Cleaning structure, wafer processing system and semiconductor production system
By setting up a suction exhaust structure at the loading port of the wafer loading device, the pollution problem of gas escape when the door body is opened is solved, the cleanliness of the wafer processing environment is improved, and the wafer quality is improved.
Patent Information
- Application Number
- CN202422210692.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-09-09
AI Technical Summary
During wafer processing, when the door body of the wafer loading device is opened, internal gas will escape, contaminating the wafer processing environment and causing the wafer quality to decline.
A cleaning structure is designed, including a suction exhaust structure, arranged at the loading port of the wafer loading device for absorbing and venting pollutants and gases when the door body is opened.
It effectively avoids pollutants and gases entering the wafer processing environment, improves the cleanliness and improves the quality of the wafer.
Smart Images
Figure CN223006747U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, and particularly relates to a cleaning structure, a wafer processing system and a semiconductor production system. Background Art
[0002] With the continuous development of semiconductor processes towards higher orders, even slight environmental changes will affect the quality of products. Therefore, the environmental requirements during wafer processing are also constantly increasing, that is, it is necessary to ensure the cleanliness of the environment inside the wafer processing equipment. Currently, during wafer processing, when the door of the wafer loading device is opened, the gas inside will escape from the loading port, polluting the wafer processing environment, causing wafer contamination, and affecting the quality of the wafer. Summary of the Utility Model
[0003] Aiming at the above problems of the prior art, the utility model discloses a cleaning structure, a wafer processing system and a semiconductor production system, which can avoid polluting the wafer processing environment and improve the cleanliness.
[0004] The technical solution disclosed by the utility model is as follows:
[0005] The utility model provides a cleaning structure, which is used for a wafer loading device. The wafer loading device includes a first loading device loaded with wafers and a second loading device. The cleaning structure and the first loading device are both arranged on the second loading device; the first loading device includes a first loading port and a first door arranged at the first loading port, and the second loading device includes a second loading port corresponding to the first loading port. The cleaning structure and the first loading device are respectively located on both sides of the second loading port;
[0006] The cleaning structure includes an air suction and exhaust structure, which is detachably arranged at the second loading port. An opening is arranged on the side of the air suction and exhaust structure facing the second loading port; when the first door is just opened, the air suction and exhaust structure absorbs and discharges the pollutants attached to the first door and the first loading port through the opening, and during the opening process of the first door, the air suction and exhaust structure absorbs and discharges the gas in the first loading device through the opening.
[0007] Optionally, the air suction and exhaust structure includes a first exhaust pipeline, which is detachably arranged at the second loading port, and the first exhaust pipeline is spaced from the edge of the second loading port by a preset distance. The opening is arranged on the side of the first exhaust pipeline facing the second loading port.
[0008] Optionally, the first exhaust pipeline is arranged in a ring around the second loading port.
[0009] Optionally, the second loading device further includes a loading platform, a loading rack provided with the second loading opening, and a second door body provided at the second loading opening. The second door body is adhesively connected to the first door body. The first loading device is arranged on the loading platform, and the first exhaust pipeline is detachably arranged on the loading rack. At the second loading opening, the first exhaust pipeline and the first loading device are respectively located on both sides of the loading rack.
[0010] Optionally, the second loading device further includes a connecting structure and a driving mechanism. The driving mechanism is fixedly arranged on the loading rack. One end of the connecting structure is fixedly connected to the second door body, and the other end of the connecting structure is fixedly connected to the driving mechanism.
[0011] The first exhaust pipeline includes a first sub-pipeline and a second sub-pipeline. Openings are provided on both the first sub-pipeline and the second sub-pipeline. The first sub-pipeline and the second sub-pipeline are detachably arranged at the second loading opening on the loading rack. The first sub-pipeline, the second sub-pipeline and the connecting structure are located on the same side of the loading rack. The first sub-pipeline and the second sub-pipeline are respectively located on both sides of the connecting structure, and the first sub-pipeline and the second sub-pipeline are not connected at the connecting structure.
[0012] Optionally, the cleaning structure further includes a first control mechanism, and the second loading device further includes a second control mechanism. The first control mechanism is electrically connected to the second control mechanism, and the second control mechanism is electrically connected to the second door body.
[0013] Optionally, the second control mechanism includes a delay control mechanism, and the delay control mechanism is electrically connected to the first control mechanism.
[0014] Optionally, a control device is further included, and the control device is electrically connected to the first valve and the water supply pump group respectively.
[0015] Optionally, a purging structure is arranged on the loading platform. The purging structure is communicated with the first loading device. During the opening process of the first door body, the air exhaust and intake structure absorbs and discharges the gas in the first loading device purged out by the purging structure through the opening.
[0016] Optionally, the air exhaust and intake structure further includes a second exhaust pipeline, an exhaust valve and a one-way valve. One end of the second exhaust pipeline is communicated with the first exhaust pipeline. Along the direction of gas discharge, the exhaust valve and the one-way valve are sequentially arranged at the other end of the second exhaust pipeline.
[0017] Optionally, the cleaning structure further includes a first control mechanism, and the first control mechanism is electrically connected to the exhaust valve.
