Wafer bearing equipment and wafer conveying system
By setting a temperature regulator in the annular bearing part of the wafer bearing device to adjust the surface temperature of the bearing part, the problem of damage during the transmission process is solved and the morphological quality of the wafer is improved.
Patent Information
- Application Number
- CN202421859608.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-01
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-08-01
AI Technical Summary
During semiconductor manufacturing, the wafer is prone to damage during the transmission process, mainly because the temperature of the bearing device does not match the temperature of the wafer, resulting in internal stress accumulation.
A wafer bearing device is designed, including an annular bearing part and a containment slot, and a built-in temperature regulator can adjust the surface temperature of the bearing part and reduce the temperature difference with the wafer.
By adjusting the surface temperature of the bearing part, the probability of wafer breakage is reduced and the morphological quality of the wafer is improved.
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Figure CN223006762U_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present disclosure relate to the field of semiconductor manufacturing technologies, and in particular, to a wafer carrier device and a wafer transfer system. Background Art
[0002] In the process of semiconductor manufacturing, wafers need to be transferred to different processing machines for different treatments of the wafers. For example, the wafers are cleaned, pre-aligned, and de-glued.
[0003] Currently, wafers are usually placed in a carrier device to avoid being contaminated during the transfer process. However, there is a probability of wafer breakage when placing the wafers in the carrier device.
[0004] In this context, how to provide technical solutions to reduce the probability of wafer breakage has become a technical problem that those skilled in the art urgently need to solve. Summary of the Utility Model
[0005] In view of this, embodiments of the present disclosure provide a wafer carrier device and a wafer transfer system, which can reduce the probability of wafer breakage.
[0006] The wafer carrier device in the embodiments of the present disclosure includes:
[0007] A cavity;
[0008] An annular carrier part disposed in the cavity for carrying wafers; a receiving groove is provided in the annular carrier part, and the receiving groove is coaxially arranged with the annular carrier part;
[0009] A temperature regulator disposed in the receiving groove for adjusting the surface temperature of the annular carrier part.
[0010] Optionally, the number of the receiving grooves is multiple;
[0011] The multiple receiving grooves are concentrically arranged, and the radial dimensions of the receiving grooves are different; or, the multiple receiving grooves are spaced along the normal direction of the annular carrier part.
[0012] Optionally, the temperature regulator includes:
[0013] A heating element disposed in the receiving groove of the annular carrier part;
[0014] And / or, a cooling element disposed in the receiving groove of the annular carrier part.
[0015] Optionally, the temperature regulator further includes: a pipeline, and the pipeline is disposed in the receiving groove of the annular carrier part;
[0016] The pipeline forms a passage for the cooling medium to flow through, so as to reduce the surface temperature of the annular bearing part, wherein the cooling medium is provided by the refrigeration element;
[0017] Alternatively, the pipeline forms a passage for the hot gas to flow through, so as to increase the surface temperature of the annular bearing part, wherein the hot gas is generated by heating with the heating element.
[0018] Optionally, the wafer carrying device further includes: a medium inlet and a medium outlet which are arranged on the annular bearing part and communicated with the pipeline for the cooling medium or the hot gas to enter and exit.
[0019] Optionally, the wafer carrying device further includes: a lifting assembly for lifting and lowering the wafer along the hollow channel.
[0020] Optionally, the wafer carrying device further includes: a temperature sensor which is arranged on the annular bearing part and detects the surface temperature of the annular bearing part;
[0021] A controller which is connected to the temperature sensor and controls the working process of the temperature regulator according to the surface temperature detected by the temperature sensor.
[0022] Optionally, the wafer carrying device further includes:
[0023] An adsorption assembly which is inserted through the cavity and sucks the gas in the cavity.
[0024] Optionally, the wafer carrying device further includes:
[0025] A limiting member which is arranged on the annular bearing part and restricts the movement of the wafer along the surface of the annular bearing part.
