Imaging colorimeter

Abstract

The utility model discloses an imaging colorimeter which is used for avoiding the problem of internal dust accumulation and water accumulation caused by a built-in air duct. The colorimeter comprises a heat dissipation structure, a PCB and a colorimeter front panel, the heat dissipation structure is composed of a heat dissipation rear shell and a heat dissipation assembly, a heat conduction plate, a first containing area and a second containing area are arranged in the heat dissipation rear shell, and the first containing area and the second containing area are separated through the heat conduction plate; the PCB is arranged in the first containing area, the colorimeter front panel is arranged outside the first containing area in a covering mode and connected with the heat dissipation rear shell, a heating element on the PCB abuts against the heat conduction plate, and therefore heat of the heating element is transmitted to the heat conduction plate; the heat dissipation assembly is arranged in the second containing area and used for conducting heat dissipation on the heat conduction plate.

Description

Technical Field

[0001] This application relates to the technical field of equipment heat dissipation, and particularly to an imaging colorimeter. Background Art

[0002] An imaging colorimeter is an instrument used to measure the color of an object. It can measure and record the color of the object surface, and perform quantitative and qualitative analysis on it. It is widely used in multiple industries, including but not limited to display tests in fields such as flat panel displays (FPD), backlit keyboards, LED lighting, automotive, aerospace, medical, etc.

[0003] Since an imaging colorimeter generates a large amount of heat during operation, especially when its high-precision photodetector and internal electronic components are operating at high intensity, the temperature will rise significantly. To ensure the stability and measurement accuracy of the equipment, effective heat dissipation measures are required. Currently, most imaging colorimeters adopt an internal heat dissipation scheme, that is, a wind channel and a radiator are arranged inside the imaging colorimeter to achieve heat conduction and dissipation. However, the internal heat dissipation scheme also has certain problems:

[0004] 1. The design of the internal wind channel and radiator makes the overall structure of the imaging colorimeter relatively heavy, with poor portability and integration;

[0005] 2. For a specific imaging colorimeter, a radiator of an additional customized model is required. The additional customized radiator not only increases the production cost but also extends the product development cycle;

[0006] 3. The internal wind channel is prone to problems such as dust accumulation and water ingress inside the casing;

[0007] Therefore, there is an urgent need for an imaging colorimeter to solve the above technical problems. Utility Model Content

[0008] To solve the above technical problems, this application provides an imaging colorimeter that can avoid problems such as internal dust accumulation and waterlogging caused by the internal wind channel.

[0009] An imaging colorimeter provided by this application includes:

[0010] Heat dissipation structure, PCB board and front panel of colorimeter. The heat dissipation structure consists of a heat dissipation rear case and a heat dissipation component. A heat conduction plate, a first accommodation area and a second accommodation area are arranged in the heat dissipation rear case. The first accommodation area and the second accommodation area are separated by the heat conduction plate. The PCB board is arranged in the first accommodation area. The front panel of the colorimeter covers the outside of the first accommodation area and is connected to the heat dissipation rear case. The heating elements on the PCB board abut against the heat conduction plate, so that the heat of the heating elements is transferred to the heat conduction plate. The heat dissipation component is arranged in the second accommodation area and is used for dissipating heat from the heat conduction plate.

[0011] Optionally, the heat dissipation component includes a turbo fan. The turbo fan is connected to the heat conduction plate and is used for accelerating the air flow in the second accommodation area.

[0012] Optionally, the heat dissipation component further includes a plurality of heat dissipation fins. The plurality of heat dissipation fins are respectively arranged around the turbo fan and are connected to the heat conduction plate. The plurality of heat dissipation fins are used for transferring the heat on the heat conduction plate to the periphery of the turbo fan, so that when the turbo fan starts, the air flow between the plurality of heat dissipation fins is accelerated.

[0013] Optionally, the plurality of heat dissipation fins and the heat conduction plate are integrally formed.

[0014] Optionally, a heat dissipation cover plate is further arranged on the heat dissipation rear case. The heat dissipation cover plate covers the second accommodation area.

[0015] Optionally, a first heat dissipation hole is arranged on the heat dissipation cover plate. The first heat dissipation hole penetrates through the heat dissipation cover plate, so that the heat dissipation component dissipates heat through the first heat dissipation hole.

[0016] Optionally, a second heat dissipation hole is arranged on the heat dissipation rear case. The second heat dissipation hole penetrates through the side surface of the second accommodation area, so that the heat dissipation component dissipates heat through the first heat dissipation hole and the second heat dissipation hole.

[0017] Optionally, a silicone grease or a heat conduction sticker is arranged between the heat conduction plate and the heating element.

