PCB heat dissipation structure

Abstract

The utility model relates to the technical field of circuit boards, in particular to a PCB (printed circuit board) heat dissipation structure which comprises a fixed plate, a heat dissipation plate is fixedly connected to the upper side of the fixed plate, vent holes are formed in the surface of the heat dissipation plate, heat dissipation fan blades are arranged in the vent holes, and a heat dissipation mechanism is arranged on the front side of the heat dissipation plate. The heat dissipation mechanism comprises a mounting plate, clamping grooves, heat conduction plates, clamping blocks and heat dissipation fins, the multiple sets of heat conduction plates are arranged, the rear end of the heat conduction plate on the lowermost side is fixedly connected with the position, close to the lower side, of the mounting plate, and a circuit board body is clamped to the upper surfaces of the heat conduction plates; a plurality of groups of heat conducting plates fixed with circuit board bodies are sequentially mounted on the side surface of the mounting plate, then the connecting blocks on the surface of the circuit board on the upper side are inserted into the connecting grooves in the surface of the circuit board on the lower side, circuits of the two groups of circuit board bodies are connected, and the air circulation speed among a plurality of groups of heat dissipation fins is increased through rotation of heat dissipation fan blades. Therefore, the heat dissipation speed and the heat dissipation effect of the multi-layer PCB are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and particularly relates to a heat dissipation structure for a PCB board. Background Art

[0002] The names of circuit boards (PCBs) include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, printed circuit boards, PCB boards, etc. With the rapid development of electronic technology, the functions of circuit boards are becoming more and more complex. Circuit boards have developed from single-sided to double-sided and multi-layer, and are developing towards high precision, high density and high reliability. Therefore, the heat dissipation of circuit boards is particularly important.

[0003] Among them, the patent with publication number CN219145725U discloses an embedded PCB board heat dissipation structure. The main body module includes a limit frame, a heat conduction plate fixed at the bottom end of the limit frame, a plurality of support rods symmetrically fixed on both sides of the heat conduction plate, heat dissipation fins fixedly arranged in an array at the bottom end of the heat conduction plate, a bottom plate fixed at the bottom end of the heat dissipation fins, a fan installed on the inner wall of the bottom plate, a fixed frame with its end hinged to the end of the limit frame, locking components symmetrically installed on the fixed frame, and a PCB board main body fitted in the limit frame. The limit frame is used to limit and fix the PCB board main body to maintain the stability of the PCB board main body. The heat conduction plate is integrally fixed at the bottom end of the limit frame and is used to absorb the heat generated when the PCB board main body works and dissipate the heat. A serpentine flow channel is opened in the inner cavity of the heat conduction plate for the coolant to flow. This embedded PCB board heat dissipation structure has the advantages of high heat dissipation efficiency and convenient use.

[0004] This device drives the fan blades to rotate through a motor and cooperates with the serpentine flow channel to dissipate heat from the bottom of the circuit board. Since the circuit board is gradually developing towards a multi-layer circuit board, when multiple multi-layer circuit boards are stacked together, the heat dissipation effect of this device on the upper circuit board is poor, which has certain limitations and a poor heat dissipation effect on multi-layer circuit boards.

[0005] Therefore, it is very necessary to invent a heat dissipation structure for a PCB board to solve the above problems. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a heat dissipation structure for a PCB board to solve the problem that in the technology, since the circuit board is gradually developing towards a multi-layer circuit board, when multiple multi-layer circuit boards are stacked together, the heat dissipation effect of this device on the upper circuit board is poor, which has certain limitations and a poor heat dissipation effect on multi-layer circuit boards.

[0007] To achieve the above object, the present utility model provides the following technical solution: A heat dissipation structure for a PCB board, including a fixing plate, a heat dissipation plate is fixedly connected to the upper side of the fixing plate, ventilation holes are provided on the surface of the heat dissipation plate, a heat dissipation fan blade is arranged inside the ventilation holes, and a heat dissipation mechanism is arranged on the front side of the heat dissipation plate. The heat dissipation mechanism includes a mounting plate, a card slot, a heat conduction plate, a clamping block, and heat dissipation fins. A plurality of groups of heat conduction plates are provided, and the rear end of the lowermost heat conduction plate is fixedly connected to a position near the lower side of the mounting plate. The circuit board body is clamped on the upper surface of the heat conduction plate.