[0026] Correspondingly, the embodiment of the present disclosure further provides a wafer transfer system, including:
[0027] The wafer carrying device described in any of the foregoing examples;
[0028] A transfer device which transfers the wafer carrying device and picks and places the wafer in the wafer carrying device.
[0029] By using the wafer carrying device provided by the embodiment of the present disclosure, an annular bearing part for carrying a wafer is arranged in the cavity, a containing groove for containing a temperature regulator is arranged in the annular bearing part, and a temperature regulator is arranged in the containing groove, which can adjust the surface temperature of the annular bearing part. Thus, when the wafer is placed on the annular bearing part, the temperature difference between the annular bearing part and the wafer can be reduced, and the probability of breakage caused by the local temperature sudden change of the wafer resulting in the internal stress accumulation or buildup of the wafer can be avoided or reduced. Description of the Drawings
[0030] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for describing the embodiments of the present disclosure or the prior art. Obviously, the following described drawings are only some embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0031] Figure 1 The structural schematic diagram of a wafer carrier device according to an embodiment of the present disclosure is shown;
[0032] Figure 2 For Figure 1 The top view schematic diagram of the wafer carrier device shown;
[0033] Figure 3 The top view schematic diagram of another wafer carrier device according to an embodiment of the present disclosure is shown. Detailed implementation manners
[0034] As described in the background art, when placing a wafer on a carrier device, there is a probability of wafer breakage because:
[0035] During the process of performing some processing operations (such as a degluing process) on the wafer, it is necessary to place the wafer in a high-temperature environment (such as 275 °C). After the processing is completed, it is necessary to cool the wafer.
[0036] During the process of transferring the wafer to the cooling station, it is necessary to place the wafer that has been subjected to high-temperature treatment in the carrier device, and the temperature in the carrier device is usually normal temperature. The temperature on the surface of the wafer after high-temperature treatment is relatively high. When the wafer comes into contact with the metal carrier sheet in the carrier device, due to the high thermal conductivity of the metal carrier sheet, the temperature at the contact between the wafer and the metal carrier sheet drops rapidly, while the other parts of the wafer are still at a high temperature. As a result, a temperature gradient is generated inside the wafer, leading to the accumulation or build-up of internal stress in the wafer. When the stress exceeds the stress range that the wafer can withstand, the wafer will break into pieces.
[0037] To solve the above technical problems, an embodiment of the present disclosure provides a wafer carrier device. By providing a temperature regulator in the accommodation groove of the annular carrier portion, the surface temperature of the annular carrier portion can be adjusted, so that when the wafer is placed on the annular carrier portion, the temperature difference between the annular carrier portion and the wafer can be reduced, avoiding or reducing the probability of breakage caused by the sudden change of the local temperature of the wafer, resulting in the accumulation or build-up of internal stress in the wafer.
[0038] To enable those skilled in the art to have a clearer understanding of the technical concepts, technical principles, advantages, etc. included in the embodiments of the present disclosure, the following will refer to the drawings, and through specific embodiments and in combination with specific application scenarios, etc., a detailed introduction will be made.
[0039] Combined with reference toFigure 1 and Figure 2 , Figure 1 FIG. Figure 1 is a schematic structural diagram of a wafer carrier device provided by an embodiment of the present disclosure, Figure 2 and Figure 1 FIG. Figure 1 is a top view schematic diagram of the wafer carrier device shown in FIG. Figure 1 .
[0040] As shown in Figure 1 and Figure 2 FIG. Figure 1 and FIG. Figure 2 , the wafer carrier device 100 may include:
[0041] a cavity 110;
[0042] an annular carrier part 120 disposed in the cavity 110 for carrying a wafer ( Figure 1 and Figure 2 not shown in the figures). An accommodation groove ( Figure 1 not shown) is provided in the annular carrier part 120, and the accommodation groove is coaxially disposed with the annular carrier part 120;
[0043] at least one temperature regulator disposed in the accommodation groove for adjusting the surface temperature of the annular carrier part 120 (for example, Figure 1 and Figure 2 the first temperature regulator 131 and / or the second temperature regulator 132 shown in FIG. Figure 2 ).