[0018] Optionally, PIN probes are arranged on the heat conduction plate. The heat dissipation component and the PCB board are connected through the PIN probes.

[0019] Optionally, the heat dissipation component includes a turbo fan and a heat pipe. The turbo fan and the evaporation end of the heat pipe are respectively connected to the heat conduction plate. The condensation ends of the heat pipe are distributed around the turbo fan, so that when the turbo fan starts, the air flow around the condensation ends is accelerated.

[0020] As can be seen from the above technical solutions, the present application has the following effects:

[0021] By providing a first accommodation area and a second accommodation area on both sides of the heat dissipation rear case, and separating the two areas by a heat conduction plate, the PCB board in the imaging colorimeter and the colorimeter front panel are sequentially fixed in the first accommodation area, and the heat generating components on the PCB board are directly in contact with the heat conduction plate. The heat is transferred to the second accommodation area through the heat conduction plate, and a heat dissipation assembly is provided in the second accommodation area to further dissipate the heat on the heat conduction plate to the external environment, thereby realizing the heat dissipation of the heat generating components. Compared with the built-in air duct in the prior art, the present application can solve the problems of internal dust accumulation and water accumulation while achieving good heat dissipation, and ensure the sealing of the entire imaging colorimeter. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the present application, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 A schematic diagram of an imaging colorimeter provided by the present application;

[0024] Figure 2 Another schematic diagram of an imaging colorimeter provided by the present application;

[0025] Figure 3 A schematic diagram of a second heat dissipation hole in an imaging colorimeter provided by the present application;

[0026] Among them, heat dissipation rear case 01, turbine fan 02, heat conduction plate 03, PCB board 04, colorimeter front panel 05, heat generating component 06, heat dissipation fin 07, heat dissipation cover 08, first heat dissipation hole 09, second heat dissipation hole 10, PIN probe 11, heat pipe 12. Detailed Embodiments

[0027] In the present utility model, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to illustrate the relative positional relationship between each component or component part, and do not particularly limit the specific installation orientation of each component or component part.

[0028] Moreover, in addition to being used to indicate orientation or positional relationship, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0029] In addition, the terms "install", "set", "provided with", "connect", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, components, or parts. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] In addition, the structures, proportions, sizes, etc. depicted in the drawings in this application are only used to cooperate with the content disclosed in the specification for those of ordinary skill in the art to understand and read, and are not used to limit the implementable conditions of this application. Therefore, they do not have technical substantial significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that this application can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in this application.

[0031] Next, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope protected by this application.

[0032] This application provides an imaging colorimeter to avoid the problems of internal dust accumulation and water accumulation caused by the built-in air duct. The specific implementation process of this application is described as follows.

[0033] Please refer to Figures 1 to 3 , an imaging colorimeter provided by this application includes:

[0034] Heat dissipation structure, PCB board 04 and front panel 05 of the colorimeter. The heat dissipation structure consists of a heat dissipation rear case 01 and a heat dissipation component. Inside the heat dissipation rear case 01, there is a heat conduction plate 03, a first accommodation area and a second accommodation area. The first accommodation area and the second accommodation area are separated by the heat conduction plate 03. The PCB board 04 is arranged in the first accommodation area, and the front panel 05 of the colorimeter is covered outside the first accommodation area and connected to the heat dissipation rear case 01. The heating element 06 on the PCB board 04 abuts against the heat conduction plate 03, so that the heat of the heating element 06 is transferred to the heat conduction plate 03. The heat dissipation component is arranged in the second accommodation area and is used to dissipate heat from the heat conduction plate 03.

[0035] The heat dissipation rear case 01 is made of a material with high thermal conductivity and strong structure, such as aluminum alloy, magnesium alloy, copper, iron or stainless steel, etc., to ensure both effective heat dissipation and protection of internal components from the external environment. The inside of the heat dissipation rear case 01 is divided into a first accommodation area and a second accommodation area. The first accommodation area and the second accommodation area are physically separated and heat is transferred through a heat conduction plate 03.

[0036] Among them: The first accommodation area is used to install and fix the PCB board 04 (printed circuit board) and the front panel 05 of the colorimeter. The PCB board 04 is placed in the first accommodation area, and the front panel 05 of the colorimeter is covered outside the PCB board 04 and fixedly connected to the heat dissipation rear case 01. The heating elements 06 on the PCB board 04, such as processors, sensors, etc., are closely connected to the heat conduction plate 03 by direct contact to ensure that heat can be quickly and effectively conducted to the heat conduction plate 03.

