Heat dissipation mechanism, electric appliance box device and air conditioner

Abstract

The utility model relates to the technical field of electric appliance box heat dissipation, in particular to a heat dissipation mechanism, an electric appliance box device and an air conditioner, the heat dissipation mechanism comprises a radiator and a refrigerant pipe, the radiator is provided with a through groove for a component to penetrate through, and the inner surface of the through groove exchanges heat with the component; the refrigerant pipe is attached to the radiator; when the refrigerant flows through the refrigerant pipe, heat on the radiator is taken away, and the heat dissipation mechanism can effectively increase the contact area between the heat dissipation mechanism and components, so that the heat dissipation effect is improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electrical boxes, and particularly to a heat dissipation mechanism, an electrical box device, and an air conditioner. Background Art

[0002] There are many components arranged on the circuit board in the electrical box. Some of these components are high-heat-generating components. When the current in the components is too large or the ambient temperature is too high, the heat at the components cannot be dissipated, which will cause the temperature rise of the components to intensify. Exceeding the operating temperature range of the components will affect the working effect of the components, and further affect the reliability of the unit operation, and also affect the service life of the components. Currently, the methods for dissipating heat from the components include air cooling and liquid cooling. Among them, the effect of liquid cooling for cooling specific parts is better than that of air cooling. Therefore, liquid cooling is generally used for the heat dissipation of high-heat-generating components in the electrical box. That is, the high-heat-generating components are attached to the surface of the refrigerant radiator, so that the heat of the high-heat-generating components is transferred to the radiator, and then the heat of the radiator is taken away by the refrigerant. However, the components and the radiator are in a single-sided attachment form, and the effective contact area is small, resulting in poor heat dissipation effect. Summary of the Utility Model

[0003] The purpose of the present application is to provide a heat dissipation mechanism, an electrical box device, and an air conditioner. The heat dissipation mechanism can effectively increase the contact area with the components, thereby improving the heat dissipation effect.

[0004] To this end, in a first aspect, an embodiment of the present application provides a heat dissipation mechanism, including: a radiator having a through groove for the components to pass through, and the inner surface of the through groove exchanges heat with the components; and a refrigerant pipe attached to the radiator; wherein, when the refrigerant flows through the refrigerant pipe, it takes away the heat on the radiator.

[0005] In a possible implementation manner, the components include: a first part located in the through groove; and a second part connected to the first part, and the second part is located outside the through groove.

[0006] In a possible implementation manner, the side of the second part facing the radiator abuts against the radiator.

[0007] In a possible implementation manner, the components are arranged on the circuit board, and the second part is connected to the radiator.

[0008] In a possible implementation manner, the heat dissipation mechanism further includes an elastic heat transfer module arranged in the through groove. The elastic heat transfer module can expand and contract along a first direction. One end of the elastic heat transfer module along the first direction abuts against the components, and the other end abuts against the inner wall of the through groove.

[0009] In a possible implementation, one end of the component abuts against the elastic heat transfer module, and the other end abuts against the inner surface of the through groove; alternatively, both ends of the component abut against the inner surface of the through groove respectively.

[0010] In a possible implementation, the elastic heat transfer module includes: a housing having a deformable cavity; elastic ribs disposed in the housing for supporting the cavity along a first direction; and a heat conductive medium filled in the cavity.

[0011] In a possible implementation, the housing is made of aluminum foil.

[0012] In a possible implementation, a heat dissipation paste is provided between the inner surface of the through groove and the component.

[0013] In a possible implementation, the radiator is provided with a receiving groove for receiving the refrigerant pipe, and the heat dissipation mechanism further includes a fixing cover connected to the radiator, and the refrigerant pipe is clamped between the radiator and the fixing cover.

[0014] In a second aspect, an embodiment of the present application provides an electrical box device, including: a circuit board and components disposed on the circuit board; and the above heat dissipation mechanism.

[0015] In a third aspect, an embodiment of the present application provides an air conditioner, including the above electrical box device.

