Heat dissipation module and electronic equipment

Abstract

The utility model discloses a heat dissipation module and electronic equipment, and belongs to the technical field of electronic products. The heat dissipation module comprises a heat dissipation fan, an air inlet fin set, an air outlet fin set and a heat conduction assembly. The air inlet fin group is arranged beside the cooling fan and is staggered with the fan air outlet; the air outlet fin group is arranged beside the cooling fan and is aligned with the fan air outlet; the heat conduction assembly comprises a heat conduction block, a first heat transfer piece and a second heat transfer piece. The heat conduction block is used for making contact with an electronic device. The first heat transfer piece is arranged between the heat conduction block and the air outlet fin set. The second heat transfer piece is arranged between the heat conduction block and the air inlet fin set, or the second heat transfer piece is arranged between the air outlet fin set and the air inlet fin set. According to the utility model, the heat of the internal heating device is respectively transmitted to the air inlet fin group and the air outlet fin group through the heat conduction assembly, so that the heat dissipation area is increased; when the cooling fan works, airflow firstly passes through the air inlet fin set to absorb part of heat and then passes through the air outlet fin set to absorb heat again, and the cooling efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, in particular to a heat dissipation module and an electronic device. Background Art

[0002] A large number of high-performance electronic devices, such as central processing units, etc., are integrated inside many electronic devices to achieve complex data processing, control and other functions. However, a large amount of heat is generated during the operation of these high-performance electronic devices. If the heat cannot be effectively removed, the operation stability and safety of the device will be affected.

[0003] In the related art, a heat dissipation fan is arranged inside the electronic device, and the heat is taken away from the heat source by air flow to dissipate the heat inside the electronic device to the outside. However, the heat dissipation efficiency is still limited. Summary of the Utility Model

[0004] The purpose of the embodiments of the utility model is to provide a heat dissipation module and an electronic device, so that the heat of the heat source can be transferred to the air inlet fin group and the air outlet fin group, and the area of the heat dissipation components can be increased in a limited space, and the heat dissipation efficiency can be improved.

[0005] To achieve the above object, the utility model adopts the following technical solutions:

[0006] In a first aspect, the utility model provides a heat dissipation module, including:

[0007] A heat dissipation fan provided with a fan air outlet;

[0008] An air inlet fin group arranged beside the heat dissipation fan and offset from the fan air outlet;

[0009] An air outlet fin group arranged beside the heat dissipation fan and facing the fan air outlet;

[0010] A heat conduction component, including a heat conduction block, a first heat transfer member and a second heat transfer member; the heat conduction block is used to contact the electronic device;

[0011] The first heat transfer member is arranged between the heat conduction block and the air outlet fin group;

[0012] The second heat transfer member is arranged between the heat conduction block and the air inlet fin group, or the second heat transfer member is arranged between the air outlet fin group and the air inlet fin group.

[0013] The heat conducting block is used to absorb the heat of the electronic device. The heat conducting block transfers the heat to the air outlet fin group through the first heat transfer member. The air outlet fin group plays the main heat dissipation function. The air inlet fin group and the second heat transfer member are arranged to increase the heat dissipation area to improve the heat dissipation efficiency, and also help to reduce the heat around the air outlet fin group to make the temperature distribution of the entire heat dissipation module more uniform. Optionally, the heat dissipation fan is a centrifugal fan, and the air inlet fin group and the air outlet fin group are both located on the side of the centrifugal fan in the radial direction.

[0014] A centrifugal fan is used as the cooling fan, which has large air volume, high air pressure and improved heat dissipation efficiency.

[0015] Optionally, the air inlet fin group is located on a side of the air outlet fin group away from the fan outlet.

[0016] Optionally, the air outlet fin group is directly opposite to the fan outlet, so that the wind blown out from the fan outlet can enter the inside of the air outlet fin group. Wherein, the air outlet fin group is provided with a plurality of air outlet fin channels, and the inlet of the air outlet fin channel is directly opposite to the fan outlet.

[0017] Optionally, the heat dissipation fan is provided with a fan air inlet, and the heat conductive block is arranged on a side of the heat dissipation fan away from the fan air inlet; a heat transfer element is arranged between the heat dissipation fan and the heat conductive block, or the heat dissipation fan is in contact with the heat conductive block.

[0018] After the heat of the electronic device is transferred to the heat conductive block, it can be transferred to the fan housing of the cooling fan through the heat conductive block. The fan housing also serves as a heat dissipation surface, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

[0019] Optionally, the second heat transfer element is arranged between the heat conduction block and the air inlet fin group; the first heat transfer element and the second heat transfer element are an integrated part.

[0020] Optionally, the heat conduction assembly further includes a third heat transfer member, and the third heat transfer member is disposed between the heat conduction block and the air outlet fin group.

[0021] When the second heat transfer element is provided, the heat of the heat conduction block can be transferred to the air inlet fin group, which plays a role in uniform heat distribution. The heat conduction block transfers heat to the air outlet fin group through at least two heat transfer elements, the first heat transfer element and the third heat transfer element, which plays a major role in heat dissipation. The layout of the heat transfer element is simple and reasonable.

[0022] Optionally, the first heat transfer member, the second heat transfer member, and the third heat transfer member are all copper tubes. Using copper tubes as heat transfer members has high heat transfer efficiency.

[0023] Optionally, the air outlet fin group is spaced apart from the fan outlet, and a first spacing channel is formed between the heat dissipation fan and the air outlet fin group;

[0024] The heat dissipation module also includes an enclosure structure, which is connected to the air outlet fin group and / or the heat dissipation fan, and the enclosure structure surrounds the outside of the first partition channel; the heat dissipation fan, the enclosure structure, and the air outlet fin group form a mixed flow channel.

[0025] By setting a mixed flow channel, i.e., an air mixed flow zone, between the cooling fan and the air outlet fin group, the airflows in different areas can be pre-mixed after the air is sent out of the cooling fan, so that the wind speed and air volume passing through the air outlet fin group can be as consistent as possible in different areas, thereby optimizing the heat dissipation efficiency of different areas of the air outlet fin group and making the temperature difference of different parts of the air outlet fin group as consistent as possible.

[0026] Optionally, a guide gap is provided between the air outlet fin group and the enclosure structure, and the mixed flow channel is connected with the space outside the air outlet fin group through the guide gap.

[0027] Part of the airflow from the cooling fan is blown to the overheated surface of the casing outside the cooling fan through the guide gap, taking away part of the casing heat and improving the temperature experience of the local surface of the casing. When this heat dissipation module is set inside the casing of an electronic device, the overall surface temperature of the casing will be more balanced and pleasant, improving the user experience of the product, and increasing the consumer acceptance and competitiveness of the product.

[0028] Optionally, an inner end chamfer is arranged between the first side and the third side of the air outlet fin group, and a guide gap is formed between the enclosure structure and the inner end chamfer; an outer end chamfer is arranged between the second side and the third side of the air outlet fin group; wherein, the side of the air outlet fin group close to the cooling fan is the first side, the side of the air outlet fin group away from the cooling fan is the second side, and the side of the air outlet fin group away from the heat conductive block is the third side.

[0029] By providing the inner end chamfer and the outer end chamfer, the airflow is not only guided to the overheating surface of the casing, but also guided to flow out of the casing, thereby improving the smoothness of the airflow.

