Heat pipe radiator structure
By adopting a heat pipe radiator structure in the photo-storage integrated machine and using the combination of heat pipes and ceramic sheets, the problem of insufficient heat dissipation in high-temperature areas is solved, and a more efficient heat dissipation effect is achieved, reducing noise and extending the system life.
Patent Information
- Application Number
- CN202422086643.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-08-27
AI Technical Summary
The existing photo storage integrated machine has insufficient heat dissipation in high-temperature areas, which leads to an increase in the system temperature. The fan power needs to be increased to force air-cooled heat dissipation, which affects the system life and generates noise.
The heat pipe radiator structure is adopted, including power plate assembly, radiator substrate, heat pipe assembly and ceramic sheet. The heat is transmitted to the heat pipe assembly through the ceramic sheet. The phase change heat dissipation performance of the heat pipe quickly and evenly conducts heat to the radiator substrate, and disperses to the surrounding air through the substrate.
Under the same space volume, better heat dissipation effect can be achieved, product temperature, noise and system life can be achieved.
Smart Images
Figure CN222981891U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photovoltaic energy storage integrated machines, and particularly to a heat pipe radiator structure. Background Art
[0002] With the continuous progress of power electronics technology and semiconductor technology, and the continuous maturity of battery process technology, the cost of inverters has been continuously reduced. The cost per kilowatt-hour of household photovoltaic energy storage integrated machines is close to that of fossil energy, and for foreign users, it is even better than the price of fossil energy power generation. A large number of photovoltaic energy storage integrated machines on the market have entered thousands of households. Due to safety factors such as batteries, household integrated machines are generally installed outdoors. In high-temperature regions, in order to enhance system heat dissipation and prevent system derating, the fan power is generally increased for forced air cooling. Since the fan life affects the system operation life and generates noise, especially at night, the noise may affect users' rest, so there is room for improvement. Summary of the Utility Model
[0003] Aiming at the deficiencies of the prior art, this application provides a heat pipe radiator structure to solve the above problems.
[0004] A heat pipe radiator structure includes a power board assembly, a radiator base material, a heat pipe assembly, and several ceramic sheets. The radiator base material includes a substrate. An installation groove matching the shape of the heat pipe assembly is formed on the substrate. The heat pipe assembly is embedded and installed in the installation groove. Several ceramic installation grooves for the ceramic sheets to be embedded are formed on the substrate. The upper end surface of the heat pipe assembly is in close contact with the lower end surface of the ceramic sheet. The power board assembly is installed on the substrate through installation screws, and the power module group on the power board assembly is in close contact with the upper end surface of the ceramic sheet.
[0005] By adopting the above technical solution, the power module group on the power board generates heat. The heat is transmitted to the ceramic sheet and then conducted to the heat pipe assembly through the ceramic sheet. The heat pipe assembly has good phase change heat dissipation performance, and the heat will be quickly conducted along the surface of the heat pipe assembly. The heat is quickly and evenly conducted along the surface of the heat pipe assembly to the radiator base material, and the radiator base material dissipates the heat into the surrounding air, completing the entire process of heat transfer. By adding a heat pipe assembly and ceramic sheets inside the radiator, a more efficient heat dissipation structure is formed. Under the same space volume, it can provide better heat dissipation effect, reduce the product temperature, and reduce noise.
[0006] Optionally, the heat pipe assembly includes a first heat pipe, a second heat pipe, a third heat pipe, and a fourth heat pipe. Corresponding installation grooves for the first heat pipe, the second heat pipe, the third heat pipe, and the fourth heat pipe to be embedded are formed on the substrate of the radiator base material.
[0007] Optionally, the power module group on the power board assembly includes a plurality of first power modules. The first heat pipe is located below all the first power modules and spans the bottom heat generation areas of all the first power modules. The portions of the first heat pipe extending beyond the two ends of the first power modules extend to the edges of the substrate.