[0037] The second accommodation area is used for the layout and installation of the heat dissipation component. The second accommodation area is located on the other side of the heat conduction plate 03, away from the heat source. The second accommodation area provides sufficient space and a good working environment for the heat dissipation component.

[0038] The heat dissipation component is responsible for dissipating the heat transferred from the heat conduction plate 03 into the air, thereby realizing the heat dissipation of the heating element 06 on the PCB board 04.

[0039] In actual work, when the imaging colorimeter is working, the heating element 06 on the PCB board 04 will generate a large amount of heat. The heat is quickly conducted to the heat conduction plate 03 by direct contact. The heat conduction plate 03 serves as a bridge for heat transfer, evenly distributes and transfers the heat to the heat dissipation component in the second accommodation area. The heat dissipation component then dissipates the heat into the air, thereby realizing the heat dissipation process. The imaging colorimeter provided by this application ensures the stability and reliability of the imaging colorimeter under high-load operation, extends the service life of the device; and compared with the built-in air duct of the prior art, it avoids the problems of internal dust accumulation and water accumulation; separating the PCB board 04 from the heat dissipation component can play a better role in protecting the components on the PCB board 04.

[0040] In an alternative embodiment, the heat dissipation component includes a turbo fan 02. The turbo fan 02 is connected to a heat conducting plate 03. The turbo fan 02 is used to accelerate the air flow in the second accommodation area, thereby achieving heat dissipation of the heat conducting plate 03. Specifically, there is an electrical connection between the turbo fan 02 and a PCB board 04. The electrical connection can be set such that a wire penetrates through the heat conducting plate 03, and the two ends of the wire are respectively connected to the turbo fan 02 and the PCB board 04. It can also be achieved through probe contact. Specifically, probes are respectively arranged on both sides of the heat conducting plate 03, and there is an electrical connection between the probes on both sides. The probes on both sides are respectively abutted against the turbo fan 02 and the PCB board 04, thereby achieving the electrical connection between the two. After the turbo fan 02 is started, a strong air flow will be generated. The air flow flows in front of the heat conducting plate 03, thereby taking away the heat on the heat conducting plate 03 during the flow, achieving heat dissipation of the heat conducting plate 03.

[0041] In an alternative embodiment, the heat dissipation component further includes a number of heat dissipation fins 07. The number of heat dissipation fins 07 is directly connected to the heat conducting plate 03. The number of heat dissipation fins 07 are respectively arranged around the turbo fan 02. The number of heat dissipation fins 07 is used to transfer the heat on the heat conducting plate 03 to the surroundings of the turbo fan 02. Thus, when the turbo fan 02 is started, it accelerates the air flow between the number of heat dissipation fins 07. Specifically, the heat dissipation fins 07 are made of a metal material with high thermal conductivity, such as aluminum or copper, to ensure that the heat dissipation fins 07 can effectively absorb and dissipate heat. The heat dissipation fins 07 and the heat conducting plate 03 are tightly connected through welding, riveting or other reliable connection methods to ensure that heat can smoothly transfer from the heat conducting plate 03 to the heat dissipation fins 07 without significant thermal resistance. And the heat dissipation component is used to dissipate heat from the heat dissipation fins 07. Thus, the heat on the heat dissipation fins 07 is quickly taken away. The entire heat transfer process (heat transfers from the heating element 06 to the heat conducting plate 03, then to the heat dissipation fins 07, and then is transferred to the external environment through the cooperation of the heat dissipation component) ensures that the temperatures of the heat conducting plate 03 and the PCB board 04 can be maintained within a safe range, preventing overheating.

[0042] When used in cooperation with the turbo fan 02, an accommodation area is provided between the number of heat dissipation fins 07. The accommodation area is used to place the turbo fan 02. The size of the accommodation area matches the size of the turbo fan 02. After the turbo fan 02 is embedded in the accommodation area, it is connected to the heat conducting plate 03.

[0043] After the turbo fan 02 is started, a strong air flow will be generated. The air flow passes through the gaps or channels between the heat dissipation fins 07, accelerating the heat exchange process between the air and the heat dissipation fins 07. Therefore, it can effectively take away the heat on the heat dissipation fins 07 and dissipate it into the surrounding environment, improving the heat dissipation effect on the heat conducting plate 03.

[0044] In this embodiment, the turbo fan 02 and the heat dissipation fins 07 in the heat dissipation assembly are both arranged in the second accommodation area. When the turbo fan 02 operates, it can dissipate the heat on the heat dissipation fins 07 to the outside, thereby achieving heat dissipation. The heat dissipation area is significantly increased by the heat dissipation fins 07, thereby accelerating the heat dissipation speed, and thus being able to better control the temperature of the heating element 06 inside the imaging colorimeter and ensure its stable operation.