[0030] Optionally, the enclosure structure includes a heat equalizing block, the top surface of the heat equalizing block has a first area and a second area, the air outlet fin group is installed in the first area, and the second area is the inner wall of the mixed flow channel.

[0031] By setting up a heat spreader, the temperature of the heat transfer element can be evenly transferred to all parts of the air outlet fin group, avoiding local overheating and improving heat dissipation efficiency. The heat spreader can also serve as a barrier, as the inner wall of the mixed flow channel, and the heat spreader has multiple functions.

[0032] Optionally, the enclosure structure further includes a guide bracket, which is arranged on the same side of the heat equalizing block as the air outlet fin group, and is connected to the heat equalizing block; the inner wall of the guide bracket is the inner wall of the mixed flow channel.

[0033] Optionally, the guide bracket is a U-shaped bracket.

[0034] Optionally, it also includes a mounting bracket; the mounting bracket is provided with a first mounting portion and a second mounting portion; the cooling fan is mounted on the first mounting portion via a first fastener, and the second mounting portion can be mounted on the casing via a second fastener; the heat conductive block is connected to the mounting bracket.

[0035] Each structural member in the heat dissipation module can be connected to the mounting bracket, and the heat dissipation module can be mounted on the casing through the mounting bracket.

[0036] Optionally, the heat dissipation module further comprises a heat equalizing block, the air outlet fin group abuts against and is fixed to the heat equalizing block; a groove is provided on the side of the heat equalizing block away from the air outlet fin group, the heat transfer element is a heat transfer tube, and at least part of the heat transfer tube is inserted into the groove. The heat transfer tube is embedded in the groove of the heat equalizing block, which has a positioning effect on the heat transfer tube, and the heat of the heat transfer tube can be radiated and transferred to the heat equalizing block.

[0037] Optionally, a heat conducting pad is provided on one side of the heat spreader away from the air outlet fin group, and the heat conducting pad is used to contact the electronic device. Through the cooperation of the heat conducting pad and the heat spreader, other electronic devices on the circuit board can also be assisted in heat dissipation.

[0038] In a second aspect, the utility model provides an electronic device, comprising a housing, a circuit board, and a heat dissipation module as described above; the circuit board and the heat dissipation module are arranged inside the housing, the circuit board is provided with a plurality of electronic devices, and the heat conductive block is in contact with the electronic devices;

[0039] The casing is provided with a casing air inlet and a casing air outlet, the air inlet fin group is arranged at the casing air inlet, and the air outlet fin group is arranged at the casing air outlet.

[0040] The electronic device has high heat dissipation efficiency.

[0041] Optionally, the housing includes a first housing plate and a second housing plate disposed on opposite sides of the heat dissipation module; a fan air inlet is disposed on a side of the heat dissipation fan close to the first housing plate, the circuit board is disposed between the heat dissipation module and the second housing plate, and the heat conduction block is disposed between the heat dissipation module and the circuit board;

[0042] The cooling fan is spaced apart from the first shell plate, and a first cooling channel is formed between the cooling fan and the first shell plate; the air outlet fin group is spaced apart from the first shell plate, and a second cooling channel is formed between the air outlet fin group and the first shell plate;

[0043] The air inlet fin group includes a plurality of first fins arranged at intervals, and an air inlet fin channel is formed between adjacent first fins; the air outlet fin group includes a plurality of second fins arranged at intervals, and an air outlet fin channel is formed between adjacent second fins;

[0044] The housing air inlet, the air inlet fin channel, the first heat dissipation channel, the fan air inlet, and the fan air outlet are connected; the fan air outlet is connected to the housing air outlet through the air outlet fin channel, and furthermore, the fan air outlet is connected to the housing air outlet through the second heat dissipation channel.

[0045] It can improve the heat dissipation efficiency and is also beneficial to improving the uniformity of the temperature on the surface of the housing.

[0046] The beneficial effects of the present utility model are as follows: for this heat dissipation module and the electronic device, the heat of the internal heat-generating components is respectively transferred to the air inlet fin group and the air outlet fin group through the heat conduction component, increasing the heat dissipation area; when the heat dissipation fan works, the air flow first passes through the air inlet fin group to absorb part of the heat. After the air flow passes through the heat dissipation fan, it then passes through the air outlet fin group to absorb heat again, thereby improving the heat dissipation efficiency; moreover, the structure of this heat dissipation module is simple. Brief Description of the Drawings

[0047] The following further describes the present utility model in detail with reference to the drawings and embodiments.

[0048] The following further describes the present utility model in detail with reference to the drawings and embodiments;

[0049] Figure 1 It is one of the overall structure diagrams of the heat dissipation module according to the embodiment of the present utility model;

[0050] Figure 2 It is the assembly diagram of the heat conduction component mounting bracket of the heat dissipation module according to the embodiment of the present utility model;

[0051] Figure 3 It is the schematic diagram of the heat dissipation module according to the embodiment of the present utility model after omitting the heat dissipation fan;

[0052] Figure 4 It is the schematic diagram of the heat dissipation fan in the heat dissipation module according to the embodiment of the present utility model;

[0053] Figure 5 It is the structural exploded view of the heat dissipation module according to the embodiment of the present utility model;

[0054] Figure 6 It is Figure 5 The enlarged view of part A in

[0055] Figure 7 It is the second overall structure diagram of the heat dissipation module according to the embodiment of the present utility model;

[0056] Figure 8 It is the third overall structure diagram of the heat dissipation module according to the embodiment of the present utility model;

[0057] Figure 9 It is the fourth overall structure diagram of the heat dissipation module according to the embodiment of the present utility model;

[0058] Figure 10 Schematic diagram of the cooperation mode between the heat dissipation module described in the embodiment of the present invention and the first housing plate on one side inside the housing;

[0059] Figure 11 is Figure 10 The enlarged view of part B in

[0060] Figure 12 Partial schematic diagram of the electronic device described in the embodiment of the present invention (the dotted arrow in the figure indicates the air flow direction);

[0061] Figure 13 is Figure 12 The enlarged view of part C in

[0062] In the figure: 10, heat dissipation fan; 101, fan air inlet; 102, fan air outlet; 11, top plate; 12, side plate; 20, air inlet fin group; 21, first fin; 22, first enclosure; 30, air outlet fin group; 301, inner end chamfer; 302, outer end chamfer; 31, second fin; 32, second enclosure; 41, heat conduction block; 421, first heat transfer member; 422, second heat transfer member 423, third heat transfer member; 43, heat conduction pad; 50, enclosure structure; 51, heat sink; 511, groove; 52, flow guide bracket; 60, mounting bracket; 61, first mounting part; 62, second mounting part; 71, first fastener; 72, second fastener; 80, housing; 801, housing air inlet; 802, housing air outlet; 81, first housing plate; 91, first separation channel; 92, mixed flow channel; 93, flow guide gap; 94, first heat dissipation channel; 900, circuit board. Detailed implementation manners

[0063] To make the technical problems solved by the present invention, the technical solutions adopted and the achieved technical effects clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of the present invention.

[0064] In the description of the present utility model, unless otherwise clearly specified and defined, the terms "connected" and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or integrated as a whole; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0065] In the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on the top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely means that the horizontal height of the first feature is lower than that of the second feature.