[0008] Optionally, the power module group on the power board assembly includes a plurality of second power modules. The second heat pipe is located below all the second power modules and spans the bottom heat generation areas of all the second power modules. One end portion of the second heat pipe extending beyond the second power module extends to the edge of the substrate, and the other end portion extending beyond the second power module extends near the third heat pipe.
[0009] Optionally, the power module group on the power board assembly includes a plurality of third power modules. The third heat pipe is U-shaped. The third heat pipe is located below all the third power modules and spans the bottom heat generation areas of all the third power modules. One end of the third heat pipe extends between the second heat pipe and the first heat pipe, and the other end extends between the second heat pipe and the fourth heat pipe.
[0010] Optionally, the power module group on the power board assembly includes a plurality of fourth power modules. The fourth heat pipe is located below all the fourth power modules and spans the bottom heat generation areas of all the fourth power modules. The portions of the fourth heat pipe extending beyond the two ends of the fourth power module both extend to the edges of the substrate.
[0011] Optionally, the upper and lower end faces of each ceramic sheet are coated with thermal grease.
[0012] Optionally, a plurality of heat dissipation fins for increasing the heat dissipation area are uniformly arranged on the lower end face of the substrate.
[0013] Optionally, the radiator base material is an aluminum alloy profile of AL6063-T5.
[0014] In summary, the present application includes at least one of the following beneficial technical effects:
[0015] 1. The power module group on the power board generates heat, the heat is transmitted to the ceramic sheet, and then conducted to the heat pipe assembly through the ceramic sheet. The heat pipe assembly has good phase change heat dissipation performance, and the heat will be quickly conducted along the surface of the heat pipe assembly. The heat is quickly and evenly conducted along the surface of the heat pipe assembly to the radiator base material, and the radiator base material dissipates the heat into the surrounding air, completing the entire process of heat transfer; by adding a heat pipe assembly and a ceramic sheet inside the radiator, a more efficient heat dissipation structure is formed. Under the same space volume, it can provide a better heat dissipation effect, reduce the product temperature, and reduce noise.
[0016] 2. The radiator base is made of aluminum alloy profile, which has the advantages of light weight, excellent heat conduction performance, good oxidation resistance and corrosion resistance, is easy to process, and has a relatively low production cost. Brief Description of the Drawings
[0017] Figure 1 is a schematic structural diagram of an embodiment of the present application.
[0018] Figure 2 is an exploded schematic diagram of an embodiment of the present application.
[0019] Figure 3 is a schematic structural diagram of the radiator base in an embodiment of the present application
[0020] Figure 4 is a schematic diagram of the heat dissipation principle of the power module group on the radiator base in an embodiment of the present application.
[0021] Description of the Reference Numerals:
[0022] 1. First heat pipe; 2. Second heat pipe; 3. Third heat pipe; 4. Fourth heat pipe; 5. Radiator base; 6. Power board assembly; 7. First power module; 8. Second power module; 9. Third power module; 10. Fourth power module; 11. Ceramic chip; 12. Mounting screw. Detailed Embodiment
[0023] To facilitate the understanding of the present application, the present application will be described in more detail below in conjunction with the drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are only for the purpose of illustration.
[0024] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments, and are not used to limit the present application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.
[0025] An embodiment of the present application discloses a heat pipe radiator structure. Refer to Figure 1 、 Figure 2 and Figure 3, including a power board assembly 6, a radiator base material 5, a heat pipe assembly, and several ceramic chips 11. The radiator base material 5 is an aluminum alloy profile of AL6063-T5. The radiator base material 5 is an aluminum alloy profile, which has the advantages of light weight, excellent thermal conductivity, good oxidation resistance and corrosion resistance, and is easy to process with low production cost.
[0026] Refer to Figure 2 , Figure 3 and Figure 4 , the radiator base material 5 includes a substrate, and several heat dissipation fins for increasing the heat dissipation area are fixedly connected to the lower end surface of the substrate. The heat pipe assembly includes a first heat pipe 1, a second heat pipe 2, a third heat pipe 3, and a fourth heat pipe 4. The first heat pipe 1, the second heat pipe 2, the third heat pipe 3, and the fourth heat pipe 4 are all phase change heat dissipation copper pipes with a diameter of 6 mm. Four installation grooves respectively matching the shapes of the first heat pipe 1, the second heat pipe 2, the third heat pipe 3, and the fourth heat pipe 4 are formed on the upper end surface of the substrate, and the first heat pipe 1, the second heat pipe 2, the third heat pipe 3, and the fourth heat pipe 4 are respectively embedded in each installation groove.
