High-efficiency heat dissipation circuit board with multiple electrical components

Abstract

The utility model discloses an efficient heat dissipation circuit board with multiple electric appliance elements, which comprises a circuit board body and the electric appliance elements arranged on the circuit board body, the circuit board body is divided into a middle area and an annular peripheral area, the electric appliance elements with large heat productivity are arranged in the middle area, and the electric appliance elements with small heat productivity are arranged in the peripheral area. A heat dissipation plate is arranged in the middle area; at least two mounting holes are formed in the peripheral area, mounting column heads are arranged at the mounting holes, limiting pressing columns with top caps are detachably arranged at one ends of the mounting column heads, the limiting pressing columns penetrate through the heat dissipation plate, and elastic springs are arranged on the limiting pressing columns in a sleeving mode; one end of the elastic spring abuts against the top cap, and the other end of the elastic spring abuts against the top surface of the heat dissipation plate to apply elastic force close to the circuit board body to the heat dissipation plate. According to the application, the circuit board body is partitioned, the electric appliance element with high heat productivity is arranged in the middle area of the circuit board body, the heat dissipation plate attached to the electric appliance element is arranged in the middle area, and the heat dissipation plate is always attached to the electric appliance element through compression of the limiting compression columns and the elastic springs, so that automatic compensation is realized in the use process; in addition, the electric appliance elements with low heat productivity are arranged in the peripheral area, and the heat dissipation efficiency of the whole circuit board is improved in a zoning and auxiliary heat dissipation mode.

Description

Technical Field

[0001] The utility model relates to a circuit board, in particular to a circuit board with high heat dissipation for multiple electrical components. Background Art

[0002] The main purpose of a circuit board is to provide connection and support for electrical components and realize the functions of a circuit. Circuit boards are widely used in various electronic devices, including computers, communication devices, consumer electronics, industrial control systems, medical devices, etc. Different types of circuit boards are suitable for different application scenarios and need to be selected according to specific requirements.

[0003] The patent with the application number CN201410240572.7 discloses a high heat dissipation circuit board group, which has a circuit board and a heat dissipation device; the circuit board has a plurality of electronic components, at least one heat dissipation hole and at least one heat conducting material, wherein the electronic components are arranged on the top surface of the circuit board, each heat dissipation hole penetrates through the top surface and the bottom surface of the circuit board and is opposite to one of the electronic components, and each heat conducting material is accommodated in the corresponding heat dissipation hole and contacts the electronic component opposite to the heat dissipation hole; the heat dissipation device is flatly attached to the bottom surface of the circuit board and contacts each heat conducting material; the waste heat generated by the electronic components during the operation of the circuit board can be quickly conducted to the heat dissipation device for heat dissipation through the heat conducting material with a high heat conduction coefficient.

[0004] The above patent attaches the heat dissipation device flatly to the bottom surface of the circuit board and contacts each heat conducting material, which has two problems. One is that close installation requires welding, and the welding process is relatively complex. The other is that after using for a period of time, the welding part is corroded or loosened under the action of thermal expansion and contraction, resulting in gaps, thus weakening the heat dissipation efficiency. Summary of the Utility Model

[0005] Based on the deficiency that the heat conducting structure attached flatly will loosen and form gaps after using for a period of time, resulting in weakened heat dissipation efficiency in the prior art, the utility model provides a circuit board with high heat dissipation for multiple electrical components.

[0006] The technical solution adopted by the utility model to solve the above technical problems is as follows:

[0007] A circuit board with efficient heat dissipation for multiple electrical components, including a circuit board body and electrical components mounted on the circuit board body. The circuit board body is divided into a central area and an annular peripheral area. Electrical components with high heat generation are mounted in the central area, and electrical components with low heat generation are mounted in the peripheral area. A heat dissipation plate is provided in the central area; at least two mounting holes are provided in the peripheral area, and mounting studs are provided at the mounting holes. One end of the mounting stud is detachably provided with a limiting pressure column with a top cap. The limiting pressure column penetrates through the heat dissipation plate and a elastic spring is sleeved thereon. One end of the elastic spring abuts against the top cap and the other end abuts against the top surface of the heat dissipation plate to apply an elastic force close to the circuit board body to the heat dissipation plate.

[0008] Preferably, the heat dissipation plate includes a bottom plate parallel to the circuit board body and a plurality of heat dissipation fins provided on the bottom plate and perpendicular to the bottom plate.

[0009] Preferably, the heat dissipation fins are arranged in parallel. The heat dissipation fins include a plurality of partitions, and the distances between the heat dissipation fins within the partitions are the same. The distance between the two closest heat dissipation fins in adjacent partitions is greater than the distance between adjacent heat dissipation fins within the partitions.

[0010] Preferably, the electrical components on the front surface of the central area are a plurality of electrical components attached to the circuit board body.

[0011] Preferably, a mounting assembly is provided on the back surface of the central area. There is a gap between the mounting assembly and the back surface of the circuit board body. The main mounting assembly is used to mount a control chip.