[0016] According to the heat dissipation mechanism, the electrical box device and the air conditioner provided by the embodiments of the present application, the heat dissipation mechanism increases the contact area with the component effectively by providing a through groove on the radiator, and the component passes through the through groove and exchanges heat with the inner surface of the through groove. Compared with the existing situation where the component is attached to the radiator on one side, the heat dissipation effect can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present invention and used together with the specification to explain the principles of the present invention.

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0019] One or more embodiments are illustrated by way of example in the pictures in the corresponding accompanying drawings. These exemplary illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated, and the drawings in the drawings do not constitute a proportional limitation.

[0020] Figure 1 Shows a schematic cross-sectional structure diagram of a heat dissipation mechanism and components provided by an embodiment of the present application;

[0021] Figure 2 Shows a schematic cross-sectional structure diagram of a radiator and an elastic heat transfer module provided by an embodiment of the present application;

[0022] Figure 3 Shows a schematic structure diagram of an elastic heat transfer module provided by an embodiment of the present application;

[0023] Figure 4 Shows a schematic structure diagram of another elastic heat transfer module provided by an embodiment of the present application;

[0024] Figure 5 Shows a three-dimensional structure diagram of a circuit board and components provided by an embodiment of the present application;

[0025] Figure 6 Shows a three-dimensional structure diagram of a heat dissipation mechanism, a circuit board, and components provided by an embodiment of the present application;

[0026] Figure 7 Shows a schematic structure diagram of an electrical box device provided by an embodiment of the present application.

[0027] Description of reference numerals:

[0028] X, the first direction;

[0029] 1, radiator; 11, through groove; 12, receiving groove;

[0030] 2, refrigerant pipe;

[0031] 3, component; 31, first part; 32, second part;

[0032] 4, circuit board;

[0033] 5, elastic heat transfer module; 51, housing; 52, elastic ribs; 53, heat conductive medium; 54, spacer;

[0034] 6, fixed cover. Detailed implementation manners

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0036] The following disclosure provides many different embodiments or examples for implementing different structures of the embodiments of the present application. To simplify the disclosure of the embodiments of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the embodiments of the present application. In addition, the embodiments of the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplification and clarity and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0037] For ease of description, spatially relative relationship terms may be used in the text to describe the relative positional relationship or movement of one element or feature shown in the figure with respect to another element or feature. These relative relationship terms such as "inside", "outside", "inner side", "outer side", "below", "beneath", "above", "over", "front", "rear", etc. This spatially relative relationship term is intended to include different orientations of the device in use or operation other than the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or attitude change or motion state change, then these directional indications will change accordingly. For example, an element described as "below other elements or features" or "beneath other elements or features" will subsequently be oriented as "above other elements or features" or "over other elements or features". Therefore, the exemplary term "below" can include the orientations of above and below. The device may be oriented otherwise (rotated 90 degrees or in other directions) and the spatially relative relationship descriptors used in the text are interpreted accordingly.

[0038] To solve the problems in the prior art, the present application provides a heat dissipation mechanism, an electrical box device, and an air conditioner. The heat dissipation mechanism can effectively increase the contact area with components, thereby improving the heat dissipation effect.

[0039] Figure 1 Shows a schematic cross-sectional structure diagram of a heat dissipation mechanism and components provided by an embodiment of the present application; Figure 2 Shows a schematic cross-sectional structure diagram of a radiator and an elastic heat transfer module provided by an embodiment of the present application; Figure 3 Shows a schematic structural diagram of an elastic heat transfer module provided by an embodiment of the present application; Figure 4 Shows a schematic structural diagram of another elastic heat transfer module provided by an embodiment of the present application; Figure 5 Shows a schematic three-dimensional structure diagram of a circuit board and components provided by an embodiment of the present application; Figure 6 Shows a schematic three-dimensional structure diagram of a heat dissipation mechanism, a circuit board, and components provided by an embodiment of the present application.

