Wafer slip sheet blanking mechanism
By designing a wafer smooth cutting mechanism, including a slide platform, overflow tank and a box handling mechanism, the problems of low wafer cutting efficiency and difficult to clean the residual water stains in the prior art are solved, and efficient and water stain-free cutting operation is achieved.
Patent Information
- Application Number
- CN202422156972.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-09-03
AI Technical Summary
In the prior art, the wafer is inefficient in the cutting operation, and due to residual water stains on the surface, it is difficult to clean, and it needs to be manually removed in a specific machine.
A wafer smoothing feeding mechanism is designed, including a mounting frame, a slide platform, an overflow sink and a box handling mechanism. A discharge sink is provided between the slide platform and the overflow sink. The control mechanism connects the slide platform and the discharge sink to complete the discharge operation of the wafer. The box conveying mechanism ensures that the box is located in the overflow tank when collecting the material.
It realizes efficient wafer cutting operation, prevents wafer drying, and improves operating efficiency and use effect.
Smart Images
Figure CN223006757U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer slide blanking, in particular to a wafer slide blanking mechanism. Background Art
[0002] Currently, wafers are mainly placed into a wafer cassette one by one manually, with low efficiency and poor usage effect. Moreover, during the processing, there are residual water stains on the surface of the wafer after the previous process. If not placed in water, water stains will remain after the water dries for a long time and cannot be cleaned thoroughly. It is necessary to use a specific machine to remove the residual water on the wafer. Therefore, when collecting materials, it is necessary to place the wafer in a water tank. The existing operation mainly relies on manual picking and placing of wafers, and then cleaning the water stains on the wafer surface, resulting in low efficiency.
[0003] In view of the above situation, it is necessary to improve the existing wafer placement method to meet the current needs of wafer blanking. Summary of the Utility Model
[0004] To achieve the above object, the technical solution of the utility model is a wafer slide blanking mechanism, including a mounting frame, a slide platform arranged on the mounting frame, an overflow water tank arranged on the mounting frame and located on one side of the slide platform, and a cassette handling mechanism arranged on the mounting frame and located on one side of the overflow water tank. The slide platform is mounted on the mounting frame, the overflow water tank is fixedly mounted on the mounting frame, a blanking water tank is arranged between the overflow water tank and the slide platform, the blanking water tank is fixedly mounted on the mounting frame, and one end of the blanking water tank is connected to the slide platform.
[0005] As a further supplement to the above technical solution, the slide platform includes a support plate, a rotating shaft mechanism arranged on the support plate, a slide table arranged on the rotating shaft mechanism, and a control mechanism arranged below the slide table. The support plate is fixedly connected to the mounting frame, the rotating shaft mechanism is mounted on the support plate, the slide table is fixedly connected to the rotating shaft mechanism, the control mechanism is fixedly mounted on the mounting frame, a blanking temporary storage table is arranged on the slide table, and the slide table is in contact with the blanking water tank.
[0006] As a further supplement to the above technical solution, the control mechanism includes a fixed frame, a cylinder fixedly connected to the fixed frame, and a floating joint connected to the cylinder. The fixed frame is fixedly mounted on the mounting frame, the cylinder is inclined and fixedly connected to the fixed frame, and the upper end of the floating joint is connected to the slide table.
[0007] As a further supplement to the above technical solution, the cassette handling mechanism includes a Y-axis movement module, a Z-axis movement module connected to the Y-axis movement module, a fixed fixture arranged on the Z-axis movement module, and a cassette snap-fitted on the fixed fixture. The Y-axis movement module is fixedly mounted at the bottom of the mounting frame, and the fixed fixture is connected to the Z-axis movement module.
[0008] As a further supplement to this technical solution, there are two Z-axis moving modules and fixing jigs, which are arranged front and back.
[0009] As a further supplement to this technical solution, the rotating shaft mechanism includes bearing seats arranged on the front and back sides of the support plate, and a rotating shaft arranged between the two bearing seats. The bearing seats are fixedly installed on the support plate. One end of the lower side of the sliding table is fixedly connected to the rotating shaft, and the rotating shaft is rotatably installed on the bearing seat.
