Silicon wafer drying equipment and silicon wafer processing production line
By designing sealed boxes in silicon wafer drying equipment and using radiation heating and vacuum systems, the problems of large heat loss and silicon wafer vibration in existing equipment are solved, and low energy consumption, high-efficiency drying and high-quality silicon wafer production are achieved.
Patent Information
- Application Number
- CN202421486901.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-27
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-06-27
AI Technical Summary
The existing silicon wafer drying equipment is not sealed and has high energy consumption. At the same time, traditional hot air drying methods are difficult to balance the drying effect and the silicon wafer vibration, which can easily lead to silicon wafer damage.
A sealed box type silicon wafer drying equipment is designed, which uses radiation heating devices such as infrared heating, and is dried in combination with a vacuum system. The silicon wafer extends vertically, is arranged at intervals and is inserted in parallel into the flower basket. The vacuum system draws away the air in the sealed box through the negative pressure part and the negative pressure pump.
The heat is retained by sealed boxes to reduce the energy consumption of the silicon wafer drying process; radiation heating reduces gas flow and avoids vibration and damage of the silicon wafer; vacuum drying effectively removes water vapor impurities and improves the quality and production capacity of the silicon wafer.
Smart Images
Figure CN223005216U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer drying, in particular to a wafer drying device and a wafer processing production line. Background Art
[0002] Existing equipment loads wafers in a flower basket. After cleaning, the flower basket is placed in a drying tank. The drying tank is not sealed. Hot air is blown upward from the bottom of the drying tank to dry the wafers in the flower basket in the tank.
[0003] Obviously, this structure will cause certain heat loss and high energy consumption due to non-sealing. For blow-drying, if the wind force is small, the drying effect is poor and the time is long. If the wind force is large, it will cause the wafers to vibrate, resulting in wafer breakage and having a negative impact on production capacity. Summary of the Utility Model
[0004] (I) Technical Problems to be Solved
[0005] In view of the above-mentioned disadvantages and deficiencies of the existing technology, the utility model provides a wafer drying device, which solves the technical problems of high drying energy consumption and difficulty in balancing the drying effect and wafer vibration phenomenon existing in the existing wafer drying method.
[0006] (II) Technical Solutions
[0007] To achieve the above object, the main technical solutions adopted by the utility model include:
[0008] In the first aspect, the utility model provides a wafer drying device, which includes a sealed box, a radiation heating device and a flower basket distributed in the inner cavity of the sealed box, and a vacuum system communicating with the inner cavity of the sealed box; each flower basket corresponds to at least one group of radiation heating devices, and the wafers all extend vertically, are arranged at intervals and are inserted into the corresponding flower basket in parallel; the vacuum system includes a negative pressure part and a negative pressure pump that communicate with each other, and the negative pressure part is connected to the inner wall of the sealed box to evacuate the air in the inner cavity of the sealed box.
[0009] In the second aspect, the utility model provides a wafer processing production line, which includes the wafer drying device in the above technical solution. The wafer processing production line further includes a draining device and a manipulator. The draining device is located on the upstream side of the wafer drying device and is used to drain the water of the wafers in the flower basket; it is also used to move the flower basket with drained water into the sealed box and to move the dried wafers together with the flower basket out of the sealed box.
[0010] (III) Advantageous Effects
[0011] The beneficial effects of the present utility model are as follows: For the silicon wafer drying equipment and the silicon wafer processing production line of the present utility model, by setting the storage device for drying as a sealed box, the heat during the drying process can be retained in the sealed box as much as possible, thereby reducing the energy consumption during the silicon wafer drying process; using a radiation heating device such as an infrared heating device to dry the silicon wafers, compared with the traditional hot air drying form, there will be no obvious gas flow in the sealed box, and thus the silicon wafers will not vibrate significantly, and the problem of silicon wafer breakage caused by silicon wafer vibration can be avoided, ensuring the yield and production capacity during the silicon wafer drying process.
[0012] Adopting the vacuum drying method is beneficial to the volatilization of impurities such as water vapor on the silicon wafers during the drying process. At the same time, the water vapor and other impurities can also be evacuated in a timely manner, connected to the exhaust system for centralized treatment, avoiding secondary pollution to the silicon wafers, protecting the environment, and reducing the harm to personnel. It can also maintain low-oxygen environment for heating inside the box, improving the quality of silicon wafers.
