Cooling fin with flow guide mechanism

Abstract

The utility model discloses a radiating fin with a flow guide mechanism, which belongs to the technical field of radiating fins and comprises a bearing frame, a through groove is arranged in the bearing frame, a dismounting component is arranged in the through groove, and a flow guide component is arranged on one side of the dismounting component. According to the utility model, through the arrangement of the flow guide assembly and the dismounting assembly, the heat dissipation efficiency of equipment such as a computer is improved by guiding hot air, and meanwhile, the heat dissipation fins are convenient to mount and dismount; the problems that the number of heat dissipation fins is increased or the length of the heat dissipation fins is lengthened in most of methods for enhancing the heat dissipation efficiency of the computer in the prior art, and the demand quantity of the heat dissipation fins for large-scale or high-power computers on the market is relatively small and small-power heat dissipation fins is relatively small are solved; and the cost for manufacturing a large-scale or high-power radiator is higher, and a required mold is larger, so that the condition of higher processing cost is caused.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation fins, and particularly relates to a heat dissipation fin with a flow guiding mechanism. Background Technique

[0002] A heat dissipation fin, abbreviated as a heat sink, is classified as a "passive heat dissipation component" in the field of electronic engineering design. A metal with good thermal conductivity, light weight, and easy processing is attached to the heat generating surface to dissipate heat through a composite heat exchange mode.

[0003] Nowadays, with the continuous development of technology, most of the methods for enhancing the computer heat dissipation efficiency are to increase the number of heat dissipation fins or lengthen the length of the heat dissipation fins. However, the demand for heat dissipation fins for large or high-power computers in the market is relatively less than that for small or low-power heat dissipation fins, and the cost of manufacturing large or high-power radiators is higher, and the required molds are also larger, resulting in a relatively large processing cost. Moreover, if a part of the computer heat dissipation fin is damaged, the entire heat dissipation fin needs to be replaced, which is rather troublesome. At the same time, it is also possible to damage other hardware inside the computer during the replacement process, and the cost performance is relatively low, with a large expense. To solve the above problems, there is an urgent need for a heat dissipation fin with a flow guiding mechanism to solve the above problems. Content of the Utility Model

[0004] The purpose of the utility model is to solve the problems that nowadays, with the continuous development of technology, most of the methods for enhancing the computer heat dissipation efficiency are to increase the number of heat dissipation fins or lengthen the length of the heat dissipation fins. However, the demand for heat dissipation fins for large or high-power computers in the market is relatively less than that for small or low-power heat dissipation fins, and the cost of manufacturing large or high-power radiators is higher, and the required molds are also larger, resulting in a relatively large processing cost. Moreover, if a part of the computer heat dissipation fin is damaged, the entire heat dissipation fin needs to be replaced, which is rather troublesome. At the same time, it is also possible to damage other hardware inside the computer during the replacement process, and the cost performance is relatively low, with a large expense, and to propose a heat dissipation fin with a flow guiding mechanism.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: A heat dissipation fin with a flow guiding mechanism, including a carrier, a through groove is arranged inside the carrier, a disassembly component is arranged inside the through groove, and a flow guiding component is arranged on one side of the disassembly component.

[0006] As a further description of the above technical solution:

[0007] The disassembly component includes a limiting rod, a limiting rod is fixedly installed on the inner wall of the through groove, a threaded rod is rotatably connected to the inner wall of the through groove, a sliding frame is slidably connected to the outer wall of the limiting rod, and the sliding frame is threadedly connected to the threaded rod through a threaded hole provided in its interior.

[0008] As a further description of the above technical solution:

[0009] The through groove is slidably connected to a sliding frame through a sliding groove provided in its interior. A pulling rod is fixedly installed on one side surface of the sliding frame. The pulling rod is threadedly connected to a bolt through a threaded hole provided in its interior. The sliding frame is threadedly connected to a bolt through a threaded hole provided in its interior.

[0010] As a further description of the above technical solution:

[0011] One end of the bolt is in contact with the outer wall of the threaded rod. An installation frame is slidably connected to the inner wall of the through groove. The installation frame is slidably connected to the sliding frame through a sliding groove provided in its interior. A rotating ring is fixedly installed on the outer wall of the threaded rod.

[0012] As a further description of the above technical solution:

[0013] Tooth grooves are provided on the outer wall of the rotating ring. A spring pin is provided inside the installation frame. The through groove is slidably connected to the spring pin through a through hole provided in its interior. The installation frame is fixed to the bearing frame through the spring pin. There is a gap between the installation frame and the bearing frame.

[0014] As a further description of the above technical solution:

[0015] The diversion component includes heat dissipation fins. Heat dissipation fins are fixedly installed on one side surface of the installation frame. A diversion plate is fixedly installed on one side surface of the heat dissipation fins. A diversion plate is fixedly installed on one side surface of the heat dissipation fins.