[0018] The present invention also provides a wafer processing system, including a wafer processing device, a wafer loading device, and the cleaning structure according to any one of the above. The wafer loading device includes a first loading device and a second loading device. The cleaning structure and the first loading device are both disposed on the second loading device. The second loading device communicates with the wafer processing device through the second loading port.
[0019] The present invention also provides a semiconductor production system, including an exhaust gas treatment device and the above wafer processing system. The cleaning structure includes a first exhaust pipe and a second exhaust pipe. The exhaust gas treatment device includes a third exhaust pipe. One end of the second exhaust pipe communicates with the first exhaust pipe, and the other end of the second exhaust pipe communicates with the third exhaust pipe.
[0020] The technical solutions provided by the disclosed embodiments of the present invention at least bring the following beneficial effects:
[0021] The cleaning structure provided by the present invention is used for a wafer loading device. The wafer loading device includes a first loading device loaded with wafers and a second loading device. The cleaning structure and the first loading device are both disposed on the second loading device. The first loading device includes a first loading port and a first door disposed at the first loading port. The second loading device includes a second loading port corresponding to the first loading port. The cleaning structure and the first loading device are respectively located on both sides of the second loading port. The cleaning structure includes an air suction and exhaust structure. The air suction and exhaust structure is detachably disposed at the second loading port. An opening is provided on the side of the air suction and exhaust structure facing the second loading port. When the first door is just opened, the air suction and exhaust structure absorbs and discharges the pollutants attached to the first door and the first loading port through the opening, and during the opening process of the first door, the air suction and exhaust structure absorbs and discharges the gas in the first loading device through the opening, thereby avoiding the pollutants attached to the first door and the first loading port from entering the wafer processing environment due to vibration when the first door is just opened, and avoiding the gas from escaping from the loading port to pollute the wafer processing environment during the opening process of the first door, improving the cleanliness of the wafer processing environment, and further improving the wafer processing effect.
[0022] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. Description of the Drawings
[0023] The accompanying drawings here are incorporated into the specification and form a part of this specification, showing embodiments in line with the disclosure of the present utility model, and are used together with the specification to explain the principles disclosed by the present utility model, and do not constitute an improper limitation to the disclosure of the present utility model.
[0024] Figure 1 It is a schematic diagram of a wafer loading device provided by an embodiment of the present utility model;
[0025] Figure 2 It is a schematic diagram of a first loading device provided by an embodiment of the present utility model;
[0026] Figure 3 It is a schematic diagram of a second loading device provided by an embodiment of the present utility model;
[0027] Figure 4 It is a schematic diagram of an air intake and exhaust structure provided by an embodiment of the present utility model;
[0028] Figure 5 It is a schematic diagram of another air intake and exhaust structure provided by an embodiment of the present utility model;
[0029] Figure 6 It is a schematic diagram of a wafer processing system provided by an embodiment of the present utility model;
[0030] Among them, the corresponding reference numerals in the figure are: 1 - air intake and exhaust structure; 11 - first exhaust pipeline; 12 - opening; 13 - second exhaust pipeline; 14 - exhaust valve; 15 - one-way valve; 16 - first sub-pipeline; 17 - second sub-pipeline; 2 - wafer loading device; 3 - first loading device; 31 - first door body; 32 - loading housing; 33 - lock hole; 4 - second loading device; 41 - second door body; 42 - second loading port; 43 - loading table; 44 - loading rack; 45 - adsorption component; 46 - unlocking component; 47 - purging structure; 5 - connection structure; 6 - wafer processing device. Detailed implementation manners
[0031] In order to enable those of ordinary skill in the art to better understand the technical solutions disclosed by the present utility model, the technical solutions in the embodiments disclosed by the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the scope of protection of the present utility model.
[0032] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of the present utility model are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, device, product or equipment comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or equipment.
[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present utility model more clear, the following further details the embodiments of the present utility model in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the embodiments of the present utility model, and are not used to limit the embodiments of the present utility model.
[0034] In the semiconductor manufacturing process, a wafer loading device exists in the machine tool of the semiconductor manufacturing process. The wafer loading device at least includes a wafer transfer cassette for storing wafers and a carrying mechanism for carrying the wafer transfer cassette. As the semiconductor manufacturing process continues to develop towards higher orders, even slight environmental changes will affect the quality of the product. Therefore, the environmental requirements during the wafer processing are also constantly increasing. During the wafer processing, when the door of the wafer loading device is opened, the gas therein will escape from the loading port, polluting the wafer processing environment, causing wafer contamination and affecting the wafer quality. Based on this, the present application provides a cleaning structure for a wafer loading device. By providing a suction and exhaust structure at the loading port of the above-mentioned carrying mechanism, and an opening is provided on the side of the suction and exhaust structure facing the loading port, so that when the door of the wafer transfer cassette is opened, the gas in the wafer transfer cassette is discharged through the opening, which can prevent the gas from escaping from the loading port and polluting the wafer processing environment, improve the cleanliness of the wafer processing environment, and further improve the wafer processing effect.
[0035] The following introduces the technical solutions in the embodiments of the present utility model in conjunction with the drawings.