[0013] After the silicon wafers are vertically and parallelly inserted into the flower basket, the regularity of the silicon wafers can be ensured, and sufficient gaps can also be reserved between adjacent silicon wafers, thus ensuring no mutual interference during the drying process. At the same time, the silicon wafers are first inserted into the flower basket and then placed into the sealed box. The silicon wafers inserted into the flower basket together with the flower basket are also used in other silicon wafer production processes, such as cleaning and draining, etc., thereby improving the consistency and flexibility of silicon wafer production. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 is one of the structural schematic diagrams of the silicon wafer drying equipment of the present utility model;
[0015] Figure 2 is the second structural schematic diagram of the silicon wafer drying equipment of the present utility model;
[0016] Figure 3 is the third structural schematic diagram of the silicon wafer drying equipment of the present utility model;
[0017] Figure 4 is the fourth structural schematic diagram of the silicon wafer drying equipment of the present utility model;
[0018] Figure 5 is the fifth structural schematic diagram of the silicon wafer drying equipment of the present utility model;
[0019] Figure 6 of the present utility model Figure 1 is the partial enlarged structural schematic diagram at A in;
[0020] Figure 7 of the present utility model Figure 2 is the partial enlarged structural schematic diagram at B in;
[0021] Figure 8 For this utility model Figure 2 Schematic diagram of the local enlarged structure at point C in the middle.
[0022] [Description of Reference Numerals]
[0023] 1: sealed box; 11: box body; 12: box cover;
[0024] 13: opening and closing driving member; 131: first slide; 132: second slide;
[0025] 14: Observation window; 15: Inspection port;
[0026] 2: Radiant heating device;
[0027] 3: Flower basket; 30: Give way area;
[0028] 4: vacuum system; 41: negative pressure part; 40: negative pressure port; 42: negative pressure pump; 43: air intake part; 44: filter device;
[0029] 5: mounting seat; 50: positioning slot;
[0030] 6: Positioning pin;
[0031] 7: Temperature sensor. DETAILED DESCRIPTION
[0032] In order to better explain the present invention and facilitate understanding, the following Figure 1-8 , the utility model is described in detail through specific implementation methods. Among them, the directional nouns such as "upper" and "lower" mentioned in this article are Figure 3 The orientation is used as a reference.
[0033] Embodiment 1:
[0034] Reference Figure 1 - Figure 8 The embodiment of the utility model provides a silicon wafer drying device, including a sealed box 1, a radiation heating device 2 and a flower basket 3 distributed in the inner cavity of the sealed box 1, and a vacuum system 4 connected to the inner cavity of the sealed box 1; each flower basket 3 corresponds to at least one group of radiation heating devices 2, and the silicon wafers extend vertically, are arranged at intervals and are parallelly inserted in the corresponding flower baskets 3; the vacuum system 4 includes a negative pressure part 41 and a negative pressure pump 42 that are connected to each other, and the negative pressure part 41 is connected to the inner wall of the sealed box 1 to extract the air in the inner cavity of the sealed box 1.
[0035] In this embodiment, by setting the storage device for drying as the sealed box 1, the heat during the drying process can be retained in the sealed box 1 as much as possible, thereby reducing the energy consumption in the silicon wafer drying process; a radiation heating device 2 such as an infrared heating device is used to dry the silicon wafers. Compared with the traditional hot air drying method, there will be no obvious gas flow in the sealed box 1, so there will be no obvious vibration of the silicon wafers, and thus the problem of silicon wafer breakage caused by the vibration of the silicon wafers can be avoided, ensuring the yield and production capacity of the silicon wafer drying process. The vacuum drying method is beneficial to the volatilization of impurities such as water vapor on the silicon wafers during the drying process. At the same time, the water vapor and other impurities can be evacuated in time and connected to the exhaust system for centralized treatment to avoid secondary pollution to the silicon wafers, protect the environment, and reduce the harm to personnel. It can also keep the heating in the box in a low-oxygen environment and improve the quality of the silicon wafers.
