Semiconductor chip gluing clamp

Abstract

The utility model discloses a semiconductor chip gluing clamp, comprising a placing plate and a heating module, the placing plate is provided with a plurality of groups of chip grooves, the plurality of groups of chip grooves are respectively provided with a clamping plate, and the clamping plates are used for fixing the positions of semiconductor chips placed in the chip grooves; the heating module is used for heating the placing plate, one end of the placing plate is further provided with a spring handle, one end of the spring handle is connected with a pull rod, the spring handle is pulled to drive the clamping plate to move in the chip groove through the pull rod, and the position of the semiconductor chip in the chip groove is fixed; according to the gluing clamp for the semiconductor chip, the heating module is adopted to heat the placing plate on which the semiconductor chip to be glued is placed, a preset temperature environment is provided for the gluing process of the semiconductor chip, and the problem that relevant glue needs a certain temperature condition to improve the flowability is solved; and the gluing efficiency and the process yield are effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing devices, and specifically relates to a semiconductor chip glue coating fixture. Background Art

[0002] In the technical field of electronic product chips, the dispensing and glue coating processing and encapsulation of electronic product chips refer to encapsulating the chips on an appropriate substrate during the manufacturing process, and using glue for dispensing and glue coating to fix and protect the chips. There is also conductive glue applied to the input or output endpoints of the electronic product chips to connect them to the external circuit. It can be said that dispensing or glue coating is a very important process for semiconductor chips.

[0003] Before dispensing or glue coating the semiconductor chips, relevant materials need to be prepared, namely dispensing glue. Since the glue involved in semiconductor chip processes generally has a time limit, most of it needs to be prepared on-site and fully stirred to improve the fluidity of the glue for convenient dispensing or glue coating, and to improve the dispensing efficiency and the yield of the process.

[0004] However, for some relatively thick encapsulation glues, such as resins with poor fluidity, it is often difficult to make them flow fully only by stirring. The conditions for such glues to exhibit good fluidity usually require a certain temperature condition, which is usually higher than room temperature but much lower than the curing temperature. Under the corresponding temperature conditions, the glue usually exhibits better fluidity, which can facilitate the dispensing or glue coating process more conveniently, and improve the dispensing efficiency and the yield of the process. However, in the existing dispensing or glue coating processes, there is a widespread lack of corresponding equipment and facilities for providing temperature conditions.

[0005] Therefore, in view of the problem that it is difficult to provide temperature conditions during the glue coating and dispensing process of semiconductor chips to improve the fluidity of some relatively thick glues with poor fluidity, it is very necessary to design a new type of equipment or tooling fixture to solve the problem. Content of the Utility Model

[0006] In order to solve the above problems, the utility model proposes a semiconductor chip glue coating fixture, which uses a heating module to heat the placement plate for placing the semiconductor chips to be glue coated, provides a preset temperature environment for the semiconductor chip glue coating process, solves the problem that relevant glues require a certain temperature condition to improve fluidity, and effectively improves the glue coating efficiency and the yield of the process.

[0007] In order to achieve the above purpose, the utility model proposes the following technical solutions:

[0008] A semiconductor chip glue coating fixture includes a placement plate and a heating module;

[0009] In the technical solution of the present utility model, a plurality of groups of chip slots are provided on the placement plate, and the chip slots are used to place semiconductor chips to be coated with glue; the heating module is used to heat-treat the placement plate;

[0010] Further, clamping plates are respectively installed in the plurality of groups of chip slots, and the clamping plates are used to fix the positions of the semiconductor chips placed in the chip slots.

[0011] Further, a spring handle is installed at one end of the placement plate, one end of the spring handle is connected with a pull rod, the pull rod is fixedly connected with the clamping plate in sequence, and pulling the spring handle can drive the clamping plate to move in the chip slot through the pull rod and fix the position of the semiconductor chip in the chip slot.

[0012] Further, the heating module includes a heating rod, and the heating rod is installed inside the placement plate to heat-treat the placement plate.

[0013] In the technical solution of the present utility model, the clamping plate is pulled open by the spring handle and the semiconductor chip to be coated with glue is placed, so that the clamping plate clamps the semiconductor chip to complete the chip position fixing, and further the heating module is turned on to heat the placement plate at a low temperature to provide the temperature environment for the semiconductor chip coating process.