[0027] Refer to Figure 2 , Figure 3 and Figure 4 , four ceramic installation grooves for the ceramic chips 11 to be embedded are formed on the substrate at the upper end openings of each installation groove. The upper end surfaces of the first heat pipe 1, the second heat pipe 2, the third heat pipe 3, and the fourth heat pipe 4 are all flat and are in close contact with the lower end surface of the ceramic chip 11. The power board assembly 6 is installed on the substrate through installation screws 12, and the power module group on the power board assembly 6 is in close contact with the upper end surface of the ceramic chip 11. The power module group on the power board generates heat, and the heat is transmitted to the ceramic chip 11, and then is conducted to the heat pipe assembly through the ceramic chip 11. The heat pipe assembly has good phase change heat dissipation performance, and the heat will be quickly conducted along the surface of the heat pipe assembly. The heat is quickly and evenly conducted along the surface of the heat pipe assembly to the radiator base material 5, and the radiator base material 5 dissipates the heat into the surrounding air, completing the entire process of heat transfer; by adding a heat pipe assembly and ceramic chips 11 inside the radiator, a more efficient heat dissipation structure is formed, and in the same space volume, better heat dissipation effect can be provided, the product temperature can be reduced, and the noise can be reduced.
[0028] Refer to Figure 2 , Figure 3 and Figure 4 , thermal conductive silicone grease is coated on both the upper end surface and the lower end surface of each ceramic chip 11. The thermal conductive silicone grease on the lower end surface of the ceramic chip 11 can make the ceramic chip 11 in good contact with the surfaces of the heat pipe assembly and the radiator base material 5, ensuring the thermal conductivity; the thermal conductive silicone grease on the upper end surface of the ceramic chip 11 can make the power module group in good contact with the ceramic chip 11, ensuring the heat dissipation performance.
[0029] Refer to Figure 2, the power module group on the power board assembly 6 includes four first power modules 7. The first heat pipe 1 is located below all the first power modules 7 and spans the bottom heat - generating areas of all the first power modules 7. The parts of both ends of the first heat pipe 1 extending beyond the first power modules 7 extend to the edge of the substrate.
[0030] Referring to Figure 2 , Figure 3 and Figure 4 , the power module group on the power board assembly 6 includes four second power modules 8. The second heat pipe 2 is located below all the second power modules 8 and spans the bottom heat - generating areas of all the second power modules 8. One part of the second heat pipe 2 extending beyond the second power module 8 extends to the edge of the substrate, and the other part of the second heat pipe 2 extending beyond the second power module 8 extends near the third heat pipe 3.
[0031] Referring to Figure 2 , Figure 3 and Figure 4 , the power module group on the power board assembly 6 includes eight third power modules 9. The third heat pipe 3 is U - shaped. The third heat pipe 3 is located below all the third power modules 9 and spans the bottom heat - generating areas of all the third power modules 9. One end of the third heat pipe 3 extends between the second heat pipe 2 and the first heat pipe 1, and the other end extends between the second heat pipe 2 and the fourth heat pipe 4.
[0032] Referring to Figure 2 , Figure 3 and Figure 4 , the power module group on the power board assembly 6 includes four fourth power modules 10. The fourth heat pipe 4 is located below all the fourth power modules 10 and spans the bottom heat - generating areas of all the fourth power modules 10. The parts of both ends of the fourth heat pipe 4 extending beyond the fourth power modules 10 both extend to the edge of the substrate.