[0036] After the silicon wafers are vertically and parallelly inserted into the flower basket 3, the regularity of the silicon wafers can be ensured, and sufficient gaps can also be reserved between adjacent silicon wafers, thereby ensuring no mutual interference during the drying process. At the same time, the silicon wafers are first inserted into the flower basket 3 and then placed into the sealed box 1. The silicon wafers inserted on the flower basket 3 together with the flower basket 3 are also used in other silicon wafer production processes such as cleaning and draining, thereby improving the consistency and flexibility of silicon wafer production.
[0037] Specifically, in addition to the sealing function, a heat-insulating material is pasted on the sealed box 1, which can lock the heat in the oven to the greatest extent, reduce heat loss, and reduce energy consumption. At the same time, it ensures that the volatilized substances during the drying process are all locked in the box, without polluting the environment or harming the human body.
[0038] This silicon wafer drying equipment adopts the intermittent vacuum pumping method. For example, the vacuum degree in the sealed box 1 is pumped to -60 to -40 kPa, and while maintaining the pressure for 1 - 2 minutes, the radiation heating device 2 is started to dry the silicon wafers. Then, the negative pressure pump 42 is started again to pump the vacuum degree in the sealed box 1 to -60 to -80 kPa, and while maintaining the pressure for 1 - 2 minutes, the radiation heating device 2 is started to dry the silicon wafers. After multiple drying cycles with increasing vacuum degrees, the drying of the silicon wafers is completed. By using this phased drying method, the problem of silicon wafer damage caused by too rapid reduction of the vacuum degree can be avoided, and the silicon wafers can be fully dried in the vacuum degree environment of each step section, which is beneficial to the better and more complete volatilization of different impurities, thereby improving the drying effect of the silicon wafers.
[0039] In this embodiment, the vacuum system 4 further includes an air inlet part 43 provided on the side wall of the sealed box 1 and communicating with the inner cavity of the sealed box 1, and the air inlet part 43 is farther from the flower basket 3 than the negative pressure part 41; the vacuum system 4 further includes a filtering device 44 provided on the upstream side or the downstream side of the negative pressure pump to filter the gas output from the sealed box 1.
[0040] In this embodiment, the air intake part 43, which is the air inlet, functions to relieve pressure. After the drying operation is completed, air is input into the sealed box 1 through the air intake part 43, and the air intake part 43 should be far away from the flower basket 3 to reduce the influence of the airflow on the silicon wafers during the pressure relief process. For example, the air intake direction of the air intake part 43 can extend horizontally and be located below the bottommost silicon wafer placement mechanism.
[0041] The filtering device 44 is used to filter the gas extracted from the sealed box 1 to prevent the extracted gas from polluting the air and to reduce the harm to personnel. The filtering device 44 includes multiple layers of filtering layers arranged in sequence according to pore sizes, as well as an activated carbon adsorption layer, which will not be elaborated here.
[0042] The silicon wafer drying equipment further includes a mounting seat 5 and positioning pins 6. The mounting seat 5 is connected to the inner wall of the sealed box 1. Multiple groups of positioning grooves 50 matching the number of flower baskets 3 are provided on the mounting seat 5. The positioning pins 6 are connected to one side of the flower basket 3, and each group of positioning grooves 50 corresponds to the positioning pins 6 on each sealed box 1 one by one.
[0043] In this embodiment, under the combined action of the positioning pins 6 and the positioning grooves 50, the position of the flower basket 3 in the sealed box 1 is limited, ensuring the stability of the flower basket 3 and the position accuracy of the flower basket 3 in the sealed box 1, thereby indirectly improving the drying effect of the silicon wafers in the flower basket 3.
[0044] Specifically, the positioning pins 6 can be set as columnar pins, and the middle part of the positioning pins 6 is recessed towards its own axis. The recessed position is engaged with the positioning grooves 50, so that the positioning with the positioning grooves 50 can be achieved by using the self-weight of the flower basket 3. At the same time, the mounting seat 5 is made of a heat-resistant material, such as PTFE, that is, polytetrafluoroethylene material.
