Mechanical molecular pump temperature adjusting device
By using a combination of semiconductor refrigeration sheet and heat pipe in mechanical molecular pumps, the problems of rising rotor temperature and excessive stator temperature are solved, effective temperature regulation and reduced lubricant evaporation are achieved, and energy utilization efficiency is improved.
Patent Information
- Application Number
- CN202421671384.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-07-15
AI Technical Summary
The rotor temperature of the mechanical molecular pump rises and it is difficult to effectively dissipate heat, resulting in too high the stator temperature, causing the rotor to be unable to cool down through thermal radiation and instead rises, and the bearing temperature is too high, resulting in lubricating oil evaporation and contamination.
Using a semiconductor refrigeration sheet, a first heat pipe and a second heat pipe, it is connected to the first heat pipe through the cold end of the semiconductor refrigeration sheet, cools the bearing and the rotor, is connected to the second heat pipe through the hot end, heat the stator, and uses a heat dissipation fan and a heat conducting medium to optimize heat transfer.
It effectively reduces the temperature of the rotor, increases the temperature of the stator, reduces the evaporation and pollution of lubricating oil, and improves the efficiency of energy utilization.
Smart Images
Figure CN222991784U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of mechanical molecular pumps, in particular to a temperature regulation device for a mechanical molecular pump. Background Art
[0002] When the rotor of an existing molecular pump works, it collides with gas molecules, causing the temperature of the rotor to rise. Due to the vacuum environment inside the molecular pump, the rotor of the current molecular pump mainly relies on thermal radiation for heat dissipation. At the same time, in order to prevent reaction products in the semiconductor process gas extracted by the molecular pump from condensing and accumulating on the stator surface, it is necessary to increase the temperature of the stator.
[0003] The rotor of the molecular pump needs to reduce the temperature, while the stator needs to increase the temperature. In actual use, the temperature of the heated stator is higher than that of the rotor, resulting in the rotor not only being unable to reduce the temperature by thermal radiation to the stator, but instead causing the stator to further increase in temperature through thermal radiation.
[0004] Currently, the prior art uses a coating on the surface of the stator or rotor to reduce the thermal radiation efficiency and reduce the temperature increase of the rotor caused by the stator. However, the heated stator blocks the thermal radiation of the rotor to the outside through the stator, still causing the rotor to further increase in temperature.
[0005] In a mechanical molecular pump, the bearing is a rolling bearing and requires the use of lubricating oil or grease. If the bearing temperature is too high, it will not only reduce the bearing life, but also accelerate the evaporation of the lubricating oil, causing lubricating oil vapor pollution. Summary of the Utility Model
[0006] The utility model aims to solve the above problems and provides a temperature regulation device for a mechanical molecular pump, which solves the above technical problems.
[0007] A temperature regulation device for a mechanical molecular pump includes: a semiconductor refrigeration chip, a first heat pipe, and a second heat pipe. The cold end of the semiconductor refrigeration chip is fixedly connected to the first heat pipe, and the hot end of the semiconductor refrigeration chip is fixedly connected to the second heat pipe.
[0008] Furthermore, it further includes a first heat conduction pad and a second heat conduction pad. The first heat conduction pad is adhesively fixed to one end of the first heat pipe away from the cold end, and the second heat conduction pad is adhesively fixed to one end of the second heat pipe away from the hot end.
[0009] Furthermore, it further includes a heat conduction medium, which is respectively located between the hot end and the second heat pipe, and between the cold end and the first heat pipe. The heat conduction medium is used for transferring heat.
[0010] Further, it further includes a cooling fan and a first base. The semiconductor refrigeration chip is fixedly connected to the first base. The hot end and the cold end are respectively located on the left and right sides. A cooling fan is respectively arranged corresponding to the hot end and the cold end of the semiconductor refrigeration chip, and the housing of the cooling fan is fixed relative to the position of the semiconductor refrigeration chip.