[0012] Preferably, the mounting assembly includes two mounting plates spaced apart on the circuit board body and a mounting seat provided on the mounting plates. The control chip is arranged on the mounting seat. Connecting circuits for connecting the circuit of the circuit board body and the circuit of the control chip are provided on the mounting plates and the mounting seat.

[0013] Preferably, the mounting stud includes a frustum at the bottom and a cylinder at the top. The maximum diameter of the frustum is greater than the aperture of the mounting hole, and the diameter of the cylinder is less than the aperture of the mounting hole. The cylinder extends into the mounting hole from the bottom of the mounting hole, and the limiting pressure column is detachably fixed on the cylinder.

[0014] Preferably, external threads are provided on the cylinder, and the limiting pressure column has internal threads and is threadedly connected to the cylinder.

[0015] Preferably, a power interface and a data interface are also provided in the peripheral area.

[0016] Preferably, a fan plug connector is also provided in the peripheral area. The fan plug connector is located at the end of the heat dissipation fin.

[0017] Compared with the prior art, the advantages of the present utility model are as follows: In this application, the circuit board body is partitioned, and electrical components with large heat generation are arranged in the middle area of the circuit board body. A heat dissipation plate is arranged in the middle area and is always attached to the electrical components by means of a limiting pressure column and a elastic spring. During use, automatic compensation is carried out to ensure a high heat dissipation efficiency. In addition, electrical components with small heat generation are arranged in the peripheral area, and the heat dissipation efficiency of the entire circuit board is improved through partitioning and auxiliary heat dissipation means. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present utility model will be further described in detail below in conjunction with the drawings and preferred embodiments. However, those skilled in the art will understand that these drawings are only drawn for the purpose of explaining the preferred embodiments and should not be construed as limiting the scope of the present utility model. In addition, unless otherwise specified, the drawings only schematically show the composition or structure of the described object and may include exaggerated displays, and the drawings are not necessarily drawn to scale.

[0019] Figure 1 is a perspective view of the present utility model;

[0020] Figure 2 is a top view of the present utility model;

[0021] Figure 3 is a perspective view of the present utility model (removing the heat dissipation plate);

[0022] Figure 4 is a perspective view of the present utility model;

[0023] Figure 5 is a perspective view of the bottom of the present utility model;

[0024] In the figure: 10, circuit board body; 20, electrical components; 30, heat dissipation plate; 301, bottom plate; 302, heat dissipation fins; 401, mounting stud; 402, limiting pressure column; 403, elastic spring; 501, mounting plate; 502, mounting seat; 503, control chip;. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The preferred embodiments of the present utility model will be described in detail below with reference to the drawings. Those skilled in the art will understand that these descriptions are only descriptive and exemplary and should not be construed as limiting the protection scope of the present utility model.

[0026] It should be noted that: Similar reference numerals represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it may not be further defined and explained in subsequent drawings.

[0027] Embodiment

[0028] This embodiment mainly elaborates on the title of a circuit board with high - efficiency heat dissipation for multiple electrical components, as follows:

[0029] Main solution :

[0030] A circuit board with high - efficiency heat dissipation for multiple electrical components, as Figures 1 - 5 shown, includes a circuit board body 10 and electrical components 20 mounted on the circuit board body 10. The circuit board body 10 is divided into a central area and an annular peripheral area. The electrical components 20 with large heat generation are mounted in the central area, and the electrical components 20 with small heat generation are mounted in the peripheral area. A heat dissipation plate 30 is provided in the central area; at least two mounting holes are provided in the peripheral area, and mounting studs 401 are provided at the mounting holes. One end of the mounting stud 401 is detachably provided with a limiting pressure column 402 with a top cap. The limiting pressure column 402 penetrates through the heat dissipation plate 30 and a spring 403 is sleeved thereon. One end of the spring 403 abuts against the top cap and the other end abuts against the top surface of the heat dissipation plate 30 to apply an elastic force close to the circuit board body 10 to the heat dissipation plate 30.

[0031] Heat sink part :

[0032] As Figures 1 - 2 shown, the heat dissipation plate 30 includes a bottom plate 301 parallel to the circuit board body 10 and a plurality of heat dissipation fins 302 provided on the bottom plate 301 and perpendicular to the bottom plate 301.

[0033] Preferably, the heat dissipation fins 302 are arranged in parallel. The heat dissipation fins 302 include several partitions. The distances between the heat dissipation fins 302 within the partition are the same, and the distance between the two closest heat dissipation fins 302 in adjacent partitions is greater than the distance between adjacent heat dissipation fins 302 within the partition. The heat dissipation fins 302 gradually increase in height from the middle to both sides.

[0034] Distribution of electrical components :

[0035] As Figures 1 - 5 shown, the electrical components 20 on the front of the central area are several electrical components 20 pasted on the circuit board body 10.

