Printed circuit board with core board stacking sequence detection structure

Abstract

The utility model provides a printed circuit board with a core board stacking sequence detection structure. The printed circuit board comprises a first core board, a second core board, a first detection part and two first guide holes, a first communication part is formed on one surface of the first core board, the first detection part is formed on one surface, close to the first communication part, of the printed circuit board, the first detection part comprises two first detection bonding pads, and the first detection bonding pads are used for being in contact with power-on detection pins. The two first detection bonding pads are respectively connected with one first guide hole. And under the condition that the stacking sequence of the first core board and the second core board is correct, the two first guide holes are connected to the first communication part, and the first communication part, the two first detection bonding pads and the two first guide holes form a circuit path. Under the condition that the stacking sequence of the first core board and the second core board is wrong, the first communication part is not connected with the two first guide holes, and the two first detection bonding pads and the two first guide holes form a circuit open circuit.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit boards, and particularly to a printed circuit board with a core board stacking order detection structure. Background Art

[0002] Some more complex printed circuit boards are multi-layer circuit board structures, and multi-layer printed circuit boards need to be manufactured through processes such as stacking and pressing. A multi-layer printed circuit board product usually includes multiple core boards, and the stacking order of the multiple core boards is fixed. Circuit connections can be achieved between the multiple core boards through vias. As Figure 1 and Figure 2 shown, taking a printed circuit board including two core boards as an example, the correct stacking order of its two core boards is that the first core board 11 shown in Figure 1 is stacked on the upper layer of the second core board 12. If the stacking order of the core boards shown in Figure 2 is incorrect (stacked upside down) and the second core board 12 is stacked on the upper layer of the first core board 11, some circuits of the printed circuit board (especially the power-on test circuit composed of vias on the core board) can still form a conductive state, making it impossible to detect the printed circuit board product with incorrect stacking order during power-on detection.

[0003] CN112040675A discloses a multi-layer circuit board hierarchical structure method, and its process steps are as follows: Design corresponding numbers on each layer of the working negative film, and design hierarchical barcodes, that is, one-dimensional barcodes, at the board edges and corners of each core board. The corresponding levels are the numbers on the same side, and for the core board where it is located, hierarchical identification one-dimensional barcodes are respectively set. During the outer layer AOI (Automatic Optical Inspection) scanning and appearance inspection, the position of the core board level module is set for fixed-point inspection. After each board is inspected by the machine, the screen is switched to the position of this fixed-point inspection to check whether the level of the physical board is consistent with the data. When inspecting the appearance, visually check the position of the level marking to see if the level is incorrect and arrange them in sequence. Before fusion, set the corresponding stacking order. During the board stacking process, align the barcode scanning lens with the position of the one-dimensional barcode. For each core board placed, click the barcode scanning function to scan and read the one-dimensional barcode, identify the level number, and display the number in the corresponding position of the board layout interface for one scan and code reading. Repeat the operation until after the board stacking is completed, click the level check to compare the read level number with the set level order.

[0004] The multi-layer circuit board hierarchical structure method provided by the above-mentioned invention patent application requires setting one-dimensional barcode marks on each layer of the circuit board and then performing layer-by-layer scanning and inspection by machines and humans. This method will significantly increase the production cost of multi-layer printed circuit boards, reduce production efficiency, and is not suitable for large-scale mass production of multi-layer circuit boards. Utility Model Content

[0005] This application is made in view of the state of the above-mentioned prior art. The purpose of this application is to provide a printed circuit board with a core board stacking order detection structure, which can conveniently and quickly detect the stacking order of core boards of a multi-layer circuit board.

[0006] This application provides a printed circuit board with a core board stacking order detection structure, which includes a first core board, a second core board, a first detection part, and two first vias.

[0007] A first communication part is formed on one side of the first core board.

[0008] The first detection part is formed on the side of the printed circuit board close to the first communication part. The first detection part includes two first detection pads, and the first detection pads are used to contact the energized detection needle.

[0009] Each of the two first detection pads is connected to one of the first vias.

[0010] When the stacking order of the first core board and the second core board is correct, the two first vias are connected to the first communication part, and the first communication part, the two first detection pads, and the two first vias form a circuit path.

[0011] When the stacking order of the first core board and the second core board is incorrect, the first communication part is not connected to the two first vias, and the two first detection pads and the two first vias form a circuit open circuit.

[0012] In at least one possible implementation, the printed circuit board with a core board stacking order detection structure further includes a third core board, a second detection part, and two second vias.

[0013] A second communication part is formed on one side of the third core board.

[0014] The second detection part is formed on the side of the printed circuit board close to the second communication part. The second detection part includes two second detection pads, and the second detection pads are used to contact the energized detection needle.

[0015] Each of the two second detection pads is connected to one of the second vias.

[0016] When the stacking order of the second core board and the third core board is correct, the two second vias are connected to the second communication part, and the second communication part, the two second detection pads, and the two second vias form a circuit path.

[0017] When the stacking order of the second core board and the third core board is incorrect, the second communication portion does not connect the two second vias, and a circuit open circuit is formed between the two second detection pads and the two second vias.