[0045] In an alternative embodiment, a plurality of heat dissipation fins 07 and the heat conduction plate 03 are integrally formed. The integral formation includes processes such as casting, forging, extrusion or injection molding. Through the integral formation, a gapless and thermal resistance-free tight connection between the heat dissipation fins 07 and the heat conduction plate 03 is ensured, further reducing the thermal resistance and improving the heat transfer efficiency.

[0046] In an alternative embodiment, a heat dissipation cover plate 08 is further arranged on the heat dissipation rear shell 01, and the heat dissipation cover plate 08 covers the second accommodation area. The heat dissipation cover plate 08 is closely matched with the heat dissipation rear shell 01 and is used to cover and protect the second accommodation area, the heat dissipation assembly in the second accommodation area, and the heat dissipation fins 07. The heat dissipation cover plate 08 can be fixed on the heat dissipation rear shell 01 by means of screws, buckles or magnetic attraction, etc., to ensure firmness and easy disassembly and maintenance.

[0047] In this alternative embodiment, a first heat dissipation hole 09 is arranged on the heat dissipation cover plate 08, and the first heat dissipation hole 09 penetrates through the heat dissipation cover plate 08, so that the heat dissipation assembly dissipates heat through the first heat dissipation hole 09. The position of the first heat dissipation hole 09 is aligned with the heat dissipation assembly, so that the heat dissipation area of the heat dissipation assembly can be increased, enabling the heat to be discharged more directly and efficiently through the heat dissipation hole; the heat dissipation hole serves as an air flow channel, enabling the external cold air to more easily enter the second accommodation area and exchange with the hot air around the heat dissipation fins 07, thereby taking away the heat.

[0048] In this embodiment, additional holes can be arranged at the edge of the heat dissipation cover plate 08, and a ventilation channel is formed between the additional holes and the first heat dissipation hole 09, and air circulation is carried out under the action of the turbo fan 02, thereby achieving accelerated heat dissipation.

[0049] In this alternative embodiment, a second heat dissipation hole 10 is provided on the heat dissipation rear case 01. The second heat dissipation hole 10 penetrates through the side surface of the second accommodation area. The heat dissipation component dissipates heat through the first heat dissipation hole 09 and the second heat dissipation hole 10. The second heat dissipation hole 10 is designed on the heat dissipation rear case 01 and directly penetrates through the side surface of the second accommodation area. In this way, the second heat dissipation hole 10 communicates with the first heat dissipation hole 09 to form a direct and efficient heat dissipation path. Combined with the operation of the turbo fan 02 in the heat dissipation component, air circulates in the heat dissipation path and dissipates the heat in the first accommodation area during the circulation process, thereby achieving the heat dissipation effect. For the two heat dissipation situations in this embodiment, the first is that when the turbo fan 02 operates, the second heat dissipation hole 10 is controlled to intake air and the first heat dissipation hole 09 is controlled to exhaust air; the second is that when the turbo fan 02 operates, the second heat dissipation hole 10 is controlled to exhaust air and the first heat dissipation hole 09 is controlled to intake air. In this way, the air convection in the second accommodation area is enhanced, thereby achieving the rapid dissipation of heat.

[0050] In an alternative embodiment, a silicone grease or a thermal conductive sticker is provided between the heat conductive plate 03 and the heat generating element 06. This can effectively improve the efficiency of heat transfer and ensure the stable operation of the heat generating element 06.

[0051] In an alternative embodiment, PIN probes 11 are provided on the heat conductive plate 03. The heat dissipation component is connected to the PCB board 04 through the PIN probes 11. As conductive elements, the PIN probes 11 penetrate through the heat conductive plate 03, and both ends of the PIN probes 11 are in contact connection with the heat dissipation component and the PCB board 04 respectively, so that there is an electrical connection between the heat dissipation component and the PCB board 04. In this way, the PCB board 04 can transmit power or signals to the heat dissipation component (such as the turbo fan 02, the heat pipe 12, etc.) through the PIN probes 11 without additional wires or connectors, thereby simplifying the circuit structure and reducing the fault points.