[0036] Please refer to Figures 1-5, a cleaning structure provided by an embodiment of the present utility model. The cleaning structure is used for a wafer loading device 2, and the wafer loading device 2 includes a first loading device 3 loaded with wafers and a second loading device 4. The cleaning structure and the first loading device 3 are both arranged on the second loading device 4; the first loading device 3 includes a first loading port and a first door body 31 arranged at the first loading port, and the second loading device 4 includes a second loading port 42 corresponding to the first loading port. The cleaning structure and the first loading device 3 are respectively located on both sides of the second loading port 42; the cleaning structure includes an air suction and exhaust structure 1, and the air suction and exhaust structure 1 is detachably arranged at the second loading port 42. An opening 12 is arranged on the side of the air suction and exhaust structure 1 facing the second loading port 42. When the first door body 31 is just opened, the air suction and exhaust structure 1 absorbs and discharges the pollutants attached to the first door body 31 and the first loading port through the opening 12, and during the opening process of the first door body 31, the air suction and exhaust structure 1 absorbs and discharges the gas in the first loading device 3 through the opening 12.
[0037] In a specific embodiment, as Figure 1 and Figure 2 shown, the first loading device 3 is a wafer cassette, which can be used to store, protect and transport wafers in the semiconductor manufacturing process. The specific setting of the wafer cassette can be determined according to wafer parameters. For example, a Front Opening Unified Pod (FOUP) can be used to load 12-inch wafers; specifically, the first loading device 3 may include a first door body 31 and a loading housing 32. Wafers are placed in the space area formed by the loading housing 32. The loading housing 32 has a first loading port, and the first door body 31 is arranged at the first loading port to control the opening and closing of the first loading device 3.
[0038] In a specific embodiment, the second loading device 4 is a loading mechanism (Load Port) for loading the first loading device 3, and the loading ports of the wafer cassette and the loading mechanism correspond to each other. The air suction and exhaust structure 1 is detachably arranged on the loading mechanism and is arranged at the loading port of the loading mechanism, which is convenient for installation and disassembly and does not affect the structure of the original loading mechanism. Specifically, a sealing structure is arranged at the opening 12 of the air suction and exhaust structure 1, and the material of the sealing structure can be set according to actual application requirements. For example, soft rubber can be used. In order not to generate additional chemical molecule pollution, silicone rubber with a higher cleanliness level can be used.
[0039] In practical applications, the wafer transfer cassette can be transferred between machines of different processes through a transfer mechanism. When performing corresponding process treatments, the wafer transfer cassette is placed on a loading mechanism, with the door of the wafer transfer cassette facing the door of the loading mechanism. The door is opened, and the wafer in the wafer transfer cassette is taken out by an operating manipulator and transported to the machine for corresponding processes. After the wafer is processed, the wafer is then stored in the wafer transfer cassette by the operating manipulator. During the above processing, when the door of the loading mechanism is opened, a large vibration will occur, causing the contamination particles attached to the opening and door of the wafer transfer cassette to enter the wafer processing environment, and the gas in the wafer transfer cassette will also escape and contaminate the wafer processing environment. Through the suction and exhaust structure 1 provided at the loading port of the loading mechanism, when the door of the loading mechanism is just opened, the contaminants at the opening and door of the wafer transfer cassette can be absorbed and discharged, and during the process when the door of the loading mechanism is just opened, the gas in the wafer transfer cassette can be absorbed and discharged, preventing it from being released into the wafer processing environment and contaminating the processing environment and the wafer.
[0040] Specifically, as Figure 3 shown, a purging structure 47 can be provided on the second loading device 4. The purging structure 47 is connected to the first loading device 3. During the opening process of the first door 31, the suction and exhaust structure 1 absorbs and discharges the gas in the first loading device 3 purged by the purging structure 47 through the opening 12. After the wafer transfer cassette is placed on the loading mechanism, the internal environment of the wafer transfer cassette can be continuously purged with gas (such as nitrogen, clean compressed air, etc.) through the purging structure 47 to ensure good environmental parameters (such as humidity, particle size, metal ion concentration, etc.) inside the wafer transfer cassette. Through the suction and exhaust structure 1, when the first door 31 is opened, the gas in the wafer transfer cassette blown out by the purging structure 47 can be absorbed and discharged, and the contamination particles dropped due to the opening and closing action of the first door 31 can be absorbed and discharged when the first door 31 is opened, preventing them from entering the internal environment of the machine, improving the cleanliness of the internal environment of the machine and the wafer, thereby improving the wafer processing effect and the yield of high-order semiconductor process products. At the same time, it can avoid the sudden change of the environmental pressure inside the machine caused by the purging air flow and maintain the stability of the gas flow field inside the machine.
[0041] Optionally, the suction and exhaust structure 1 includes a first exhaust pipeline 11. The first exhaust pipeline 11 is detachably arranged at the second loading port 42, and the first exhaust pipeline 11 is spaced from the edge of the second loading port 42 by a preset distance. An opening 12 is provided on the side of the first exhaust pipeline 11 facing the second loading port 42.
