Integrally-formed radiator

Abstract

The utility model provides an integrally-formed radiator which comprises an upper cover assembly, a bottom plate and a radiating assembly, the upper cover assembly covers the bottom plate, the upper cover assembly and the bottom plate jointly form a heat exchange cavity, the radiating assembly comprises a plurality of radiating fins, a plurality of radiating pieces are arranged in the heat exchange cavity at intervals, the radiating fins are of a wave-shaped structure, and the radiating fins are arranged on the bottom plate. A heat transfer channel is formed between every two adjacent cooling fins, each cooling fin is provided with a plurality of turbulent flow holes, and the two ends of each turbulent flow hole are communicated with the corresponding heat transfer channels respectively. The wave-shaped heat dissipation structure increases the contact area of the liquid heat dissipation medium and the heat dissipation fins, the turbulent flow holes in the heat dissipation fins reduce the flow resistance of the liquid heat dissipation medium in the heat transfer channels, the liquid heat dissipation medium forms a turbulent flow layer in the heat transfer channels, the contact area of the liquid heat dissipation medium and the heat dissipation fins is increased, and the heat dissipation efficiency is improved. And meanwhile, the boiling effect of the liquid heat dissipation medium after heat absorption is enhanced, so that the liquid heat dissipation medium can absorb more heat, and the heat conduction rate of the integrally formed radiator is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat sinks for electronic products, and particularly to an integrally formed heat sink. Background Art

[0002] With the development of technology, the performance of electronic devices has been continuously improved. Components with high frequency and high power consumption inside are more widely used. At the same time, the volume of electronic devices is continuously reduced and the integration degree is also continuously increased. Electronic products will generate heat during operation, which will directly affect the performance and reliability of electronic products. Therefore, heat dissipation devices are needed to improve the performance of products.

[0003] However, traditional heat sinks are difficult to meet the requirements, and liquid cooling and phase change heat dissipation technologies have emerged as the times require and become effective ways to solve the heat dissipation problem. However, common liquid cooling or phase change heat sinks are formed by welding after assembling multiple parts. The welding process has certain limitations on the structure of the heat sink. On the one hand, it affects the flow resistance and heat conduction efficiency of the liquid heat dissipation medium; on the other hand, it affects the boiling effect of the liquid heat dissipation medium.

[0004] The comparative document CN202310363049.2 discloses a new type of liquid cooling heat sink. It includes: a first cover plate; a plurality of spiral tubes, which are combined to form a matrix arrangement of spiral tubes; a second cover plate, which includes a spiral tube positioning plate and a bottom cover plate. The bottom cover plate is covered with the bottom cover plate at the bottom of the spiral tube positioning plate. A phase change medium storage cavity is arranged below the area formed by the matrix positioning holes corresponding to the spiral positioning plate; and a phase change medium, which is a gaseous / liquid phase change medium; the middle part of the first cover plate protrudes upward to form a heat exchange cavity. An inlet and an outlet are arranged on the outer periphery of the heat exchange cavity. After the working fluid coolant enters through the inlet, it enters the heat exchange cavity and contacts the exposed surface of the spiral tube for heat exchange, and then flows out from the outlet. However, in this solution, the top of the spiral tube forms an upper end closed structure by being mounted on the top plate of the heat exchange cavity and is fixed by welding. The bottom of the spiral tube also needs to be welded and fixed to the spiral tube positioning plate. However, the welding process has certain limitations on the structure of the heat sink. On the one hand, it affects the flow resistance and heat conduction efficiency of the liquid heat dissipation medium; on the other hand, it affects the boiling effect of the liquid heat dissipation medium. Summary of the Utility Model

[0005] The purpose of the present disclosure is to overcome the deficiencies in the prior art and provide a heat sink that is integrally formed by 3D printing and has high heat conduction efficiency.

[0006] The purpose of the present disclosure is achieved through the following technical solutions:

[0007] An integrally formed radiator comprises an upper cover assembly, a bottom plate and a heat dissipation assembly, wherein the upper cover assembly is covered on the bottom plate, the upper cover assembly and the bottom plate together form a heat exchange chamber, the upper cover assembly is provided with a liquid inlet hole and a liquid outlet hole, the liquid inlet hole and the liquid outlet hole are respectively connected to the heat exchange chamber,

[0008] The heat dissipation component includes a plurality of heat sinks, which are arranged at intervals in the heat exchange chamber. The heat sink is a wavy structure, and a heat transfer channel is formed between two adjacent heat sinks. Each heat sink is provided with a spoiler hole, and the number of the spoiler holes is multiple. The plurality of spoiler holes are arranged at intervals in each heat sink, and the two ends of each spoiler hole are respectively connected to the corresponding heat transfer channel.