[0052] In an alternative embodiment, the heat dissipation component includes a turbo fan 02 and a heat pipe 12. The evaporation ends of the turbo fan 02 and the heat pipe 12 are respectively connected to a heat conducting plate 03. The condensation ends of the heat pipe 12 are distributed around the turbo fan 12. Thus, when the turbo fan 02 starts, the air flow around the condensation ends of the heat pipe 12 is accelerated. Specifically, a working fluid (such as water, alcohol, acetone, etc.) is encapsulated inside the heat pipe 12. The working fluid circulates between the two ends (evaporation end and condensation end) of the heat pipe 12. When the evaporation end is heated, the working fluid absorbs heat and evaporates into a gaseous state. Subsequently, under the action of a pressure difference, it flows towards the condensation end. The gaseous working fluid releases heat at the condensation end and condenses into a liquid state. Then, it flows back to the evaporation end through a capillary structure or the action of gravity, completing a cycle. During this cycle process, heat is transferred from the evaporation end to the condensation end and dissipated into the environment through the heat dissipation device at the condensation end. The condensation ends are distributed around the turbo fan 02. When the turbo fan 02 is started, the turbo fan 02 accelerates the air circulation around the condensation ends, thereby improving the conversion efficiency of the working fluid inside the heat pipe 12 and enhancing the heat exchange efficiency.

[0053] The evaporation end of the heat pipe 12 is tightly connected to the heat conducting plate 03 to ensure that the heat conducted from the heat conducting plate 03 can be efficiently absorbed. To enhance the heat conduction effect, a layer of thermal paste or other thermal conductive materials can be applied between the evaporation end and the heat conducting plate 03; the condensation end of the heat pipe 12 is far from the heat conducting plate 03 and is usually arranged at a position with better heat dissipation effect, such as near heat dissipation components like the turbo fan 02.

[0054] In addition, the heat pipe 12 can be used as a type of heat dissipation component and be installed alone in the second accommodation area, or the turbo fan 02 and the heat pipe 12 can be used in combination and installed together in the second accommodation area.

[0055] It should be noted that the above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather should conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An imaging colorimeter, characterized in that: include: A heat dissipation structure, a PCB board and a colorimeter front panel, wherein the heat dissipation structure is composed of a heat dissipation rear shell and a heat dissipation assembly, wherein a heat conduction plate, a first accommodating area and a second accommodating area are arranged in the heat dissipation rear shell, and the first accommodating area and the second accommodating area are separated by the heat conduction plate; The PCB board is arranged in the first accommodating area, the colorimeter front panel cover is arranged outside the first accommodating area and connected to the heat dissipation rear shell, and the heating element on the PCB board abuts against the heat conducting plate, so that the heat of the heating element is transferred to the heat conducting plate; The heat dissipation component is disposed in the second accommodating area, and the heat dissipation component is used to dissipate heat from the heat conducting plate.

2. The imaging colorimeter according to claim 1, wherein: The heat dissipation component includes a turbofan, which is connected to the heat conducting plate and is used to accelerate the flow of air in the second accommodation area.

3. The imaging colorimeter according to claim 2, characterized in that The heat dissipation assembly also includes a plurality of heat dissipation fins, which are respectively arranged around the turbofan and connected to the heat conducting plate. The heat dissipation fins are used to transfer the heat on the heat conducting plate to the surroundings of the turbofan, thereby accelerating the flow of air between the plurality of heat dissipation fins when the turbofan is started.

4. The imaging colorimeter according to claim 3, characterized in that: A plurality of the heat dissipation fins and the heat conducting plate are integrally formed.

5. The imaging colorimeter according to any one of claims 1 to 4, characterized in that The heat dissipation rear shell is also provided with a heat dissipation cover plate, and the heat dissipation cover plate is provided on the second accommodating area.

6. The imaging colorimeter according to claim 5, characterized in that: The heat dissipation cover plate is provided with a first heat dissipation hole, and the first heat dissipation hole penetrates the heat dissipation cover plate, so that the heat dissipation component dissipates heat through the first heat dissipation hole.

7. The imaging colorimeter according to claim 6, wherein: The heat dissipation rear shell is provided with a second heat dissipation hole, and the second heat dissipation hole runs through the side surface of the second accommodating area, so that the heat dissipation component dissipates heat through the first heat dissipation hole and the second heat dissipation hole.

8. The imaging colorimeter according to any one of claims 1 to 4, characterized in that Silicone grease or thermal conductive paste is arranged between the heat conducting plate and the heating element.

9. The imaging colorimeter according to any one of claims 1 to 4, characterized in that: A PIN probe is arranged on the heat conducting plate, and the heat dissipation assembly is connected to the PCB board via the PIN probe.

10. The imaging colorimeter according to claim 1, wherein: The heat dissipation component includes a turbofan and a heat pipe. The evaporation ends of the turbofan and the heat pipe are respectively connected to the heat conduction plate. The condensation ends of the heat pipe are distributed around the turbofan, so that the flow of air around the condensation end is accelerated when the turbofan is started.

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