[0040] As Figures 1-6 shown, the embodiment of the present application provides a heat dissipation mechanism, including a radiator 1 and a refrigerant pipe 2.

[0041] The heat sink 1 has a through groove 11 for the component 3 to pass through, and the inner surface of the through groove 11 exchanges heat with the component 3. Specifically, the heat sink 1 is in a plate-like structure and made of a high thermal conductivity material. The heat exchange between the inner surface of the through groove 11 and the component 3 can be achieved by directly attaching the inner surface of the through groove 11 to the outer surface of the component 3 for heat transfer, or by using other heat transfer structures between the inner surface of the through groove 11 and the component 3 for heat transfer.

[0042] The refrigerant pipe 2 is attached to the heat sink 1. The refrigerant pipe 2 can be one that is reciprocally bent, or multiple pipes arranged in parallel. The number of refrigerant pipes 2 is determined according to the width of the heat sink 1. In this application, 1 refrigerant pipe 2 is provided.

[0043] Wherein, when the refrigerant flows through the refrigerant pipe 2, it takes away the heat on the heat sink 1.

[0044] Specifically, the component 3 is some high-heat-generating components 3, such as diodes, etc.

[0045] In this application, by providing the through groove 11 on the heat sink 1, the component 3 passes through the through groove 11 and exchanges heat with the inner surface of the through groove 11. Compared with the existing situation where the component 3 is attached to the heat sink 1 on one side, the contact area with the component 3 can be effectively increased, thereby improving the heat dissipation effect.

[0046] In the related art, some of the components 3 are high-heat-generating components 3. The existing heat dissipation method for these high-heat-generating components 3 is: attaching one side (the side away from the circuit board 4) of the component 3 to the heat sink 1, so as to exchange heat with the heat sink 1, enabling the heat sink 1 to take away the heat of the component 3. Although the dedicated heat dissipation of the component 3 can also be achieved, the contact area between the heat sink 1 and the component 3 is limited, and the heat dissipation effect on the component 3 is average. When the current in the component 3 is too large or the ambient temperature is too high, the heat in the component 3 cannot be effectively dissipated, resulting in an increase in the temperature rise of the component 3, exceeding the operating temperature range of the component 3, reducing the service life of the component 3, and affecting the reliability of the unit operation.

[0047] In the embodiment of this application, by providing the through groove 11 on the heat sink 1, the component 3 can penetrate the through groove 11, which is convenient for connecting with the circuit board 4. The outer peripheral surface of the component 3 exchanges heat with the through groove 11. Compared with the single-sided heat transfer situation in the prior art, heat can be dissipated from the four sides of the component 3, effectively increasing the contact area with the component 3, thereby improving the heat dissipation effect on the component 3, and further ensuring the service life of the component 3, and ensuring the reliable operation of the unit by ensuring the working effect of the component 3.

[0048] In some embodiments, the component 3 includes: a first part 31 located within the through groove 11; and a second part 32 connected to the first part 31, with the second part 32 located outside the through groove 11.

[0049] In this application, the component 3 includes a first part 31 and a second part 32. The first part 31 is located within the through groove 11 for heat dissipation of the component 3, and the second part 32 is located outside the through groove 11 to facilitate the installation and fixation of the device and subsequent replacement and maintenance.

[0050] In a specific embodiment, the component 3 is a diode, and the diode has an L-shaped structure. The first part 31 is the vertical part of the diode, and the first part 31 is arranged along the thickness direction of the heat sink 1, that is, along the extension direction of the through groove 11. The second part 32 is the horizontal part of the diode, and the second part 32 is located outside the through groove 11.

[0051] Of course, the component 3 in this application is not limited to a diode and can also be other high-heat-generating components 3.

[0052] In some embodiments, the side of the second part 32 facing the heat sink 1 abuts against the heat sink 1.

[0053] In this application, the side of the second part 32 facing the heat sink 1 abuts against the heat sink 1, which can further increase the contact area between the heat sink 1 and the component 3, thereby further improving the heat dissipation effect on the component 3.