[0009] In one embodiment, the surface of the heat sink is a porous structure.

[0010] In one embodiment, a center line of the spoiler hole on each heat sink is parallel to a center line of a corresponding spoiler hole on an adjacent heat sink.

[0011] In one embodiment, the upper cover assembly includes an upper cover shell, a liquid inlet pipe and a liquid outlet pipe, the upper cover shell is covered on the bottom plate, the upper cover shell and the bottom plate together form the heat exchange chamber, the upper cover shell is provided with the liquid inlet hole and the liquid outlet hole, the liquid inlet pipe is installed at the liquid inlet hole, and the liquid outlet pipe is installed at the liquid outlet hole.

[0012] In one of the embodiments, a liquid inlet groove is formed between the upper cover assembly and the bottom plate. The liquid inlet groove is arranged in the heat exchange cavity, the liquid inlet groove is connected to the liquid inlet hole, and the liquid inlet groove is arranged adjacent to the heat sink.

[0013] In one embodiment, the liquid inlet pipe is provided with a liquid inlet channel, the liquid outlet pipe is provided with a liquid outlet channel, the bottom end of the liquid inlet channel is arranged adjacent to the bottom of the heat exchange chamber, and the bottom end of the liquid outlet channel is arranged adjacent to the top of the heat exchange chamber.

[0014] In one of the embodiments, the liquid inlet channel of the liquid inlet pipe and the liquid outlet channel of the liquid outlet pipe form an inclined surface in the heat exchange chamber.

[0015] In one embodiment, the cross-sectional area of ​​the liquid inlet channel is smaller than the cross-sectional area of ​​the liquid outlet channel.

[0016] In one embodiment, a side of the base plate facing away from the heat dissipation component is a first surface, a side of the base plate adjacent to the heat dissipation component is a second surface, and the roughness of the first surface is smaller than that of the second surface.

[0017] In one embodiment, the upper cover assembly, the bottom plate and the heat dissipation assembly are integrally formed by 3D printing technology.

[0018] Compared with the prior art, the present disclosure has at least the following advantages:

[0019] 1. For the above integrally formed radiator, when the liquid heat dissipation medium is introduced into the integrally formed radiator, the heat dissipation fins with a wavy structure on the heat transfer channel increase the contact area between the liquid heat dissipation medium and the heat dissipation fins, and the heat dissipation fins are provided with turbulence holes. The turbulence holes reduce the flow resistance of the liquid heat dissipation medium in the heat transfer channel. At the same time, the turbulence holes cause the liquid heat dissipation medium to form a turbulent layer in the heat transfer channel, and the turbulent layer can further increase the contact area between the liquid heat dissipation medium and the heat dissipation fins, thereby accelerating the heat conduction efficiency between the liquid heat dissipation medium and the heat dissipation fins.

[0020] 2. The increase in the contact area between the liquid heat dissipation medium and the heat dissipation fins is beneficial to strengthening the boiling effect after the liquid heat dissipation medium absorbs heat, enabling the liquid heat dissipation medium to absorb more heat, and further improving the heat dissipation rate of the integrally formed radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present disclosure, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0022] Figure 1 It is a schematic structural diagram of an integrally formed radiator according to an embodiment;

[0023] Figure 2 is Figure 1 a partial exploded view of the integrally formed radiator shown;

[0024] Figure 3 is Figure 1 a partial cross-sectional view of the integrally formed radiator shown;

[0025] Figure 4 is Figure 2 a schematic structural diagram of the heat dissipation assembly shown. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] To facilitate the understanding of the present disclosure, the present disclosure will be described more comprehensively below with reference to the relevant accompanying drawings. Preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present disclosure more thorough and comprehensive.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present disclosure belongs. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0029] To better understand the technical solutions and beneficial effects of the present disclosure, the present disclosure will be further described in detail with specific embodiments as follows:

[0030] As Figures 1 to 4 shown, an integrally formed radiator 10 according to an embodiment of the present disclosure includes an upper cover assembly 100, a bottom plate 200 and a heat dissipation assembly 300. The upper cover assembly 100 covers the bottom plate 200. The upper cover assembly 100 and the bottom plate 200 together form a heat exchange cavity 101. The upper cover assembly 100 is provided with a liquid inlet hole 1201 and a liquid outlet hole 1301. The liquid inlet hole 1201 and the liquid outlet hole 1301 are respectively communicated with the heat exchange cavity 101. The heat exchange cavity 101 is used for circulating a liquid heat dissipation medium. Since the bottom plate 200 is in contact with the heat source, the heat generated by the heat source will be conducted to the bottom plate 200. After the liquid heat dissipation medium is introduced into the heat exchange cavity 101, the liquid heat dissipation medium exchanges heat with the bottom plate 200.

[0031] Furthermore, the heat dissipation assembly 300 includes a plurality of heat dissipation fins 310. The plurality of heat dissipation fins 310 are arranged at intervals in the heat exchange cavity 101. The heat dissipation fins 310 are of a wavy structure. A heat transfer channel 3101 is formed between two adjacent heat dissipation fins 310. Each heat dissipation fin 310 is provided with a plurality of turbulence holes 3102. The plurality of turbulence holes 3102 are arranged at intervals on each heat dissipation fin 310. Both ends of each turbulence hole 3102 are respectively communicated with the corresponding heat transfer channel 3101.

[0032] In this embodiment, during the heat dissipation process of the integrally formed radiator 10, the bottom plate 200 contacts the heat source, and the heat source conducts heat to the bottom plate 200. Then, the liquid heat dissipation medium is introduced into the heat exchange cavity 101 through the liquid inlet hole 1201. During the flow of the liquid heat dissipation medium in the heat transfer channel 3101, the liquid heat dissipation medium simultaneously absorbs the heat of the absorption heat sink 310 and the bottom plate 200. The heat sink 310 with a wavy structure increases the contact area between the liquid heat dissipation medium and the heat sink 310, accelerating the heat conduction efficiency between the heat sink 310 and the liquid heat dissipation medium. The flow disturbance holes 3102 change the flow direction of the liquid heat dissipation medium in the heat transfer channel 3101 to form a turbulent layer, further increasing the contact area between the liquid heat dissipation medium and the heat sink 310, thereby improving the heat conduction efficiency between the liquid heat dissipation medium and the heat sink 310. Furthermore, the bottom plate 200 can absorb heat from the heat source faster and conduct it to the heat sink 310 and the liquid heat dissipation medium. After absorbing a large amount of heat, the liquid heat dissipation medium flows out from the liquid outlet hole 1301, enabling the heat generated by the heat source to be quickly conducted to the liquid heat dissipation medium through the bottom plate 200 and then transferred out of the heat exchange cavity 101, improving the heat dissipation efficiency of the integrally formed radiator 10.

[0033] For the above-mentioned integrally formed radiator 10, when the liquid heat dissipation medium is introduced into the integrally formed radiator 10, the heat sink 310 with a wavy structure on the heat transfer channel 3101 increases the contact area between the liquid heat dissipation medium and the heat sink 310. And the heat sink 310 is provided with flow disturbance holes 3102. The flow disturbance holes 3102 reduce the flow resistance of the liquid heat dissipation medium in the heat transfer channel 3101. At the same time, the flow disturbance holes 3102 enable the liquid heat dissipation medium to form a turbulent layer in the heat transfer channel 3101. The turbulent layer can further increase the contact area between the liquid heat dissipation medium and the heat sink 310, thereby accelerating the heat conduction efficiency between the liquid heat dissipation medium and the heat sink 310. The increase in the contact area between the liquid heat dissipation medium and the heat sink 310 is beneficial to strengthening the boiling effect after the liquid heat dissipation medium absorbs heat, enabling the liquid heat dissipation medium to absorb more heat, and further improving the heat dissipation rate of the integrally formed radiator 10.

