PCB (Printed Circuit Board) structure for accelerating heat dissipation of PCB bonding pad

Abstract

The utility model discloses a PCB structure for accelerating the heat dissipation of PCB pads, which comprises a PCB and a power supply device, the PCB is provided with a plurality of PCB pads, each PCB pad is provided with a heat dissipation through hole, the heat dissipation through holes penetrate through the PCB, the peripheral side walls of the heat dissipation through holes are provided with heat dissipation layers, and the heat dissipation layers are connected with the PCB pads; and the power supply device is arranged on the bonding pad in a binding manner. According to the PCB structure capable of accelerating heat dissipation of the PCB bonding pad, the heat dissipation through holes are formed in the PCB, namely, the heat dissipation through holes penetrate through the PCB to increase air circulation, and the heat dissipation layers are arranged on the heat dissipation through holes to enable the heat dissipation layers to be connected with the PCB bonding pad, so that the contact area between the PCB bonding pad and air is increased, heat dissipation of the PCB bonding pad is further accelerated through the heat dissipation layers, and the heat dissipation efficiency of the PCB bonding pad is improved. And the service life and performance of the power supply device can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of PCBs, in particular to a PCB structure for accelerating heat dissipation of PCB pads. Background Art

[0002] A PCB, namely a printed circuit board, is widely used in various electronic devices. In highly integrated electronic devices, the PCB pads on the PCB, as the key parts for connecting electronic components, carry the function of electrical connection. Therefore, in electronic devices, especially for high-power power devices, the area of the PCB pads corresponding to the power devices is often a heat concentration point. If the heat cannot be dissipated in time, it will affect the service life and performance of the power devices.

[0003] In view of the above, a PCB structure for accelerating heat dissipation of PCB pads is proposed. Summary of the Utility Model

[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a PCB structure for accelerating heat dissipation of PCB pads.

[0005] The purpose of the utility model is achieved by the following technical solutions:

[0006] A PCB structure for accelerating heat dissipation of PCB pads, comprising: a PCB board and a power device. A plurality of PCB pads are arranged on the PCB board. Heat dissipation through holes are formed in each of the PCB pads. The heat dissipation through holes penetrate through the PCB board, and heat dissipation layers are arranged on the peripheral side walls of the heat dissipation through holes. The heat dissipation layers are connected to the PCB pads; the power device is fixedly arranged on the PCB pads.

[0007] In one embodiment, the heat dissipation layer is a copper metal heat dissipation layer.

[0008] In one embodiment, a plurality of heat dissipation through holes are formed in each of the PCB pads.

[0009] In one embodiment, the heat dissipation through holes are regularly arranged.

[0010] In one embodiment, the heat dissipation through holes are circular in structure.

[0011] In one embodiment, the heat dissipation through holes are oval in structure.

[0012] In one embodiment, device pads are arranged on the side surface of the power device facing the PCB pads, and the device pads are connected to the PCB pads through soldering paste.

[0013] In one embodiment, the heat dissipation through-holes are located in the edge area away from the power device.

[0014] In one embodiment, the PCB pad has a rectangular structure.

[0015] In one embodiment, the PCB pad is a copper metal pad.

[0016] Compared with the prior art, the present utility model has at least the following advantages:

[0017] The PCB structure for accelerating heat dissipation of the PCB pad of the present utility model increases air circulation by opening heat dissipation through-holes in the PCB board, that is, the heat dissipation through-holes penetrate the PCB board, and a heat dissipation layer is provided on the heat dissipation through-holes, so that the heat dissipation layer is connected to the PCB pad, thereby increasing the contact area between the PCB pad and the air, and further accelerating the heat dissipation of the PCB pad through the heat dissipation layer, and thus ensuring the life and performance of the power device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below.

[0019] Figure 1 It is a schematic structural diagram of a PCB structure for accelerating heat dissipation of a PCB pad in an embodiment of the present utility model;

[0020] Figure 2 is Figure 1 a schematic structural diagram of the connection between the PCB pad of the PCB structure for accelerating heat dissipation of the PCB pad and the heat dissipation layer in the heat dissipation through-hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] In order to facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings.

[0022] Please refer to Figure 1 and Figure 2 As shown, a PCB structure 10 for accelerating heat dissipation of a PCB pad 110 includes: a PCB board 100 and a power device 200. A plurality of PCB pads 110 are provided on the PCB board 100. Heat dissipation through-holes 120 are opened on each PCB pad 110. The heat dissipation through-holes 120 penetrate the PCB board 100, and a heat dissipation layer 130 is provided on the peripheral side walls of the heat dissipation through-holes 120. The heat dissipation layer 130 is connected to the PCB pad 110; the power device 200 is bonded and provided on the PCB pad 110.

