Sealed power supply system capable of realizing rapid cooling
By designing a sealed power supply system in the power supply system, using the first heat dissipation structure of phase change materials and honeycomb structure, as well as the combination of thermal plates and thermal teeth, the problem that traditional power supply natural heat dissipation solutions are difficult to reduce the device temperature, and rapid cooling and efficient heat dissipation are achieved.
Patent Information
- Application Number
- CN202421982474.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-08-15
AI Technical Summary
Traditional power supply natural heat dissipation solutions are difficult to effectively solve the hot issues caused by heat aggregation, resulting in excessive temperature of the device, affecting its performance and life.
A sealed power supply system is designed, including a housing, power supply assembly and a heat dissipation assembly. The power supply component is provided with a lower heating device group, a circuit board and an upper heating device group in sequence from bottom to top, and the heat dissipation component includes a radiator, a first heat dissipation structure and a heat conducting plate. The first heat dissipation structure absorbs and releases heat in a short time through the phase change material and the honeycomb structure, avoids violent temperature fluctuations, and enhances heat conduction and natural heat dissipation through the thermal conduction plate and the thermal conduction teeth.
It achieves rapid cooling, improves the heat dissipation efficiency of the overall power supply components, and ensures the long-term safe and stable use of the product.
Smart Images

Figure CN222996927U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a sealed power supply system, in particular to a sealed power supply system capable of achieving rapid cooling. Background Art
[0002] With the rapid development of the power electronics field and the increasing use density of high-power devices, the heat dissipation of power supplies faces huge challenges. In power supply design, it is necessary to comprehensively consider various factors such as hardware, safety regulations, heat dissipation methods, and structures, and the improvement of heat dissipation efficiency is one of the key issues. Especially under some harsh conditions that require natural heat dissipation, it is difficult to reduce the thermal power consumption of modules, which requires new heat dissipation system design ideas to solve the heat dissipation problem.
[0003] Traditional natural heat dissipation solutions for power supplies often fail to effectively solve the hot spot problems caused by heat accumulation. These hot spots lead to too high device temperatures, affecting their performance and lifespan. Therefore, solving the heat accumulation problem is crucial for improving heat dissipation efficiency. Summary of the Utility Model
[0004] The purpose of the utility model is to solve the deficiencies of traditional natural heat dissipation solutions for power supplies, which are difficult to effectively solve the hot spot problems caused by heat accumulation, resulting in too high device temperatures and affecting their performance and lifespan, and to provide a sealed power supply system capable of achieving rapid cooling.
[0005] In order to solve the above-mentioned deficiencies of the prior art, the utility model provides the following technical solutions:
[0006] A sealed power supply system capable of achieving rapid cooling, comprising a housing, and a power supply component and a heat dissipation component arranged in the housing; the special feature is that:
[0007] The power supply component includes a lower-layer heating device group, a circuit board, and an upper-layer heating device group arranged in sequence from bottom to top, and the upper-layer heating device group is arranged on the top surface of the circuit board;
[0008] The heat dissipation component includes a radiator, a silicone grease layer, and at least one heat conduction plate;
[0009] The silicone grease layer and the lower-layer heating device group are arranged on the top surface of the radiator in sequence from bottom to top. A conduction cavity is formed between the bottom surface of the radiator and the bottom surface of the housing. A first heat dissipation structure with its top surface and bottom surface respectively abutted against the bottom surface of the radiator and the bottom surface of the housing is arranged in the conduction cavity. The first heat dissipation structure includes a honeycomb structure and a phase change material filled in the honeycomb structure. The honeycomb structure includes a plurality of honeycomb units arranged in a row-column matrix manner;
[0010] The heat conducting plate is arranged on the top surface of the upper-layer heating device group, and both ends of the heat conducting plate are respectively connected to the interiors of two side walls of the housing. A plurality of heat conducting teeth extending in the vertical direction are vertically arranged on the exteriors of the two side walls of the housing.
[0011] Further, each of the honeycomb units includes a central axis and a plurality of fan blade units circumferentially and evenly distributed around the central axis. The central axis is perpendicular to the side wall of the housing provided with the heat conducting teeth. Each of the fan blade units is a hollow quadrangular prism with openings at both ends. One edge of the quadrangular prism is connected to the central axis, and a strip-shaped opening is arranged at a position of the edge opposite thereto along the direction parallel to the central axis. At least one inclined rib is arranged in the quadrangular prism along the direction parallel to the central axis.