[0045] In this embodiment, the sealed box 1 includes a box body 11 with an open top, and a box cover 12 that is movably connected to the top of the box body 11; the sealed box 1 further includes an opening and closing driving member 13 for opening and closing the box cover 12; the opening and closing driving member 13 includes a first sliding table 131 and a second sliding table 132. The body of the first sliding table 131 is supported on the box body 11, the body of the second sliding table 132 is supported on the sliding part of the first sliding table 131, the sliding part of the second sliding table 132 is connected to the box cover 12, and the second sliding table 132 can drive the box cover 12 to vertically move away from the top opening of the box body 11 to open the top opening of the box body 11; the first sliding table 131 can drive the second sliding table 132 and the box cover 12 to horizontally move away from the box body 11 to make way for the top opening position of the box body 11.
[0046] In this embodiment, the lid 12 is controlled to open by the opening and closing driving member 13. This embodiment presents a possible form of the opening and closing driving member 13, but does not limit the opening and closing driving member 13 to this sole form.
[0047] The opening process of the lid 12 by the opening and closing driving member 13 includes two actions. The first action is to move the lid 12 vertically away from the box body 11, and the second action is to move the lid 12 horizontally away from the box body 11. During the opening process of the lid 12, the first action is always executed first, and then the second action. During the execution of the first action, the box body 11 and the lid 12 are disengaged from the sealed contact. During the execution of the second action, the lid 12 vacates the top opening position of the box body 11 to facilitate the placement or removal of the flower basket 3.
[0048] When the first sliding table 131 slides, it can drive the second sliding table 132 and the lid 12 to slide horizontally at the same time. When the second sliding table 132 slides, it can drive the lid 12 to slide vertically.
[0049] Specifically, the first sliding table 131 includes a first telescopic driving member, a slide rail, and a sliding frame. The sliding frame is horizontally slidably connected within the slide rail. The slide rail is supported on the box body 11. Both ends of the first telescopic driving member are respectively connected to the sliding frame and the box body 11 to drive the sliding frame to slide horizontally.
[0050] The second sliding table 132 includes a second telescopic driving member and a mounting frame. The mounting frame is supported on the sliding frame. Both ends of the second telescopic driving member are respectively connected to the lid 12 and the mounting frame to drive the lid 12 to slide vertically.
[0051] This form of the first sliding table 131 and the second sliding table 132 has a simple structure and high reliability, which is conducive to ensuring the reliability of the sealing relationship between the box body 11 and the lid 12, and indirectly ensuring the drying effect of the silicon wafers.
[0052] Embodiment 2:
[0053] Referring to Figure 2 and Figure 4 In addition to having all the technical solutions of the above embodiment, the embodiment of the present utility model further has the following technical solutions:
[0054] One or more flower baskets 3 are horizontally arranged in the sealed box 1 to form a set of silicon wafer placement mechanisms; one sealed box 1 corresponds to one silicon wafer placement mechanism, or multiple vertically stacked silicon wafer placement mechanisms are provided; each silicon wafer placement mechanism corresponds to one or more negative pressure parts 41; when one silicon wafer placement mechanism is provided in the sealed box 1, the radiation heating device 2 is located at the bottom of the silicon wafer placement mechanism.
[0055] In this embodiment, when there is only one set of wafer placement mechanisms, the flower baskets 3 are arranged horizontally; when multiple sets of wafer placement mechanisms are provided, adjacent wafer placement mechanisms are stacked vertically, and at the same time, the wafers in each set of wafer placement mechanisms are still arranged horizontally. In this way, for each wafer placement mechanism, there will be sufficient drying area, thus ensuring the drying effect of the wafers. At the same time, the wafers in the wafer placement mechanism are dried by bottom heating. In this way, the evaporable impurities that sink under the action of gravity on the wafers can receive thermal radiation more directly, thereby further improving the drying efficiency of the wafers.