[0044] In some embodiments of the present disclosure, the cavity 110 may provide a space for carrying the wafer. When it is necessary to transfer the wafer, the surface temperature of the annular carrier part 120 may be adjusted by the temperature regulator (the first temperature regulator 131 and / or the second temperature regulator 132) according to the temperature corresponding to the process currently being executed by the wafer, so as to reduce the temperature difference between the annular carrier part 120 and the wafer, and further avoid the probability of breakage caused by the local temperature sudden change of the wafer resulting in the internal stress accumulation or aggregation in the wafer. Therefore, the topography quality of the wafer can be improved.
[0045] As an optional example, during the execution of the processing process, if the wafer is in a high-temperature environment, the temperature regulator may be used to perform a heating operation, that is, raise the surface temperature of the annular carrier part 120; if the wafer is in a low-temperature environment, the temperature regulator may be used to perform a cooling operation, that is, lower the surface temperature of the annular carrier part 120, thereby reducing the temperature difference between the annular carrier part 120 and the wafer.
[0046] Moreover, by adopting the annular structure of the annular carrier part 120, the heat absorption of the contact surface between the wafer and the annular carrier part 120 can be made more uniform, further reducing the probability of breakage caused by the local temperature sudden change of the wafer resulting in the internal stress accumulation or aggregation in the wafer.
[0047] In some embodiments of the present disclosure, the connection manner between the annular bearing portion 120 and the inner wall of the cavity 110 may include any one of welding, clamping or plugging.
[0048] In some embodiments of the present disclosure, the cavity 110 may be a pressure conversion air lock chamber.
[0049] In some examples, the surface of the annular bearing portion 120 may be made of a material with a thermal conductivity not higher than 1 W / (m·K). The bearing portion made of the above material can reduce the temperature gradient formed between the contact point of the bearing member and the wafer and other positions, thereby reducing the thermal stress at the contact point and further reducing the probability of wafer breakage.
[0050] In some embodiments of the present disclosure, the first temperature regulator 131 and the second temperature regulator 132 may be temperature regulators with different temperature regulation characteristics. By using the first temperature regulator 131 and / or the second temperature regulator 132, the temperature of the surface of the annular bearing portion 120 can be increased and / or decreased.
[0051] As an alternative example, the first temperature regulator 131 may be a temperature regulator with a temperature increasing characteristic, capable of increasing the temperature of the surface of the annular bearing portion 120, such as a heating element; the second temperature regulator 132 may be a temperature regulator with a temperature decreasing characteristic, capable of decreasing the temperature of the surface of the annular bearing portion 120, such as a refrigeration element.
[0052] In some other embodiments of the present disclosure, the first temperature regulator 131 and the second temperature regulator 132 may be temperature regulators with the same temperature regulation characteristics. For example, both the first temperature regulator 131 and the second temperature regulator 132 are heating elements or both are refrigeration elements.
[0053] It should be noted that Figure 1 and Figure 2 The shapes, numbers, distribution positions, etc. of the illustrated temperature regulators and the annular bearing portion are only examples, which are used to illustrate that during the process of carrying the wafer, by setting a temperature regulator cooperating with the annular bearing portion, the surface temperature of the annular bearing portion can be adjusted, and it should not be construed as a limitation on the wafer carrying device.
[0054] As an alternative implementation, the wafer carrier device may be provided with a greater number of annular carriers and temperature regulators, for example, 3 or more annular carriers and temperature regulators. As an alternative implementation, the annular carrier may be a solid structure. As an alternative implementation, the wafer carrier device may include both the first temperature regulator 131 and the second temperature regulator 132, or include one of the first temperature regulator 131 and the second temperature regulator 132. The embodiments of the present disclosure do not impose any limitations on the possible implementation manners of the possible annular carriers and temperature regulators, as long as the temperature adjustment between the annular carrier and the temperature regulator can be achieved.
