High-temperature thin film grounding capacitor

Abstract

The utility model discloses a high-temperature film grounding capacitor, which relates to the technical field of capacitors and comprises a high-temperature-resistant film grounding capacitor body, two first pins are arranged on the front surface of the high-temperature-resistant film grounding capacitor body, and second pins are welded at the front ends of the first pins. After production, a second pin and a first pin are separated and accommodated in an accommodating mechanism, and the first pin is totally accommodated in an insulating plastic protective frame, so that the whole high-temperature film grounding capacitor is small in size, does not need a relatively large packaging box or packaging bag, and is convenient to use. Meanwhile, the two pins cannot be collided, mail and transportation of manufacturers are facilitated, during use, the second pin and the first pin can be accurately butted firstly and then welded, at the moment, welding is convenient, connection is firm, and subsequent normal use of the high-temperature film grounding capacitor cannot be affected.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a high-temperature thin-film grounded capacitor. Background Technique

[0002] The thin-film grounded capacitor is a kind of capacitor. Using a thin-film material as the dielectric, it has the effects of small volume, light weight, good insulation performance and excellent frequency characteristics. It is often used in electronic circuits, such as filters, couplers, bypass capacitors, etc.

[0003] Some existing thin-film grounded capacitors come with two pins. These pins are usually made of hard metal materials (such as aluminum, stainless steel, copper, etc.), with long lengths and most of them being in a bare state. This makes the size of the thin-film grounded capacitor much larger. When carrying it, a larger package is needed, which takes up a large amount of space and has a high cost. Moreover, the pins are easily bumped and damaged, and there are often return phenomena, which is not conducive to the manufacturer's mailing or batch transportation. Content of the Utility Model

[0004] The utility model provides a high-temperature thin-film grounded capacitor, which has the advantages of small size and high pin safety, so as to solve the problems put forward in the background technique.

[0005] To solve the defects of the large size and easy pin bumping and damage of the existing thin-film grounded capacitors, the utility model provides the following technical solution: a high-temperature thin-film grounded capacitor, including a high-temperature resistant thin-film grounded capacitor body. Two first pins are provided on the front surface of the high-temperature resistant thin-film grounded capacitor body. A second pin is welded to the front end of the first pin. An insulating plastic protection frame is integrally connected to the front end of the high-temperature resistant thin-film grounded capacitor body. A storage mechanism is integrally connected to the front surface of the high-temperature resistant thin-film grounded capacitor body.

[0006] As a preferred technical solution of the utility model, the first pin includes a first pin body extending into the high-temperature resistant thin-film grounded capacitor body and fixedly connected thereto. A first insulating sleeve fixedly connected thereto is sleeved on the front end of the first pin body. A first welding sleeve fixedly connected thereto is sleeved on the first insulating sleeve.

[0007] As a preferred technical solution of the utility model, the second pin includes a second pin body. A second insulating sleeve fixedly connected thereto is sleeved on the second pin body. A second welding sleeve fixedly connected thereto is sleeved on the second insulating sleeve.

[0008] As a preferred technical solution of the present utility model, the rear end of the second insulating sleeve is welded to the front end of the first welding sleeve. The rear end of the second pin body is inserted into the first insulating sleeve, and the rear end of the second pin body is closely attached to and clamped on the front end of the first pin body.

[0009] As a preferred technical solution of the present utility model, the storage mechanism includes a storage box integrally connected to the front surface of the high-temperature thin-film grounded capacitor body. Three storage long grooves are provided on the front surface of the storage box. A sliding cover is provided on the front surface of the storage box and is slidably connected thereto. A rubber soft layer is fixedly attached to the inner wall of the storage long groove.

[0010] As a preferred technical solution of the present utility model, first openings are provided on both sides of the insulating plastic protective frame, and a second opening is provided on the top surface of the insulating plastic protective frame. The second opening is located directly above the sliding cover.