[0008] By adopting the above technical solution, the circuit board body is fixed on the upper surface of the heat conduction plate, then a plurality of groups of circuit boards are stacked and installed together, and a plurality of groups of circuit boards are installed on the side of the heat dissipation plate. During use, the heat dissipation fan blade is driven to rotate by an electric motor to synchronously dissipate heat from a plurality of groups of circuit boards, improving the heat dissipation effect of the multi-layer circuit board.

[0009] Optionally, two groups of mounting plates are provided, and the two groups of mounting plates are respectively fixedly connected to the left and right sides of the front surface of the heat dissipation plate. The card slot is opened on the front surface of the mounting plate.

[0010] By adopting the above technical solution, the mounting plate is used to fix a plurality of groups of heat conduction plates.

[0011] Optionally, the clamping block is fixed to the rear end of the heat conduction plate, the clamping block is slidably connected to the card slot, and the heat dissipation fins are fixedly connected to the lower surface of the heat conduction plate.

[0012] By adopting the above technical solution, the clamping block is placed inside the card slot, and then the heat conduction plate is fixed on the surface of the mounting plate.

[0013] Optionally, two groups of support blocks are fixedly connected to both the left and right ends of the heat conduction plate. A sliding groove is opened inside the support block, and positioning grooves are opened on the front and rear inner walls of the sliding groove.

[0014] Optionally, a slider is slidably connected inside the sliding groove, a positioning block is fixedly connected to the side surface of the slider, and the positioning block is slidably connected to the positioning groove.

[0015] By adopting the above technical solution, the slider slides inside the sliding groove, and the positioning block slides inside the positioning groove to limit the position of the slider.

[0016] Optionally, a pressing plate is fixedly connected to one end of the slider close to the heat conduction plate, and a handle is fixedly connected to one end of the slider on the same side away from the heat conduction plate.

[0017] By adopting the above technical solution, the slider drives the pressing plate to slide left and right to tightly fix both ends of the circuit board body.

[0018] Optionally, a support spring is arranged inside the positioning groove, and two ends of the support spring are respectively fixedly connected with the positioning block and the side wall of the positioning groove.

[0019] By adopting the above technical solution, the support spring is used to automatically push the pressing plate out of the sliding groove so that it always presses the circuit board body.

[0020] Optionally, two groups of first connecting plates are fixedly connected to both the left and right ends of the upper surface of the circuit board body. A connecting groove is formed on the upper surface of the first connecting plate. Two groups of second connecting plates are fixedly connected to both the left and right ends of the lower surface of the circuit board body. A connecting block is fixedly connected to the lower surface of the second connecting plate.

[0021] By adopting the above technical solution, the connecting block is inserted into the lower connecting groove to electrically connect the two circuit boards and fix the two circuit board bodies at the same time.

[0022] In the above technical solution, the technical effects and advantages provided by the present utility model are as follows:

[0023] In the present utility model, the circuit board is clamped on the upper side of the heat conducting plate, and the circuit boards are sequentially installed on the side surfaces of the heat dissipation plates. At the same time, the connecting block is inserted into the lower connecting groove to electrically connect the two circuit boards and fix the two circuit board bodies, thereby fixing multiple heat conducting plates. At this time, by starting the heat dissipation fan blades, heat dissipation is carried out on multiple circuit boards at the same time, and multi-layer circuit boards with any number of layers can be used. The applicable range is relatively wide and the heat dissipation effect is good, solving the problem that as the circuit board gradually develops towards the multi-layer circuit board direction, when multiple multi-layer circuit boards are stacked together, the heat dissipation effect of the device on the upper circuit board is relatively poor, having certain limitations and a poor heat dissipation effect on multi-layer circuit boards. Description of the Drawings

[0024] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0025] Figure 2 It is a schematic diagram of the structure of the heat dissipation plate of the present utility model;

[0026] Figure 3 It is a schematic diagram of the structure of the heat dissipation mechanism of the present utility model;

[0027] Figure 4 It is a schematic diagram of the structure of the circuit board body of the present utility model;

[0028] Figure 5 It is a schematic diagram of the structure of the heat conducting plate of the present utility model;

[0029] Figure 6 It is a schematic diagram of the internal structure of the support block of the present utility model.