[0042] Specifically, the first exhaust pipeline 11 can be an integrally formed structure or composed of multiple sub-pipelines. The shape and structure of the pipeline can be set according to the shape of the second loading port 42 and the edge of the corresponding door body. The material of the first exhaust pipeline 11 and the preset distance between it and the edge of the second loading port 42 can be determined according to actual application requirements. The material of the first exhaust pipeline 11 can be a metal material with good anti-fouling properties, high temperature resistance, corrosion resistance, etc., such as mirror stainless steel.
[0043] In some embodiments, such as Figure 4 shown, the first exhaust pipeline 11 can include two sub-pipelines, and the two sub-pipelines are respectively arranged on one side of the second loading port 42. In some embodiments, such as Figure 5 shown, the first exhaust pipeline 11 is arranged in a ring around the second loading port 42.
[0044] Optionally, the second loading device 4 further includes a loading table 43, a loading rack 44 provided with a second loading port 42, and a second door body 41 provided at the second loading port 42. The second door body 41 is adsorbed and connected to the first door body 31. The first loading device 3 is arranged on the loading table 43, and the first exhaust pipeline 11 is detachably arranged on the loading rack 44; at the second loading port 42, the first exhaust pipeline 11 and the first loading device 3 are respectively located on both sides of the loading rack 44.
[0045] In a specific embodiment, the first exhaust pipeline 11 can be spaced a certain distance from the edge of the second door body 41, and the shape and structure of the pipeline can be set according to the shape and structure of the second door body 41. Both the second door body 41 and the first exhaust pipeline 11 are arranged on the side of the loading rack 44 facing the machine platform. The first loading device 3 and the loading table 43 are located on the other side of the loading rack 44. The second loading device 4 is communicated with the space inside the machine platform through the second loading port 42, that is, the second door body 41 and the first exhaust pipeline 11 are arranged in the machine platform space, and the first loading device 3 is located outside the machine platform space. The first loading device 3 can be communicated with the machine platform space through the first loading port and the second loading port 42. Thus, the wafers in the first loading device 3 can be taken by a manipulator for corresponding process processing and then placed back and stored in the first loading device 3.
[0046] Specifically, the second door body 41 is used to open and close the first door body 31. As Figure 3 shown, an adsorption component 45 and an unlocking component 46 are arranged on the side of the second door body 41 facing the second loading port 42. After the first loading device 3 is placed on the loading table 43, the adsorption component 45 adsorbs the first door body 31, and the unlocking component 46 cooperates with the lock hole 33 on the first door body 31 to unlock, so that the first door body 31 is opened.
[0047] Specifically, the loading rack 44 is fixedly connected to the loading platform 43, and the above-mentioned purging structure 47 can be arranged on the loading platform 43.
[0048] In some embodiments, as Figure 5 shown, the second loading device 4 further includes a connection structure 5 and a driving mechanism. The driving mechanism (not shown) is fixedly arranged on the loading rack 44. One end of the connection structure 5 is fixedly connected to the second door body 41, and the other end of the connection structure 5 is fixedly connected to the driving mechanism. The first exhaust pipeline 11 includes a first sub-pipeline 16 and a second sub-pipeline 17. Openings 12 are provided on both the first sub-pipeline 16 and the second sub-pipeline 17. The first sub-pipeline 16 and the second sub-pipeline 17 are detachably arranged at the second loading port 42 on the loading rack 44. The first sub-pipeline 16, the second sub-pipeline 17 and the connection structure 5 are located on the same side of the loading rack 44. The first sub-pipeline 16 and the second sub-pipeline 17 are respectively located on both sides of the connection structure 5, and the first sub-pipeline 16 and the second sub-pipeline 17 are not connected at the connection structure 5.
[0049] In a specific embodiment, one end of the connection structure 5 is fixedly connected to the second door body 41. One end of the driving mechanism can be fixed on the loading rack 44, and the other end of the driving mechanism is fixedly connected to the other end of the connection structure 5. After the unlocking assembly 46 unlocks the first door body 31, under the drive of the driving mechanism, the connection structure 5 and the second door body 41 first move a certain distance in a direction away from the first loading device 3, and then move downward. At the same time, the second door body 41 adsorbs and drives the first door body 31 to move correspondingly until the first door body 31 is fully opened.
[0050] In a specific embodiment, the first sub-pipeline 16, the second sub-pipeline 17 and the connection structure 5 are all located on the side of the loading rack 44 facing the machine table. And when the first door body 31 is closed, the connection structure 5 can contact the loading rack 44. One end of the first sub-pipeline 16 and one end of the second sub-pipeline 17 are not connected at the connection structure 5, and the other end of the first sub-pipeline 16 and the other end of the second sub-pipeline 17 can be connected or not connected.
[0051] In an alternative embodiment, the air intake and exhaust structure 1 further includes a second exhaust pipeline 13, an exhaust valve 14 and a one-way valve 15. One end of the second exhaust pipeline 13 is communicated with the first exhaust pipeline 11. Along the direction of gas discharge, the exhaust valve 14 and the one-way valve 15 are sequentially arranged at the other end of the second exhaust pipeline 13.