[0011] Compared with the prior art, the present utility model provides a high-temperature thin-film grounded capacitor, which has the following beneficial effects:

[0012] 1. After the production of the high-temperature thin-film grounded capacitor, the second pin and the first pin are separated and stored in the storage mechanism. The first pin is completely stored in the insulating plastic protective frame. The whole high-temperature thin-film grounded capacitor is small in size, and no large packaging box or packaging bag is required. At the same time, the two pins will not be knocked. It is convenient for the manufacturer's mailing and transportation. When in use, the second pin and the first pin can be accurately docked first and then welded (the thinner first pin body and the second pin body do not need to be directly welded, but the thicker first welding sleeve and the second welding sleeve are welded). At this time, the welding is convenient and the connection is firm, which will not affect the normal use of the subsequent high-temperature thin-film grounded capacitor.

[0013] 2. For the high-temperature thin-film grounded capacitor, the high-temperature thin-film grounded capacitor body uses single-aluminum metallized film evaporation, and the thickness is thicker than that of the conventional zinc-aluminum metallized film. The current-carrying capacity of the electrode is improved, and the heat generation can be reduced. At the same time, the high-temperature thin-film grounded capacitor body undergoes hot pressing and heat treatment, which can improve the overall high-temperature resistance performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic structural diagram after the first pin and the second pin of the present utility model are connected;

[0015] Figure 2 is a schematic structural diagram of the first pin and the second pin of the present utility model;

[0016] Figure 3 is a schematic structural diagram during the storage and transportation of the present utility model;

[0017] Figure 4 This is a schematic structural diagram of the storage mechanism of the present utility model.

[0018] In the figure:

[0019] 10. High-temperature resistant thin-film grounded capacitor body; 20. First pin; 21. First pin body; 22. First insulating sleeve; 23. First welding sleeve; 30. Second pin; 31. Second pin body; 32. Second insulating sleeve; 33. Second welding sleeve; 40. Insulating plastic protection frame; 50. Storage mechanism; 51. Storage box; 52. Storage long groove; 53. Slide cover; 60. First opening; 70. Second opening. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] Please refer to Figures 1 - 4 , the present utility model discloses a high-temperature thin-film grounded capacitor, which includes a high-temperature resistant thin-film grounded capacitor body 10. Two first pins 20 are provided on the front surface of the high-temperature resistant thin-film grounded capacitor body 10. A second pin 30 is welded to the front end of the first pin 20. An insulating plastic protection frame 40 is integrally connected to the front end of the high-temperature resistant thin-film grounded capacitor body 10. A storage mechanism 50 is integrally connected to the front surface of the high-temperature resistant thin-film grounded capacitor body 10.

[0022] The high-temperature resistant thin-film grounded capacitor body 10 adopts single aluminum metallized film evaporation, and the thickness is thicker than that of the conventional zinc-aluminum metallized film. The current-carrying capacity of the electrode is improved, the heat generation of the electrode can be reduced. At the same time, the high-temperature resistant thin-film grounded capacitor body 10 undergoes hot pressing and heat treatment, the internal structure is more firm and compact, the reliability is improved, and the overall high-temperature resistance performance can be effectively improved.

[0023] Specifically, the first pin 20 includes a first pin body 21 extending into and fixedly connected to the inside of the high-temperature resistant thin-film grounding capacitor body 10. A first insulating sleeve 22 fixedly connected thereto is sleeved on the front end of the first pin body 21. A first welding sleeve 23 fixedly connected thereto is sleeved on the first insulating sleeve 22. The second pin 30 includes a second pin body 31. A second insulating sleeve 32 fixedly connected thereto is sleeved on the second pin body 31. A second welding sleeve 33 fixedly connected thereto is sleeved on the second insulating sleeve 32. The rear end of the second insulating sleeve 32 is welded to the front end of the first welding sleeve 23. The rear end of the second pin body 31 is inserted into the first insulating sleeve 22, and the rear end of the second pin body 31 is closely attached to and clamped on the front end of the first pin body 21.

[0024] In this embodiment, before installation, the first pin 20 and the second pin 30 are in a split state. The first pin 20 is received in the insulating plastic protection frame 40, and the second pin 30 is received in the receiving mechanism 50. At this time, the overall size is small and the carrying safety is high. Before welding and installation, the first pin 20 and the second pin 30 can be connected together.

