Silicon carbide MOS device

Abstract

The utility model discloses a silicon carbide MOS (Metal Oxide Semiconductor) device, which comprises a main body unit, the main body unit comprises a PCB (Printed Circuit Board), a plurality of pin holes are arranged on the PCB, a silicon carbide MOS body is arranged on the front surface of the PCB, a pin assembly is arranged on the silicon carbide MOS body, the pin assembly comprises a pin I and a pin II, the pin I is fixed with the silicon carbide MOS body, the pin I penetrates through the pin holes, and the pin II penetrates through the pin holes. The first pins penetrate through the pin holes and then are welded to the back face of the PCB. The transverse plate is pressed to drive the column body to move into the cylinder body, then the inner concave plate is embedded into the groove hole, so that the inner wall of the top of the groove hole is attached to the concave position of the inner concave plate, then the supporting plate is loosened, at the moment, the supporting feet abut against the PCB under the resilience force of the spring, namely, the second pin and the first pin are supported, and at the moment, the silicon carbide MOS body is also arranged perpendicular to the PCB. And the silicon carbide MOS body does not have a falling phenomenon, so that welding is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of MOS devices, in particular to a silicon carbide MOS device. Background Art

[0002] A silicon carbide MOS device is a metal-oxide-semiconductor field-effect transistor (MOSFET) device based on silicon carbide (SiC) semiconductor material. Compared with traditional silicon-based MOS devices, the silicon carbide MOS device has higher voltage withstand capacity, lower switching loss and better thermal stability.

[0003] Currently, when welding a silicon carbide MOS device onto a PCB board, first, the pins of the silicon carbide MOS device are penetrated through the pin holes in the PCB board. Then, a solder wire is brought close to the pins of the MOS device, and an electric soldering iron is used to melt the solder wire, thereby welding and fixing the pins of the MOS device and the PCB board. However, the following problems exist in this process: there are many components welded on the PCB board, such as resistors, capacitors, crystal oscillators, etc., but the heights of these components are different. When welding the silicon carbide MOS device, after its pins are penetrated through the pin holes in the PCB board, the PCB board needs to be flipped over for soldering. After the PCB board is flipped over, if other components are relatively tall, the silicon carbide MOS device will drop down at this time. Currently, usually the redundant pins are bent to prevent the silicon carbide MOS device from falling. However, since the diameter of the pin hole is larger than the width of the pin, although the pins are bent, the silicon carbide MOS device will still tilt at a certain angle. Moreover, after welding is completed, the redundant pins need to be pried up again, and then the redundant pins are cut with pliers. However, prying up the redundant pins in this process will cause the solder joints to become loose, and when manually cutting the pins with pliers, since the pins are made of metal, a great deal of effort is required for manual cutting. Summary of the Utility Model

[0004] The purpose of this part is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part, as well as in the abstract and the title of the utility model of this application, to avoid obscuring the purpose of this part, the abstract and the title of the utility model. However, such simplifications or omissions shall not be used to limit the scope of the utility model.

[0005] In view of the above problems of a silicon carbide MOS device, the present utility model is proposed.

[0006] Therefore, the purpose of the present utility model is to provide a silicon carbide MOS device, which is used to solve the problem that there are many components soldered on the PCB board, such as resistors, capacitors, crystal oscillators, etc. However, the heights of these components are different. When soldering the silicon carbide MOS device, after passing its pins through the pin holes of the PCB board, the PCB board needs to be flipped over for soldering. After the PCB board is flipped over, if other components are relatively tall, the silicon carbide MOS device will drop downward at this time. Currently, usually the redundant pins are bent to prevent the silicon carbide MOS device from dropping. However, since the diameter of the pin hole is larger than the width of the pin, although the pins are bent, the silicon carbide MOS device will still tilt at a certain angle. Moreover, after soldering is completed, the redundant pins need to be pried up, and then the redundant pins are cut with pliers. However, prying up the redundant pins during this process will cause the solder joints to become loose, and when manually cutting the pins with pliers, since the pins are made of metal, manual cutting requires a lot of effort and other problems.

[0007] To solve the above technical problems, the present utility model provides the following technical solutions: A silicon carbide MOS device, comprising:

[0008] A main body unit, which includes a PCB board. A plurality of pin holes are formed on the PCB board. A silicon carbide MOS body is arranged on the front surface of the PCB board. A pin assembly is arranged on the silicon carbide MOS body. The pin assembly includes a first pin and a second pin. The first pin is fixed to the silicon carbide MOS body, and the first pin and the second pin can pass through the pin holes. After the first pin passes through the pin hole, it is soldered to the back surface of the PCB board. A removal component is arranged between the first pin and the second pin for quickly removing the redundant second pin;

[0009] A welding assistance unit, which includes a support plate. Two support legs are fixed to one side of the support plate. A cylinder is fixed to the other side of the support plate. A column is slidably connected inside the cylinder. A cross plate is fixed to the end of the column away from the cylinder. Inner concave plates are fixed to both ends of the cross plate. A slot hole is formed in the second pin, and the inner concave plate can be embedded into the slot hole to restrain the second pin.