[0036] Preferably, an installation component is provided on the back of the central area. There is a gap between the installation component and the back of the circuit board body 10. The installation component is used to install the control chip 503. Installing the control chip 503 on the back and dispersing it from other electrical components 20 can avoid local heat accumulation.

[0037] Preferably, the mounting component includes two mounting plates 501 spaced apart on the circuit board body 10 and a mounting seat 502 disposed on the mounting plate 501. The control chip 503 is disposed on the mounting seat 502. A connection circuit for connecting the circuit of the circuit board body 10 and the circuit of the control chip 503 is provided on the mounting plate 501 and the mounting seat 502.

[0038] Preferably, a power interface and a data interface are further provided in the peripheral area. Both the power interface and the data interface are structures with relatively small heat generation, and being provided in the periphery will not be affected.

[0039] Preferably, a fan socket is further provided in the peripheral area. The fan socket is located at the end of the heat sink 302. When in use in summer, a fan can be added to the circuit board to further improve its heat dissipation effect.

[0040] Installation structure of heat sink :

[0041] As Figure 4 shown, the mounting post includes a frustum at the bottom and a cylinder at the top. The maximum diameter of the frustum is greater than the aperture of the mounting hole, the diameter of the cylinder is less than the aperture of the mounting hole, the cylinder extends into the mounting hole from the bottom of the mounting hole, and the limiting pressure post 402 is detachably fixed on the cylinder.

[0042] Preferably, an external thread is provided on the cylinder, and the limiting pressure post 402 has an internal thread and is threadedly connected to the cylinder.

[0043] The above has introduced the title provided by the present utility model in detail. Specific examples are used in this article to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the present utility model and its core idea. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present utility model, several improvements and modifications can be made to the present utility model, and these improvements and modifications also fall within the protection scope of the claims of the present utility model.

Claims

1. A circuit board with high efficiency heat dissipation of multiple electrical components, comprising a circuit board body and electrical components mounted on the circuit board body, characterized in that: The circuit board body is divided into a central area and an annular peripheral area. Electrical components with high heat generation are installed in the central area, and electrical components with low heat generation are installed in the peripheral area. The central area is provided with a heat sink; the peripheral area is provided with at least two mounting holes, and mounting column heads are provided at the mounting holes. A limit pressure column with a top cap is detachably provided at one end of the mounting column head. The limit pressure column passes through the heat sink and is sleeved with an elastic spring. One end of the elastic spring abuts against the top cap and the other end abuts against the top surface of the heat sink to apply an elastic force close to the circuit board body to the heat sink.

2. The circuit board with high efficiency heat dissipation of multiple electrical components according to claim 1, characterized in that: The heat dissipation plate comprises a bottom plate parallel to the circuit board body and a plurality of heat dissipation fins arranged on the bottom plate and perpendicular to the bottom plate.

3. The circuit board with high efficiency heat dissipation of multiple electrical components according to claim 2, characterized in that: The heat sinks are arranged in parallel, and the heat sinks include a plurality of partitions. The heat sinks in the partitions have the same spacing, and the spacing between two closest heat sinks in adjacent partitions is greater than the spacing between adjacent heat sinks in the partitions.

4. The circuit board with high efficiency heat dissipation of multiple electrical components according to claim 1, characterized in that: The electrical components on the front side of the middle area are a plurality of electrical components attached to the circuit board body.

5. The circuit board with high efficiency heat dissipation of multiple electrical components according to claim 1, characterized in that: A mounting component is provided on the back of the middle area, and a gap is provided between the mounting component and the back of the circuit board body. The mounting component is used to install a control chip.

6. The circuit board with high efficiency heat dissipation of multiple electrical components according to claim 5, characterized in that: The mounting assembly includes two mounting plates spaced apart on the circuit board body and a mounting seat arranged on the mounting plates, the control chip is arranged on the mounting seat, and the mounting plates and the mounting seat are provided with a connecting circuit that connects the circuit board body circuit and the control chip circuit.

7. The circuit board with high efficiency heat dissipation of multiple electrical components according to claim 1, characterized in that: The mounting column includes a frustum at the bottom and a cylinder at the top. The maximum diameter of the frustum is larger than the aperture of the mounting hole, and the diameter of the cylinder is smaller than the aperture of the mounting hole. The cylinder extends from the bottom of the mounting hole into the mounting hole, and the limiting pressure column is detachably fixed on the cylinder.

8. The circuit board with high efficiency heat dissipation of multiple electrical components according to claim 7, characterized in that: The cylinder is provided with an external thread, and the limiting pressure column has an internal thread which is connected with the cylinder thread.

9. The circuit board with high efficiency heat dissipation of multiple electrical components according to claim 1, characterized in that: The peripheral area also has power and data interfaces.

10. The circuit board with high efficiency heat dissipation of multiple electrical components according to claim 2 or 3, characterized in that: The peripheral area also has a fan plug connector, which is located at the end of the heat sink.

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