[0052] Specifically, the exhaust valve 14 can be used to indicate whether the air intake and exhaust structure 1 performs air intake and exhaust operations. When the exhaust valve 14 is opened, the air intake and exhaust structure 1 starts to perform air intake and exhaust operations, absorbs the escaping gas through the opening 12 on the first exhaust pipe 11 and discharges it through the exhaust pipe. The one-way valve 15 can be used to prevent abnormal exhaust from causing gas to flow back along the second exhaust pipe 13.
[0053] Optionally, the cleaning structure further includes a first control mechanism (not shown), and the second loading device 4 further includes a second control mechanism (not shown). The first control mechanism is electrically connected to the second control mechanism, and the second control mechanism is electrically connected to the second door body 41. The first control mechanism is electrically connected to the exhaust valve 14.
[0054] Specifically, the second control mechanism is electrically connected to the driving mechanism to control the start and stop of the driving mechanism. The first control mechanism is electrically connected to the second control mechanism, and can obtain the action signal of the second loading device 4, and synchronously control the opening and closing of the exhaust valve 14, so as to realize the synchronous opening and closing of the exhaust valve 14 following the door opening and closing actions. For example, the opening and closing of the exhaust valve 14 can be controlled according to the start and stop signals of the driving mechanism. When the driving mechanism starts, the exhaust valve 14 is synchronously opened; when the driving mechanism stops, the exhaust valve 14 is synchronously closed. The opening and closing of the exhaust valve 14 can also be controlled according to the movement of the second door body 41. When the second door body 41 adsorbs the first door body 31, or when the second door body 41 drives the first door body 31 to move away from the loading rack 44, the exhaust valve 14 is synchronously opened; when the second door body 41 drives the first door body 31 to move close to the loading rack 44 until it is completely closed, or when the second door body 41 releases the adsorption of the first door body 31, the exhaust valve 14 is synchronously closed.
[0055] Optionally, the second control mechanism includes a delay control mechanism (not shown), and the delay control mechanism is electrically connected to the first control mechanism.
[0056] Specifically, the delay control mechanism can be used to control the delay time of opening and closing the exhaust valve 14 according to actual application requirements. For example, when the driving mechanism starts, the exhaust valve 14 can be opened after a first preset time; when the driving mechanism stops, the exhaust valve 14 can be closed after a second preset time. On the basis of ensuring the air intake and exhaust effect, the accuracy of air intake and exhaust control can be improved, and at the same time, the gas environment and air pressure of the machine can be accurately controlled. Specifically, the first preset time and the second preset time can be set according to actual application requirements, and the delay control mechanism can be a delay relay.
[0057] The following introduces specific embodiments of the present invention based on the above technical solutions.
[0058] Embodiment 1
[0059] Please refer to Figures 1-3 and Figure 5 Embodiment 1 provides a cleaning structure for a wafer loading device 2. The wafer loading device 2 includes a first loading device 3 loaded with wafers and a second loading device 4. The cleaning structure and the first loading device 3 are both disposed on the second loading device 4. The first loading device 3 includes a first loading port and a first door 31 disposed at the first loading port. The second loading device 4 includes a second loading port 42 corresponding to the first loading port. The cleaning structure and the first loading device 3 are respectively located on both sides of the second loading port 42. The cleaning structure includes a suction and exhaust structure 1. The suction and exhaust structure 1 is detachably disposed at the second loading port 42. An opening 12 is disposed on a side of the suction and exhaust structure 1 facing the second loading port 42. When the first door 31 is just opened, the suction and exhaust structure 1 absorbs and discharges contaminants attached to the first door 31 and the first loading port through the opening 12, and during the process of opening the first door 31, absorbs and discharges the gas in the first loading device 3 through the opening 12.
[0060] In a specific embodiment, as Figure 1 and Figure 2 shown, the first loading device 3 is a Front Opening Unified Pod (FOUP) for loading 12-inch wafers. Specifically, the first loading device 3 may include a first door 31 and a loading housing 32. Wafers are placed in a space area formed by the loading housing 32. The loading housing 32 has a first loading port, and the first door 31 is disposed at the first loading port to control the opening and closing of the first loading device 3.
[0061] In a specific embodiment, as Figure 1 and Figure 3 shown, the second loading device 4 is a load port for loading the first loading device 3, and the loading ports of the wafer transfer cassette and the load port correspond to each other. The suction and exhaust structure 1 is detachably disposed on the load port and is disposed at the loading port of the load port, which is convenient for installation and disassembly and does not affect the structure of the original load port. Specifically, a sealing structure is disposed at the opening 12 of the suction and exhaust structure 1. In order not to generate additional chemical molecule contamination, the material of the sealing structure can be made of silicone rubber with a relatively high cleanliness level.
