in the second heat conduction plate, the damping breathable net is laid on the top of the second heat conduction plate, and the first heat conduction plate with the heat dissipation strips is installed on the top of the damping breathable net; and meanwhile, the damping breathable net and the first heat conduction plate are movably connected to the outer side of the heat conduction rod in a sleeving mode, meanwhile, the heat dissipation paste is embedded in the first heat conduction plate, heat conducted out by the first heat conduction plate and the second heat conduction plate can be rapidly dissipated in a multi-angle mode through the heat dissipation strips and the heat dissipation paste, and heat accumulation is not likely to happen.

Description

Technical Field

[0001] The utility model relates to the technical field of aluminum substrates, and specifically relates to a high-efficiency heat dissipation aluminum substrate for PCB. Background Art

[0002] A printed circuit board, also known as a printed wiring board or printed circuit board, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Since it is made by electronic printing technology, it is called a "printed" circuit board.

[0003] A PCB aluminum substrate, also known as an aluminum-based circuit board or aluminum substrate, is a metal-based copper clad laminate, mainly composed of a metal aluminum base, an electronic glass fiber cloth or other reinforcing materials impregnated with an insulating adhesive layer such as resin, and copper foil is covered on one or both sides and made by hot pressing.

[0004] The existing aluminum substrate for PCB has the following disadvantages. When the PCB board is in use, its aluminum substrate is prone to heat generation. Especially after the PCB board works for a long time, a large amount of heat will accumulate on the aluminum substrate, which will seriously affect the working efficiency of the PCB. A working environment with too high temperature may damage the components and is not conducive to the normal operation of the PCB board. Summary of the Utility Model

[0005] To solve the problems raised in the above background art. The utility model provides a high-efficiency heat dissipation aluminum substrate for PCB, which has a heat dissipation structure to solve the problem that when the PCB board is in use, its aluminum substrate is prone to heat generation. Especially after the PCB board works for a long time, a large amount of heat will accumulate on the aluminum substrate, which will seriously affect the working efficiency of the PCB. A working environment with too high temperature may damage the components and is not conducive to the normal operation of the PCB board.

[0006] The technical solution of the utility model is: a high-efficiency heat dissipation aluminum substrate for PCB, including an aluminum substrate body, a heat dissipation structure is arranged on the top of the aluminum substrate body, and the heat dissipation structure is installed on the top of the aluminum substrate body through a locking mechanism;

[0007] The heat dissipation structure includes a first heat conducting plate, a second heat conducting plate, a heat dissipation sticker, a heat conducting rod, a heat dissipation strip, a heat dissipation sticker and a shock-absorbing breathable net. The second heat conducting plate is arranged on the top of the aluminum substrate body, the heat dissipation sticker is arranged inside the second heat conducting plate, through holes are opened inside the first heat conducting plate, the second heat conducting plate and the shock-absorbing breathable net. The bottom end of the heat conducting rod is clamped and inserted into the through hole of the second heat conducting plate, and the heat conducting rod movably penetrates and is inserted into the through holes of the shock-absorbing breathable net and the first heat conducting plate. The heat dissipation strip is fixedly installed on the top of the first heat conducting plate.

[0008] Further, the locking mechanism includes a threaded rod, a clamping block, a locking nut and a clamping piece. A clamping groove is formed at the bottom of the aluminum substrate body, and the clamping block is limited and inserted into the inside of the clamping groove.

[0009] Further, the bottom end of the threaded rod is limited and inserted into the inside of the clamping block. The locking nut is threadedly sleeved on the outside of the threaded rod, and the locking nut is clamped to the first heat conducting plate.

[0010] Further, the clamping block includes a sleeve and a clamping block. The clamping block is fixedly installed on the outer wall of the bottom of the sleeve. The clamping piece is movably clamped and sleeved on the bottom of the aluminum substrate body and the top of the first heat conducting plate.

[0011] Further, the heat dissipation sticker is embedded and bonded inside the second heat conducting plate, and the shock-absorbing breathable net is arranged in the interlayer between the first heat conducting plate and the second heat conducting plate.