[0033] The implementation principle of a heat - pipe radiator structure in an embodiment of this application is as follows: The power module group on the power board generates heat. The heat is transmitted to the ceramic sheet 11 and then conducted to the heat - pipe assembly through the ceramic sheet 11. The heat - pipe assembly has good phase - change heat - dissipation performance, and the heat will be quickly conducted along the surface of the heat - pipe assembly. The heat is quickly and evenly conducted along the heat - pipe surface to the radiator base material 5. The radiator base material 5 dissipates the heat into the surrounding air, completing the entire process of heat transfer; by adding a heat - pipe assembly and a ceramic sheet 11 inside the radiator, a more efficient heat - dissipation structure is formed. Under the same space volume, it can provide a better heat - dissipation effect, reduce the product temperature, and reduce noise.
[0034] The above are all the preferred embodiments of this application. It does not limit the protection scope of this application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.
Claims
1. A heat pipe radiator structure, characterized in that: The invention comprises a power board assembly (6), a heat sink substrate (5), a heat pipe assembly and a plurality of ceramic sheets (11); the heat sink substrate (5) comprises a base plate; a mounting groove matching the shape of the heat pipe assembly is provided on the base plate; the heat pipe assembly is embedded and installed in the mounting groove; a plurality of ceramic mounting grooves for embedding the ceramic sheets (11) are provided on the base plate; the upper end surface of the heat pipe assembly is in close contact with the lower end surface of the ceramic sheet (11); the power board assembly (6) is mounted on the base plate by means of mounting screws (12); and the power module group on the power board assembly (6) is in close contact with the upper end surface of the ceramic sheet (11).
2. A heat pipe radiator structure according to claim 1, characterized in that: The heat pipe assembly comprises a first heat pipe (1), a second heat pipe (2), a third heat pipe (3) and a fourth heat pipe (4); and the base plate of the heat sink substrate (5) is provided with corresponding mounting grooves for respectively embedding the first heat pipe (1), the second heat pipe (2), the third heat pipe (3) and the fourth heat pipe (4).
3. A heat pipe radiator structure according to claim 2, characterized in that: A plurality of first power modules (7) are arranged on the power board assembly (6); the first heat pipe (1) is located below all the first power modules (7) and spans across the bottom heating areas of all the first power modules (7); and portions of both ends of the first heat pipe (1) that extend beyond the first power modules (7) extend to the edge of the substrate.
4. A heat pipe radiator structure according to claim 2, characterized in that: A plurality of second power modules (8) are arranged on the power board assembly (6); the second heat pipe (2) is located below all the second power modules (8) and spans across the bottom heating area of all the second power modules (8); one end portion of the second heat pipe (2) extends beyond the second power module (8) to the edge of the substrate, and the other end portion of the second heat pipe (2) extends beyond the second power module (8) to the vicinity of the third heat pipe (3).
5. The heat pipe radiator structure according to claim 2, characterized in that: A plurality of third power modules (9) are arranged on the power board assembly (6); the third heat pipe (3) is U-shaped; the third heat pipe (3) is located below all the third power modules (9) and spans the bottom heating area of all the third power modules (9); one end of the third heat pipe (3) extends between the second heat pipe (2) and the first heat pipe (1), and the other end extends between the second heat pipe (2) and the fourth heat pipe (4).
6. The heat pipe radiator structure according to claim 2, characterized in that: A plurality of fourth power modules (10) are arranged on the power board assembly (6); the fourth heat pipe (4) is located below all the fourth power modules (10) and spans across the bottom heating area of all the fourth power modules (10); and portions of both ends of the fourth heat pipe (4) that extend beyond the fourth power modules (10) extend to the edge of the substrate.
7. The heat pipe radiator structure according to claim 1, characterized in that: The upper end surface and the lower end surface of each ceramic sheet (11) are coated with thermal conductive silicone grease.
8. The heat pipe radiator structure according to claim 1, characterized in that: The lower end surface of the base plate is evenly provided with a plurality of heat dissipation fins for increasing the heat dissipation area.
9. The heat pipe radiator structure according to claim 1, characterized in that: The heat sink substrate (5) is made of AL6063-T5 aluminum alloy profile.