[0012] Further, each of the honeycomb units includes four fan blade units, two of the fan blade units are located above, and the other two fan blade units are located below. One side wall of each of the fan blade units located above is parallel to and abuts against the bottom surface of the radiator, and one side wall of each of the fan blade units located below is parallel to and abuts against the bottom surface of the housing.
[0013] Further, the honeycomb structure and the bottom surface of the radiator are bonded with a heat conducting adhesive.
[0014] Further, the phase change material uses paraffin wax, and the material of the honeycomb unit is copper.
[0015] Further, second heat dissipation structures are symmetrically arranged on both sides of the first heat dissipation structure in the conduction cavity. The top surface and the bottom surface of the second heat dissipation structure are respectively abutted against the bottom surface of the radiator and the bottom surface of the housing. The second heat dissipation structure includes a V-shaped heat sink array. The V-shaped heat sink array includes a plurality of V-shaped heat sink units arranged in a row-column matrix manner. Each V-shaped heat sink unit is composed of two heat sinks perpendicular to the bottom surface of the housing.
[0016] Further, the material of each of the heat sinks is aluminum alloy.
[0017] Further, the plurality of heat conducting teeth include a plurality of high teeth and a plurality of low teeth. The length of the high teeth protruding from the side wall of the housing is twice the length of the low teeth protruding from the side wall of the housing. The high teeth and the low teeth are respectively located at the places with higher temperature and lower temperature on the side wall of the housing where they are located.
[0018] Further, bumps are arranged on the bottom surfaces of both ends of each of the heat conducting plates. The bumps and the bottom surface of the heat conducting plate form a wedge-shaped locking structure. The two wedge-shaped locking structures are respectively connected to two heat conducting ribs arranged inside the side wall of the housing. A graphene heat conducting film is arranged on the bottom surface of the heat conducting plate.
[0019] Further, the housing uses titanium alloy, the radiator uses aluminum alloy, and the radiator and the housing are connected by brazing.
[0020] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0021] (1) A sealed power supply system for rapid cooling according to the present utility model includes a housing, a power supply component, and a heat dissipation component; the heat dissipation component includes a radiator, a first heat dissipation structure, and heat conducting teeth. The first heat dissipation structure can not only absorb a large amount of heat in a short time through a phase change material but also release heat smoothly when the temperature drops, thus avoiding drastic temperature fluctuations. A honeycomb structure is made of copper to solve the problem of poor thermal conductivity of the phase change material. The present utility model sets two heat flow paths, namely the upper-layer heat generating device group → the housing → the heat conducting teeth, and the lower-layer heat generating device group → the radiator → the first heat dissipation structure → the housing → the heat conducting teeth, improving the heat dissipation efficiency of the entire power supply component and ensuring the long-term safe and stable use of the product.
[0022] (2) The present utility model adopts a first heat dissipation structure, the fan blade unit of which is a hollow quadrangular prism with openings on both the top and bottom surfaces. This design increases the heat dissipation area and air circulation channels, facilitating the rapid dissipation of heat.
[0023] (3) In the present utility model, for the areas with small heat generation on both sides of the power supply component, a second heat dissipation structure is adopted to enhance natural heat dissipation. The second heat dissipation structures are symmetrically arranged on both sides of the first heat dissipation structure to ensure uniform distribution and dissipation of heat and avoid local overheating.
[0024] (4) In the present utility model, the heat conducting plate is made of aluminum alloy, and a graphene heat conducting film is provided on the bottom surface to enhance the lateral heat transfer amount. The two ends are respectively connected to two heat conducting ribs arranged inside the side wall of the housing by a wedge locking structure to reduce the thermal resistance and conduct the heat outside the housing for heat dissipation.