[0016] In summary, due to the adoption of the above technical solution, the beneficial effects of the present utility model are:

[0017] 1. In the present utility model, by providing a diversion component and a disassembly component, when the device is in use, the fan on one side of the carrier frame starts, and the hot air generated by it can be discharged from the computer through the guiding of the drainage plate and the diversion plate. When the heat dissipation fins are damaged, only need to rotate the bolt so that it no longer contacts the threaded rod, and then rotate the rotating ring to make the threaded rod rotate. The rotation of the threaded rod drives the rotation of the sliding frame, so that it no longer hinders the sliding out of the mounting frame. Then, pull out the mounting frame and the damaged heat dissipation fins through the pulling rod for replacement. Through this design, not only the heat dissipation efficiency of devices such as computers is improved by diverting the hot air, but also the installation and disassembly of the heat dissipation fins are facilitated. It avoids the situation that most of the current methods for enhancing the heat dissipation efficiency of computers are to increase the number of heat dissipation fins or lengthen the length of the heat dissipation fins, and the demand for heat dissipation fins for large or high-power computers in the market is relatively small compared to small and low-power ones, and the cost of manufacturing large or high-power radiators is higher, and the required molds will also be larger, resulting in a relatively large processing cost. At the same time, it also avoids the situation that when the heat dissipation fins of the computer are damaged, the entire heat dissipation fins need to be replaced, which is more troublesome to replace, has a relatively low cost performance, and costs a lot. And it is simple and convenient to use, with strong practicability.

[0018] 2. In the present utility model, by providing a spring pin, during the use of the device, the setting of the spring pin can not only further fix the mounting frame and the sliding frame to prevent them from slipping during use, thus affecting the operation of the device, but also play a positioning role during the installation of the heat dissipation fins, facilitating the installation of the heat dissipation fins and avoiding the situation that the operation of the device is affected due to too long installation time. And it is simple and convenient to use, with strong practicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a three-dimensional structural schematic diagram of a heat dissipation fin with a diversion mechanism proposed by the present utility model;

[0020] Figure 2 is an exploded three-dimensional structural schematic diagram of a heat dissipation fin with a diversion mechanism proposed by the present utility model;

[0021] Figure 3 is a three-dimensional structural schematic diagram of the diversion component in a heat dissipation fin with a diversion mechanism proposed by the present utility model;

[0022] Figure 4 is a three-dimensional structural schematic diagram of the disassembly component in a heat dissipation fin with a diversion mechanism proposed by the present utility model;

[0023] Figure 5 is an enlarged three-dimensional structural schematic diagram of part A in a heat dissipation fin with a diversion mechanism proposed by the present utility model.

[0024] Legend:

[0025] 1. Carrier frame; 2. Flow guiding assembly; 21. Heat dissipation fins; 22. Drainage plate; 23. Flow guiding plate; 3. Dismantling assembly; 31. Mounting frame; 32. Limiting rod; 33. Threaded rod; 34. Bolt; 35. Spring pin; 36. Sliding frame; 37. Rotating ring; 38. Pulling rod; 4. Through slot. Specific implementation

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of protection of the present invention.

[0027] Please refer to Figures 1-5 , the present invention provides a technical solution: a heat dissipation fin 21 with a flow guiding mechanism, including a carrier frame 1, a through slot 4 is arranged inside the carrier frame 1, a dismantling assembly 3 is arranged inside the through slot 4, and a flow guiding assembly 2 is arranged on one side of the dismantling assembly 3;

[0028] The dismantling assembly 3 includes a limiting rod 32, the limiting rod 32 is fixedly installed on the inner wall of the through slot 4, a threaded rod 33 is rotatably connected to the inner wall of the through slot 4, a sliding frame 36 is slidably connected to the outer wall of the limiting rod 32, the sliding frame 36 is threadedly connected to the threaded rod 33 through a threaded hole arranged inside it, the through slot 4 is slidably connected to the sliding frame 36 through a chute arranged inside it, a pulling rod 38 is fixedly installed on one side surface of the sliding frame 36, the pulling rod 38 is threadedly connected to a bolt 34 through a threaded hole arranged inside it, the sliding frame 36 is threadedly connected to the bolt 34 through a threaded hole arranged inside it, one end of the bolt 34 is in contact with the outer wall of the threaded rod 33, a mounting frame 31 is slidably connected to the inner wall of the through slot 4, the mounting frame 31 is slidably connected to the sliding frame 36 through a chute arranged inside it, a rotating ring 37 is fixedly installed on the outer wall of the threaded rod 33, the flow guiding assembly 2 includes heat dissipation fins 21, a heat dissipation fin 21 is fixedly installed on one side surface of the mounting frame 31, a drainage plate 22 is fixedly installed on one side surface of the heat dissipation fin 21, and a flow guiding plate 23 is fixedly installed on one side surface of the heat dissipation fin 21;