[0066] In the related art, inside electronic devices such as computing devices (such as industrial control computers, i.e., liquid supply control computers), a large number of electronic components are integrated, such as a central processing unit (CPU), a graphics processing unit (GPU), memory chips, etc., to achieve complex data processing, control, communication and other functions. A large amount of heat will be generated during the operation of highly integrated electronic components. If it cannot be dissipated in time and effectively, it will cause the device temperature to rise, thereby affecting its performance stability, service life and even posing potential safety hazards. In the related art, some electronic devices are internally provided with fans. The fans generate airflows by rotating and use the principle of air convection to take away the heat from the heat sources.

[0067] In some electronic devices, air inlets and air outlets are provided on the device housing. When the fan works, the airflows enter from the air inlets of the housing, then pass through the electronic components in sequence, and then blow out from the air outlets of the housing, directly taking away the heat on the surfaces of the electronic components by air. However, the internal component layout is complex. In order to ensure that the air can flow through all the electronic components that need to be cooled, the design of the airflow path may become quite complex. And the heat dissipation efficiency of this electronic device is relatively low.

[0068] In some electronic devices, a heat dissipation module is provided inside the device housing. The heat dissipation module includes a fan and a fin group. However, generally, the fin group is only provided at the air outlet of the fan. The heat of the heat source can be transferred to the fin group at the air outlet of the fan, and then the heat on the fin group at the air outlet is taken away by the air flow. However, in the case where the heat generation of the electronic device is relatively large, the heat dissipation efficiency of this heat dissipation method is still limited. Moreover, there is a large temperature difference at different positions on the outer surface of the housing of this electronic device. If the housing is an appearance part, the touch feeling of the user when touching different positions of the housing is quite different, and the user experience is poor.

[0069] Based on this, the present utility model provides a heat dissipation module, which is used to be arranged inside the housing of an electronic device. The heat dissipation module is provided with a heat dissipation fan, and also provided with an air inlet fin group and an air outlet fin group. The heat of the heat source can be respectively transferred to the front air inlet fin group and the rear air outlet fin group through a heat conduction component, increasing the heat dissipation area and improving the heat dissipation efficiency; and the structure of this heat dissipation module is simple and the cost is controllable.

[0070] For this electronic device, when the air flow just enters the inside of the housing, it can first absorb heat preliminarily at the air inlet fin group, and the air flow absorbs heat again when it reaches the air outlet fin group. The setting of the two fin groups not only increases the heat dissipation area, but also can improve the heat dissipation efficiency within a limited space and time, and the structure is simple.

[0071] Moreover, the temperature difference between the two regions of the air inlet of the housing and the air outlet of the housing of this electronic device is reduced, making the heat distribution of the entire housing more uniform and improving the user touch experience.

[0072] The electronic device of the present utility model can be, but is not limited to, an industrial personal computer, a server, a workstation, a gaming computer, an outdoor electronic device, etc. Among them, an industrial personal computer, that is, an industrial personal computer (abbreviated as IPC), is a computer device designed specifically for the industrial environment.

[0073] Please refer to Figures 1 to 13 , and the heat dissipation module and the electronic device of the present utility model will be described below.

[0074] As Figure 12 and Figure 13 shown, the electronic device provided by the present utility model includes a housing 80, a plurality of electronic components, and a heat dissipation module. The electronic components and the heat dissipation module are both arranged inside the housing 80. The housing 80 is provided with a housing air inlet 801 and a housing air outlet 802.

[0075] Please continue to refer to Figure 1 , Figure 12As shown, the heat dissipation module includes a heat dissipation fan 10, an air inlet fin group 20, an air outlet fin group 30, and a heat conduction component. The air inlet fin group 20 is arranged corresponding to the housing air inlet 801, and the air outlet fin group 30 is arranged corresponding to the housing air outlet 802.

[0076] The heat dissipation fan 10 includes a fan housing and blades, and the blades are arranged inside the fan housing. The fan housing is provided with a fan air inlet 101 and a fan air outlet 102. For the electronic device, when the heat dissipation fan 10 works, the air flow flows from the housing air inlet 801 to the housing air outlet 802. For the heat dissipation module, when the heat dissipation fan 10 works, the air flow path is the air inlet fin group 20, the fan air inlet 101, the inside of the heat dissipation fan 10, the fan air outlet 102, and the air outlet fin group 30.

[0077] As Figure 2 、 Figure 3 shown, the heat conduction component includes a heat conduction block 41, a first heat transfer member 421, and a second heat transfer member 422. The heat conduction block 41 is used to contact the electronic device. In the electronic device, the heat conduction block 41 is arranged on the surface of the electronic device through heat conduction glue or other means, so that the heat on the surface of the electronic device can be transferred to the heat conduction block 41.

[0078] A first heat transfer member 421 is arranged between the air outlet fin group 30 and the heat conduction block 41, and the heat of the electronic device is transferred to the air outlet fin group 30 through the heat conduction block 41 and the first heat transfer member 421. A second heat transfer member 422 is arranged between the air inlet fin group 20 and the heat conduction block 41, or a second heat transfer member 422 is arranged between the air inlet fin group 20 and the air outlet fin group 30, and the heat of the electronic device can be directly or indirectly transferred to the air inlet fin group 20. In this way, the heat generated by the electronic device can be transferred to the air inlet fin group 20 and the air outlet fin group 30 at the front and rear ends of the air flow path respectively through the heat conduction component.

[0079] It should be noted that in this application, when it is described that there is a heat transfer member between the first structural member and the second structural member, it means that there is a heat conduction contact between the heat transfer member and the first structural member and between the heat transfer member and the second structural member. Heat conduction contact means that there is a direct surface-to-surface contact between the heat transfer member and the structural member, or there is a heat conduction glue or the like coated between the heat transfer member and the structural member.

[0080] When this application describes a "heat transfer member", it can be the first heat transfer member 421, or the second heat transfer member 422, or other heat transfer members (such as a third heat transfer member 423, etc.).

[0081] When the cooling fan 10 of the present application is working, the air flow first passes through the air inlet fin group 20, exchanges heat with the air inlet fin group 20, takes away the heat, and after the air flow enters the cooling fan 10, it is sent from the fan air outlet 102 to the air outlet fin group 30. The air flow exchanges heat with the air outlet fin group 30 and takes away the heat. As the air flow blows out from the housing air outlet 802 of the housing 80, the heat is discharged from the housing 80.

[0082] In some embodiments, the air outlet fin group 30 plays a main heat dissipation function, and the air inlet fin group 20 mainly plays a heat equalizing function of equalizing heat, that is, the air inlet fin group 20 plays an auxiliary heat dissipation function.

[0083] The cooling module and the electronic device of the present application have the following advantages:

[0084] First, the heat of the electronic device can be transferred to the air inlet fin group 20 and the air outlet fin group 30 through the heat conduction component. The surfaces of the fins in the air inlet fin group 20 and the air outlet fin group 30 can dissipate heat outward. Compared with the scheme of only dissipating heat through the outer surface of the electronic device or only setting one fin group, the cooling module of the present application can increase the heat dissipation area and thus improve the heat dissipation efficiency.