[0030] Description of the reference numerals:

[0031] 1. Fixed plate; 11. Heat dissipation plate; 12. Ventilation holes; 13. Heat dissipation fan blades; 14. Mounting plate; 15. Card slot; 2. Heat conducting plate; 21. Card block; 22. Heat dissipation fins; 23. Support block; 24. Slide groove; 25. Positioning groove; 26. Slide block; 27. Positioning block; 28. Pressing plate; 29. Support spring; 210. Handle; 3. Circuit board body; 31. First connecting plate; 32. Connecting groove; 33. Second connecting plate. Detailed implementation manners

[0032] In order to enable those skilled in the art to better understand the technical solutions of the present utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0033] The present utility model provides a PCB board heat dissipation structure as shown in Figures 1 to 4 the figure, which includes a fixed plate 1. A heat dissipation plate 11 is fixedly connected to the upper side of the fixed plate 1. Ventilation holes 12 are formed on the surface of the heat dissipation plate 11. Heat dissipation fan blades 13 are arranged inside the ventilation holes 12. A heat dissipation mechanism is arranged on the front side of the heat dissipation plate 11. The heat dissipation mechanism includes a mounting plate 14, a card slot 15, a heat conducting plate 2, a card block 21, and heat dissipation fins 22. Multiple groups of heat conducting plates 2 are provided. The rear end of the lowermost heat conducting plate 2 is fixedly connected to a position close to the lower side of the mounting plate 14. The upper surface of the heat conducting plate 2 is clamped with a circuit board body 3. Two groups of first connecting plates 31 are fixedly connected to the left and right ends of the upper surface of the circuit board body 3. Connecting grooves 32 are formed on the upper surface of the first connecting plates 31. Two groups of second connecting plates 33 are fixedly connected to the left and right ends of the lower surface of the circuit board body 3. A connecting block is fixedly connected to the lower surface of the second connecting plates 33. Two groups of mounting plates 14 are provided, and the two groups of mounting plates 14 are respectively fixedly connected to the left and right sides of the front surface of the heat dissipation plate 11. The card slot 15 is formed on the front surface of the mounting plate 14. The card block 21 is fixed to the rear end of the heat conducting plate 2. The card block 21 is slidably connected to the card slot 15. The heat dissipation fins 22 are fixedly connected to the lower surface of the heat conducting plate 2.

[0034] Among them, the heat sink 11 is fixed to the surface of the fixing plate 1 by screws, and then the multiple groups of circuit board bodies 3 are respectively clamped on the surfaces of the multiple groups of heat conducting plates 2, and then the clamping block 21 is clamped on the inner side of the clamping groove 15 and slid downward, and the multiple groups of heat conducting plates 2 fixed with the circuit board bodies 3 are installed on the side of the mounting plate 14 in sequence, and then the connecting block on the surface of the upper circuit board is inserted into the connecting groove 32 on the surface of the lower circuit board to connect the circuits of the two groups of circuit board bodies 3, and the connecting block and the connecting groove 32 are interference fit, so that after the connecting block and the connecting groove 32 are plugged in, the two groups of circuit board bodies 3 are locked to improve the stability of the circuit board connection. During use, the heat conducting plate 2 conducts the temperature of the surface of the circuit board body 3 to the surface of the heat dissipation fins 22, and the heat dissipation fan blades 13 rotate to increase the air circulation speed between the multiple groups of heat dissipation fins 22, thereby increasing the heat dissipation speed and heat dissipation effect of the multi-layer PCB board.

[0035] See also Figure 5 and Figure 6 Two groups of support blocks 23 are fixedly connected to the left and right ends of the heat conducting plate 2. A slide groove 24 is provided inside the support block 23. Positioning grooves 25 are provided on the inner walls of the front and rear sides of the slide groove 24. A slider 26 is slidably connected inside the slide groove 24. A positioning block 27 is fixedly connected to the side of the slider 26. The positioning block 27 is slidably connected to the positioning groove 25. A pressing plate 28 is fixedly connected to one end of the slider 26 close to the heat conducting plate 2. A handle 210 is fixedly connected to the end of the slider 26 on the same side facing away from the heat conducting plate 2. A support spring 29 is arranged inside the positioning groove 25. The two ends of the support spring 29 are respectively fixedly connected to the positioning block 27 and the side wall of the positioning groove 25.