[0055] In some embodiments of the present disclosure, to improve the uniformity of the surface temperature of the annular carrier, when a receiving groove is provided in the annular carrier, the number of receiving grooves may be multiple.
[0056] Conversely, when the number of receiving grooves is multiple, the number of temperature regulators may be multiple, and one temperature regulator corresponds to one receiving groove, that is, the number of receiving grooves is the same as the number of temperature regulators. In this way, during the same temperature adjustment process, the temperatures of multiple regions on the surface of the annular carrier can be changed simultaneously, thereby improving the uniformity of the surface temperature of the annular carrier.
[0057] In some examples, when the number of receiving grooves is multiple, the multiple receiving grooves may be concentrically arranged, and the radial dimensions of the respective receiving grooves may be different.
[0058] In some examples, when the number of receiving grooves is multiple, the multiple receiving grooves may be spaced apart along the normal direction of the annular carrier. In this case, the radial dimensions of the respective receiving grooves may be the same or different; or, along the normal direction of the annular carrier, the radial dimensions of the respective receiving grooves change from large to small or from small to large.
[0059] In some other examples, when the number of receiving grooves is multiple, the multiple receiving grooves may be randomly distributed within the annular carrier, and the embodiments of the present disclosure do not impose any limitations on the distribution positions of the receiving grooves.
[0060] In some embodiments of the present disclosure, the temperature regulator may include a heating element disposed in the receiving groove of the annular carrier; and / or a refrigerating element disposed in the receiving groove of the annular carrier.
[0061] By enabling the temperature regulator to include a heating element and / or a refrigerating element, the surface temperature of the carrier can be increased and / or decreased, thereby being applicable to various processing scenarios of wafers and improving the universality of the wafer carrier device.
[0062] As an alternative example, refer to Figure 2, the first temperature regulator 131 may be a heating element, and the second temperature regulator 132 may be a refrigerating element; alternatively, the first temperature regulator 131 may be a refrigerating element, and the second temperature regulator 132 may be a heating element. By providing temperature regulators with different temperature regulation characteristics to the wafer carrier device 100, it is possible to change (increase, decrease, or maintain) the surface temperature of the annular carrier portion by using at least one of the temperature regulators with temperature regulation characteristics.
[0063] In some embodiments of the present disclosure, the temperature regulator may further include: a pipe disposed in the accommodation groove of the annular carrier portion.
[0064] In some examples, the pipe may be used to form a passage for the cooling medium to flow through, so as to reduce the surface temperature of the annular carrier portion.
[0065] Wherein, the cooling medium is provided by the refrigerating element. In some other examples, a peripheral device may be used to provide the cooling medium for the pipe.
[0066] In some alternative examples, the cooling medium may include at least one of cooling water, coolant, and inert gas.
[0067] In some examples, the pipe may be used to form a passage for hot air to flow through, so as to increase the surface temperature of the annular carrier portion.
[0068] Wherein, the hot air is generated by heating with the heating element. In some other examples, hot air may be directly provided to the pipe through a peripheral device.
[0069] In some alternative examples, the heating element may include heating wires.
[0070] Referring to Figure 3 the top view schematic diagram of another wafer carrier device in the embodiments of the present disclosure shown in Figure 3 as shown, when the first temperature regulator 131 and / or the second temperature regulator 132 includes a pipe ( Figure 3 not shown), the wafer carrier device 100 may further include a medium inlet 141 and a medium outlet 142 which are disposed on the annular carrier portion 120 and are in communication with the pipe for the cooling medium or hot air to enter and exit.
[0071] In some examples, as Figure 3 shown, the medium inlet 141 and the medium outlet 142 may be in communication with the pipe disposed on the first temperature regulator 131, so as to introduce the hot air into the pipe through the medium inlet 141 and overflow from the medium outlet 142.