[0062] Specifically, a purging structure 47 may be provided on the second loading device 4. The purging structure 47 is communicated with the first loading device 3. During the opening process of the first door body 31, the suction and exhaust structure 1 absorbs and discharges the gas in the first loading device 3 purged by the purging structure 47 through the opening 12. After the wafer transfer cassette is placed on the bearing mechanism, the internal environment of the wafer transfer cassette can be continuously purged with gas (such as nitrogen, clean compressed air, etc.) through the purging structure 47, so that various environmental parameters (such as humidity, particle size, metal ion concentration, etc.) in the wafer transfer cassette are good. Through the suction and exhaust structure 1, when the first door body 31 is opened, the gas in the wafer transfer cassette blown out by the purging structure 47 can be absorbed and discharged, and the contaminated particles dropped due to the opening and closing action of the first door body 31 can be absorbed and discharged when the first door body 31 is opened, so as to avoid entering the internal environment of the machine tool, improve the cleanliness of the internal environment of the machine tool and the wafers, and further improve the wafer processing effect and the yield of high-order semiconductor process products. At the same time, it is possible to avoid the sudden change of the environmental pressure in the machine tool when the first door body 31 is opened due to the purging air flow, and maintain the stability of the gas flow field in the machine tool.
[0063] Optionally, the suction and exhaust structure 1 includes a first exhaust pipeline 11. The first exhaust pipeline 11 is detachably provided at the second loading port 42, and the first exhaust pipeline 11 is spaced from the edge of the second loading port 42 by a preset distance. An opening 12 is provided on the side of the first exhaust pipeline 11 facing the second loading port 42.
[0064] Specifically, the first exhaust pipeline 11 may be an integrally formed structure. The shape and structure of the pipeline can be set according to the shape of the second loading port 42 and the edge of the corresponding door body. The material of the first exhaust pipeline 11 and the preset distance between it and the edge of the second loading port 42 can be determined according to actual application requirements. The material of the first exhaust pipeline 11 can be a metal material with good anti-pollution, high temperature resistance, corrosion resistance, etc., such as mirror stainless steel.
[0065] In some embodiments, as Figure 5 shown, the first exhaust pipeline 11 is arranged in a ring around the second loading port 42.
[0066] Optionally, the second loading device 4 further includes a loading table 43, a loading rack 44 provided with a second loading port 42, and a second door body 41 provided at the second loading port 42. The second door body 41 is adsorbed and connected to the first door body 31. The first loading device 3 is arranged on the loading table 43, and the first exhaust pipeline 11 is detachably arranged on the loading rack 44; at the second loading port 42, the first exhaust pipeline 11 and the first loading device 3 are respectively located on both sides of the loading rack 44.
[0067] In a specific embodiment, the first exhaust pipeline 11 may be spaced apart from the edge of the second door body 41 by a certain distance, and the shape and structure of the pipeline may be set according to the shape and structure of the second door body 41. Both the second door body 41 and the first exhaust pipeline 11 are provided on the side of the loading rack 44 facing the machine table, the first loading device 3 and the loading table 43 are located on the other side of the loading rack 44, and the second loading device 4 is communicated with the space inside the machine table through the second loading port 42, that is, the second door body 41 and the first exhaust pipeline 11 are provided in the machine table space, the first loading device 3 is located outside the machine table space, and the first loading device 3 can be communicated with the machine table space through the first loading port and the second loading port 42, so that the wafers in the first loading device 3 can be taken by a manipulator for corresponding process processing and then placed back and stored in the first loading device 3.
[0068] Specifically, the second door body 41 is used to open and close the first door body 31. An adsorption component 45 and a lock-opening component 46 are provided on the side of the second door body 41 facing the second loading port 42. After the first loading device 3 is placed on the loading table 43, the adsorption component 45 adsorbs the first door body 31, and the lock-opening component 46 cooperates with the lock hole 33 on the first door body 31 to unlock, so that the first door body 31 is opened.
[0069] Specifically, the loading rack 44 and the loading table 43 are fixedly connected, and the above-mentioned purging structure 47 can be provided on the loading table 43.
[0070] In some embodiments, such as Figure 1 and Figure 5 shown, the second loading device 4 further includes a connection structure 5 and a driving mechanism. The driving mechanism (not shown) is fixedly provided on the loading rack 44. One end of the connection structure 5 is fixedly connected to the second door body 41, and the other end of the connection structure 5 is fixedly connected to the driving mechanism; the first exhaust pipeline 11 includes a first sub-pipeline 16 and a second sub-pipeline 17. Openings 12 are provided on both the first sub-pipeline 16 and the second sub-pipeline 17. The first sub-pipeline 16 and the second sub-pipeline 17 are detachably provided at the second loading port 42 on the loading rack 44; the first sub-pipeline 16, the second sub-pipeline 17 and the connection structure 5 are located on the same side of the loading rack 44. The first sub-pipeline 16 and the second sub-pipeline 17 are respectively located on both sides of the connection structure 5, and the first sub-pipeline 16 and the second sub-pipeline 17 are not communicated at the connection structure 5.
[0071] In a specific embodiment, one end of the connection structure 5 is fixedly connected to the second door body 41. One end of the driving mechanism can be fixed on the loading rack 44, and the other end of the driving mechanism is fixedly connected to the other end of the connection structure 5. After the unlocking component 46 unlocks the first door body 31, under the drive of the driving mechanism, the connection structure 5 and the second door body 41 first move a certain distance away from the first loading device 3, and then move downward. At the same time, the second door body 41 adsorbs and drives the first door body 31 to move accordingly until the first door body 31 is fully opened.