[0056] Embodiment 3:
[0057] Referring to Figure 8 , in addition to having all the technical solutions of any of the above embodiments, the embodiments of the present invention further have the following technical solutions:
[0058] A plurality of negative pressure ports 40 are formed on the negative pressure part 41, and the negative pressure ports 40 face the thickness side direction of the wafer, so as to more directly extract the air near the wafer, improve the vacuum pumping effect and also improve the cleanliness of the wafer, indirectly improving the drying effect of the wafer;
[0059] The negative pressure ports 40 are parallel to the extending direction of the wafer, and the plurality of negative pressure ports 40 are arranged side by side along the spacing arrangement direction of the wafers;
[0060] In this embodiment, the negative pressure ports that extend vertically and are arranged along the wafer arrangement direction can make the airflow formed after the negative pressure is established more consistent with the extending direction of the wafer, thereby avoiding obvious vibration of the wafer during the negative pressure pumping process, and further avoiding the problem of wafer breakage caused by vibration of the wafer, ensuring the yield and production capacity during the wafer drying process.
[0061] Specifically, negative pressure ports 40 are formed on the negative pressure part 41, and the extending direction of the negative pressure ports 40 is parallel to the extending direction of the wafer, that is, the extending direction of the negative pressure ports 40 is parallel to the gap direction between adjacent wafers. The negative pressure ports 40 are arranged in parallel along the spacing arrangement direction of the wafers in a flower basket, so that when the gas in the sealed box 1 is pumped away by the negative pressure pump 42, it flows along the gap between adjacent wafers. Therefore, during the negative pressure pumping process, the air will stably flow through the side of the wafer, making the flow velocity and pressure on both sides of the wafer close. In this way, the gas flow process will hardly affect the wafer, thereby avoiding vibration during the vacuum pumping process and further avoiding wafer damage.
[0062] Embodiment 4:
[0063] Referring to Figure 8 , in addition to having all the technical solutions of any of the above embodiments, the embodiments of the present invention further have the following technical solutions:
[0064] Air flow channels are formed between adjacent silicon wafers in each flower basket 3 , and the air flow channels corresponding to adjacent flower baskets 3 along the extending direction of the silicon wafers are continuous.
[0065] In this embodiment, the gaps between adjacent silicon wafers are defined as airflow channels, and the airflow channels corresponding to the adjacent flower baskets 3 along the extension direction of the silicon wafers are continuous, which is beneficial to the continuity of gas flow during the negative pressure extraction process, thereby reducing the probability of turbulence, and further avoiding the problem of vibration of the silicon wafer during vacuum extraction.
[0066] Embodiment 5:
[0067] Reference Figure 8 In addition to all the technical solutions of any of the above embodiments, the embodiments of the present utility model further have the following technical solutions:
[0068] The air flow channels and the negative pressure ports 40 correspond one to one.
[0069] The negative pressure port 40 corresponding to the air flow channel one by one can enable each air flow channel to obtain the negative pressure generated by the corresponding negative pressure port 40, thereby ensuring that during the process of pumping negative pressure, each air flow channel maintains a closer negative pressure value, thereby further improving the stability of gas flow, further avoiding the problem of vibration of silicon wafers, and improving the drying quality of silicon wafers.
[0070] Embodiment 6:
[0071] Reference Figure 1-Figure 5 In addition to all the technical solutions of any of the above embodiments, the embodiments of the present utility model further have the following technical solutions:
[0072] There are multiple sealed boxes 1 , and one vacuum system 4 corresponds to one or more sealed boxes 1 .
[0073] In this embodiment, in order to improve the drying efficiency, multiple sealed boxes 1 are provided. At the same time, in order to fully utilize the vacuum system 4, a vacuum system 4 can be used to correspond to multiple sealed boxes 1, which can improve the drying efficiency while keeping the cost of the drying device at a relatively low level.
[0074] Specifically, for the negative pressure pipeline, the negative pressure pump 42 and the filter device 44 are arranged on the main line, and each negative pressure part 41 is arranged on the branch line. Figure 6 That's it.
[0075] Embodiment 7:
[0076] Reference Figure 1 , Figure 2 , Figure 4 and Figure 5In addition to all the technical solutions of any of the above embodiments, the embodiments of the present utility model further have the following technical solutions:
[0077] The silicon wafer drying device also includes a temperature regulating device, which includes a temperature control module and a temperature sensor 7 that are connected to each other in communication. The temperature sensor 7 is arranged on the sealing box 1 and corresponds to each flower basket 3 one by one to detect the temperature of the silicon wafer in each flower basket 3;
[0078] The flower basket 3 has a clearance area 30 for vacating the detection position of the temperature sensor 7 ; each radiation heating device 2 is control-connected to the temperature control module so that the temperature control module can control the heating temperature of the radiation heating device 2 according to the temperature feedback of the temperature sensor 7 .