[0034] As Figure 4As shown, in one embodiment, the surface of the heat sink 310 is a porous structure. In this embodiment, when the liquid cooling medium is introduced into the integrally formed radiator 10, the liquid cooling medium penetrates into the pores, increasing the contact area between the liquid cooling medium and the heat sink 310, enabling heat to be transferred to the liquid cooling medium more quickly; when the liquid phase change medium is introduced into the integrally formed radiator 10, since the liquid phase change medium will vaporize and transform from liquid to gas after absorbing heat, the porous structure of the heat sink 310 provides more vaporization nuclei for the vaporization process, facilitating the generation of bubbles, enabling the liquid phase change medium to carry away heat more effectively, thereby enhancing the boiling heat transfer effect of the liquid phase change medium.

[0035] As Figure 4 shown, in one embodiment, the centerlines of the flow disturbance holes 3102 on each heat sink 310 are parallel to the centerlines of the corresponding flow disturbance holes 3102 on the adjacent heat sink 310. In this embodiment, when the liquid cooling medium flows through the flow disturbance holes 3102, since the centerlines of the flow disturbance holes 3102 on each heat sink 310 are parallel to the centerlines of the flow disturbance holes 3102 on the adjacent heat sink 310, the liquid cooling medium can flow efficiently between multiple heat sinks 310, reducing the flow resistance of the liquid cooling medium in the heat transfer channel 3101, thereby improving the heat conduction efficiency of the integrally formed radiator 10.

[0036] As Figure 3 shown, in one embodiment, the upper cover assembly 100 includes an upper cover housing 110, an inlet pipe 120, and an outlet pipe 130. The upper cover housing 110 covers the bottom plate 200. The upper cover housing 110 and the bottom plate 200 together form a heat exchange cavity 101. The upper cover housing 110 is provided with an inlet hole 1201 and an outlet hole 1301. The inlet pipe 120 is installed in the inlet hole 1201, and the outlet pipe 130 is installed in the outlet hole 1301. In this embodiment, the liquid cooling medium flows into the heat exchange cavity 101 from the inlet hole 1201 and absorbs the heat of the bottom plate 200, and then the liquid cooling medium flows out of the heat exchange cavity 101 from the outlet hole 1301. Since a closed heat exchange cavity 101 is formed between the upper cover assembly 100 and the bottom plate 200, the problem of liquid cooling medium leakage can be effectively avoided, enabling the liquid phase change medium to efficiently complete the heat exchange process in the heat exchange cavity 101, thereby improving the reliability of the integrally formed radiator 10.

[0037] As Figure 2 and Figure 4As shown, in one embodiment, a liquid inlet groove 102 is jointly formed between the upper cover assembly 100 and the bottom plate 200. The liquid inlet groove 102 is arranged in the heat exchange cavity 101, and the liquid inlet groove 102 communicates with the liquid inlet hole 1201. The liquid inlet groove 102 is arranged adjacent to the heat sink 310. In this embodiment, when the liquid cooling medium enters the heat exchange cavity 101 through the liquid inlet hole 1201, the liquid cooling medium first enters the liquid inlet groove 102, and then flows into the heat transfer channels 3101 formed by the adjacent heat sinks 310. Since the liquid inlet groove 102 is adjacent to a plurality of heat sinks 310, the liquid cooling medium can quickly flow into a plurality of heat transfer channels 3101 after entering the liquid inlet groove 102, thereby accelerating the heat conduction efficiency between the liquid cooling medium and the heat sink 310.

[0038] As Figure 3 shown, in one embodiment, the liquid inlet pipe 120 is provided with a liquid inlet channel 1202, and the liquid outlet pipe 130 is provided with a liquid outlet channel 1302. The bottom end of the liquid inlet channel 1202 is arranged adjacent to the bottom of the heat exchange cavity 101, and the bottom end of the liquid outlet channel 1302 is arranged adjacent to the top of the heat exchange cavity 101. In this embodiment, when the liquid phase change medium enters the heat exchange cavity 101, the liquid phase change medium will absorb heat and change from liquid to gas during the heat exchange process with the bottom plate 200. Since the liquid inlet channel 1202 is arranged at a position adjacent to the bottom of the heat exchange cavity 101 and the bottom end of the liquid inlet channel 1202 is immersed in the liquid-phase liquid phase change medium, it is difficult for the gaseous liquid phase change medium to be discharged from the liquid inlet pipe 120, avoiding the problem of gas-liquid mixed flow of the liquid phase change medium.