[0025] (5) In the present utility model, a plurality of high teeth and a plurality of low teeth are provided on the outer sides of the two side walls provided with heat conducting ribs. Utilizing the chimney effect of natural heat dissipation, the natural heat exchange can be effectively enhanced. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 is an exploded structural schematic diagram of Embodiment 1 of a sealed power supply system for rapid cooling according to the present utility model;
[0027] Figure 2 When the section is parallel to the 0YZ plane Figure 1 is a sectional view;
[0028] Figure 3 is a structural schematic diagram of a honeycomb unit in Embodiment 1 of the present utility model;
[0029] Figure 4 is a structural schematic diagram of the connection between a heat conducting plate and a heat conducting rib in Embodiment 1 of the present utility model;
[0030] Figure 5 This is a schematic structural diagram of the heat-conducting teeth in the first embodiment of the present utility model;
[0031] Figure 6 This is a cross-sectional view of the second embodiment of the present utility model;
[0032] Figure 7 This is a schematic structural diagram of the bottom surface of the second embodiment of the present utility model (the bottom surface of the housing is not shown).
[0033] The reference numerals are explained as follows: 1 - housing, 101 - bottom surface of the housing, 102 - heat-conducting rib; 2 - lower-layer heat-generating device group; 3 - circuit board; 4 - upper-layer heat-generating device group; 5 - radiator; 6 - first heat-dissipating structure, 601 - honeycomb structure, 6011 - honeycomb cell, 6012 - fan blade unit, 6013 - central axis, 6014 - strip-shaped opening, 6015 - inclined rib; 602 - phase-change material; 7 - heat-conducting plate, 701 - bump; 8 - silicone grease layer; 9 - heat-conducting teeth, 901 - high teeth, 902 - low teeth; 10 - graphene heat-conducting film; 11 - second heat-dissipating structure, 111 - V-shaped heat-dissipating fin unit. Detailed implementation manners
[0034] The present utility model will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0035] Embodiment 1
[0036] Referring to Figures 1 to 5 , a sealed power supply system for achieving rapid cooling includes a housing 1, and a power supply component and a heat-dissipating component arranged in the housing 1.
[0037] To adapt to long-term underwater applications, the housing 1 is made of titanium alloy to increase strength and corrosion resistance.
[0038] The power supply component includes a lower-layer heat-generating device group 2, a circuit board 3, and an upper-layer heat-generating device group 4 arranged in sequence from bottom to top, and the upper-layer heat-generating device group 4 is arranged on the top surface of the circuit board 3.
[0039] The heat-dissipating component includes a radiator 5, a first heat-dissipating structure 6, and two heat-conducting plates 7.
[0040] Referring to Figure 2 , on the top surface of the radiator 5, a silicone grease layer 8 and a lower-layer heat-generating device group 2 are arranged in sequence from bottom to top. A conduction cavity is formed between the bottom surface of the radiator 5 and the bottom surface 101 of the housing. A first heat-dissipating structure 6 whose top surface and bottom surface are respectively in contact with the bottom surface of the radiator 5 and the bottom surface 101 of the housing is arranged in the conduction cavity. The first heat-dissipating structure 6 includes a honeycomb structure 601 and a phase-change material 602 filled in the honeycomb structure 601, and the material of the honeycomb structure 601 is copper.
[0041] Referring to Figure 3, the honeycomb structure 601 includes a plurality of honeycomb cells 6011 arranged in a row-column matrix; each honeycomb cell 6011 includes a central axis 6013 and four fan blade units 6012 evenly distributed circumferentially around the central axis 6013, where two fan blade units 6012 are located above and the other two fan blade units 6012 are located below; the central axis 6013 is arranged along the parallel Figure 1 in the 0X axis direction. Each fan blade unit 6012 is a hollow quadrangular prism with both ends open. One edge of the quadrangular prism is connected to the central axis 6013, and a strip-shaped opening 6014 is arranged along the direction parallel to the central axis 6013 at the position of the opposite edge, which helps the flow of hot air and promotes air convection heat dissipation; two inclined ribs 6015 are arranged along the direction parallel to the central axis 6013 inside the quadrangular prism, which further enhances the structural stability and at the same time increases the contact area with the phase change material 602, improving the heat conduction efficiency; one side wall of each fan blade unit 6012 located above is parallel to the bottom surface of the radiator 5 and is bonded with thermal conductive glue to ensure that heat can be quickly conducted to the radiator 5. One side wall of each fan blade unit 6012 located below is parallel to the bottom surface of the housing 101 and is in contact, effectively conducting heat to the bottom surface of the housing 101 for large-area heat dissipation.