[0018] In at least one possible implementation, the first communication portion includes two pads forming an electrical connection.

[0019] In at least one possible implementation, the second communication portion includes two pads forming an electrical connection.

[0020] In at least one possible implementation, the first detection pad forms a solder mask opening.

[0021] In at least one possible implementation, the second detection pad forms a solder mask opening.

[0022] In at least one possible implementation, the first via has a metal plating to form an electrical connection, and the first via includes one of a through hole, a blind hole, and a buried hole.

[0023] In at least one possible implementation, the second via has a metal plating to form an electrical connection, and the second via includes one of a through hole, a blind hole, and a buried hole.

[0024] In at least one possible implementation, a printed circuit board having a core board stacking order detection structure includes a sequence detection area and a circuit board main body area, and the sequence detection area includes the first detection portion.

[0025] In at least one possible implementation, a printed circuit board having a core board stacking order detection structure further includes one or more of a substrate, a solder mask layer, a screen layer, and a power supply layer.

[0026] The printed circuit board provided in this application with a core board stacking order detection structure can quickly detect whether there is an incorrect core board stacking order in a printed circuit board with a multi-layer core board structure through a power-on test, improving the production detection efficiency of the printed circuit board product and reducing the defect rate of the final product. Description of the Drawings

[0027] Figure 1 It is a schematic structural diagram of a multi-layer circuit board with the correct core board order.

[0028] Figure 2 It is a schematic structural diagram of a multi-layer circuit board with an incorrect core board order.

[0029] Figure 3 It is a schematic detection structure diagram of the correct core board order according to the first embodiment of this application.

[0030] Figure 4Schematic diagram of the detection structure for the incorrect order of core boards according to the first embodiment of the present application.

[0031] Figure 5 Schematic diagram of the detection structure for the correct order of core boards according to the second embodiment of the present application.

[0032] Figure 6 Schematic diagram of a detection structure for the incorrect order of core boards according to the second embodiment of the present application.

[0033] Figure 7 Schematic diagram of another detection structure for the incorrect order of core boards according to the second embodiment of the present application.

[0034] Figure 8 Partial schematic diagram of the detection structure for the correct order of core boards according to the first embodiment of the present application.

[0035] Figure 9 Partial schematic diagram of the detection structure for the incorrect order of core boards according to the first embodiment of the present application.

[0036] Figure 10 Schematic diagram of the structure of a printed circuit board according to an embodiment of the present application.

[0037] Description of reference numerals

[0038] 11 First core board

[0039] 111 First connection part

[0040] 12 Second core board

[0041] 13 Third core board

[0042] 131 Second connection part

[0043] 14 First detection part

[0044] 141 First detection pad

[0045] 15 Second detection part

[0046] 151 Second detection pad

[0047] 16 First via hole

[0048] 17 Second via hole

[0049] 20 Power-on detection pin

[0050] 100 Circuit board processing area

[0051] 200 Sequence detection area

[0052] 300 Circuit board main body area Detailed Embodiments

[0053] The following describes exemplary embodiments of the present application with reference to the accompanying drawings. It should be understood that these specific descriptions are only used to teach those skilled in the art how to implement the present application, and are not used to exhaust all feasible ways of the present application, nor to limit the scope of the present application.

[0054] An embodiment of the present application provides a printed circuit board (hereinafter sometimes simply referred to as "printed circuit board") having a core board stacking order detection structure, which may include a plurality (especially two or three) core boards (i.e., core, also known as copper clad laminate). It can be understood that in addition to the core board, the printed circuit board may also include multi-layer structures such as a substrate, a solder mask layer, a silk screen layer, a power layer, etc. (exemplarily, there are three-layer structures on both the upper and lower sides of the core board structure of this embodiment). The core board is usually relatively located in the middle of the multi-layer structure of the printed circuit board, and the present application does not specifically limit this.

[0055] It can be understood that in this embodiment, the positional relationships such as "upper" and "lower" are defined based on the orientation of the printed circuit board in the drawings to facilitate the description of the embodiments of the present application, rather than limiting the specific detection structure or the printed circuit board structure.

[0056] First Embodiment

[0057] As shown in Figure 3 and Figure 4 In this embodiment, the printed circuit board may include a first core board 11, a second core board 12, a first detection portion 14, and a first via 16. A first connection portion 111 may be formed on one side of the first core board 11, and the first connection portion 111 may be composed of two pads forming an electrical connection. The first detection portion 14 may be formed on the surface of the printed circuit board close to the first connection portion 111, and it may include two first detection pads 141. The two first detection pads 141 can respectively contact the power-on detection needle 20 to perform a power-on detection on the printed circuit board (especially the first core board). The two first detection pads 141 may be respectively connected (electrically connected) to a first via 16, and the two vias 16 can contact the first core board 11 (especially the pads forming the first connection portion 111) and can be connected to the first connection portion 111 to form an electrical connection. Correspondingly, the second core board 12 does not have a connection portion that can form an electrical connection with the first via 16.