[0010] As a preferred solution of the silicon carbide MOS device of the present utility model, wherein: The removal component includes two connecting bars fixed to one side of the second pin. The end of the connecting bar away from the second pin is fixed to the first pin. A stress block is fixed to the end of the first pin close to the second pin. A groove is formed on the side of the connecting bar away from the stress block.

[0011] As a preferred solution of the silicon carbide MOS device described in the utility model, two travel grooves are symmetrically opened in the cylinder, and two limit blocks are symmetrically fixed at the bottom of the column, and the limit blocks are slidably matched in the corresponding travel grooves.

[0012] As a preferred solution of the silicon carbide MOS device described in the utility model, a spring is arranged in the cylinder, and one end of the spring abuts against the column, and the other end of the spring abuts against the support plate.

[0013] As a preferred solution of the silicon carbide MOS device described in the utility model, the height of the slot is three times the height of the inner concave plate.

[0014] Beneficial effects of the utility model:

[0015] 1. Press the horizontal plate to drive the column to move into the cylinder, then embed the concave plate into the slot, so that the inner wall of the top of the slot fits with the concave part of the concave plate, and then release the support plate. At this time, the support foot and the PCB board are against each other under the spring rebound force, that is, pin 2 and pin 1 are supported. At this time, the silicon carbide MOS body is also vertically set to the PCB board, and the silicon carbide MOS body will not fall, so it is easy to weld.

[0016] 2. After the silicon carbide MOS body is welded, bend the second pin towards the force block so that the groove of the connecting strip contacts the force block, so that the connecting strip can be easily broken from the groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0018] Figure 1 The utility model is a structural schematic diagram of a silicon carbide MOS device.

[0019] Figure 2 This is a schematic structural diagram of the silicon carbide MOS body provided by the utility model.

[0020] Figure 3 It is a schematic diagram of the enlarged local structure of a silicon carbide MOS device of the utility model.

[0021] Figure 4 This is a structural schematic diagram of the welding auxiliary unit provided by the utility model.

[0022] Description of the Drawings: 100, main body unit; 101, PCB board; 102, pin holes; 104, silicon carbide MOS body; 105, pin assembly; 1051, pin one; 1052, pin two; 106, removal assembly; 1061, connecting bar; 1062, force-receiving block; 1063, groove; 107, slot hole; 200, welding assistance unit; 201, support plate; 202, support leg; 203, cylinder body; 204, column body; 205, cross plate; 206, concave plate; 207, limit block; 208, travel slot; 209, spring. Detailed Implementation Manner

[0023] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following detailed description of the specific implementation manners of the present utility model is provided in conjunction with the drawings of the specification.

[0024] In the following description, many specific details are set forth to facilitate a thorough understanding of the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0025] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that can be included in at least one implementation manner of the present utility model. The phrase "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that mutually excludes other embodiments.

[0026] Furthermore, the present utility model is described in detail in conjunction with schematic diagrams. When detailing the embodiments of the present utility model, for the convenience of explanation, the cross-sectional views showing the device structure will be enlarged locally in a non-general proportion, and the schematic diagrams are only examples and should not limit the scope of protection of the present utility model herein. In addition, in actual production, three-dimensional spatial dimensions including length, width, and depth should be included.

[0027] Referring to Figures 1 - 4 , for an embodiment of the present utility model, a silicon carbide MOS device is provided, which includes: a main body unit 100 and a welding assistance unit 200;

[0028] Among them, the main body unit 100 includes a PCB board 101. A plurality of pin holes 102 are formed in the PCB board 101. On the front surface of the PCB board 101, a silicon carbide MOS body 104 is provided. A pin assembly 105 is provided on the silicon carbide MOS body 104. The pin assembly 105 includes a first pin 1051 and a second pin 1052. The first pin 1051 is fixed to the silicon carbide MOS body 104. The first pin 1051 and the second pin 1052 can penetrate through the pin hole 102. After the first pin 1051 penetrates through the pin hole 102, it is welded to the back surface of the PCB board 101. A removal assembly 106 is provided between the first pin 1051 and the second pin 1052 for quickly removing the redundant second pin 1052.