[0010] Its beneficial effects are as follows: It can well complete the blanking operation of the wafer, and is provided with an overflow water tank to ensure that the cassette is in the overflow water tank during material collection, preventing the wafer from drying out, with high efficiency and good use effect. Description of the Drawings
[0011] Figure 1 is the overall structural schematic diagram of the first angle of the present utility model;
[0012] Figure 2 is the overall structural schematic diagram of the second angle of the present utility model;
[0013] Figure 3 is the overall structural schematic diagram of the third angle of the present utility model;
[0014] In the figure, 1. mounting frame; 2. sliding plate platform; 21. support plate; 22. rotating shaft mechanism; 221. bearing seat; 222. rotating shaft; 23. sliding table; 24. control mechanism; 241. fixing frame; 242. cylinder; 243. floating joint; 3. overflow water tank; 4. cassette handling mechanism; 41. Y-axis moving module; 42. Z-axis moving module; 43. fixing jig; 44. cassette; 5. blanking water tank; 6. blanking temporary storage table. Detailed Embodiments
[0015] For the convenience of those skilled in the art to understand this technical solution more clearly, the technical solution of the present utility model will be elaborated in detail below in combination with the attached Figures 1-3 The technical solution of the present utility model will be elaborated in detail:
[0016] A wafer slide blanking mechanism includes a mounting frame 1, a slide platform 2 disposed on the mounting frame 1, an overflow water tank 3 disposed on the mounting frame 1 and on one side of the slide platform 2, a cassette 44 handling mechanism 4 disposed on the mounting frame 1 and on one side of the overflow water tank 3. The slide platform 2 is mounted on the mounting frame 1, the overflow water tank 3 is fixedly mounted on the mounting frame 1, a blanking water tank 5 is provided between the overflow water tank 3 and the slide platform 2, the blanking water tank 5 is fixedly mounted on the mounting frame 1, and one end of the blanking water tank 5 is connected to the slide platform 2. Among them, the settings of the slide platform 2, the overflow water tank 3, and the cassette 44 handling mechanism 4 can ensure that the cassette 44 is in the overflow water tank 3 during material collection, preventing dry wafers (after the previous process, there are residual water stains on the surface of the wafer. If not placed in water, the water will dry out after a long time, leaving water stains that cannot be cleaned. It is necessary to remove the residual water on the wafer in a specific machine, so it should be in the water tank during material collection). The cassette 44 handling mechanism 4 can take out the installed wafer from the overflow water tank 3 and put the cassette 44 without installed wafers into the overflow water tank 3.
[0017] The structure of the slide platform 2 will be elaborated in detail below. The slide platform 2 includes a support plate 21, a rotating shaft 222 mechanism 22 disposed on the support plate 21, a slide table 23 disposed on the rotating shaft 222 mechanism 22, and a control mechanism 24 disposed below the slide table 23. The support plate 21 is fixedly connected to the mounting frame 1, the rotating shaft 222 mechanism 22 is mounted on the support plate 21, the slide table 23 is fixedly connected to the rotating shaft 222 mechanism 22, the control mechanism 24 is fixedly mounted on the mounting frame 1, a blanking temporary storage table 6 is provided on the slide table 23, the slide table 23 is in contact with the blanking water tank 5, and the control mechanism 24 can control the rotation of the slide table 23, and the rotating shaft 222 mechanism 22 can limit its tilt angle to facilitate its contact with the blanking water tank 5 to complete the wafer blanking operation. Among them, the control mechanism 24 includes a fixed frame 241, a cylinder 242 fixedly connected to the fixed frame 241, and a floating joint 243 connected to the cylinder 242. The fixed frame 241 is fixedly mounted on the mounting frame 1, the cylinder 242 is inclined and fixedly connected to the fixed frame 241, the upper end of the floating joint 243 is connected to the slide table 23, the cylinder 242 can control the movement of the floating joint 243, and the movement of the floating joint 243 can control the rotation of the slide table 23 to complete its docking with the blanking water tank 5, so that the wafer on the slide table 23 flows into the cassette 44 in the overflow water tank 3
[0018] The structure of the cassette handling mechanism 4 will be described in detail below. The cassette handling mechanism 4 includes a Y-axis movement module 41, a Z-axis movement module 42 connected to the Y-axis movement module 41, a fixed jig 43 disposed on the Z-axis movement module 42, and a cassette 44 snap-fitted to the fixed jig 43. The Y-axis movement module 41 is fixedly installed at the bottom of the mounting frame 1. The fixed jig 43 is connected to the Z-axis movement module 42. During operation, the cassette 44 is placed in the overflow water tank 3 through the cassette 44 handling mechanism 4, and the wafer is loaded through the sliding platform 2. The Z-axis movement module 42 can control the height of the fixed jig 43, thereby adjusting the height of the cassette 44 until the wafer on it is full. Then, the Z-axis movement module 42 and the Y-axis movement module 41 are controlled to take out the full cassette 44.