[0085] Second, after the fin group receives the heat transferred from the electronic device, it will radiate a certain amount of heat outward. If the housing 80 is arranged close to the fin group, the housing 80 will also heat up under the thermal radiation of the fin group. If only the air outlet fin group 30 is provided, then the air outlet fin group 30 is located on the side of the cooling fan 10 close to the housing air outlet 802, which will cause a large temperature difference between the area of the housing 80 close to the housing air outlet 802 and the area close to the housing air inlet 801. When the housing 80 is an appearance part that can be touched by the user with hand, the temperature difference of different areas of the housing 80 touched by the user is relatively large. The outer surface temperature of the housing 80 in the area close to the air outlet fin group 30 will be relatively high, and there will even be a burning sensation locally, and there is a risk of scalding when the user touches it.

[0086] For the cooling module and the electronic device of the present application, the heat of the electronic device is respectively transferred to the air inlet fin group 20 and the air outlet fin group 30. The air inlet fin group 20 can share a little heat, reduce the heat transferred to the air outlet fin group 30, so that the temperature at the housing air outlet 802 of the housing 80 is not too high, and the temperature difference between the area of the housing 80 close to the housing air outlet 802 and the area close to the housing air inlet 801 can be reduced. The temperatures of different areas of the appearance surface of the housing 80 are balanced to a certain extent, and the user's touch experience is improved.

[0087] Third, for the conventional fan structure, including one air outlet, without changing the structure of the cooling fan 10, the present application can also improve the heat dissipation efficiency through the cooperation of the air outlet fin group 30 arranged at the air outlet of the cooling fan 10 and the air inlet fin group 20 close to the housing air inlet 801. The structure is simple and the cost is controllable.

[0088] It should be noted that the present application does not exclude the solution in which the cooling fan 10 is provided with multiple air outlets.

[0089] Fourth, by providing the first heat transfer member 421 and the second heat transfer member 422, the heat conducting block 41 can be first arranged at the main heat source inside the electronic device, and then the heat of the heat conducting block 41 is respectively conducted to the fin groups close to the housing air inlet 801 and the housing air outlet 802 through the first heat transfer member 421 and the second heat transfer member 422. The layout of each structural member is reasonable, and the layout of the heat transfer members is not complicated. Among them, the air outlet fin group 30 is arranged close to the housing air outlet 802, so that after the air flow passes through the air outlet fin group 30, the heat can be directly taken out of the housing 80.

[0090] Fifth, staggering the air inlet fin group 20 from the air outlet of the cooling fan 10 can enable the air flow to perform a heat exchange once before entering the cooling fan 10, and is also beneficial to balancing the temperature difference in different regions of the housing 80.

[0091] In an embodiment, the air outlet fin group 30 faces the fan air outlet 102 so that the air blown out from the fan air outlet 102 can enter the inside of the air outlet fin group 30. Among them, the air outlet fin group 30 is provided with a plurality of air outlet fin channels, and the inlets of the air outlet fin channels face the fan air outlet 102.

[0092] In an embodiment, the heat conducting block 41 is in thermal contact with the central processing unit (CPU). The heat conducting block 41 conducts the heat of the central processing unit to the air inlet fin group 20 and the air outlet fin group 30 through the second heat transfer member 422 and the first heat transfer member 421. For an electronic device with a central processing unit, the central processing unit is the main heat source. By transferring the heat of the main heat source to the air inlet fin group 20 and the air outlet fin group 30 through the main heat conducting block 41, the heat dissipation efficiency is high. Among them, according to requirements, heat conducting pads 43 can be additionally provided between the air inlet fin group 20 and some other electronic devices, and between the air outlet fin group 30 and some other electronic devices to simultaneously dissipate heat from other electronic devices. Heat transfer members may not be provided between the heat conducting pads 43 and the fin groups.

[0093] In an embodiment, the cooling fan 10 is a centrifugal fan. The fan air inlet 101 of the centrifugal fan is located on its axial side surface, and the fan air outlet 102 of the centrifugal fan is located on its radial side surface, that is, the centrifugal fan has axial air inlet and radial air outlet after the internal impeller rotates. Among them, the centrifugal fan can generate a relatively high static pressure, and can enable the air to smoothly enter and flow out in the case of a dense layout of the internal structural members of the housing 80, improving the heat dissipation efficiency.

[0094] In one embodiment, the intake fin group 20 includes a plurality of spaced-apart first heat dissipation fins, and further includes a first shroud 22 surrounding the second sides of the plurality of first heat dissipation fins. An intake fin channel is formed between adjacent first heat dissipation fins. The two sides of the intake fin group 20 facing away from and approaching the cooling fan 10 respectively form an inlet and an outlet of the intake fin channel.

[0095] In one embodiment, the intake fin group 20 includes a plurality of spaced-apart second heat dissipation fins, and further includes a second shroud 32 surrounding the second sides of the plurality of second heat dissipation fins. An exhaust fin channel is formed between adjacent second heat dissipation fins. The two sides of the intake fin group 20 facing away from and approaching the cooling fan 10 respectively form an inlet and an outlet of the exhaust fin channel.

[0096] In one embodiment, the heat conducting block 41 is a metal block. Exemplarily, the heat conducting block 41 is a copper block. Among them, copper has a high thermal conductivity and can dissipate heat evenly, with good thermal performance. Copper is easy to be processed into various shapes and structures, and is easy to cooperate well with electronic devices and heat transfer components for efficient heat transfer. Moreover, copper is light in weight, which is beneficial to the lightweight design of electronic devices. In other embodiments, the heat conducting block 41 can also be a graphene structure or the like.

[0097] In one embodiment, the first heat transfer component 421 and the second heat transfer component 422 are metal tubes. Exemplarily, the heat transfer component 42 is a copper tube. Using a metal tube as the heat transfer component 42, a coolant can also be introduced into the interior of the metal tube according to requirements to improve the heat dissipation efficiency. Optionally, the heat transfer component is of a flat structure to facilitate providing relatively flat contact surfaces on both sides of the flat heat transfer component and improve the heat transfer efficiency of the heat transfer component.

[0098] Among them, when both the heat conducting block 41 and the heat transfer component are of metal structures, the heat transfer component and the heat conducting block 41 can be connected and fixed by, but not limited to, welding.

[0099] In one embodiment, the intake fin group 20 includes a plurality of first fins 21 arranged at intervals, and an intake fin channel is formed between adjacent first fins 21.

[0100] In one embodiment, referring to Figure 1 、 Figure 4 、 Figure 5 、 Figure 9 、 Figure 10 , the cooling fan 10 is a centrifugal fan; both the intake fin group 20 and the exhaust fin group 30 are located on the sides in the radial direction of the centrifugal fan.

[0101] The heat dissipation fan 10 includes a fan housing and an impeller. The impeller, i.e., the blades, is disposed inside the fan housing. The fan housing includes a top plate 11, side plates 12, and a bottom plate. The top plate 11 and the bottom plate are located on both sides of the heat dissipation fan 10 in the axial direction of the fan. The side plates 12 are connected between the top plate 11 and the bottom plate. The fan air inlet 101 is provided on the top plate 11, and the fan air outlet 102 is provided on the side plate 12. Among them, the air outlet fin group 30 is arranged aligned with the fan air outlet 102 so that the air flow blown out from the fan air outlet 102 enters the air outlet fin channels in the air outlet fin group 30; the air inlet fin group 20 is arranged aligned with the position on the side plate 12 of the heat dissipation fan 10 where the fan air outlet 102 is not provided.