[0042] The phase change material 602 uses paraffin, and the parameters are shown in Table 1:
[0043] Table 1
[0044] Feature Unit Index Phase transition temperature ℃ 58 Thermal conductivity <![CDATA[W*m -1 *K -1 > 0.21 Latent heat of phase change <![CDATA[J*g -1 > 240 Flash point ℃ 180 Boiling point ℃ 210 Specific heat <![CDATA[J*g 1 *K 1 > 2 Density (solid / liquid) <![CDATA[g7cm 3 > 0.81 / 0.72 Enthalpy KJ / Kg 230 Service temperature ℃ -40~120
[0045] Refer to Figure 4 , two heat conducting plates 7 are arranged on the top surface of the upper-layer heating device group 4. The heat conducting plates 7 are made of aluminum alloy, and a graphene heat conducting film 10 is arranged on the bottom surface to enhance the lateral heat transfer amount; bumps 701 are arranged on the bottom surfaces at both ends of each heat conducting plate 7. The bumps 701 and the bottom surface of the heat conducting plate 7 form a wedge-shaped locking structure, and the two wedge-shaped locking structures are respectively connected to two heat conducting ribs 102 arranged inside the side wall of the housing 1 to reduce the thermal resistance and conduct the heat to the outside of the housing 1 for heat dissipation.
[0046] Refer to Figure 1 and Figure 5 , a plurality of heat conducting teeth 9 extending in the vertical direction ( Figure 1 in the 0Z axis of
[0047] A plurality of heat-conducting teeth 9 are divided into high teeth 901 and low teeth 902 according to the length protruding from the housing 1. The length of the high teeth 901 protruding from the housing 1 is twice the length of the low teeth 902 protruding from the housing 1. The high teeth 901 and the low teeth 902 are respectively located at the higher-temperature and lower-temperature positions on the side wall of the corresponding housing 1. By utilizing the chimney effect of natural heat dissipation (hot air rises due to lower density, and cold air descends due to higher density, thus forming natural air flow in the vertical direction), the plurality of heat-conducting teeth 9 can effectively enhance natural heat exchange.
[0048] The radiator 5 is made of aluminum alloy with good heat-conducting performance. The radiator 5 and the housing 1 are connected by brazing to reduce the thermal resistance.
[0049] Embodiment 2
[0050] Refer to Figure 6 、 Figure 7 In this embodiment, a first heat dissipation structure 6 and a second heat dissipation structure 11 are arranged in the conduction cavity, and both the first heat dissipation structure 6 and the second heat dissipation structure 11 are in contact with the bottom surface of the radiator 5 and the bottom surface 101 of the housing.
[0051] The second heat dissipation structure 11 is two V-shaped fin arrays symmetrically arranged on both sides of the first heat dissipation structure 6. Each V-shaped fin array includes a plurality of V-shaped fin units 111 arranged in a row-column matrix. Each V-shaped fin unit 111 is composed of two fins perpendicular to the bottom surface 101 of the housing and connected to each other. The V-shaped structure increases the surface area of the fins, which helps to increase the contact area with the air and improve the heat dissipation efficiency. The material of each fin is aluminum alloy, which can quickly conduct the heat from the power supply component to the surface of the fin and quickly dissipate it into the surrounding environment.
[0052] The remaining settings in this embodiment are the same as those in Embodiment 1.
Claims
1. A sealed power supply system for achieving rapid cooling, comprising a housing (1), and a power supply component and a heat dissipation component arranged in the housing (1); characterized in that: The power supply assembly comprises a lower heating device group (2), a circuit board (3) and an upper heating device group (4) which are arranged in sequence from bottom to top, and the upper heating device group (4) is arranged on the top surface of the circuit board (3); The heat dissipation assembly comprises a heat sink (5), a silicone grease layer (8) and at least one heat conducting plate (7); The silicone grease layer (8) and the lower heating device group (2) are arranged on the top surface of the heat sink (5) in sequence from bottom to top, and a conduction cavity is formed between the bottom surface of the heat sink (5) and the bottom surface (101) of the shell. A first heat dissipation structure (6) is arranged in the conduction cavity, and the top surface and the bottom surface are respectively abutted against the bottom surface of the heat sink (5) and the bottom surface (101) of the shell. The first heat dissipation structure (6) includes a honeycomb structure (601) and a phase change material (602) filled in the honeycomb structure (601), and the honeycomb structure (601) includes a plurality of honeycomb units (6011) arranged in a row and column matrix manner; The heat conducting plate (7) is arranged on the top surface of the upper heating device group (4), and the two ends of the heat conducting plate (7) are respectively connected to the inside of the two side walls of the shell (1), and a plurality of heat conducting teeth (9) extending in the vertical direction are vertically arranged on the outside of the two side walls of the shell (1).