[0072] In a specific embodiment, the first sub-pipeline 16, the second sub-pipeline 17 and the connection structure 5 are all located on the side of the loading rack 44 facing the machine platform. And when the first door body 31 is closed, the connection structure 5 can contact the loading rack 44. One end of the first sub-pipeline 16 and one end of the second sub-pipeline 17 are not connected at the connection structure 5, and the other end of the first sub-pipeline 16 and the other end of the second sub-pipeline 17 are connected.
[0073] In an alternative embodiment, the air intake and exhaust structure 1 further includes a second exhaust pipeline 13, an exhaust valve 14 and a one-way valve 15. One end of the second exhaust pipeline 13 is connected to the first exhaust pipeline 11. Along the direction of gas discharge, the exhaust valve 14 and the one-way valve 15 are sequentially arranged at the other end of the second exhaust pipeline 13.
[0074] Specifically, the exhaust valve 14 can be used to indicate whether the air intake and exhaust structure 1 performs air intake and exhaust operations. When the exhaust valve 14 is opened, the air intake and exhaust structure 1 starts to perform air intake and exhaust operations, absorbs the escaped gas through the opening 12 on the first exhaust pipeline 11 and discharges it through the exhaust pipeline. The one-way valve 15 can be used to prevent the gas from flowing back along the second exhaust pipeline 13 due to abnormal exhaust.
[0075] Optionally, the cleaning structure further includes a first control mechanism (not shown), and the second loading device 4 further includes a second control mechanism (not shown). The first control mechanism is electrically connected to the second control mechanism, and the second control mechanism is electrically connected to the second door body 41. The first control mechanism is electrically connected to the exhaust valve 14.
[0076] Specifically, the second control mechanism is electrically connected to the driving mechanism to control the start and stop of the driving mechanism. The first control mechanism is electrically connected to the second control mechanism, and can obtain the action signal of the second loading device 4, and synchronously control the opening and closing of the exhaust valve 14 to realize the synchronous opening and closing of the exhaust valve 14 following the opening and closing of the door.
[0077] Optionally, the second control mechanism includes a delay control mechanism (not shown), and the delay control mechanism is electrically connected to the first control mechanism.
[0078] Specifically, the delay control mechanism can be used to control the delay time for opening and closing the exhaust valve 14 according to the actual application requirements.
[0079] Embodiment 2
[0080] The difference between Embodiment 2 and Embodiment 1 lies in the setting of the first exhaust pipeline. The same parts as those in Embodiment 1 will not be described herein again. Now, the differences between Embodiment 2 and Embodiment 1 are described as follows:
[0081] As Figure 4 shown, the first exhaust pipeline 11 is composed of multiple sub-pipelines. The first exhaust pipeline 11 can include two sub-pipelines, which are respectively arranged on one side of the second loading port 42.
[0082] By implementing the above embodiments of the present utility model, the cleaning structure is used for a wafer loading device. The wafer loading device includes a first loading device loaded with wafers and a second loading device. The cleaning structure and the first loading device are both arranged on the second loading device; the first loading device includes a first loading port and a first door body arranged at the first loading port. The second loading device includes a second loading port corresponding to the first loading port. The cleaning structure and the first loading device are respectively located on both sides of the second loading port; the cleaning structure includes an air suction and exhaust structure, and the air suction and exhaust structure is detachably arranged at the second loading port. An opening is arranged on the side of the air suction and exhaust structure facing the second loading port. When the first door body is just opened, the air suction and exhaust structure absorbs and discharges the pollutants attached to the first door body and the first loading port through the opening, and during the opening process of the first door body, the air suction and exhaust structure absorbs and discharges the gas in the first loading device through the opening, thereby avoiding the pollutants attached to the first door body and the first loading port from entering the wafer processing environment due to vibration when the first door body is just opened, and during the opening process of the first door body, avoiding the gas from escaping from the loading port to pollute the wafer processing environment, improving the cleanliness of the wafer processing environment, and further improving the wafer processing effect. Moreover, it can effectively improve problems such as residues of water molecules and chemical molecules in the wafer transfer cassette causing defects.
[0083] The embodiment of the present utility model also provides a wafer processing system. As Figure 6 shown, it includes a wafer processing device 6, a wafer loading device, and the cleaning structure in the above embodiments of the present application. The wafer loading device includes a first loading device and a second loading device. The cleaning structure and the first loading device are both arranged on the second loading device. The second loading device is communicated with the wafer processing device 6 through the second loading port. Specifically, the wafer processing device 6 can be used to perform processes such as etching and cleaning on wafers.
[0084] Regarding the above wafer processing system, the specific setting and method of the cleaning structure have been described in detail in the embodiments related to the water supply system, and will not be elaborated herein again.
[0085] An embodiment of the utility model also provides a semiconductor production system, including an exhaust gas treatment device (not shown) and the above-mentioned wafer processing system, the above-mentioned cleaning structure includes a first exhaust pipeline and a second exhaust pipeline, the exhaust gas treatment device includes a third exhaust pipeline (not shown), one end of the second exhaust pipeline is connected to the first exhaust pipeline, and the other end of the second exhaust pipeline is connected to the third exhaust pipeline.