[0079] In this embodiment, the temperature sensor 7 is arranged on the sealed box 1 and corresponds to each flower basket 3. The purpose of this is to ensure that the temperature of the silicon wafers in each flower basket 3 can be accurately detected. Each flower basket 3 has a clearance area 30, which is for the temperature sensor 7 to detect the temperature of the silicon wafers in the flower basket 3 without hindrance, and to reduce the weight of the flower basket 3.
[0080] The temperature control module is the core part of the entire temperature adjustment device, which is responsible for receiving data from the temperature sensor 7 and controlling the heating temperature of the radiation heating device 2 according to the data. The temperature control module communicates with each temperature sensor 7 to ensure that the temperature information of the silicon wafer in each flower basket 3 can be obtained in real time.
[0081] Each radiation heating device 2 is connected to the temperature control module, so that the temperature control module can directly control their heating temperature. When the temperature control module detects that the temperature in a certain flower basket 3 is lower or higher than the preset value, it will send a command to the corresponding radiation heating device 2 to adjust its heating temperature to ensure that the silicon wafer can be dried at a constant temperature.
[0082] During the drying process, the temperature sensor 7 will continuously detect the temperature of the silicon wafers in the flower basket 3 and send these data to the temperature control module. The temperature control module will compare the received temperature data with the preset drying temperature, and then adjust the heating temperature of the radiation heating device 2. If the temperature in a flower basket 3 is too high, the temperature control module will reduce the heating temperature of the corresponding radiation heating device 2; if the temperature is too low, the heating temperature will be increased. Through such a cycle adjustment, it is ensured that the silicon wafers in each flower basket 3 can be dried at a constant temperature, thereby improving the drying effect and product quality.
[0083] The temperature regulating device of the silicon wafer drying equipment realizes precise control of the temperature of the silicon wafers in the flower basket 3 through the cooperation of the temperature control module and the temperature sensor 7, ensuring the high efficiency and stability of the drying process, thereby improving the drying effect of the silicon wafers.
[0084] Example 8:
[0085] Referring to Figure 1-Figure 3 , in addition to all the technical solutions of any of the above embodiments, the embodiments of the present utility model further have the following technical solutions:
[0086] The sealed box 1 further includes an observation window 14 and a maintenance opening 15 provided on the box body 11; the inner cavity of the sealed box 1 is provided with a mirror-polished layer.
[0087] The observation window 14 is provided on the box body 11 of the sealed box 1, which is convenient for the staff to observe the state of the internal silicon wafers or other items without opening the box body 11. The observation window 14 allows non-invasive visual inspection, which helps to detect and handle possible problems in a timely manner and ensure the smooth progress of the drying process.
[0088] The maintenance opening 15 is also located on the box body 11 of the sealed box 1. Its design should follow the principle of being easy to operate and maintain. For example, it is set at a position near the bottom of the side wall of the box body 11, so as to facilitate the maintenance and repair work and also facilitate the discharge of impurities. The maintenance opening 15 should have good sealing performance when closed to prevent external air, dust or moisture from entering the inside of the sealed box 1 and affecting the drying effect.
[0089] The inner cavity of the sealed box 1 is provided with a mirror-polished layer to improve the smoothness and reflectivity of the inner wall of the sealed box 1. The mirror-polished layer helps to reduce the adhesion of dust and impurities, making the inside easier to clean and maintain. The smooth surface can enhance the reflection of light, improve the internal light intensity, and thus improve the drying effect of the silicon wafers. It is convenient for the observation effect of the observation window 14.
[0090] The design of the sealed box 1 takes into account multiple aspects of observation, maintenance and internal environment, ensuring the high efficiency, safety and reliability of the drying process.