[0054] In the related art, the existing component 3 is arranged on the circuit board 4, and the component 3 is connected to the circuit board 4 through pins. Under the pulling force of the pins, the single-sided fitting of the component 3 and the heat sink 1 is uneven, making it difficult to ensure the heat dissipation effect on the component 3.

[0055] In an embodiment, the component 3 is arranged on the circuit board 4, and the second part 32 is connected to the heat sink 1.

[0056] In this application, the second part 32 of the component 3 is connected to the heat sink 1 by screws, thereby effectively fixing the component 3 and the heat sink 1. The through groove 11 can dissipate heat from the first part 31 of the component 3, and the second part 32 can also ensure full contact with the heat sink 1 under the action of the screws, thereby ensuring the heat dissipation effect on the component 3.

[0057] Specifically, the circuit board 4 is fixedly arranged inside the electrical box, and the radiator 1 is also fixedly arranged inside the box. The component 3 is electrically connected to the circuit board 4 through pins. In the prior art, the component 3 lacks fixation, and it is easy to occur that the component 3 moves and causes the pins to break. However, in this application, the second part 32 of the component 3 is connected to the radiator 1, so as to fix the component 3 in the vertical direction, so that the component 3 will not move in the vertical direction, and the pins can be protected.

[0058] In this application, the radiator 1 and the circuit board 4 are arranged in parallel or nearly parallel. After the component 3 is connected to the circuit board 4, it is generally installed perpendicular to the circuit board 4 or parallel to the circuit board 4. For the component 3 installed perpendicular to the circuit board 4, its length in the direction perpendicular to the circuit board 4 is greater than its length in the direction parallel to the circuit board 4. Therefore, this component 3 can be arranged in the through groove 11 to increase the contact area between the radiator 1 and the component 3. For the component 3 parallel to the circuit board 4, its length parallel to the circuit board 4 is greater than its length perpendicular to the circuit board 4. At this time, the surface of the component 3 in the length direction can be made to fit with the radiator 1. It is also possible to provide a groove on the radiator 1, and the shape of the groove matches the shape of the component 3 in the length direction. The component 3 is located in the groove, which can also increase the contact area with the radiator 1, and the groove can also position the component 3.

[0059] In some embodiments, the heat dissipation mechanism further includes an elastic heat transfer module 5 arranged in the through groove 11. The elastic heat transfer module 5 can expand and contract along the first direction X. One end of the elastic heat transfer module 5 along the first direction X abuts against the component 3, and the other end abuts against the inner wall of the through groove 11.

[0060] In this application, by abutting one end of the elastic heat transfer module 5 that can expand and contract along the first direction X against the component 3 and the other end against the inner wall of the through groove 11, the component 3 can be pressed and positioned in the first direction X, ensuring that one end of the component 3 facing the elastic heat transfer module 5 fits fully with the elastic heat transfer module 5, and the end away from the elastic heat transfer module 5 fits fully with the through groove 11, further ensuring the fitting effect and heat dissipation effect with the component 3. The heat of the component 3 can be transferred to the radiator 1 through the elastic heat transfer module 5, and then the heat is dissipated through the refrigerant pipe 2.

[0061] Specifically, if the component 3 needs to pass through the through slot 11 and the heat exchange between the component 3 and the through slot 11 is sufficient, it is necessary to reduce the gap between the through slot 11 and the component 3. However, if the gap is too small, it is not convenient to install the component 3, and it is easy to damage the component 3 during the installation process. The present application sets an elastic heat transfer module 5. When the component 3 is inserted into the through slot 11, the elastic heat transfer module 5 is squeezed and compressed in the first direction X, thereby facilitating the installation of the component 3 and protecting the component 3 to prevent the component 3 from being damaged during the insertion into the through slot 11. After the component 3 is inserted into the through slot 11 and the external force is lost, the elastic heat transfer module 5 stretches along the first direction X under the action of its own elasticity, thereby squeezing the component 3, ensuring that both ends of the component 3 along the first direction X can fully abut against the heat dissipation structure, thereby ensuring the heat dissipation effect of the component 3.