[0102] The air inlet fin group 20 is arranged on the radially outer side of the heat dissipation fan 10. On the one hand, with such an arrangement, the air inlet fin group 20 and the air outlet fin group 30 are basically located in the same horizontal space, which is convenient for the heat transfer member to be arranged between any two of the heat conduction block 41, the air inlet fin group 20, and the air outlet fin group 30, reducing the bending of the heat transfer member and making the layout of the heat transfer member simpler. Exemplarily, the heat conduction block 41 is provided on the lower side of the centrifugal fan, the first heat transfer member 421 is between the heat conduction block 41 and the lower side of the air outlet fin group 30, and the second heat transfer member 422 is between the heat conduction block 41 and the lower side of the air inlet fin group 20. Of course, the setting manner of the heat transfer member 42 is not limited to this.

[0103] The air inlet fin group 20 is arranged on the radially outer side of the heat dissipation fan 10. On the second hand, it is beneficial to reduce the overall height and thickness of the entire heat dissipation module. When the heat dissipation module is arranged inside the casing 80, it can avoid wasting the internal space of the casing 80 and is suitable for application in a casing 80 with a smaller height and thickness.

[0104] In other embodiments, the heat dissipation fan 10 is a centrifugal fan, and the air inlet fin group 20 is arranged on the side of the heat dissipation fan 10 in the axial direction and beside the fan air inlet 101.

[0105] In one embodiment, the heat dissipation fan 10 is a centrifugal fan. The fan air inlet 101 is provided on one side of the heat dissipation fan 10 in the axial direction. The circuit board 900 and the heat conduction block 41 in the casing 80 are both provided on the side of the heat dissipation fan 10 away from the fan air inlet 101, reducing the interference of the circuit board 900 and related electronic devices on the air flow.

[0106] Optionally, the heat dissipation fan 10 is configured to receive the heat conducted by the heat conduction block 41. Taking the heat conduction block 41 used for setting on the central processing unit as an example, in this way, the heat generated when the central processing unit works can be respectively transferred to the three areas of the air inlet fin group 20, the air outlet fin group 30, and the housing of the heat dissipation fan 10. And there is air flowing through these three areas, and the air can take away heat when flowing through these three areas, with high heat dissipation efficiency.

[0107] Among them, the heat dissipation fan 10 receives the heat of the heat conduction block 41 in the following manner: a first heat transfer member 421 and a second heat transfer member 422 are arranged between the heat dissipation fan 10 and the heat conduction block 41, and at least the heat of the heat conduction block 41 can be transferred to the heat dissipation fan 10 through the first heat transfer member 421 and the second heat transfer member 422; alternatively, the heat dissipation fan 10 is in direct contact with the heat conduction block 41.

[0108] In one embodiment, the heat dissipation fan 10 is a centrifugal fan, and the air inlet fin group 20 is located beside the radial direction of the centrifugal fan. Moreover, there are several air inlet fin channels inside the air inlet fin group 20, and the relative two ends of the air inlet fin group 20 respectively form the inlet and outlet of the air inlet fin channel, which can improve the smoothness of the air flow passing through the air inlet fin group 20. Among them, the outlet of the air inlet fin channel is located on the side of the air inlet fin group 20 close to the centrifugal fan, and there is an interval between the air inlet fin group 20 and the side plate 12 of the centrifugal fan, which is convenient for providing a flow-through channel. In this way, after the air flow blows out from the outlet of the air inlet fin channel, it can pass through the interval channel between the air inlet fin group 20 and the centrifugal fan and flow to the side of the fan air inlet 101 of the centrifugal fan and enter the centrifugal fan.

[0109] In other embodiments, the air inlet fin group 20 can also abut against the side plate 12 of the heat dissipation fan 10, and the outlet of the air inlet fin channel is opened on the upper side of the air inlet fin group 20.

[0110] In one embodiment, referring to Figure 2 、 Figure 3 , one end of the first heat transfer member 421 is arranged between the heat dissipation fan 10 and the heat conduction block 41, and the other end is arranged on the air outlet fin group 30. The heat of the electronic device (such as the CPU) is conducted to the heat conduction block 41, the heat is conducted to the first heat transfer member 421 through the heat conduction block 41, and the heat is conducted to the air outlet fin group 30 and the heat dissipation fan 10 through the first heat transfer member 421.

[0111] Optionally, one end of the second heat transfer member 422 is arranged on the air inlet fin group 20, the middle of the second heat transfer member 422 is arranged between the heat dissipation fan 10 and the heat conduction block 41, and the other end of the second heat transfer member 422 is arranged on the air outlet fin group 30. The heat of the electronic device (such as the CPU) is conducted to the heat conduction block 41, the heat is conducted to the second heat transfer member 422 through the heat conduction block 41, and the heat is conducted to the air inlet fin group 20, the air outlet fin group 30 and the heat dissipation fan 10 through the second heat transfer member 422.

[0112] In this embodiment, through the arrangement of as few heat transfer members as possible and through a simple and reasonable layout method of the heat transfer members 42, the functions of equalizing the temperature of the air inlet fin group 20 and mainly dissipating heat from the air outlet fin group 30 are realized. And both the first heat transfer member 421 and the second heat transfer member 422 are at least partially arranged between the heat dissipation fan 10 and the heat conduction block 41, and the heat can also be dissipated through the heat dissipation fan 10.

[0113] Optionally, referring to Figure 2 and Figure 3 , the first heat transfer member 421 and the second heat transfer member 422 are integral parts, that is, the first heat transfer member 421 and the second heat transfer member 422 are integrally formed structures.

[0114] Optionally, referring to Figure 2 and Figure 3 , the heat conduction assembly further includes a third heat transfer member 423. The third heat transfer member 423 is disposed between the heat conduction block 41 and the air outlet fin group 30. Both the third heat transfer member 423 and the first heat transfer member 421 are used to conduct heat to the air outlet fin group 30, improving the heat dissipation efficiency.

[0115] In other embodiments, the first heat transfer member 421 and the second heat transfer member 422 may also be a split structure, being two components.

[0116] In other embodiments, between the heat conduction block 41 and the air outlet fin group 30, only one heat transfer member, that is, the first heat transfer member 421, may also be provided. On this basis, if more heat needs to be conducted to the air outlet fin group 30, the size of the first heat transfer member 421 can be increased. Or, in other embodiments, between the heat conduction block 41 and the air outlet fin group 30, a fourth heat transfer member, a fifth heat transfer member, etc. may also be provided. In one embodiment, referring to Figure 9 , the air outlet fin group 30 and the cooling fan 10 are spaced apart, that is, the air outlet fin group 30 and the fan air outlet 102 are spaced apart. A first spacer channel 91 is formed between the cooling fan 10 and the air outlet fin group 30. The heat dissipation module further includes an enclosure structure 50. The enclosure structure 50 is connected to the air outlet fin group 30 and / or the cooling fan 10. The enclosure structure 50 surrounds the outside of the first spacer channel 91. A mixing flow channel 92 is formed by enclosing between the end of the cooling fan 10 close to the air outlet fin group 30, the inner side of the enclosure structure 50, and the end of the air outlet fin group 30 close to the cooling fan.