2. A sealed power supply system for achieving rapid cooling according to claim 1, characterized in that: Each of the honeycomb units (6011) comprises a central axis (6013) and a plurality of blade units (6012) uniformly distributed around the circumference of the central axis (6013); the central axis (6013) is perpendicular to a side wall of a shell (1) provided with heat-conducting teeth (9); each of the blade units (6012) is a hollow quadrangular prism with openings at both ends; one edge of the quadrangular prism is connected to the central axis (6013); a strip opening (6014) is provided at an edge opposite to the quadrangular prism in a direction parallel to the central axis (6013); and at least one oblique rib (6015) is provided in the quadrangular prism in a direction parallel to the central axis (6013).
3. A sealed power supply system for achieving rapid cooling according to claim 2, characterized in that: Each of the honeycomb units (6011) includes four blade units (6012), two of which are located at the top and the other two are located at the bottom. One side wall of each of the blade units (6012) located at the top is parallel to and abuts against the bottom surface of the radiator (5), and one side wall of each of the blade units (6012) located at the bottom is parallel to and abuts against the bottom surface (101) of the shell.
4. A sealed power supply system for achieving rapid cooling according to any one of claims 1 to 3, characterized in that: The honeycomb structure (601) is bonded to the bottom surface of the heat sink (5) using heat-conducting adhesive.
5. A sealed power supply system for achieving rapid cooling according to claim 4, characterized in that: The phase change material (602) is made of paraffin, and the honeycomb unit (6011) is made of copper.
6. A sealed power supply system for achieving rapid cooling according to claim 5, characterized in that: A second heat dissipation structure (11) is symmetrically arranged on both sides of the first heat dissipation structure (6) in the conduction cavity; the top surface and the bottom surface of the second heat dissipation structure (11) are respectively in contact with the bottom surface of the radiator (5) and the bottom surface (101) of the shell; the second heat dissipation structure (11) comprises a V-shaped heat dissipation fin array; the V-shaped heat dissipation fin array comprises a plurality of V-shaped heat dissipation fin units (111) arranged in a row-column matrix; each V-shaped heat dissipation fin unit (111) is composed of two heat dissipation fins perpendicular to the bottom surface (101) of the shell.
7. A sealed power supply system for achieving rapid cooling according to claim 6, characterized in that: The material of each heat sink is aluminum alloy.
8. A sealed power supply system for achieving rapid cooling according to claim 7, characterized in that: The plurality of heat-conducting teeth (9) comprise a plurality of high teeth (901) and a plurality of low teeth (902); the length of the high teeth (901) protruding from the side wall of the shell (1) is twice the length of the low teeth (902) protruding from the side wall of the shell (1); the high teeth (901) and the low teeth (902) are respectively located at a higher temperature location and a lower temperature location of the side wall of the shell (1).
9. A sealed power supply system for achieving rapid cooling according to claim 1, characterized in that: The bottom surfaces at both ends of each heat conducting plate (7) are provided with protrusions (701), the protrusions (701) and the bottom surface of the heat conducting plate (7) form a wedge-shaped locking structure, the two wedge-shaped locking structures are respectively connected to two heat conducting ribs (102) arranged inside the side wall of the shell (1), and the bottom surface of the heat conducting plate (7) is provided with a graphene heat conducting film (10).
10. A sealed power supply system for achieving rapid cooling according to claim 1, characterized in that: The shell (1) is made of titanium alloy, the radiator (5) is made of aluminum alloy, and the radiator (5) and the shell (1) are connected by brazing.