[0091] Example 9:
[0092] The embodiment of the present utility model provides a silicon wafer processing production line, including the silicon wafer drying equipment in any of the above embodiments. The silicon wafer processing production line further includes:
[0093] A draining device, located on the upstream side of the silicon wafer drying equipment, for draining the water of the silicon wafers in the carrier 3. A manipulator, used to move the carrier 3 with drained water into the sealed box 1 and also used to move the dried silicon wafers together with the carrier 3 out of the sealed box 1.
[0094] The draining device is located on the upstream side of the silicon wafer drying device, that is, the draining process is carried out before the silicon wafers are fed into the drying device. The main function of the draining device is to remove the residual moisture of the silicon wafers in the carrier 3. The draining step is crucial for improving the drying efficiency. Silicon wafers with a large amount of moisture entering the drying device will prolong the drying time and reduce the production efficiency. Therefore, the draining device is an important part of the silicon wafer processing production line.
[0095] The manipulator is used to move the carrier 3 after draining moisture from the draining device into the sealed box 1, and is also used to move the dried silicon wafers together with the carrier 3 out of the sealed box 1. This process requires precise operation and quick response of the manipulator to ensure the continuity and high efficiency of the production line.
[0096] The use of the manipulator reflects the high level of automation of the production line. Through programming control, the manipulator can move according to the preset path and speed, greatly improving the production efficiency and reducing the difficulty of manual operation.
[0097] Coordination and cooperation The manipulator needs to cooperate closely with the draining device and the drying device to ensure the smooth flow of silicon wafers during the processing. This requires a high degree of compatibility and coordination among the various devices on the production line.
[0098] Specifically, a claw that cooperates with the manipulator can be additionally connected to the carrier 3. The manipulator is set as a two-axis manipulator, which can slide horizontally and vertically to meet the requirements. The detailed structure of the manipulator will not be elaborated here.
[0099] It can be understood that in the above Embodiments 1-9, except for the conflicting parts, they can be freely combined to form other embodiments of the present invention.
[0100] In the description of the present invention, it should be understood that the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.
[0101] In the present invention, unless otherwise clearly defined and limited, the terms "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0102] In the present utility model, unless otherwise clearly specified and defined, a first feature being “on” or “under” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “over” and “on top of” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. A first feature being “under”, “beneath” and “underneath” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.
[0103] The term “comprising” or any other similar term is intended to cover non-exclusive inclusion, such that a process, article or apparatus / device comprising a series of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent in these process, article or apparatus / device.
[0104] So far, the technical solution of the present utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present utility model is obviously not limited to these specific embodiments. Without departing from the principle of the present utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of the present utility model.
Claims
1. A silicon wafer drying device, characterized in that: It comprises a sealed box (1), a radiation heating device (2) and a flower basket (3) distributed in the inner cavity of the sealed box (1), and a vacuum system (4) connected to the inner cavity of the sealed box (1); Each of the flower baskets (3) corresponds to at least one group of the radiation heating devices (2), and the silicon wafers are all extended vertically, arranged at intervals and inserted in parallel into the corresponding flower baskets (3); The vacuum system (4) comprises a negative pressure part (41) and a negative pressure pump (42) which are interconnected. The negative pressure part (41) is connected to the inner wall of the sealed box (1) to extract the air in the inner cavity of the sealed box (1).
2. The silicon wafer drying equipment according to claim 1, characterized in that: The negative pressure portion (41) is provided with a plurality of negative pressure ports (40), and the negative pressure ports (40) are oriented toward the thickness side of the silicon wafer; The negative pressure port (40) is parallel to the extension direction of the silicon wafer, and a plurality of the negative pressure ports (40) are arranged in parallel along the spacing arrangement direction of the silicon wafer; An air flow channel is formed between adjacent silicon wafers in each of the flower baskets (3), and the air flow channels corresponding to the adjacent flower baskets (3) along the extension direction of the silicon wafers are continuous; The air flow channels and the negative pressure ports (40) correspond one to one.