[0117] When the cooling fan 10 is a centrifugal fan, due to the working principle and structural design of the centrifugal fan, when the centrifugal fan works, air is thrown out towards the fan air outlet 102 by the rotation of the impeller. The air flow velocities in different regions at the fan air outlet 102 are inconsistent and uneven. If the air flow blown out from the fan air outlet 102 has different wind speeds in different regions, it will cause different cooling rates in different regions of the air outlet fin module. In this way, not only is the heat dissipation efficiency limited, but there are also differences in the temperatures on the outer surface of the air outlet fin module and the outer surface of the nearby chassis 80, and the user's touch feeling is not good. As Figure 4 and Figure 9As shown in the figure, the area towards which the hollow arrow on the top plate 11 of the cooling fan 10 points generally has a relatively high air flow rate. The heat dissipation efficiency of the air outlet fin module area near the hollow arrow of the fan top plate 11 is relatively high and the temperature is also slightly lower.

[0118] It can be understood that if the air outlet fin group 30 is set closely against the cooling fan 10 so that the air outlet fin group 30 is tightly connected to the cooling fan 10, although it can make the air flow generated by the rotation of the fan blades all enter the air outlet fin group 30 as much as possible to avoid air flow leakage. However, there may still be a situation where the temperatures in different areas of the air outlet fin group 30 are inconsistent.

[0119] In this embodiment, the air outlet fin group 30 is not set closely against the cooling fan 10, but is spaced a certain distance from the cooling fan 10, and a baffle structure 50 is provided around it. A mixing channel 92 can be provided between the cooling fan 10 and the air outlet fin group 30, and this mixing channel 92 functions as a duct. After the air is blown out from the cooling fan 10, it is pre-mixed in the mixing channel 92, making the air speeds near the area of the hollow arrow, the middle area, and the area far from the hollow arrow at the fan air outlet 102 relatively balanced. The balanced air flow rate everywhere is also conducive to making the temperatures everywhere on the air outlet fin group 30 relatively balanced, improving the heat dissipation efficiency, making the temperatures on the outer surface of the air outlet fins and the outer surface of the housing 80 more uniform, and improving the user's touch experience.

[0120] In one embodiment, referring to Figures 10 to 13 , a guiding gap 93 is provided between the cooling fan 10 and the air outlet fin group 30, and a first heat dissipation channel 94 is provided between one side of the air outlet fin group 30 and the housing 80. The fan air outlet 102, the guiding gap 93, the first heat dissipation channel 94, and the housing air outlet 802 are connected. The arrows in the figure indicate the air flow direction. The guiding gap 93 provides a channel. After the air is blown out from the fan air outlet 102 of the cooling fan 10, most of the air flow passes through the air outlet fin group 30 to take away the heat on the fins and is blown out from the housing air outlet 802 to achieve the main heat dissipation function. There is also a part of the air flow that can pass through the guiding gap 93 to reach the first heat dissipation channel 94 between the air outlet fin group 30 and the housing 80, and then is blown out from the housing air outlet 802 to also dissipate heat from the housing 80, reducing the temperature of the area of the housing 80 close to the air outlet fin group 30 and avoiding a burning sensation when touching this area of the housing 80 by hand.

[0121] Optionally, the guiding gap 93 is provided between the air outlet fin group 30 and the baffle structure 50. One side of the guiding gap 93 is close to the fan air outlet 102, and the other side of the guiding gap 93 is close to the outer surface of the air outlet fin group 30. The guiding gap 93 is used to provide an air flow channel between the fan air outlet 102 and the outer space of the air outlet fin group 30.

[0122] In one embodiment, the configuration of the guide gap 93 is as follows: an inner chamfer 301 is provided on the side of the air outlet fin group 30 close to the heat dissipation fan 10, and the guide gap 93 is formed between the heat dissipation fan 10 and the inner chamfer 301. Providing the inner chamfer 301 is equivalent to providing a notch on the side of the air outlet fin group 30 close to the heat dissipation fan 10. It should be noted that the chamfer can be a planar chamfer, an inwardly concave arc-shaped chamfer, an outwardly convex arc-shaped chamfer (C-shaped angle), etc. Among them, the side of the air outlet fin group 30 close to the heat dissipation fan 10 is the first side, the side of the air outlet fin group 30 away from the heat dissipation fan 10 is the second side, and the side of the air outlet fin group 30 away from the heat conduction component is the third side; the inner chamfer 301 is located between the first side and the third side of the air outlet fin group 30.

[0123] In other embodiments, when the enclosure structure 50 is provided, the enclosure structure 50 may be chamfered to provide a notch to form a guide gap 93 for airflow to pass through. Alternatively, both the air outlet fin group 30 and the enclosure structure 50 may be chamfered to provide a notch.

[0124] Optionally, the air outlet fin is provided with an outer chamfer 302 on the side facing away from the heat dissipation fan 10 , and the outer chamfer 302 is located between the second side and the third side of the air outlet fin group 30 . The outer chamfer 302 is used to guide air to the housing outlet of the housing 80 .

[0125] Reference Figures 10 to 13 When the air outlet fin group 30 is provided with an inner end chamfer 301 and an outer end chamfer 302, after the airflow is blown out from the air outlet of the cooling fan 10, it enters the mixed flow channel 92. A part of the airflow is guided by the inner end chamfer 301 of the air outlet fin group 30 to reach the first heat dissipation channel 94 between the outer surface of the air outlet fin group 30 and the inner surface of the casing 80. The airflow takes away the heat of the casing 80 and the outer surface of the air outlet fin group 30. Then the airflow is blown out under the guidance of the outer end chamfer 302. At the outer end chamfer 302, the distance between the outer surface of the air outlet fin group 30 and the inner surface of the casing 80 gradually increases, which can make the airflow blowing process smoother, reduce abnormal noise, and improve heat dissipation efficiency.

[0126] In one embodiment, the enclosure structure 50 includes a heat balancing block 51, a first heat transfer member 421 is disposed between the heat conductive block 41 and the heat balancing block 51, and the air outlet fin group 30 is installed on the heat balancing block 51 and is in thermal contact with the heat balancing block 51. In this way, the heat of the electronic device (such as the CPU) is transferred to the air outlet fin group 30 through the heat conductive block 41, the heat transfer member, and the heat balancing block 51, and when the airflow passes through the inside and / or outside of the air outlet fin group 30, the heat is taken away to achieve heat dissipation.

[0127] Optionally, when the third heat transfer member 423 is provided, the third heat transfer member 423 is provided between the heat conducting block 41 and the heat equalizing block 51 .

[0128] Reference Figures 8 to 10 As shown in Figures 8 to 10 , the top surface of the heat sink 51 has a first region and a second region (not marked in the figure). The air outlet fin group 30 is installed in the first region and is in thermally conductive contact with the first region. The second region serves as the inner wall of the mixed-flow channel 92. The heat sink 51 can provide an installation position for the air outlet fin group 30 and can support and fix the air outlet fin group 30. The heat sink 51 also partially shields the outside of the space between the cooling fan 10 and the air outlet fin group 30 to serve as the inner wall of the mixed-flow channel 92. When the air flows into the mixed-flow channel 92, part of the heat of the heat sink 51 can be carried away.