[0072] In some other examples, the medium inlet 141 and the medium outlet 142 may be connected to the pipes provided on the second temperature regulator 132 to introduce the cooling medium into the pipes through the medium inlet 141 and overflow from the medium outlet 142.
[0073] In some embodiments, when the wafer carrying device includes both a heating element and a refrigerating element, different pipes may be provided to respectively provide a medium inlet and a medium outlet for the hot gas to enter and exit for the heating element, and a medium inlet and a medium outlet for the cooling medium to enter and exit for the refrigerating element.
[0074] In some other embodiments, the same pipe may be used to form a passage for the hot gas to flow and the cooling medium to flow.
[0075] In some embodiments of the present disclosure, to improve the temperature regulation effect, the cooling duration of the cooling medium or the heating duration of the hot gas may be extended.
[0076] As an alternative example, a plurality of partition plates are provided in the pipe. Each partition plate can divide the chamber in the pipe into a plurality of cooling chambers or heating chambers, and each partition plate has through holes. Then, the cooling medium or the hot gas can flow through the through holes in the adjacent cooling chambers, which can increase the flow distance of the cooling medium or the hot gas and improve the utilization efficiency of the cooling medium or the hot gas.
[0077] As another alternative example, the medium inlet is arranged below the medium outlet, which can also increase the flow distance of the cooling medium or the hot gas, so that the cooling medium can fully exchange heat with the surface of the annular carrying part to reduce the surface temperature of the annular carrying part; or the hot gas can fully exchange heat with the surface of the annular carrying part to increase the surface temperature of the annular carrying part.
[0078] Thus, by using the wafer carrying device with a temperature regulator in the above examples, the surface temperature of the annular carrier can be adaptively adjusted according to the process performed by the wafer, so as to reduce the temperature difference between the surface of the annular carrier and the wafer.
[0079] In some embodiments of the present disclosure, according to the actual application scenarios and requirements, the structure of the wafer carrying device can be further expanded to further reduce the probability of the wafer being damaged.
[0080] As an example, the wafer carrying device may include a temperature sensor provided on the annular carrying part for detecting the surface temperature of the annular carrying part, and a controller connected to the temperature sensor for controlling the working process of the temperature regulator according to the surface temperature detected by the temperature sensor.
[0081] That is, through the cooperation between the temperature sensor and the controller, the surface temperature of the annular bearing part can be adjusted in real time, so that the surface temperature of the annular bearing part can be maintained within a certain temperature range, thereby reducing or avoiding the situation that the temperature difference between the surface of the annular bearing and the wafer is relatively large due to the large change in the surface temperature of the annular bearing part.
[0082] For example, when the controller determines that the surface temperature of the annular bearing part is too low according to the surface temperature of the annular bearing part detected by the temperature sensor, it can output a heating control signal to the temperature regulator, so that the temperature regulator can perform a heating operation to increase the surface temperature of the annular bearing part; when the controller determines that the surface temperature of the annular bearing part is too high according to the surface temperature of the annular bearing part detected by the temperature sensor, it can output a cooling control signal to the temperature regulator, so that the temperature regulator can perform a refrigeration operation to reduce the surface temperature of the annular bearing part, thereby achieving accurate temperature detection and control.
[0083] As another example, the wafer carrier device may further include an adsorption component disposed on the cavity for sucking the gas in the cavity.
[0084] Through the adsorption component, the gas in the cavity can be sucked out, so that the wafer is in a vacuum state. On the one hand, it can reduce the pollution or oxidation of the wafer by air to improve the performance and reliability of subsequent devices; on the other hand, the number of particles in the vacuum environment is small, which can reduce the particle deposition on the wafer surface, reduce defects, and improve the yield.
[0085] In some alternative examples, the adsorption component may include a vacuum pump. These are all structures or components originally existing in the air lock chamber and do not need to be elaborated.
[0086] As another example, the wafer carrier device may further include a limiting member disposed on the annular bearing part for restricting the movement of the wafer along the surface of the annular bearing part.