[0011] Further, it further includes a first temperature sensor, a second temperature sensor and a control device. The cooling fan is electrically connected to the control device, and the first temperature sensor and the second temperature sensor are respectively electrically connected to the control device.
[0012] Further, it further includes a clamp, and the clamp is sleeved outside the second heat pipe.
[0013] Further, the first heat pipe and the second heat pipe are flexible heat pipes.
[0014] Further, one end of the first heat pipe away from the cold end is arranged in a circumferentially uniform distribution, and the number of the first heat pipes is greater than or equal to three.
[0015] Further, the first heat conduction pad and the second heat conduction pad are elastic heat conduction silica gel pads.
[0016] The utility model has the following advantages:
[0017] 1. The cold end of the semiconductor refrigeration chip cools the bearing through the first heat pipe, and then reduces the temperature of the bearing and the molecular pump rotor through heat transfer. The hot end heats the molecular pump stator through the second heat pipe, increases the temperature of the molecular pump stator, and then reduces the condensation of gas on the surface of the molecular pump stator;
[0018] 2. The semiconductor refrigeration chip is small in volume and high in efficiency, and the cold quantity and heat quantity generated by the semiconductor refrigeration chip are both utilized in the molecular pump, improving the energy utilization efficiency;
[0019] 3. The temperature of the lubricating oil in the bearing is reduced, the evaporation amount of the lubricating oil is reduced, and the pollution of the lubricating oil vapor is reduced. Description of the Drawings
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only one embodiment of the present utility model. For those of ordinary skill in the art, without creative efforts, other implementation drawings can also be obtained according to the provided drawings.
[0021] Figure 1 : The front view structural schematic diagram of the present utility model;
[0022] Figure 2: The first schematic structural diagram of the structure installed in the molecular pump of the present utility model;
[0023] Figure 3 : At Figure 2 The partial enlarged structural diagram at position A;
[0024] Figure 4 : At Figure 2 The partial enlarged structural diagram at position B;
[0025] Figure 5 : The second schematic structural diagram of the structure installed in the molecular pump of the present utility model. Detailed implementation manners
[0026] The present utility model will be further described below in conjunction with the drawings and examples:
[0027] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.
[0028] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0029] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.
[0030] As Figures 1 to 5 shown, a mechanical molecular pump temperature regulation device includes: a semiconductor refrigeration sheet 7, a first heat pipe 73, and a second heat pipe 75. The cold end 72 of the semiconductor refrigeration sheet 7 is fixedly connected to the first heat pipe 73, and the hot end 71 of the semiconductor refrigeration sheet 7 is fixedly connected to the second heat pipe 75.
[0031] Further, it further includes a first heat-conducting pad 74 and a second heat-conducting pad 76. The first heat-conducting pad 74 is adhesively fixed to one end of the first heat pipe 73 away from the cold end 72, and the second heat-conducting pad 76 is adhesively fixed to one end of the second heat pipe 75 away from the hot end 71.
[0032] Further, it further includes a heat-conducting medium 780. The heat-conducting medium 780 is respectively located between the hot end 71 and the second heat pipe 75, and between the cold end 72 and the first heat pipe 73. The heat-conducting medium 780 is used for transferring heat. Preferably, the heat-conducting medium 780 is silicone grease or a heat-conducting pad.
[0033] Further, it further includes a cooling fan 78 and a first base 79. The thermoelectric cooler 7 is fixedly connected to the first base 79. The hot end 71 and the cold end 72 are respectively located on the left and right sides. A cooling fan 78 is respectively arranged corresponding to the hot end 71 and the cold end 72 of the thermoelectric cooler 7, and the housing of the cooling fan 78 is fixed relative to the position of the thermoelectric cooler 7.
[0034] Further, it further includes a first temperature sensor 18, a second temperature sensor 22 and a control device. The cooling fan 78 is electrically connected to the control device, and the first temperature sensor 18 and the second temperature sensor 22 are respectively electrically connected to the control device.
[0035] Further, it further includes a clamp 77. The clamp 77 is sleeved on the outer side of the second heat pipe 75.