[0129] Optionally, when the heat sink 51 is configured, a thermal pad 43 is provided at the bottom of the heat sink 51. The thermal pad 43 is also used for thermally conductive contact with the electronic device and can assist in dissipating heat from other components. Exemplarily, a circuit board 900 is provided on the lower side of the heat dissipation module. The heat conducting block 41 is a copper block, the heat transfer member is a copper tube, and the thermal pad 43 is a thermal silicone dot. The heat conducting block 41 is in thermally conductive contact with the CPU, and the thermal pad 43 contacts other components such as the power supply on the main board. In this way, the heat of the CPU can be conducted to the air outlet fin group 30 through the heat conducting block 41, the copper tube, and the heat sink 51 to achieve heat dissipation; and the heat of the heat generating components such as the power supply on the main board can be conducted to the heat sink 51 through the thermal pad 43 and then conducted to the air outlet fin group 30 to achieve heat dissipation. By providing the heat sink 51, the heat dissipation efficiency can be improved in cooperation with the thermal pad 43.

[0130] Optionally, a groove 511 is provided on the side of the heat sink 51 facing away from the air outlet fin group 30. The first heat transfer member 421 and the third heat transfer member 423 are heat transfer tubes, and at least part of the heat transfer tubes are embedded in the groove 511 and are in thermally conductive contact with the heat sink 51. By configuring the groove 511, on the one hand, the area for the heat transfer tubes to spread heat to the heat sink 51 can be increased, improving the heat dissipation efficiency, and on the other hand, the position stability of the heat transfer tubes can be improved to ensure reliable heat transfer.

[0131] In one embodiment, please refer to Figure 5 , Figure 8 , Figures 10 to 13 , the enclosure structure 50 includes the heat sink 51 and further includes a diversion bracket 52. The diversion bracket 52 and the air outlet fin group 30 are arranged on the same side of the heat sink 51. The diversion bracket 52 is connected to the heat sink 51; the inner wall of the diversion bracket 52 is the inner wall of the mixed-flow channel 92.

[0132] Optionally, the flow guiding bracket 52 is a U-shaped bracket. In the case of using a U-shaped bracket, one side of the spaced space between the heat dissipation fan 10 and the air outlet fin group 30 is blocked by the heat sink 51, and the other three sides are blocked by the U-shaped flow guiding bracket 52 to enclose and form a mixed flow channel 92. Among them, the air outlet fin group 30 is installed on the heat sink 51, and the flow guiding bracket 52 is installed on the heat sink 51, which is convenient for assembly. Exemplarily, the flow guiding bracket 52 includes a main frame portion and side frame portions on both sides. The side frame portions on both sides are locked to both side surfaces of the heat sink 51 by screws. Studs are provided in the second area on the top surface of the heat sink 51, and the main frame portion is locked to the studs by screws. Three sides of the flow guiding bracket 52 are fixed to the heat sink 51 through fasteners. The flow guiding bracket 52 is stably installed. When the air flow enters the mixed flow channel 92, the flow guiding bracket 52 remains stable without shaking or abnormal noise.

[0133] In other embodiments, the enclosure structure 50 can also be an integrally formed structure.

[0134] In one embodiment, please refer to Figures 1 to 3 , Figure 5 , Figures 7 to 10 , Figure 12 , the heat dissipation module further includes a mounting bracket 60. The heat dissipation fan 10 is connected to the mounting bracket 60, the heat dissipation block is connected to the mounting bracket 60, and the air inlet fin group 20 and the air outlet fin group 30 are directly or indirectly connected to the mounting bracket 60. The mounting bracket 60 is used to mount the entire heat dissipation module on the chassis 80.

[0135] Optionally, the heat conducting block 41 is a copper block, and the heat conducting block 41 is fixed to the fan bracket by riveting.

[0136] Optionally, the mounting bracket 60 is provided with a first mounting portion 61 and a second mounting portion 62. The heat dissipation fan 10 is mounted on the first mounting portion 61 through a first fastener 71, and the second mounting portion 62 of the mounting bracket 60 can be mounted on the chassis 80 through a second fastener 72. Exemplarily, the electronic device includes a circuit board 900. The second fastener 72 passes through the second mounting portion 62 of the mounting bracket 60 and the circuit board 900 and is fixed to the chassis 80 to fix the mounting bracket 60 on the side of the circuit board 900 facing away from the chassis 80.

[0137] Optionally, referring to Figure 2 , Figure 12 , the second fastener 72 is a spring stud. By using the spring stud to mount the mounting bracket 60 on the chassis 80, the circuit board 900 can be protected from being crushed.

[0138] In one embodiment, please refer to Figure 10 , Figure 12, the housing 80 includes a first housing plate 81 and a second housing plate disposed on opposite sides of the heat dissipation module. A fan air inlet 101 is provided on a side of the heat dissipation fan 10 close to the first housing plate 81. The circuit board 900 is disposed between the heat dissipation module and the second housing plate, and the heat conduction block 41 is disposed between the heat dissipation module and the circuit board 900. The fan air inlet 101 is disposed on a side facing away from the circuit board 900, avoiding electronic components blocking the path of air flowing into the heat dissipation fan 10, ensuring smooth air flow, enabling efficient heat removal, and also avoiding abnormal noises caused by unsmooth air flow.

[0139] Optionally, the intake fin group 20 includes a plurality of first fins 21 arranged at intervals, and an intake fin channel is formed between adjacent first fins 21; the exhaust fin group 30 includes a plurality of second fins 31 arranged at intervals, and an exhaust fin channel is formed between adjacent second fins 31. A space is provided between the heat dissipation fan 10 and the first housing plate 81. A fan air inlet 101 is provided on the top side of the heat dissipation fan 10, and a first heat dissipation channel 94 is formed between the top side of the heat dissipation fan 10 and the first housing plate 81. The exhaust fin group 30 is spaced from the first housing plate 81, and a second heat dissipation channel is formed between the exhaust fin group 30 and the first housing plate 81.

[0140] Please continue to refer to Figure 12 , Figure 13 , when the heat dissipation module of the electronic device is operating, the housing air inlet 801, the intake fin channel, the first heat dissipation channel 94, the fan air inlet 101, and the fan air outlet 102 are connected to form an air flow path. Among them, when air flows through the intake fin channel inside the intake fin group 20, it takes away the heat of the intake fin group 20, taking away part of the heat dissipated by the electronic components, and also helping to reduce the temperature of the outer surface of the housing 80 near the housing air inlet 801. When air flows through the first heat dissipation channel 94, it takes away the temperature of the first housing plate 81 beside the heat dissipation fan 10, helping to reduce the temperature of the outer surface of the middle area of the housing 80. When there is a heat transfer member or direct contact between the heat dissipation fan 10 and the heat conduction block 41, when air passes through the heat dissipation fan 10, it can also take away part of the heat dissipated by the electronic components.

[0141] The fan air outlet 102 is connected to the housing air outlet 802 through the exhaust fin channel, and the fan air outlet 102 is connected to the housing air outlet 802 through the second heat dissipation channel. Among them, after the heat dissipation fan 10 sends air out from the fan air outlet 102, when the air flows through the exhaust fin channel inside the exhaust fin group 30, it takes away heat and takes away the heat dissipated by the electronic components. After the heat dissipation fan 10 sends air out from the fan air outlet 102, part of the air also flows through the second heat dissipation channel, taking away the temperature of the first housing plate 81 beside the exhaust fin group 30, reducing the temperature of the outer surface of the housing 80 near the housing air outlet 802, and avoiding a burning sensation when touching the housing 80 in this area.