[0014] Compared with the prior art, the present utility model has the following beneficial effects:

[0015] A semiconductor chip coating fixture of the present utility model uses a heating module to heat the placement plate for placing the semiconductor chip to be coated with glue, provides a preset temperature environment for the semiconductor chip coating process, solves the problem that relevant glues require certain temperature conditions to improve fluidity, and effectively improves the coating efficiency and the process yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural view of a semiconductor chip coating fixture of the present utility model Figure 1 ;

[0017] Figure 2 is a schematic cross-sectional view of a part of a semiconductor chip coating fixture of the present utility model;

[0018] Figure 3 is a schematic structural view of a semiconductor chip coating fixture of the present utility model Figure 2 ;

[0019] Figure 4 is a schematic use view of a semiconductor chip coating fixture of the present utility model;

[0020] In the figure: 1. Placing plate; 11. Chip slot; 12. Card board; 13. Spring handle; 131. Pull rod; 2. Heating module; 21. Heating rod. Detailed implementation manner

[0021] In order to make the objectives, features, and advantages of the present utility model more obvious and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the embodiments described below are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0022] The technical solutions of the present utility model will be further described below with reference to the accompanying drawings and through specific implementation manners.

[0023] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0024] As Figure 1 shown, an embodiment of the present utility model provides a semiconductor chip gluing fixture, including a placing plate 1 and a heating module 2. The heating module 2 is used to heat the placing plate 1.

[0025] In this embodiment, as Figure 2 shown, a plurality of groups of chip slots 11 are provided on the placing plate 1. The chip slots 11 are used to place semiconductor chips to be glued.

[0026] Among them, please continue to refer to Figure 2 , a card board 12 is installed in each of the plurality of groups of chip slots 11. The card board 12 is used to fix the position of the semiconductor chip placed in the chip slot 11.

[0027] In this embodiment, a spring handle 13 is further installed at one end of the placing plate 1. One end of the spring handle 13 is connected to a pull rod 131. The pull rod 131 and the card board 12 are fixedly connected in sequence. By pulling the spring handle 13, the card board 12 can be driven by the pull rod 131 to move in the chip slot 11 and fix the position of the semiconductor chip in the chip slot 11. After the card board 12 is opened, the semiconductor chip to be glued is placed, and then the card board 12 is released. The card board 12 will then clamp the semiconductor chip in the chip slot 11 under the spring action of the spring handle 13.

[0028] In this embodiment, the heating module 2 includes a heating rod 21, which is installed inside the placement plate 1 and heats the placement plate 1.

[0029] In this embodiment, when a semiconductor chip gluing fixture is used, first pull the clamping plate 12 in the chip slot 11 through the spring handle 13. After placing the semiconductor chip to be glued, release the spring handle 13. The clamping plate 12 will then clamp the semiconductor chip in the chip slot 11 under the spring action of the spring handle 13 to complete the fixing of the chip position, as Figure 4 shown, and then turn on the heating module 2 to perform low-temperature heating on the placement plate 1.

[0030] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip glue coating fixture, characterized in that: It comprises a placement plate (1) and a heating module (2); The placement plate (1) is provided with a plurality of groups of chip slots (11), and the chip slots (11) are used to place semiconductor chips to be coated with glue; The heating module (2) is used to heat the placement plate (1), and the heating module (2) comprises a heating rod (21). The heating rod (21) is installed inside the placement plate (1) and heats the placement plate (1).

2. A semiconductor chip glue coating fixture as claimed in claim 1, characterized in that: A clamping plate (12) is respectively installed in each of the groups of chip slots (11), and the clamping plate (12) is used to fix the position of the semiconductor chip placed in the chip slot (11).

3. A semiconductor chip glue coating fixture as claimed in claim 2, characterized in that: A spring handle (13) is also installed at one end of the placement plate (1), and a pull rod (131) is connected to one end of the spring handle (13). The pull rod (131) and the clamping plate (12) are fixedly connected in sequence. Pulling the spring handle (13) can drive the clamping plate (12) to move in the chip slot (11) through the pull rod (131) and fix the position of the semiconductor chip in the chip slot (11).

Images