[0029] The specific implementation method is as follows: When the device is applied, the fan on one side of the carrier 1 starts, and the hot air generated by it can be discharged from the computer through the guiding of the diversion plate 22 and the flow guiding plate 23. When the heat dissipation fins 21 are damaged, only need to rotate the bolt 34 so that it no longer contacts the threaded rod 33, and then rotate the rotating ring 37 to make the threaded rod 33 rotate. The rotation of the threaded rod 33 drives the rotation of the sliding frame 36 so that it no longer hinders the sliding out of the mounting frame 31. Then, pull out the mounting frame 31 and the damaged heat dissipation fins 21 through the pulling rod 38 for replacement;

[0030] The outer wall of the rotating ring 37 is provided with teeth. A spring pin 35 is arranged inside the mounting frame 31. The through groove 4 is slidably connected with the spring pin 35 through the through hole arranged inside it. The mounting frame 31 is fixed to the carrier 1 through the spring pin 35. There is a gap between the mounting frame 31 and the carrier 1.

[0031] The specific implementation method is as follows: During the use of the device, the setting of the spring pin 35 can not only further fix the mounting frame 31 and the sliding frame 36, avoiding their slipping during use, thus affecting the operation of the device, but also play a positioning role when the heat dissipation fins 21 are installed, facilitating the installation of the heat dissipation fins 21 and avoiding the situation of affecting the operation of the device due to too long installation time.

[0032] Working principle: When the device is applied, the fan on one side of the carrier 1 starts, and the hot air generated by it can be discharged from the computer through the guiding of the diversion plate 22 and the flow guiding plate 23. When the heat dissipation fins 21 are damaged, only need to rotate the bolt 34 so that it no longer contacts the threaded rod 33, and then rotate the rotating ring 37 to make the threaded rod 33 rotate. The rotation of the threaded rod 33 drives the rotation of the sliding frame 36 so that it no longer hinders the sliding out of the mounting frame 31. Then, pull out the mounting frame 31 and the damaged heat dissipation fins 21 through the pulling rod 38 for replacement. During the use of the device, the setting of the spring pin 35 can not only further fix the mounting frame 31 and the sliding frame 36, avoiding their slipping during use, thus affecting the operation of the device, but also play a positioning role when the heat dissipation fins 21 are installed, facilitating the installation of the heat dissipation fins 21 and avoiding the situation of affecting the operation of the device due to too long installation time.

[0033] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent replacements or changes, and should be covered by the protection scope of the present invention.

Claims

1. A heat sink fin with a flow guiding mechanism, comprising a support frame (1), characterized in that: A through slot (4) is provided inside the carrier frame (1), a disassembly assembly (3) is provided inside the through slot (4), and a flow guide assembly (2) is provided on one side of the disassembly assembly (3).

2. The heat sink fin with a flow guiding mechanism according to claim 1, characterized in that: The disassembly assembly (3) comprises a limit rod (32), the limit rod (32) is fixedly mounted on the inner wall of the through slot (4), a threaded rod (33) is rotatably connected to the inner wall of the through slot (4), a sliding frame (36) is slidably connected to the outer wall of the limit rod (32), and the sliding frame (36) is threadedly connected to the threaded rod (33) through a threaded hole provided inside the sliding frame.

3. The heat sink fin with a flow guide mechanism according to claim 2, characterized in that: The through slot (4) is slidably connected to a sliding frame (36) via a sliding slot arranged therein, a pulling rod (38) is fixedly mounted on one side surface of the sliding frame (36), the pulling rod (38) is threadedly connected to a bolt (34) via a threaded hole arranged therein, and the sliding frame (36) is threadedly connected to a bolt (34) via a threaded hole arranged therein.

4. The heat sink fin with a flow guiding mechanism according to claim 3, characterized in that: One end of the bolt (34) contacts the outer wall of the threaded rod (33); a mounting frame (31) is slidably connected to the inner wall of the through slot (4); the mounting frame (31) is slidably connected to a sliding frame (36) via a sliding slot provided inside the mounting frame (31); and a rotating ring (37) is fixedly mounted on the outer wall of the threaded rod (33).

5. The heat sink fin with a flow guiding mechanism according to claim 4, characterized in that: The outer wall of the rotating ring (37) is provided with teeth, the interior of the mounting frame (31) is provided with a spring pin (35), the through slot (4) is slidably connected with the spring pin (35) through a through hole provided therein, the mounting frame (31) is fixed to the supporting frame (1) through the spring pin (35), and a gap is provided between the mounting frame (31) and the supporting frame (1).

6. The heat sink fin with a flow guiding mechanism according to claim 5, characterized in that: The air guide assembly (2) comprises a heat dissipation fin (21), the heat dissipation fin (21) is fixedly mounted on one side surface of the mounting frame (31), a guide plate (22) is fixedly mounted on one side surface of the heat dissipation fin (21), and a guide plate (23) is fixedly mounted on one side surface of the heat dissipation fin (21).

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