[0142] In the description of this article, it should be understood that the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0143] In the description of this specification, the description referring to terms such as "an embodiment" and "example" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0144] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0145] The technical principle of the present utility model has been described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present utility model and cannot be interpreted in any way as a limitation of the protection scope of the present utility model. Based on the explanations herein, those skilled in the art can think of other specific implementation manners of the present utility model without creative efforts, and these manners will all fall within the protection scope of the present utility model.

Claims

1. A heat dissipation module, characterized in that: include: A heat dissipation fan (10) is provided with a fan air outlet (102); An air inlet fin group (20) is arranged beside the heat dissipation fan (10) and staggered with the fan air outlet (102); An air outlet fin group (30) is arranged beside the heat dissipation fan (10) and faces the fan air outlet (102); A heat-conducting component comprises a heat-conducting block (41), a first heat-conducting member (421) and a second heat-conducting member (422); the heat-conducting block (41) is used to contact an electronic device; the first heat-conducting member (421) is arranged between the heat-conducting block (41) and the air outlet fin group (30); the second heat-conducting member (422) is arranged between the heat-conducting block (41) and the air inlet fin group (20), or the second heat-conducting member (422) is arranged between the air outlet fin group (30) and the air inlet fin group (20).

2. The heat dissipation module according to claim 1, characterized in that: The heat dissipation fan (10) is a centrifugal fan, the air outlet fin group (30) is directly opposite to the fan air outlet (102), and the air inlet fin group (20) is located on the side of the air outlet fin group (30) away from the fan air outlet (102).

3. The heat dissipation module according to claim 1, characterized in that: The heat dissipation fan (10) is a centrifugal fan, the heat dissipation fan (10) is provided with a fan air inlet (101), and the heat conduction block (41) is arranged on a side of the heat dissipation fan (10) facing away from the fan air inlet (101).

4. The heat dissipation module according to claim 3, characterized in that: The second heat transfer member (422) is arranged between the heat conduction block (41) and the air inlet fin group (20); the first heat transfer member (421) and the second heat transfer member (422) are an integral member; The heat-conducting assembly further comprises a third heat-conducting member (423), wherein the third heat-conducting member (423) is arranged between the heat-conducting block (41) and the air outlet fin group (30).

5. The heat dissipation module according to claim 1, characterized in that: The air outlet fin group (30) and the fan air outlet (102) are arranged at intervals, and a first spacing channel (91) is formed between the heat dissipation fan (10) and the air outlet fin group (30); The heat dissipation module further comprises an enclosure structure (50), wherein the enclosure structure (50) is connected to the air outlet fin group (30) and / or the heat dissipation fan (10), and the enclosure structure (50) surrounds the outside of the first spacing channel (91); the heat dissipation fan (10), the enclosure structure (50), and the air outlet fin group (30) form a mixed flow channel (92).

6. The heat dissipation module according to claim 5, characterized in that: A flow guiding gap (93) is provided between the air outlet fin group (30) and the enclosure structure (50), and the mixed flow channel (92) is connected to the space outside the air outlet fin group (30) through the flow guiding gap (93).

7. The heat dissipation module according to claim 6, characterized in that: An inner end chamfer (301) is provided between the first side and the third side of the air outlet fin group (30), and the guide gap (93) is formed between the enclosure structure (50) and the inner end chamfer (301); an outer end chamfer (302) is provided between the second side and the third side of the air outlet fin group (30); wherein the first side is the side of the air outlet fin group (30) close to the cooling fan (10), the second side is the side of the air outlet fin group (30) away from the cooling fan (10), and the third side is the side of the air outlet fin group (30) away from the heat conductive block (41).

8. The heat dissipation module according to any one of claims 5 to 7, characterized in that: The enclosure structure (50) comprises a heat equalizing block (51), the top surface of the heat equalizing block (51) having a first area and a second area, the air outlet fin group (30) is installed in the first area, and the second area is the inner wall of the mixed flow channel (92).

9. The heat dissipation module according to claim 8, characterized in that: The enclosure structure (50) further comprises a flow guide bracket (52), wherein the flow guide bracket (52) and the air outlet fin group (30) are arranged on the same side of the heat equalizing block (51), and the flow guide bracket (52) is connected to the heat equalizing block (51); the inner wall of the flow guide bracket (52) is the inner wall of the mixed flow channel (92).

10. The heat dissipation module according to any one of claims 1 to 7, characterized in that: It also includes a mounting bracket (60); the mounting bracket (60) is provided with a first mounting portion (61) and a second mounting portion (62); the heat dissipation fan (10) is mounted on the first mounting portion (61) via a first fastener (71), and the second mounting portion (62) can be mounted on the housing (80) via a second fastener (72); The heat conducting block (41) is connected to the mounting bracket (60).

11. The heat dissipation module according to any one of claims 1 to 7, characterized in that: The heat dissipation module further comprises a heat equalizing block (51), and the air outlet fin group (30) abuts against and is fixed to the heat equalizing block (51); A groove (511) is provided on a side of the heat equalizing block (51) facing away from the air outlet fin group (30); the first heat transfer member (421) and the second heat transfer member (422) are heat transfer pipes, and at least a portion of the heat transfer pipes is inserted into the groove (511); A thermal pad (43) is also provided on the side of the heat equalizing block (51) facing away from the air outlet fin group (30), and the thermal pad (43) is used to contact the electronic device.

12. An electronic device, characterized in that: The heat dissipation module comprises a housing (80), a circuit board (900) and a heat dissipation module according to any one of claims 1 to 11; the circuit board (900) and the heat dissipation module are arranged inside the housing (80); the circuit board (900) is provided with a plurality of electronic devices; and the heat conducting block (41) is in contact with the electronic devices; The casing (80) is provided with a casing air inlet (801) and a casing air outlet (802), the air inlet fin group (20) is provided at the casing air inlet (801), and the air outlet fin group (30) is provided at the casing air outlet (802).

13. The electronic device according to claim 12, characterized in that: The housing (80) comprises a first housing plate (81) and a second housing plate arranged on opposite sides of the heat dissipation module; a fan air inlet (101) is arranged on a side of the heat dissipation fan (10) close to the first housing plate (81); the circuit board (900) is arranged between the heat dissipation module and the second housing plate; and the heat conduction block (41) is arranged between the heat dissipation module and the circuit board (900); The heat dissipation fan (10) is spaced apart from the first shell plate (81), and a first heat dissipation channel (94) is formed between the heat dissipation fan (10) and the first shell plate (81); the air outlet fin group (30) is spaced apart from the first shell plate (81), and a second heat dissipation channel is formed between the air outlet fin group (30) and the first shell plate (81); The air inlet fin group (20) comprises a plurality of first fins (21) arranged at intervals, and an air inlet fin channel is formed between adjacent first fins (21); the air outlet fin group (30) comprises a plurality of second fins (31) arranged at intervals, and an air outlet fin channel is formed between adjacent second fins (31); The shell air inlet (801), the air inlet fin channel, the first heat dissipation channel (94), the fan air inlet (101), and the fan air outlet (102) are connected; The fan air outlet (102) is in communication with the shell air outlet (802) via the air outlet fin channel, and the fan air outlet (102) is in communication with the shell air outlet (802) via the second heat dissipation channel.

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