[0036] Further, the first heat pipe 73 and the second heat pipe 75 are flexible heat pipes. The middle section of the flexible heat pipe can be bent to change the position of the thermoelectric cooler 7 relative to the molecular pump, which is convenient for installation and transportation.
[0037] Further, the ends of the first heat pipe 73 away from the cold end 72 are arranged in a circumferentially uniform manner, and the number of the first heat pipes 73 is greater than or equal to three.
[0038] Further, the first heat-conducting pad 74 and the second heat-conducting pad 76 are elastic heat-conducting silica gel pads, which can buffer the vibration of the bearing 6 when the rotating shaft 3 rotates at a high speed.
[0039] Preferably, the heat-conducting silica gel pad has its own adhesiveness.
[0040] In the prior art, a molecular pump includes a base 1, a housing 2, a rotating shaft 3, a molecular pump stator 4, a molecular pump rotor 5, and a bearing 6. The base 1 and the housing 2 are fixedly connected. The rotating shaft 3 is rotatably connected to the base 1 through the bearing 6. The molecular pump stator 4 is located inside the housing 2 and fixedly connected to the housing 2. The molecular pump rotor 5 is fixedly connected to the rotating shaft 3. A cable interface 12 is formed on the side of the base 1, and the cable interface 12 is a prior art. A wire passes through the cable interface 12 to supply power to devices such as a motor stator 13. The motor stator 13 drives a motor rotor 31 fixedly connected to the rotating shaft 3 to rotate. An air inlet 21 is formed at the upper end of the housing 2, and an air outlet 11 is formed on the side of the base 1. The air inlet 21 and the air outlet 11 are communicated. After the gas enters the housing 2 from the air inlet 21, it finally exits from the air outlet 11.
[0041] During use, a first heat conducting pad 74 is adhesively fixed to the outer ring of the bearing 6 of the molecular pump. One side of the first heat pipe 73 away from the first heat conducting pad 74 is adhesively bonded and fitted to the base 1 or a bearing seat 14 fixedly connected to the base 1. Among them, the first heat pipe 73 can directly pass through the base 1, as Figure 2 and Figure 5 shown by the first heat pipe 73 on the left; it can also pass through the cable interface 12 and penetrate out of the base 1.
[0042] The second heat pipe 75 can be located outside the housing 2 (as Figure 2 shown). The second heat conducting pad 76 is in contact with the outer side surface of the housing 2. At this time, the second temperature sensor 22 is located outside the housing 2 and in contact with the outer side surface of the housing 2. A clamp 77 is sleeved outside the second heat pipe 75 to press and fix the second heat pipe 75 outside the housing 2. The second heat pipe 75 can also pass through the housing 2 (as Figure 5 shown). The second heat conducting pad 76 is in contact with the outer side surface of the molecular pump stator 4. At this time, the second temperature sensor 22 is in contact with the outer side surface of the molecular pump stator 4.
[0043] Preferably, the first temperature sensor 18 is an infrared temperature sensor, and the second temperature sensor 22 is a contact type temperature sensor. The first temperature sensor 18 is used to detect the temperature of the rotating shaft 3 or the molecular pump rotor 5, and the second temperature sensor 22 is used to detect the temperature of the housing 2 or the molecular pump stator 4.
[0044] During operation, the hot end of the semiconductor refrigeration chip 7 heats the molecular pump stator 4 through the second heat pipe 75 to prevent process gas from condensing on the blades of the molecular pump stator 4. The cold end of the semiconductor refrigeration chip 7 cools the outer ring of the bearing 6 through the first heat pipe 73. Through the heat transfer of the lubricating oil and the rotor, the temperature of the inner ring of the bearing 6 is reduced, and further the temperatures of the rotating shaft 3 and the molecular pump rotor 5 are reduced, avoiding overheating of the rotating shaft 3 and the molecular pump rotor 5 due to high rotational speed. At the same time, the problem that the heat dissipation of the molecular pump rotor 5 becomes more difficult due to the increase in the heat radiation of the molecular pump stator 4 during heating is eliminated.