3. The silicon wafer drying equipment according to claim 2, characterized in that: One or more of the flower baskets (3) are arranged horizontally in the sealed box (1) to form a group of silicon wafer placement mechanisms; one of the sealed boxes (1) is provided with one silicon wafer placement mechanism, or a plurality of vertically stacked silicon wafer placement mechanisms are provided; Each of the silicon wafer placement mechanisms corresponds to one or more of the negative pressure parts (41); When a silicon wafer placement mechanism is arranged in the sealed box (1), the radiation heating device (2) is located at the bottom of the silicon wafer placement mechanism.
4. The silicon wafer drying equipment according to any one of claims 1 to 3, characterized in that: The vacuum system (4) further comprises an air inlet portion (43) disposed on a side wall of the sealed box (1) and communicating with an inner cavity of the sealed box (1); the air inlet portion (43) is away from the flower basket (3) relative to the negative pressure portion (41); The vacuum system (4) further comprises a filtering device (44) arranged on the upstream side or downstream side of the negative pressure pump, so as to filter the gas outputted by the sealing box (1).
5. The silicon wafer drying equipment according to claim 4, characterized in that: The sealed boxes (1) are arranged in plurality, and one vacuum system (4) corresponds to one or more sealed boxes (1).
6. The silicon wafer drying equipment according to claim 4, characterized in that: The silicon wafer drying device also includes a mounting seat (5) and a positioning pin (6); the mounting seat (5) is connected to the inner wall of the sealed box (1); a plurality of groups of positioning grooves (50) matching the number of the flower baskets (3) are provided on the mounting seat (5); the positioning pins (6) are connected to one side of the flower basket (3); each group of the positioning grooves (50) is arranged in a one-to-one correspondence with the positioning pins (6) on each of the sealed boxes (1).
7. The silicon wafer drying equipment according to claim 1, characterized in that: The sealed box (1) comprises a box body (11) with an open top, and a box cover (12) openably connected to the top of the box body (11); The sealed box (1) also includes an opening and closing driving member (13) for opening and closing the box cover (12); The opening and closing driving member (13) comprises a first slide (131) and a second slide (132), wherein the body of the first slide (131) is supported on the box body (11), the body of the second slide (132) is supported on the sliding portion of the first slide (131), the sliding portion of the second slide (132) is connected to the box cover (12), and the second slide (132) can drive the box cover (12) vertically away from the top opening of the box body (11) to open the top opening of the box body (11); the first slide (131) can drive the second slide (132) and the box cover (12) horizontally away from the box body (11) to make way for the top opening position of the box body (11); The first slide (131) comprises a first telescopic driving member, a slide rail and a slide frame, the slide frame is connected to the slide rail in a transverse sliding manner, the slide rail is supported on the box (11), and two ends of the first telescopic driving member are respectively connected to the slide frame and the box (11) to drive the slide frame to slide transversely; The second slide (132) comprises a second telescopic driving member and a mounting frame, wherein the mounting frame is supported on the sliding frame, and two ends of the second telescopic driving member are respectively connected to the box cover (12) and the mounting frame to drive the box cover (12) to slide vertically.
8. The silicon wafer drying equipment according to claim 1, characterized in that: The silicon wafer drying device further comprises a temperature regulating device, the temperature regulating device comprising a temperature control module and a temperature sensor (7) which are communicatively connected to each other, the temperature sensor (7) being arranged on the sealing box (1) and corresponding to each of the flower baskets (3) one by one, so as to detect the temperature of the silicon wafers in each of the flower baskets (3); The flower basket (3) is provided with a clearance area (30) for vacating a detection position of the temperature sensor (7); Each of the radiation heating devices (2) is controllably connected to the temperature control module.
9. The silicon wafer drying equipment according to claim 7, characterized in that: The sealed box (1) further comprises an observation window (14) and an inspection port (15) arranged on the box body (11); The inner cavity of the sealing box (1) is provided with a mirror-polished layer.
10. A silicon wafer processing production line, characterized in that: The silicon wafer drying device according to any one of claims 1 to 9, wherein the silicon wafer processing production line further comprises: A draining device, located at the upstream side of the silicon wafer drying device, used to drain the moisture of the silicon wafers in the flower basket (3); The robot is used to move the flower basket (3) after the water is drained into the sealed box (1), and is also used to move the dried silicon wafers together with the flower basket (3) out of the sealed box (1).