[0029] The welding auxiliary unit 200 includes a pallet 201. Two supporting feet 202 are fixed on one side of the pallet 201. A cylinder body 203 is fixed on the other side of the pallet 201. A column body 204 is slidably connected in the cylinder body 203. A cross plate 205 is fixed at one end of the column body 204 away from the cylinder body 203. Inner concave plates 206 are fixed at both ends of the cross plate 205. A slot hole 107 is formed in the second pin 1052. The inner concave plate 206 can be embedded into the slot hole 107 to restrain the second pin 1052. Two stroke slots 208 are symmetrically formed in the cylinder body 203. Two limiting blocks 207 are symmetrically fixed at the bottom of the column body 204. The limiting blocks 207 are slidably matched in the corresponding stroke slots 208. A spring 209 is arranged in the cylinder body 203. One end of the spring 209 abuts against the column body 204, and the other end of the spring 209 abuts against the pallet 201. The height of the slot hole 107 is three times the height of the inner concave plate 206.

[0030] During use, when welding the silicon carbide MOS body 104 on the PCB board 101, first penetrate the first pin 1051 and the second pin 1052 through the pin hole 102. Then turn over the PCB board 101. Hold the PCB board 101 and the silicon carbide MOS body 104 with one hand. Insert the index finger of the other hand between the two supporting feet 202 and below the pallet 201. Then press the cross plate 205 with the thumb to drive the column body 204 to move into the cylinder body 203. At this time, the column body 204 will compress the spring 209. Then embed the inner concave plate 206 into the slot hole 107 and move the cross plate 205 upward so that the inner wall at the top of the slot hole 107 fits with the concave part of the inner concave plate 206. Then release the index finger from the pallet 201. At this time, the pallet 201 and the supporting feet 202 are driven by the resilience of the spring 209 to approach the PCB board 101, so that the supporting feet 202 abut against the PCB board 101, thereby supporting the second pin 1052 and the first pin 1051. At this time, the silicon carbide MOS body 104 is also vertically arranged with respect to the PCB board 101, and the silicon carbide MOS body 104 will not drop. At this time, welding can be carried out.

[0031] In addition, the removing component 106 includes two connecting bars 1061 fixed to one side of the pin two 1052. One end of the connecting bar 1061 far from the pin two 1052 is fixed to the pin one 1051. A stress block 1062 is fixed to one end of the pin one 1051 close to the pin two 1052. A groove 1063 is formed on one side of the connecting bar 1061 far from the stress block 1062.

[0032] During use, after the silicon carbide MOS body 104 is welded, first remove the welding auxiliary unit 200, and then bend the pin two 1052 towards the stress block 1062, so that the groove 1063 of the connecting bar 1061 abuts against the stress block 1062, thereby enabling the connecting bar 1061 to be easily broken from the groove 1063.

[0033] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered by the scope of the claims of the present invention.

Claims

1. A silicon carbide MOS device, characterized in that: include: A main unit (100) comprises a PCB (101), wherein the PCB (101) is provided with a plurality of pin holes (102), a silicon carbide MOS body (104) is arranged on the front side of the PCB (101), a pin assembly (105) is arranged on the silicon carbide MOS body (104), and the pin assembly (105) comprises a pin 1 (1051) and a pin 2 (1052), wherein the pin 1 (1051) and the silicon carbide MOS body (104) are fixed to each other, and the pin 1 (1051) and the pin 2 (1052) can pass through the pin hole (102), and the pin 1 (1051) is welded to the back side of the PCB (101) after passing through the pin hole (102), and a removal assembly (106) for quickly removing redundant pin 2 (1052) is arranged between the pin 1 (1051) and the pin 2 (1052); A welding auxiliary unit (200) comprises a support plate (201), two legs (202) are fixed on one side of the support plate (201), a cylinder (203) is fixed on the other side of the support plate (201), and a column (204) is slidably connected inside the cylinder (203), a transverse plate (205) is fixed on one end of the column (204) away from the cylinder (203), and inner concave plates (206) are fixed on both ends of the transverse plate (205), a slot hole (107) is opened in the second pin (1052), and the inner concave plate (206) can be embedded in the slot hole (107) and constrain the second pin (1052).

2. A silicon carbide MOS device according to claim 1, characterized in that: The rejecting component (106) comprises two connecting strips (1061) fixed to one side of the second pin (1052); one end of the connecting strip (1061) away from the second pin (1052) is fixed to the first pin (1051); one end of the first pin (1051) close to the second pin (1052) is fixed with a force block (1062); and a groove (1063) is provided on one side of the connecting strip (1061) away from the force block (1062).

3. A silicon carbide MOS device according to claim 1, characterized in that: Two travel grooves (208) are symmetrically provided in the cylinder (203), and two limit blocks (207) are symmetrically fixed to the bottom of the column (204), and the limit blocks (207) are slidably fitted in the corresponding travel grooves (208).

4. The silicon carbide MOS device according to claim 1, characterized in that: A spring (209) is arranged in the cylinder (203), and one end of the spring (209) abuts against the column (204), and the other end of the spring (209) abuts against the support plate (201).

5. The silicon carbide MOS device according to claim 1, characterized in that: The height of the slot (107) is three times the height of the inner concave plate (206).

Images