[0039] As Figure 3 shown, in one embodiment, an inclined surface is formed between the liquid inlet channel 1202 of the liquid inlet pipe 120 and the liquid outlet channel 1302 of the liquid outlet pipe 130 in the heat exchange cavity 101. In this embodiment, when the liquid phase change medium exchanges heat with the bottom plate 200 in the heat exchange cavity 101, the liquid phase change medium will absorb heat and change from liquid to gas. The gaseous liquid phase change medium rises to the inclined surface. Since the inclined surface has a certain guiding property for the gaseous liquid phase change medium, it is beneficial for the gaseous liquid phase change medium to be discharged from the liquid outlet pipe 130, avoiding the problem of turbulent flow of the gaseous liquid phase change medium in the heat exchange cavity 101.

[0040] As Figure 3As shown, in one embodiment, the cross-sectional area of the liquid inlet channel 1202 is smaller than that of the liquid outlet channel 1302. In this embodiment, when the liquid cooling medium enters the heat exchange chamber 101 from the liquid inlet pipe 120, due to the smaller cross-sectional area of the liquid inlet channel 1202, the flow rate of the liquid cooling medium is increased, creating a pressure difference within the heat exchange chamber 101. This is beneficial for the liquid cooling medium to flow within the heat transfer channel 3101, thereby accelerating the heat conduction efficiency between the liquid cooling medium and the bottom plate 200, and further improving the heat dissipation efficiency of the integrally formed radiator 10.

[0041] As Figure 2 shown, in one embodiment, the side of the bottom plate 200 facing away from the heat dissipation assembly is the first surface, and the side of the bottom plate 200 adjacent to the heat dissipation assembly is the second surface. The roughness of the first surface is smaller than that of the second surface. In this embodiment, since the smoother the solid surfaces in contact with each other, the smaller the gaps between the contact interfaces, resulting in a reduction in contact thermal resistance. The roughness of the first surface is 0.4 μm to 0.8 μm. Therefore, the smooth and flat surface on the side of the bottom plate 200 facing away from the heat dissipation assembly 300 can reduce the contact thermal resistance, enabling the heat generated by the heat source to be transferred to the bottom plate 200 more quickly. Since the roughness of the second surface is 0.8 μm to 3.2 μm, the higher roughness increases the contact area between the bottom plate 200 and the liquid cooling medium, accelerating the rate of heat conduction from the bottom plate 200 to the liquid cooling medium, and further improving the heat dissipation efficiency of the integrally formed radiator 10.

[0042] As Figure 1 and Figure 2As shown, in one embodiment, the upper cover assembly 100, the bottom plate 200, and the heat dissipation assembly 300 are integrally formed by 3D printing technology. In this embodiment, in one embodiment, the upper cover assembly 100, the bottom plate 200, and the heat dissipation assembly 300 are integrally formed by 3D printing technology. In this embodiment, through 3D printing technology, the upper cover assembly 100, the bottom plate 200, and the heat dissipation assembly 300 are integrally formed and connected to each other. There is no welded joint between the upper cover assembly 100, the bottom plate 200, and the heat dissipation assembly 300, avoiding the problem of liquid heat dissipation medium leakage caused by insecure welding in the welding process, improving the structural strength of the integrally formed radiator 10, and thus improving the reliability of the integrally formed radiator 10; Since 3D printing technology can flexibly adjust the ratio and microstructure of the printing material, reducing the structural limitation of the welding process on the integrally formed radiator 10, by precisely controlling the parameters of 3D printing, the bottom plate 200 and the heat dissipation fins 310 have a porous surface structure. The porous surface structure increases the contact area between the bottom plate 200 and the heat dissipation fins 310 and the liquid heat dissipation medium, and at the same time promotes the boiling heat transfer effect of the liquid heat dissipation medium, enabling the heat of the bottom plate 200 and the heat dissipation fins 310 to be absorbed by the liquid heat dissipation medium more quickly, thereby improving the heat conduction efficiency of the integrally formed radiator 10.