[0012] The utility model provides an efficient heat dissipation type aluminum substrate for PCB by improvement. Compared with the prior art, the following improvements and advantages are achieved:

[0013] By providing a heat dissipation structure, during use, the second heat conducting plate is attached to the top surface of the aluminum substrate, and then the heat dissipation sticker is embedded and installed inside the second heat conducting plate. At the same time, the shock-absorbing breathable net is laid on the top of the second heat conducting plate, and then the first heat conducting plate with heat dissipation strips is installed on the top of the shock-absorbing breathable net. At the same time, both the shock-absorbing breathable net and the first heat conducting plate are movably sleeved on the outside of the heat conducting rod. At the same time, the heat dissipation sticker is embedded inside the first heat conducting plate. By using the heat dissipation strips and the heat dissipation sticker, it helps the heat conducted by the first heat conducting plate and the second heat conducting plate to be quickly dissipated from multiple angles, and it is not easy for heat to accumulate, which is beneficial to the rapid diversion of heat, facilitates the rapid cooling of the aluminum substrate, and is not easy for the aluminum substrate to have too high a temperature during use, resulting in component damage. While greatly improving the heat dissipation efficiency, it helps the PCB board to operate smoothly after long-term work. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The following further explains the present utility model with reference to the drawings and embodiments:

[0015] Figure 1 is a three-dimensional schematic diagram of the present utility model;

[0016] Figure 2 is a bottom view schematic diagram of the present utility model;

[0017] Figure 3 is an assembly schematic diagram of the present utility model;

[0018] Figure 4 is an exploded schematic diagram of the present utility model;

[0019] Figure 5 is a schematic diagram of the installation structure of the clamping block of the present utility model;

[0020] Figure 6 Schematic diagram of the internal structure of the clamping block of the present utility model;

[0021] Explanation of reference numerals: 1, aluminum substrate body; 2, first heat conducting plate; 3, threaded rod; 4, clip; 5, heat conducting rod; 6, heat dissipating strip; 7, heat dissipating sticker; 8, clamping block; 9, locking nut; 10, heat dissipating sticker; 11, second heat conducting plate; 12, shock-absorbing and breathable net. Specific implementation manners

[0022] The following will combine the attached Figures 1 to 6 The present utility model will be described in detail. The technical solutions in the embodiments of the present utility model will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] The present utility model provides an efficient heat-dissipating aluminum substrate for PCB by improvement. As Figures 1-6 shown in the figure, it includes an aluminum substrate body 1. A heat-dissipating structure is provided on the top of the aluminum substrate body 1, and the heat-dissipating structure is installed on the top of the aluminum substrate body 1 through a locking mechanism.

[0024] The heat-dissipating structure includes a first heat conducting plate 2, a second heat conducting plate 11, a heat dissipating sticker 7, a heat conducting rod 5, a heat dissipating strip 6, a heat dissipating sticker 10 and a shock-absorbing and breathable net 12. The second heat conducting plate 11 is arranged on the top of the aluminum substrate body 1, and the heat dissipating sticker 10 is arranged inside the second heat conducting plate 11. Through holes are opened inside the first heat conducting plate 2, the second heat conducting plate 11 and the shock-absorbing and breathable net 12. The bottom end of the heat conducting rod 5 is clamped and inserted into the through hole inside the second heat conducting plate 11, and the heat conducting rod 5 movably penetrates and is inserted into the through holes of the shock-absorbing and breathable net 12 and the first heat conducting plate 2. The heat dissipating strip 6 is fixedly installed on the top of the first heat conducting plate 2. By providing the heat-dissipating structure, during use, the second heat conducting plate 11 is attached to the top surface of the aluminum substrate, and then the heat dissipating sticker 10 is embedded and installed inside the second heat conducting plate 11. At the same time, the shock-absorbing and breathable net 12 is laid on the top of the second heat conducting plate 11, and then the first heat conducting plate 2 with the heat dissipating strip 6 is installed on the top of the shock-absorbing and breathable net 12. At the same time, both the shock-absorbing and breathable net 12 and the first heat conducting plate 2 are movably sleeved on the outside of the heat conducting rod 5. At the same time, the heat dissipating sticker 7 is embedded and arranged inside the first heat conducting plate 2. By adopting the heat dissipating strip 6 and the heat dissipating sticker 7, it is helpful for the heat conducted by the first heat conducting plate 2 and the second heat conducting plate 11 to be quickly dissipated from multiple angles, and it is not easy for heat to accumulate, which is beneficial to the rapid diversion of heat, facilitates the rapid cooling of the aluminum substrate, and is not easy for the aluminum substrate to have too high a temperature during use, resulting in component damage. While greatly improving the heat dissipation efficiency, it helps the PCB board to operate smoothly after long-term work.