[0062] In some embodiments, one end of the component 3 abuts against the elastic heat transfer module 5 , and the other end abuts against the inner surface of the through slot 11 ; or, both ends of the component 3 abut against the inner surface of the through slot 11 respectively.

[0063] In a specific embodiment, the cross section of the component 3 is rectangular, the cross section of the through slot 11 is rectangular, an elastic heat transfer module 5 is provided on one side wall in the length direction of the through slot 11, and cooperates with the side wall on the other side in the length direction of the through slot 11 to clamp the two sides in the length direction of the component 3; an elastic heat transfer module 5 is provided on one side wall in the width direction of the through slot 11, and cooperates with the side wall on the other side in the width direction of the through slot 11 to clamp the two sides in the width direction of the component 3. Thus, the four outer sides of the component 3 can fully fit the heat dissipation mechanism, and when the component 3 is inserted into the through slot 11, it can avoid in both the length direction and the width direction, further improving the protection of the component 3 during the installation process.

[0064] In another specific embodiment, the cross section of the component 3 is rectangular, the cross section of the through slot 11 is rectangular, and an elastic heat transfer module 5 is provided on one side wall in the length direction of the through slot 11, and cooperates with the side wall on the other side in the length direction of the through slot 11 to clamp the two sides in the length direction of the component 3. The two sides in the width direction of the component 3 are respectively fitted with the two inner walls of the through slot 11, and the elastic heat transfer module 5 is only provided in one direction, which can also ensure the fitting and heat dissipation effect of the component 3.

[0065] In another specific embodiment, the cross-section of the component 3 is circular, the cross-section of the through groove 11 is a runway-shaped structure, and an elastic heat transfer module 5 is provided on one side of the through groove 11 of the runway-shaped structure along the length direction. The elastic heat transfer module 5 is provided with a concave surface on the side facing the component 3 for conforming to the outer surface of the component 3.

[0066] Furthermore, the elastic heat transfer module 5 includes: a shell 51 having a deformable cavity; elastic ribs 52 disposed in the shell 51 and used to support the cavity along the first direction X; and a heat conducting medium 53 filled in the cavity.

[0067] In the present application, the shell 51 is made of a soft material, the heat-conducting medium 53 is located in the cavity of the shell 51 and can flow as the shape of the shell 51 changes, and the elastic ribs 52 support the shell 51 inside the shell 51, so that the shell 51 can maintain elastic expansion and contraction properties in the first direction X, and can preliminarily limit the shape of the shell 51.

[0068] Specifically, the heat-conducting medium 53 has good thermal conductivity, and the heat-conducting medium 53 is in a flowable state in the shell 51. The temperature of the heat-conducting medium 53 on the side close to the component 3 is higher than the temperature on the side close to the inner wall of the through groove 11. Under the action of the temperature difference, the heat-conducting medium 53 can circulate in the shell 51, further improving the thermal conductivity effect of the heat-conducting medium 53.

[0069] In the present application, the heat-conducting medium 53 is filled and arranged in the cavity of the shell 51. The heat-conducting medium 53 is located in the middle and lower areas of the cavity. A spacer 54 is arranged in the middle of the cavity. A gap is left between the top of the spacer 54 and the inner top wall of the cavity, and a gap is left between the bottom of the spacer 54 and the inner bottom wall of the cavity. The top area of ​​the cavity is an empty area. The heated end of the heat-conducting medium 53 will evaporate to form gas. The gas moves upward and passes over the spacer 54 to the top of the other side. After precooling, it becomes liquid, so that the liquid heat-conducting medium 53 increases. The heat-conducting medium 53 returns to the other side at the bottom of the spacer 54, thereby forming a circulating flow of the heat-conducting medium 53. The heat-conducting medium 53 is selected to have good thermal conductivity and a low evaporation temperature, so as to form a circulation of the heat-conducting medium 53 in the shell 51.