[0087] Specifically, when the wafer is placed on the annular bearing part, the wafer can be limited within the area surrounded by the limiting member, thereby reducing or avoiding the probability of the wafer falling off the annular bearing part.
[0088] In some alternative examples, when the limiting member is disposed on the annular bearing part, the shape of the side of the limiting member in contact with the wafer is adapted to the shape of the wafer.
[0089] For example, the shape of the side of the limiting member in contact with the wafer may be arc-shaped, so that the limiting member can better fit the wafer and can provide a more uniform contact pressure, reducing the problem of local pressure concentration.
[0090] In some embodiments of the present disclosure, to meet diverse wafer size requirements, the limiting members can move along the surface of the annular bearing portion, thereby changing the space formed between the limiting members to restrict wafers of different sizes from moving along the surface of the annular bearing portion.
[0091] As an alternative example, the number of limiting members can be multiple, and the multiple limiting members can be concentrically arranged along the circumferential direction of the bearing portion.
[0092] That is, the limiting members can form a bearing space adapted to the size of the wafer on the surface of the annular bearing portion by moving the limiting members according to the size of the wafer to be borne, without replacing the annular bearing portion, which improves the flexibility and universality of the wafer bearing device and saves the design cost and manufacturing cost.
[0093] In some embodiments of the present disclosure, to facilitate placing the wafer on the annular bearing portion or removing the wafer from the wafer bearing device, the annular bearing portion can have a hollow channel.
[0094] In this case, the wafer bearing device further includes: a lifting component for lifting and lowering the wafer along the hollow channel.
[0095] Specifically, when the wafer is transferred to the cavity by a transfer device (such as a robotic arm), the lifting component can move upward along the hollow channel. Then, the lifting component can receive the wafer, and after contacting the wafer, the lifting component can move downward along the hollow channel to place the wafer on the annular bearing portion.
[0096] When the wafer needs to be removed from the cavity, the lifting component can move upward along the hollow channel. Then, the lifting component can receive the wafer, and after contacting the wafer, the lifting component can continue to move upward along the hollow channel until the transfer device can grip the wafer. After that, the lifting component can move downward along the hollow channel to return to its original state.
[0097] In some alternative examples, to enable the wafer to be accurately placed on the bearing portion, the lifting component can further include: a position sensor for detecting the relative position of the wafer and the annular bearing portion, and a controller connected to the position sensor for controlling the lifting and lowering of the lifting component according to the relative position of the wafer and the bearing portion detected by the position sensor.
[0098] Specifically, during the process of transferring the wafer to the cavity by the robotic arm, the position detector (which is set on the door frame and can confirm whether the position of the wafer on the arm is correct by calculation, and the robotic arm only needs to reach a fixed position) can detect the relative position between the wafer and the annular carrier in real time, and send the information related to the detected relative position to the controller. Then, the controller can control the working process of the lifting component according to the detected relative position between the wafer and the annular carrier.
[0099] For example, when the position detector detects that the relative position between the wafer and the carrier is that the wafer is directly above the carrier and the centers of the two overlap or are close to coinciding, the controller can control the lifting component to place the wafer on the carrier.
[0100] It should be noted that the wafer carrier device provided in the embodiments of the present disclosure may actually further include other components. For the convenience of describing the technical solutions of this specification and highlighting the innovative parts of this specification, in this specification, the components that can be realized by the prior art in the wafer carrier device are omitted.
[0101] It can be understood that the above examples are only for illustrative purposes. In actual applications, those skilled in the art can adaptively select and / or modify the wafer carrier device provided in the embodiments of the present disclosure according to actual needs and application scenarios. For example, changing the number of some components in the wafer carrier device; or, equivalently replacing some components in the wafer carrier device, etc. Based on this, more implementation schemes of the wafer carrier device can be extended, and the embodiments of the present disclosure do not limit these extended schemes.