[0036] Specifically, the handle 210 is pulled to both sides to retract the pressure plate 28 into the inside of the slide groove 24, and then the circuit board body 3 is clamped on the surface of the heat conducting plate 2, and then the handle 210 is released. At this time, the support spring 29 pushes the positioning block 27 to the side, and then pushes the pressure plate 28 out of the slide groove 24, so that it presses the surface of the circuit board body 3, and the circuit board body 3 is clamped on the surface of the heat conducting plate 2.

[0037] Working principle of the utility model: in order to improve the heat dissipation effect of the multi-layer PCB board, multiple groups of circuit board bodies 3 are respectively clamped on the surfaces of multiple groups of heat conducting plates 2, and then multiple groups of heat conducting plates 2 fixed with circuit board bodies 3 are sequentially installed on the side of the mounting plate 14, and then the connecting block on the surface of the upper circuit board is inserted into the connecting groove 32 on the surface of the lower circuit board, the circuits of the two groups of circuit board bodies 3 are connected, and the air circulation speed between the multiple groups of heat dissipating fins 22 is increased by rotating the heat dissipation fan blades 13, thereby increasing the heat dissipation speed and heat dissipation effect of the multi-layer PCB board.

[0038] The basic principle, main features and advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only the preferred examples of the present utility model and are not used to limit the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed.

Claims

1. A PCB board heat dissipation structure, comprising a fixing plate (1), characterized in that: A heat sink (11) is fixedly connected to the upper side of the fixing plate (1), a ventilation hole (12) is provided on the surface of the heat sink (11), a heat dissipation fan blade (13) is arranged inside the ventilation hole (12), a heat dissipation mechanism is arranged on the front side of the heat sink (11), the heat dissipation mechanism comprises a mounting plate (14), a card slot (15), a heat conduction plate (2), a card block (21), and heat dissipation fins (22), a plurality of groups of heat conduction plates (2) are arranged, a rear end of the lowest heat conduction plate (2) is fixedly connected to a position close to the lower side of the mounting plate (14), and a circuit board body (3) is clamped on the upper surface of the heat conduction plate (2).

2. A PCB board heat dissipation structure according to claim 1, characterized in that: Two groups of the mounting plates (14) are provided, and the two groups of the mounting plates (14) are respectively fixedly connected to the left and right sides of the front surface of the heat sink (11), and the card slots (15) are provided on the front side surfaces of the mounting plates (14).

3. A PCB board heat dissipation structure according to claim 2, characterized in that: The clamping block (21) is fixed to the rear end of the heat conducting plate (2), the clamping block (21) is slidably connected to the clamping slot (15), and the heat dissipation fins (22) are fixedly connected to the lower surface of the heat conducting plate (2).

4. The PCB heat dissipation structure according to claim 1, characterized in that: Two groups of support blocks (23) are fixedly connected to the left and right ends of the heat conduction plate (2), a slide groove (24) is provided inside the support block (23), and positioning grooves (25) are provided on the front and rear inner walls of the slide groove (24).

5. A PCB board heat dissipation structure according to claim 4, characterized in that: A sliding block (26) is slidably connected inside the sliding groove (24), a positioning block (27) is fixedly connected to the side of the sliding block (26), and the positioning block (27) is slidably connected to the positioning groove (25).

6. A PCB board heat dissipation structure according to claim 5, characterized in that: One end of the slider (26) close to the heat conducting plate (2) is fixedly connected to a pressing plate (28), and one end of the slider (26) on the same side facing away from the heat conducting plate (2) is fixedly connected to a handle (210).

7. The PCB heat dissipation structure according to claim 5, characterized in that: A support spring (29) is disposed inside the positioning groove (25), and two ends of the support spring (29) are respectively fixedly connected to the positioning block (27) and the side wall of the positioning groove (25).

8. The PCB heat dissipation structure according to claim 1, characterized in that: Two groups of first connecting plates (31) are fixedly connected to the left and right ends of the upper surface of the circuit board body (3), and the upper surfaces of the first connecting plates (31) are provided with connecting grooves (32). Two groups of second connecting plates (33) are fixedly connected to the left and right ends of the lower surface of the circuit board body (3), and the lower surfaces of the second connecting plates (33) are fixedly connected to connecting blocks.

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