[0070] Among them, the elastic rib 52 has two abutment ends relatively set and an elastic part located between the two abutment ends, the two abutment ends are respectively connected to the two inner side walls in the cavity along the first direction X, and the elastic part is used to play the role of elastic support, positioning the shell 51, and assisting the shell 51 to restore its original state after the shell 51 is compressed.

[0071] In some embodiments, the housing 51 is made of aluminum foil.

[0072] In this application, the housing 51 is made of aluminum foil, which also has good thermal conductivity. The heat of the component 3 is transferred to the heat-conducting medium 53 through the aluminum foil, and then transferred to the radiator 1 through the aluminum foil on the other side. Or, a part of the heat of the component 3 is directly transferred to the radiator 1 through the aluminum foil, and the other part of the heat is transferred through the heat-conducting medium 53. The aluminum foil has good thermal conductivity and can conduct heat quickly, but the temperature difference between the two ends of the aluminum foil is relatively small, which affects the heat-conducting effect. In this application, the heat-conducting medium 53 is filled in the aluminum foil, which not only enables telescopic deformation, but also increases the temperature difference between the two ends of the aluminum foil, thereby ensuring the heat-conducting effect.

[0073] In some embodiments, a heat-conducting paste is provided between the inner surface of the through groove 11 and the component 3.

[0074] In this application, by providing a heat-conducting paste in the through groove 11, and the heat-conducting paste is provided between the component 3 and the inner wall of the through groove 11, the fitting effect between the component 3 and the through groove 11 can be further increased. The heat-conducting paste itself also has good heat-dissipating effect, thereby ensuring the heat-dissipating effect on the component 3.

[0075] In some embodiments, a receiving groove 12 for receiving the refrigerant pipe 2 is provided on the radiator 1. The heat-dissipating mechanism further includes a fixing cover 6 connected to the radiator 1, and the refrigerant pipe 2 is clamped between the radiator 1 and the fixing cover 6.

[0076] In this application, the refrigerant pipe 2 is arranged in the receiving groove 12 of the radiator 1, which increases the contact area with the radiator 1, thereby increasing the heat exchange effect between the refrigerant pipe 2 and the radiator 1. The fixing cover 6 can limit and fix the refrigerant pipe 2, and the fixing cover 6 is installed on the radiator 1 through bolts, which can also protect the component 3. Avoid the area of the component 3 outside the through groove 11 from being contaminated or knocked.

[0077] The heat-dissipating mechanism increases the contact area with the component 3 by providing a through groove 11 on the radiator 1, and the component 3 passes through the through groove 11 and exchanges heat with the inner surface of the through groove 11. Compared with the existing situation where the component 3 is attached to the radiator 1 on one side, the heat-dissipating effect can be effectively improved.

[0078] Among them, the number, position, and shape of the through grooves 11 on the radiator 1 are determined according to the number, position, and shape of the components 3 that need to dissipate heat. One through groove 11 can dissipate heat from one component 3, or one through groove 11 can dissipate heat from multiple components 3 arranged in a row. When multiple components 3 are arranged in one through groove 11, an elastic heat transfer module 5 can be provided. One side of the elastic heat transfer module 5 is respectively attached to multiple components 3, with a gap left between the components 3. An interval part can be provided on the elastic heat transfer module 5, and the interval part is located between two components 3 and is used to fill the area between the two components 3. For multiple components 3 arranged in a row, compared with inserting each component 3 into one through groove 11, the time for inserting the components 3 into the through grooves 11 is saved.

[0079] Figure 7 The structural schematic diagram of an electrical box device provided by an embodiment of the present application is shown.

[0080] As Figure 7 As shown, an embodiment of the present application provides an electrical box device, including: a circuit board 4 and components 3 arranged on the circuit board 4; and the above heat dissipation mechanism.