[0102] This specification also provides a wafer transfer system corresponding to the wafer carrier device described in any of the above embodiments, which is introduced below. It should be noted that the content of the wafer transfer system described below can be referred to in correspondence with the content of the wafer carrier device described above.
[0103] In some embodiments of the present disclosure, the wafer transfer system provided by the embodiments of the present disclosure may include:
[0104] The wafer carrier device described in any of the foregoing embodiments, which is used to carry the wafer;
[0105] A transfer device that transfers the wafer carrier device and picks and places the wafer in the wafer carrier device.
[0106] Among them, the specific contents such as the structure, connection relationship, function, and working principle of the wafer carrier device can refer to the descriptions and drawings of the relevant parts above, and will not be elaborated here.
[0107] By adopting the wafer transfer system with a temperature regulator in the embodiments of the present disclosure, the surface temperature of the annular carrier can be adjusted. Thus, when placing the wafer on the annular carrier, the temperature difference between the annular carrier and the wafer can be reduced, avoiding or reducing the probability of breakage caused by the sudden change in the local temperature of the wafer, resulting in the accumulation or build-up of internal stress in the wafer. Therefore, the topography quality of the wafer can be improved.
[0108] In some examples, the wafer carrier device may include a pre-vacuum loading chamber; the transfer device may include a robotic arm.
[0109] Although the embodiments of the present disclosure are disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model should be subject to the scope defined by the claims.
Claims
1. A wafer carrying device, characterized in that: include: Cavity; An annular supporting portion disposed in the cavity and supporting the wafer; A receiving groove is provided in the annular bearing portion, and the receiving groove is coaxially arranged with the annular bearing portion; A temperature regulator is disposed in the accommodating groove and is used to adjust the surface temperature of the annular bearing portion.
2. The wafer carrier device according to claim 1, characterized in that: The number of the containing grooves is multiple; The plurality of accommodating grooves are concentrically arranged, and the radial dimensions of the accommodating grooves are different; or, the plurality of accommodating grooves are spaced apart along the normal direction of the annular bearing portion.
3. The wafer carrying device according to claim 1, characterized in that: The temperature regulator comprises: A heating element disposed in the receiving groove of the annular bearing portion; And / or, a refrigeration element is arranged in the accommodating groove of the annular bearing portion.
4. The wafer carrying device according to claim 3, characterized in that: The temperature regulator further comprises: a pipeline, the pipeline being arranged in the receiving groove of the annular bearing portion; The pipe forms a passage for a cooling medium to flow so as to reduce the surface temperature of the annular bearing portion, wherein the cooling medium is provided by the refrigeration element; Alternatively, the pipe forms a passage for hot gas to flow so as to increase the surface temperature of the annular bearing portion, wherein the hot gas is generated by heating by the heating element.
5. The wafer carrying device according to claim 4, characterized in that: Also includes: It is arranged on the annular bearing portion and is connected with the pipeline to provide a medium inlet and a medium outlet for the cooling medium or hot gas to enter and exit.
6. The wafer carrying device according to claim 1, characterized in that: The annular bearing portion has a hollow channel; The wafer carrying device further includes: a lifting component for lifting and lowering the wafer along the hollow channel.
7. The wafer carrying device according to claim 1, characterized in that: Also includes: A temperature sensor disposed on the annular bearing portion and detecting a surface temperature of the annular bearing portion; A controller is connected to the temperature sensor and controls the working process of the temperature regulator according to the surface temperature detected by the temperature sensor.
8. The wafer carrying device according to claim 1, characterized in that: Also includes: An adsorption component is placed on the cavity to absorb the gas in the cavity.
9. The wafer carrying device according to claim 1, characterized in that: Also includes: A limiting member is disposed on the annular bearing portion and limits the movement of the wafer along the surface of the annular bearing portion.
10. A wafer transfer system, characterized in that: include: The wafer carrier device according to any one of claims 1 to 9; A conveying device that transports the wafer carrying device and takes and places the wafers in the wafer carrying device.