[0023] It should be noted that by providing heat dissipation through-holes 120 in the PCB board 100, that is, the heat dissipation through-holes 120 penetrate the PCB board 100, the air circulation is increased, and a heat dissipation layer 130 is provided on the heat dissipation through-holes 120, so that the heat dissipation layer 130 is connected to the PCB pad 110, thereby increasing the contact area between the PCB pad 110 and the air, and further accelerating the heat dissipation of the PCB pad 110 through the heat dissipation layer 130, and thus the lifespan and performance of the power device 200 can be ensured.

[0024] Preferably, the heat dissipation layer 130 is a copper metal heat dissipation layer 130. Copper metal has a high thermal conductivity and can achieve uniform heat dissipation at the same time, so it helps to improve the heat dissipation effect and accelerate the heat dissipation efficiency of the PCB pad 110, and further protects the power device 200 from high-temperature damage. In this embodiment, the PCB pad 110 is a copper metal pad, that is, the same material is used for both the PCB pad 110 and the heat dissipation layer 130. Then when plating the copper metal heat dissipation layer 130 on the inner side wall of the heat dissipation through-hole 120, even if the copper metal heat dissipation layer 130 is plated onto the PCB pad 110, it will not affect the connection effect between the PCB pad 110 and the power device 200.

[0025] In one embodiment, a plurality of heat dissipation through-holes 120 are provided on each PCB pad 110. That is, when the PCB pad 110 is relatively large, a plurality of heat dissipation through-holes 120 can be provided, and a layer of copper metal heat dissipation layer 130 is plated on the peripheral side walls of each heat dissipation through-hole 120, thereby being able to improve the heat dissipation effect. Preferably, the heat dissipation through-holes 120 are arranged regularly.

[0026] Preferably, the heat dissipation through-hole 120 has a circular structure. The heat dissipation through-hole 120 with a circular structure is not only easy to process but also can reduce local stress concentration.

[0027] Preferably, the heat dissipation through-hole 120 has an oval structure. The heat dissipation through-hole 120 with an oval structure is not only easy to process but also can reduce local stress concentration.

[0028] In one embodiment, a device pad is provided on the side of the power device 200 facing the PCB pad 110, and the device pad is connected to the PCB pad 110 through soldering paste. In order to prevent the soldering paste from entering the heat dissipation through-hole 120 and affecting the heat dissipation effect of the heat dissipation layer 130 of the heat dissipation through-hole 120, therefore, in this embodiment, the heat dissipation through-hole 120 is located in the edge area far from the power device 200, that is, since generally the soldering paste is applied around the power device 200, in order to prevent the heat dissipation through-hole 120 from being tinned, when there is enough space on the PCB pad 110, the heat dissipation through-hole 120 is made to be as far as possible from the edge area of the power device 200.

[0029] Preferably, the PCB pad 110 has a rectangular structure.

[0030] The above-described embodiments merely represent several implementation manners of the present utility model. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the present utility model patent shall be subject to the appended claims.

Claims

1. A PCB structure for accelerating heat dissipation of a PCB pad, characterized in that: include: A PCB board, wherein a plurality of PCB pads are arranged on the PCB board, each of the PCB pads is provided with a heat dissipation through hole, the heat dissipation through hole penetrates the PCB board, and a heat dissipation layer is arranged on the side walls around the heat dissipation through hole, and the heat dissipation layer is connected to the PCB pad; and A power supply device is bound and arranged on the PCB pad.

2. The PCB structure for accelerating heat dissipation of the PCB pad according to claim 1, characterized in that: The heat dissipation layer is a copper metal heat dissipation layer.

3. The PCB structure for accelerating heat dissipation of the PCB pad according to claim 1, characterized in that: A plurality of heat dissipation through holes are provided on each of the PCB pads.

4. The PCB structure for accelerating heat dissipation of the PCB pad according to claim 3, characterized in that: The heat dissipation through holes are regularly arranged.

5. The PCB structure for accelerating heat dissipation of PCB pads according to claim 1, characterized in that: The heat dissipation through hole is a circular structure.

6. The PCB structure for accelerating heat dissipation of the PCB pad according to claim 1, characterized in that: The heat dissipation through hole is in an elliptical structure.

7. The PCB structure for accelerating heat dissipation of the PCB pad according to claim 1, characterized in that: A device pad is arranged on one side of the power supply device facing the PCB pad, and the device pad is connected to the PCB pad through solder paste.

8. The PCB structure for accelerating heat dissipation of the PCB pad according to claim 7, characterized in that: The heat dissipation through hole is located in an edge area away from the power supply device.

9. The PCB structure for accelerating heat dissipation of PCB pads according to claim 1, characterized in that: The PCB pad is in a rectangular structure.

10. The PCB structure for accelerating heat dissipation of the PCB pad according to claim 2, characterized in that: The PCB pad is a copper metal pad.

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