[0025] The locking mechanism includes a threaded rod 3, a clamping block 8, a locking nut 9 and a clip 4. A clamping groove is formed at the bottom of the aluminum substrate body 1. The clamping block 8 is inserted into the clamping groove in a limited manner. The bottom end of the threaded rod 3 is inserted into the clamping block 8 in a limited manner. The locking nut 9 is threadedly sleeved on the outside of the threaded rod 3, and the locking nut 9 is clamped with the first heat conducting plate 2. The clamping block 8 includes a sleeve and a clamping block. The clamping block is fixedly installed on the outer wall of the bottom of the sleeve. The clip 4 is movably clamped and sleeved on the bottom of the aluminum substrate body 1 and the top of the first heat conducting plate 2. During use, the clamping block 8 and the threaded rod 3 are inserted into the aluminum substrate body 1, and then the locking nut 9 is rotated, so that the heat dissipation structure is fixed to the aluminum substrate body 1. The clamping block 8 is used to limit and clamp the aluminum substrate body 1 to prevent loosening, and the fixing effect is better.

[0026] The heat dissipation sticker 7 is embedded and bonded inside the second heat conducting plate 11. The shock-absorbing and breathable net 12 is arranged in the sandwich layer of the first heat conducting plate 2 and the second heat conducting plate 11. The shock-absorbing and breathable net 12 can buffer and damp the vibration generated by the aluminum substrate during operation, prevent the heat dissipation structure from loosening due to vibration, and also can prevent dust on one side of the aluminum substrate.

[0027] The standard parts used in the present utility model can all be purchased from the market. The special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, welding, etc. that are mature in the prior art. The machines, parts and equipment all adopt conventional models in the prior art. Coupled with the circuit connection adopting the conventional connection method in the prior art, it will not be elaborated here. The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0028] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present utility model. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. Therefore, the present utility model will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high-efficiency heat dissipation aluminum substrate for PCB, comprising an aluminum substrate body (1), characterized in that: A heat dissipation structure is arranged on the top of the aluminum substrate body (1), and the heat dissipation structure is installed on the top of the aluminum substrate body (1) by means of a locking mechanism; the heat dissipation structure comprises a heat conducting plate 1 (2), a heat conducting plate 2 (11), a heat dissipation paste (7), a heat conducting rod (5), a heat dissipation strip (6), a heat conducting paste (10) and a shock-absorbing breathable net (12); the heat conducting plate 2 (11) is arranged on the top of the aluminum substrate body (1); the heat conducting paste (10) is arranged inside the heat conducting plate 2 (11); the heat conducting plate 1 (2), the heat conducting plate 2 (11) and the shock-absorbing breathable net (12) are all provided with through holes inside; the bottom end of the heat conducting rod (5) is inserted and inserted into the through hole of the heat conducting plate 2 (11); the heat conducting rod (5) is movably inserted and inserted into the through holes of the shock-absorbing breathable net (12) and the heat conducting plate 1 (2); and the heat dissipation strip (6) is fixedly installed on the top of the heat conducting plate 1 (2).

2. The high-efficiency heat dissipation aluminum substrate for PCB according to claim 1, characterized in that: The locking mechanism comprises a threaded rod (3), a clamping block (8), a locking nut (9) and a clamping piece (4); a clamping groove is provided at the bottom of the aluminum substrate body (1), and the clamping block (8) is limitedly inserted into the inside of the clamping groove.

3. The high-efficiency heat dissipation aluminum substrate for PCB according to claim 2, characterized in that: The bottom end of the threaded rod (3) is inserted into the interior of the clamping block (8) in a limited position, the locking nut (9) is threadedly sleeved on the exterior of the threaded rod (3), and the locking nut (9) is clamped with the heat conducting plate 1 (2).

4. The high-efficiency heat dissipation aluminum substrate for PCB as claimed in claim 3, characterized in that: The clamping block (8) comprises a sleeve and a clamping block, wherein the clamping block is fixedly mounted on the bottom outer wall of the sleeve, and the clip (4) is movably clamped and sleeved on the bottom of the aluminum substrate body (1) and the top of the heat conducting plate 1 (2).

5. The high-efficiency heat dissipation aluminum substrate for PCB according to claim 1, characterized in that: The heat dissipation patch (7) is embedded and bonded to the inside of the second heat conducting plate (11), and the shock-absorbing and breathable mesh (12) is arranged in the interlayer between the first heat conducting plate (2) and the second heat conducting plate (11).

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