[0025] Specifically, the receiving mechanism 50 includes a receiving box 51 integrally connected to the front surface of the high-temperature resistant thin-film grounding capacitor body 10. Three receiving long grooves 52 are formed on the front surface of the receiving box 51. A sliding cover 53 slidably connected to the front surface of the receiving box 51 is provided on the front surface of the receiving box 51. A rubber soft layer is fixedly attached to the inner wall of the receiving long groove 52.

[0026] In this embodiment, when not in use, the second pin 30 can be stored in the receiving long groove 52, and the size of the entire high-temperature thin-film grounding capacitor is greatly reduced, which is convenient to carry. The rubber soft layer with good buffering effect can improve the safety of the second pin 30 during storage.

[0027] Specifically, first openings 60 are formed on both sides of the insulating plastic protection frame 40, and a second opening 70 is formed on the top surface of the insulating plastic protection frame 40. The second opening 70 is located directly above the sliding cover 53.

[0028] In this embodiment, the setting of the first opening 60 facilitates the subsequent connection of the first pin 20 and the second pin 30, and the setting of the second opening 70 does not affect the upward movement of the sliding cover 53.

[0029] Working principle and usage process of the present utility model: During the process of carrying and transporting, the second pin 30 is separated from the first pin 20 and received in the receiving long groove 52. Before installation, the second pin body 31 is inserted into the first insulating sleeve 22 to achieve contact and clamping with the first pin body 21. At this time, the first insulating sleeve 22 is attached to the second insulating sleeve 32, and the first welding sleeve 23 is attached to the second welding sleeve 33. Then, the first welding sleeve 23 and the second welding sleeve 33 are welded together. Finally, the second pin body 31 is welded to the circuit board or some electronic components.

[0030] It should be noted that in this article, terms such as "including", "comprising" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0031] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A high temperature film grounding capacitor, characterized in that: The invention comprises a high temperature resistant film grounding capacitor body (10), wherein two first pins (20) are arranged on the front of the high temperature resistant film grounding capacitor body (10), a second pin (30) is welded to the front end of the first pin (20), an insulating plastic protection frame (40) is integrally connected to the front end of the high temperature resistant film grounding capacitor body (10), and a storage mechanism (50) is integrally connected to the front end of the high temperature resistant film grounding capacitor body (10).

2. The high temperature film grounding capacitor according to claim 1, characterized in that: The first pin (20) comprises a first pin body (21) extending into the interior of the high temperature resistant film grounding capacitor body (10) and fixedly connected thereto, the front end of the first pin body (21) is sleeved with a first insulating sleeve (22) fixedly connected thereto, and the first insulating sleeve (22) is sleeved with a first welding sleeve (23) fixedly connected thereto.

3. The high temperature film grounding capacitor according to claim 2, characterized in that: The second pin (30) comprises a second pin body (31), the second pin body (31) is sleeved with a second insulating sleeve (32) fixedly connected thereto, and the second insulating sleeve (32) is sleeved with a second welding sleeve (33) fixedly connected thereto.

4. The high temperature film grounding capacitor according to claim 3, characterized in that: The rear end of the second insulating sleeve (32) is welded to the front end of the first welding sleeve (23), the rear end of the second pin body (31) is inserted into the first insulating sleeve (22), and the rear end of the second pin body (31) is tightly fitted and clamped on the front end of the first pin body (21).

5. The high temperature film grounding capacitor according to claim 1, characterized in that: The storage mechanism (50) comprises a storage box (51) integrally connected to the front of the high temperature resistant film grounding capacitor body (10), three long storage slots (52) are provided on the front of the storage box (51), a sliding cover (53) connected to the storage box (51) for sliding up and down movement is provided on the front of the storage box (51), and a rubber soft layer is fixedly attached to the inner wall of the long storage slot (52).

6. The high temperature film grounding capacitor according to claim 5, characterized in that: The insulating plastic protection frame (40) has first openings (60) on both sides, and the top surface of the insulating plastic protection frame (40) has a second opening (70), and the second opening (70) is located directly above the sliding cover (53).

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