[0086] Specifically, the third exhaust pipeline can correspond to a variety of exhaust scenarios, such as process vacuum, ordinary vacuum, machine-provided vacuum pump, acid exhaust, alkaline exhaust, etc. Correspondingly, the interface between the second exhaust pipeline and the third exhaust pipeline can be adaptively set according to the exhaust scenario requirements of the third exhaust pipeline.
[0087] Those skilled in the art will readily come to other embodiments of the present invention after considering the specification and practicing the utility model disclosed herein. The present invention is intended to cover any variation, use, or adaptation disclosed herein, which follows the general principles disclosed herein and includes common knowledge or customary technical means in the art that are not disclosed herein. The specification and examples are to be regarded as exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.
[0088] It should be understood that the present invention is not limited to the precise structure described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.
Claims
1. A cleaning structure, characterized in that: The cleaning structure is used for a wafer loading device, the wafer loading device includes a first loading device loaded with wafers, and a second loading device, the cleaning structure and the first loading device are both arranged on the second loading device; the first loading device includes a first loading port and a first door body arranged at the first loading port, the second loading device includes a second loading port corresponding to the first loading port, and the cleaning structure and the first loading device are respectively located on both sides of the second loading port; The cleaning structure includes an air suction and exhaust structure, which is detachably arranged at the second loading port, and an opening is arranged on the side of the air suction and exhaust structure facing the second loading port; when the first door body is just opened, the air suction and exhaust structure absorbs and discharges pollutants attached to the first door body and the first loading port through the opening, and during the process of opening the first door body, the air suction and exhaust structure absorbs and discharges gas in the first loading device through the opening.
2. The cleaning structure according to claim 1, characterized in that: The air intake and exhaust structure includes a first exhaust pipeline, which is detachably arranged at the second loading port, and the first exhaust pipeline is spaced a preset distance from an edge of the second loading port, and the opening is arranged on a side of the first exhaust pipeline facing the second loading port. 3 . The cleaning structure according to claim 2 , wherein the first exhaust pipe is arranged in a ring shape around the second loading port.
4. The cleaning structure according to claim 2, characterized in that: The second loading device also includes a loading platform, a loading rack provided with the second loading port, and a second door body arranged at the second loading port, the second door body is adsorbed and connected to the first door body, the first loading device is arranged on the loading platform, and the first exhaust pipeline is detachably arranged on the loading rack; at the second loading port, the first exhaust pipeline and the first loading device are respectively located on both sides of the loading rack.
5. The cleaning structure according to claim 4, characterized in that: The second loading device further comprises a connecting structure and a driving mechanism, wherein the driving mechanism is fixedly disposed on the loading frame, one end of the connecting structure is fixedly connected to the second door body, and the other end of the connecting structure is fixedly connected to the driving mechanism; The first exhaust pipeline includes a first sub-pipeline and a second sub-pipeline, the first sub-pipeline and the second sub-pipeline are both provided with the opening, and the first sub-pipeline and the second sub-pipeline are detachably arranged at the second loading port on the loading rack; the first sub-pipeline, the second sub-pipeline and the connecting structure are located on the same side of the loading rack, the first sub-pipeline and the second sub-pipeline are respectively located on both sides of the connecting structure, and the first sub-pipeline and the second sub-pipeline are not connected at the connecting structure.
6. The cleaning structure according to claim 4, characterized in that: The cleaning structure further includes a first control mechanism, and the second loading device further includes a second control mechanism. The first control mechanism is electrically connected to the second control mechanism, and the second control mechanism is electrically connected to the second door body.
7. The cleaning structure according to claim 6, characterized in that: The second control mechanism includes a delay control mechanism, and the delay control mechanism is electrically connected to the first control mechanism.
8. The cleaning structure according to claim 4, characterized in that: A purge structure is provided on the loading platform, and the purge structure is connected to the first loading device. When the first door is opened, the air intake and exhaust structure absorbs and discharges the gas in the first loading device purged by the purge structure through the opening.
9. The cleaning structure according to claim 2, characterized in that: The air intake and exhaust structure also includes a second exhaust pipeline, an exhaust valve and a one-way valve. One end of the second exhaust pipeline is connected to the first exhaust pipeline. Along the direction of gas discharge, the other end of the second exhaust pipeline is sequentially provided with the exhaust valve and the one-way valve.
10. The cleaning structure according to claim 9, characterized in that: The cleaning structure further includes a first control mechanism, which is electrically connected to the exhaust valve.
11. The cleaning structure according to claim 1, characterized in that: A sealing structure is arranged at the opening.
12. A wafer processing system, characterized in that: It comprises a wafer processing device, a wafer loading device and a cleaning structure as described in any one of claims 1 to 11, the wafer loading device comprises a first loading device and a second loading device, the cleaning structure and the first loading device are both arranged on the second loading device, and the second loading device is connected to the wafer processing device through the second loading port.
13. A semiconductor production system, characterized in that: It includes an exhaust gas treatment device and a wafer processing system as described in claim 12, wherein the cleaning structure includes a first exhaust pipeline and a second exhaust pipeline, and the exhaust gas treatment device includes a third exhaust pipeline, one end of the second exhaust pipeline is connected to the first exhaust pipeline, and the other end of the second exhaust pipeline is connected to the third exhaust pipeline.