[0043] Compared with the prior art, the present disclosure has at least the following advantages:

[0044] 1. For the above-mentioned integrally formed radiator 10, when the liquid heat dissipation medium is introduced into the integrally formed radiator 10, the heat dissipation fins 310 with a wavy structure on the heat transfer channel 3101 increase the contact area between the liquid heat dissipation medium and the heat dissipation fins 310, and the heat dissipation fins 310 are provided with flow disturbance holes 3102. The flow disturbance holes 3102 reduce the flow resistance of the liquid heat dissipation medium in the heat transfer channel 3101. At the same time, the flow disturbance holes 3102 cause the liquid heat dissipation medium to form a turbulent layer in the heat transfer channel 3101, and the turbulent layer can further increase the contact area between the liquid heat dissipation medium and the heat dissipation fins 310, thereby accelerating the heat conduction efficiency between the liquid heat dissipation medium and the heat dissipation fins 310.

[0045] 2. The increase in the contact area between the liquid heat dissipation medium and the heat dissipation fins 310 is beneficial to strengthening the boiling effect after the liquid heat dissipation medium absorbs heat, enabling the liquid heat dissipation medium to absorb more heat, and thus improving the heat dissipation rate of the integrally formed radiator 10.

[0046] The above-described embodiments merely represent several implementation manners of the present disclosure. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the disclosed patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present disclosure, several variations and improvements can still be made, and these all fall within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure patent shall be subject to the appended claims.

Claims

1. An integrally formed radiator, comprising an upper cover assembly, a bottom plate and a heat dissipation assembly, wherein the upper cover assembly is covered on the bottom plate, the upper cover assembly and the bottom plate together form a heat exchange chamber, the upper cover assembly is provided with a liquid inlet hole and a liquid outlet hole, the liquid inlet hole and the liquid outlet hole are respectively connected to the heat exchange chamber, characterized in that: The heat dissipation component includes a plurality of heat sinks, which are spaced apart in the heat exchange chamber. The heat sink is a wavy structure, and a heat transfer channel is formed between two adjacent heat sinks. Each heat sink is provided with a spoiler hole, and the number of the spoiler holes is multiple. The plurality of spoiler holes are spaced apart in each heat sink, and both ends of each spoiler hole are respectively connected to the corresponding heat transfer channel.

2. The integrally formed heat sink according to claim 1, characterized in that: The surface of the heat sink is a porous structure.

3. The integrally formed heat sink according to claim 1, characterized in that: The center line of the spoiler hole on each heat sink is kept parallel to the center line of the corresponding spoiler hole on the adjacent heat sink.

4. The integrally formed heat sink according to claim 1, characterized in that: The upper cover assembly includes an upper cover shell, a liquid inlet pipe and a liquid outlet pipe. The upper cover shell is covered on the bottom plate. The upper cover shell and the bottom plate together form the heat exchange chamber. The upper cover shell is provided with the liquid inlet hole and the liquid outlet hole. The liquid inlet pipe is installed in the liquid inlet hole, and the liquid outlet pipe is installed in the liquid outlet hole.

5. The integrally formed heat sink according to claim 1, characterized in that: A liquid inlet groove is formed between the upper cover assembly and the bottom plate. The liquid inlet groove is arranged in the heat exchange cavity, is connected to the liquid inlet hole, and is arranged adjacent to the heat sink.

6. The integrally formed heat sink according to claim 4, characterized in that: The liquid inlet pipe is provided with a liquid inlet channel, the liquid outlet pipe is provided with a liquid outlet channel, the bottom end of the liquid inlet channel is arranged adjacent to the bottom of the heat exchange chamber, and the bottom end of the liquid outlet channel is arranged adjacent to the top of the heat exchange chamber.

7. The integrally formed heat sink according to claim 6, characterized in that: The liquid inlet channel of the liquid inlet pipe and the liquid outlet channel of the liquid outlet pipe form an inclined surface in the heat exchange chamber.

8. The integrally formed heat sink according to claim 6, characterized in that: The cross-sectional area of ​​the liquid inlet channel is smaller than the cross-sectional area of ​​the liquid outlet channel.

9. The integrally formed heat sink according to claim 1, characterized in that: The side of the bottom plate facing away from the heat dissipation component is a first surface, and the side of the bottom plate adjacent to the heat dissipation component is a second surface. The roughness of the first surface is smaller than that of the second surface.

10. The integrally formed heat sink according to claim 1, characterized in that: The upper cover assembly, the bottom plate and the heat dissipation assembly are all integrally formed using 3D printing technology.

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