[0019] In this technical solution, there are two Z-axis movement modules 42 and fixed jigs 43, which are arranged front and back, and work at two stations, reducing the waiting time for changing the cassette 44 and improving the operation efficiency.
[0020] Among them, the rotating shaft 222 mechanism 22 includes bearing seats 221 arranged on the front and back sides of the support plate 21, and a rotating shaft 222 arranged between the two bearing seats 221. The bearing seats 221 are fixedly installed on the support plate 21. One end of the lower side of the slide table 23 is fixedly connected to the rotating shaft 222, and the rotating shaft 222 is rotatably installed on the bearing seats 221.
[0021] The above technical solution only reflects the preferred technical solution of the technical solution of the present invention. Some changes that may be made to some parts by those skilled in the art of the present technology all reflect the principle of the present invention and are within the protection scope of the present invention.
Claims
1. A wafer slide unloading mechanism, characterized in that: The invention comprises a mounting frame (1), a slide platform (2) arranged on the mounting frame (1), an overflow trough (3) arranged on the mounting frame (1) and located on one side of the slide platform (2), and a film box conveying mechanism (4) arranged on the mounting frame (1) and located on one side of the overflow trough (3), wherein the slide platform (2) is mounted on the mounting frame (1), the overflow trough (3) is fixedly mounted on the mounting frame (1), a material discharge trough (5) is arranged between the overflow trough (3) and the slide platform (2), the material discharge trough (5) is fixedly mounted on the mounting frame (1), and one end of the material discharge trough (5) is connected to the slide platform (2).
2. A wafer slide unloading mechanism according to claim 1, characterized in that: The slide platform (2) comprises a support plate (21), a rotating shaft (222) mechanism (22) arranged on the support plate (21), a slide (23) arranged on the rotating shaft (222) mechanism (22), and a control mechanism (24) arranged below the slide (23); the support plate (21) is fixedly connected to the mounting frame (1); the rotating shaft (222) mechanism (22) is mounted on the support plate (21); the slide (23) is fixedly connected to the rotating shaft (222) mechanism (22); the control mechanism (24) is fixedly mounted on the mounting frame (1); a material unloading temporary storage platform (6) is provided on the slide (23); and the slide (23) is in contact with a material unloading water tank (5).
3. A wafer slide unloading mechanism according to claim 2, characterized in that: The control mechanism (24) comprises a fixed frame (241), a cylinder (242) fixedly connected to the fixed frame (241), and a floating joint (243) connected to the cylinder (242); the fixed frame (241) is fixedly mounted on the mounting frame (1); the cylinder (242) is tiltedly arranged on the fixed frame (241) and fixedly connected thereto; and the upper end of the floating joint (243) is connected to the slide table (23).
4. The wafer slide unloading mechanism according to claim 1, characterized in that: The film box transport mechanism (4) comprises a Y-axis moving module (41), a Z-axis moving module (42) connected to the Y-axis moving module (41), a fixed fixture (43) arranged on the Z-axis moving module (42), and a film box (44) buckled on the fixed fixture (43), wherein the Y-axis moving module (41) is fixedly mounted on the bottom of the mounting frame (1), and the fixed fixture (43) is connected to the Z-axis moving module (42).
5. A wafer slide unloading mechanism according to claim 4, characterized in that: The Z-axis moving module (42) and the fixed fixture (43) are provided with two and are arranged in a front-to-back manner.
6. The wafer slide unloading mechanism according to claim 2, characterized in that: The rotating shaft (222) mechanism (22) comprises bearing seats (221) arranged on the front and rear sides of the support plate (21), and a rotating shaft (222) arranged between the bearing seats (221) on both sides; the bearing seat (221) is fixedly mounted on the support plate (21); a lower side end of the slide (23) is fixedly connected to the rotating shaft (222); and the rotating shaft (222) is rotatably mounted on the bearing seat (221).