[0081] In the present application, the electrical box device further includes a box body. The circuit board 4 and the radiator 1 are both fixedly arranged in the box body. The components 3 are connected to the circuit board 4 through pins, and the components 3 penetrate through the through grooves 11 on the radiator 1 to increase the heat exchange area with the radiator 1. Among them, there are multiple types of components 3 on the circuit board 4. The heat dissipation mechanism in the present application is mainly applicable to the components 3 installed perpendicular to the circuit board 4, that is, the components 3 have a relatively high height. When passing through the through grooves 11, heat can be dissipated to the surroundings of the components 3 through the through grooves 11 to increase the heat exchange area and improve the heat dissipation effect. For components 3 with a relatively low height, it is difficult to pass through the through grooves 11 of the radiator 1, and the heat exchange area will not be increased. At this time, grooves can be provided on the radiator 1, and the components 3 can be arranged in the grooves to increase the heat exchange area between the components 3 and the radiator 1.

[0082] An embodiment of the present application provides an air conditioner, including the above electrical box device.

[0083] The air conditioner in the present application adopts the above electrical box device, which can increase the heat exchange area with the components 3, thereby improving the heat dissipation effect on the components 3.

[0084] It should be understood that the terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" as used herein may also include the plural forms. The terms "comprising", "including", "containing", and "having" are inclusive and thus specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the particular order described or illustrated, unless the order of performance is explicitly stated. It should also be understood that additional or alternative steps may be used.

[0085] Although the terms first, second, third, etc. may be used herein to describe multiple elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. Unless the context clearly indicates otherwise, terms such as "first", "second", and other numerical terms when used herein do not imply an order or sequence. Thus, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of the example embodiments.

[0086] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather will conform to the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A heat dissipation mechanism, characterized in that: include: A heat sink (1), the heat sink (1) having a through slot (11) for a component (3) to pass through, the inner surface of the through slot (11) exchanging heat with the component (3); and A refrigerant pipe (2) is fitted to the radiator (1); When the refrigerant flows through the refrigerant pipe (2), it takes away the heat from the radiator (1).

2. The heat dissipation mechanism according to claim 1, characterized in that: The components (3) include: A first portion (31) is located in the through slot (11); and The second part (32) is connected to the first part (31), and the second part (32) is located outside the through groove (11).

3. The heat dissipation mechanism according to claim 2, characterized in that: The second portion (32) abuts against the radiator (1) on a side facing the radiator (1).

4. The heat dissipation mechanism according to claim 2, characterized in that: The component (3) is arranged on a circuit board (4), and the second part (32) is connected to the heat sink (1).

5. The heat dissipation mechanism according to claim 1, characterized in that: The heat dissipation mechanism further comprises an elastic heat transfer module (5) arranged in the through slot (11); the elastic heat transfer module (5) is retractable along a first direction; one end of the elastic heat transfer module (5) along the first direction abuts against the component (3), and the other end abuts against the inner wall of the through slot (11).

6. The heat dissipation mechanism according to claim 5, characterized in that: One end of the component (3) abuts against the elastic heat transfer module (5), and the other end abuts against the inner surface of the through groove (11); Alternatively, two ends of the component (3) are respectively in contact with the inner surface of the through groove (11).

7. The heat dissipation mechanism according to claim 5, characterized in that: The elastic heat transfer module (5) comprises: A housing (51) having a deformable cavity; an elastic rib (52), disposed in the housing (51) and used to support the cavity along the first direction; and A heat-conducting medium (53) is filled in the cavity.

8. The heat dissipation mechanism according to claim 1, characterized in that: The radiator (1) is provided with a receiving groove (12) for receiving the refrigerant tube (2), and the heat dissipation mechanism also includes a fixing cover (6) connected to the radiator (1), and the refrigerant tube (2) is clamped between the radiator (1) and the fixing cover (6).

9. An electrical box device, characterized in that: include: A circuit board (4) and components (3) arranged on the circuit board (4); as well as A heat dissipation mechanism as claimed in any one of claims 1 to 8.

10. An air conditioner, characterized in that: It comprises the electrical box device as claimed in claim 9.

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