[0045] Moreover, the temperature drop of the lubricating oil in the bearing 6 can reduce the evaporation and leakage of the lubricating oil, and reduce the pollution of the semiconductor processing environment and equipment by the lubricating oil vapor.
[0046] The control device adjusts the rotation speed of the cooling fan 78 according to the detected temperature. If the temperature detected by the second temperature sensor 22 is lower than the calibration temperature and the temperature detected by the first temperature sensor 18 is higher than the calibration temperature, the cooling fan 78 does not work; if the second temperature sensor 22 is too high and the temperature detected by the first temperature sensor 18 is within the normal range, the cooling fan 78 at the hot end works to dissipate the excess heat; if the temperature detected by the second temperature sensor 22 is within the normal range and the temperature of the first temperature sensor 18 is too low, the cooling fan 78 at the cold end works to dissipate the excess cold.
[0047] The present invention has been described by way of example above, but the present invention is not limited to the above specific embodiments, and any modifications or variations based on the present invention fall within the scope of protection of the present invention.
Claims
1. A mechanical molecular pump temperature regulating device, characterized in that: include: A semiconductor refrigeration plate (7), a first heat pipe (73) and a second heat pipe (75), wherein the cold end (72) of the semiconductor refrigeration plate (7) is fixedly connected to the first heat pipe (73), the first heat pipe (73) is connected to a base (1) of a molecular pump or a bearing seat (14) fixedly connected to the base (1), the hot end (71) of the semiconductor refrigeration plate (7) is fixedly connected to the second heat pipe (75), and the second heat pipe (75) is connected to a housing (2) of the molecular pump.
2. A mechanical molecular pump temperature regulating device according to claim 1, characterized in that: It also includes a first thermally conductive pad (74) and a second thermally conductive pad (76), wherein the first thermally conductive pad (74) is bonded and fixed to an end of the first heat pipe (73) away from the cold end (72), and the second thermally conductive pad (76) is bonded and fixed to an end of the second heat pipe (75) away from the hot end (71).
3. A mechanical molecular pump temperature regulating device according to claim 1, characterized in that: It also includes a heat-conducting medium (780), which is respectively located between the hot end (71) and the second heat pipe (75), and the cold end (72) and the first heat pipe (73), and is used to transfer heat.
4. A mechanical molecular pump temperature regulating device according to claim 1, characterized in that: It also includes a heat dissipation fan (78) and a first base (79), the semiconductor cooling plate (7) is fixedly connected to the first base (79), the hot end (71) and the cold end (72) are respectively located on the left and right sides, a heat dissipation fan (78) is respectively provided at the hot end (71) and the cold end (72) of the semiconductor cooling plate (7), and the outer shell of the heat dissipation fan (78) is fixedly positioned relative to the semiconductor cooling plate (7).
5. A mechanical molecular pump temperature regulating device according to claim 4, characterized in that: It also includes a first temperature sensor (18), a second temperature sensor (22) and a control device, wherein the cooling fan (78) is electrically connected to the control device, and the first temperature sensor (18) and the second temperature sensor (22) are electrically connected to the control device respectively.
6. A mechanical molecular pump temperature regulating device according to claim 1, characterized in that: It also includes a clamp (77), wherein the clamp (77) is sleeved on the outside of the second heat pipe (75).
7. A mechanical molecular pump temperature regulating device according to claim 1, characterized in that: The first heat pipe (73) and the second heat pipe (75) are flexible heat pipes.
8. A mechanical molecular pump temperature regulating device according to claim 2, characterized in that: The first heat pipes (73) are evenly arranged in a circle at one end away from the cold end (72), and the number of the first heat pipes (73) is greater than or equal to three.
9. A mechanical molecular pump temperature regulating device according to claim 2, characterized in that: The first thermally conductive pad (74) and the second thermally conductive pad (76) are elastic thermally conductive silicone pads.