[0058] Preferably, the first detection pad 141 may form a solder mask opening, that is, an opening in the solder mask insulating layer, so as to facilitate its contact with the power-on detection needle 20 (PIN needle).

[0059] It can be understood that the first via 16 may have a metal plating to achieve the electrical connection function. The via 16 may include a through hole (via hole), a blind hole, or a buried hole.

[0060] As Figure 3 and Figure 8 shown, when the positions of the first core board 11 and the second core board 12 are correct (the first core board 11 and the second core board 12 are arranged in sequence from top to bottom), the two first detection pads 141, the two first vias 16, and the first connection part 111 can form an electrical circuit path. By using two energized detection needles 20 to respectively contact one first detection pad 141 for energization testing, it can be measured that the test circuit is in a conductive state, which means the positions of the core boards are correct.

[0061] As Figure 4 and Figure 9 shown, when the positions of the first core board 11 and the second core board 12 are incorrect, the second core board 12 cannot form a current path with the two first detection pads 141 and the two first vias 16. By using two energized detection needles 20 to respectively contact one first detection pad 141 for energization testing, it can be measured that the test circuit is in an open state, which means the positions of the core boards are incorrect (stacked in reverse).

[0062] Second Embodiment

[0063] The following will refer to Figure 5 , Figure 6 and Figure 7 to describe the second embodiment according to the present application. For components having the same or similar structures or functions as those in the first embodiment, the same reference numerals are used, and the detailed descriptions of these components are omitted.

[0064] In this embodiment, the printed circuit board may further include a third core board 13, a second detection part 15, and a second via 17. The third core board 13 may include a second connection part 131, and the second connection part 131 may be composed of two pads forming an electrical connection. The second detection part 15 may be formed on the other side of the printed circuit board (the opposite side of the formation of the first detection part 14, that is, the surface of the printed circuit board close to the second connection part 131), and the second detection part 15 may include two second detection pads 151. The two second detection pads 151 can respectively contact the energized detection needles 20 to perform energization detection on the printed circuit board (especially the third core board 13). The two second detection pads 151 can be respectively connected (electrically connected) to a second via 17, and the two second vias 17 can contact the third core board 13 (especially the pads forming the second connection part 131) and can be connected to the second connection part 131 to form an electrical connection. Correspondingly, the second core board 12 does not have a connection part that can form an electrical connection with the first via 16 or the second via 17.

[0065] As Figure 5As shown, when the positions of the first core board 11, the second core board 12, and the third core board 13 are correct (the first core board 11, the second core board 12, and the third core board 13 are arranged in sequence from top to bottom), two first detection pads 141, two first vias 16, and a first communication part 111 can form an electrical circuit path. By using two energized detection pins 20 to respectively contact one first detection pad 141 for energization testing, it can be measured that the test circuit is a path, indicating that the position of the first core board 11 is correct. Two second detection pads 151, two second vias 17, and a second communication part 131 can form an electrical circuit path. By using two energized detection pins 20 to respectively contact one second detection pad 151 for energization testing, it can be measured that the test circuit is a path, indicating that the position of the third core board 13 is correct. It can be understood that if the positions of the first core board 11 and the third core board 13 are correct, that is, the position of the second core board 12 is correct.

[0066] As Figure 6 shown, when the position of the first core board 11 is incorrect (the first core board and the second core board are stacked in reverse), the second core board 12 cannot form a current path with two first detection pads 141 and two first vias 16. By using two energized detection pins 20 to respectively contact one first detection pad 141 for energization testing, it can be measured that the test circuit is an open circuit, indicating that the position of the first core board 11 is incorrect (stacked in reverse).

[0067] As Figure 7 shown, when the position of the third core board 13 is incorrect (the second core board and the third core board are stacked in reverse), the second core board 12 cannot form a current path with two second detection pads 151 and two second vias 17. By using two energized detection pins 20 to respectively contact one second detection pad 151 for energization testing, it can be measured that the test circuit is an open circuit, indicating that the position of the third core board 13 is incorrect (stacked in reverse).

[0068] It can be understood that the first core board 11 can form a first communication part 111 above it, and the third core board 13 can form a second communication part 131 below it. The sides of the first core board 11 and the third core board 13 where the communication parts are formed face in opposite directions. Therefore, when their positions are swapped incorrectly, the test circuit is an open circuit.

[0069] Preferably, the second detection pad 151 can form a solder mask opening, that is, form an opening in the solder mask insulating layer, so as to facilitate its contact with the energized detection pin 20 (PIN pin).

[0070] It can be understood that the second via 17 can have a metal plating to achieve the function of electrical connection. The via 17 can include a through hole (via), a blind hole, or a buried hole.

[0071] As Figure 10As shown, the printed circuit board can perform core board stacking sequence detection within the circuit board processing area 100. The printed circuit board can include a sequence detection area 200 and a circuit board main body area 300. The sequence detection area can include the above-mentioned first detection unit 14 and second detection unit 15. The circuit board main body area 300 can include various structures capable of realizing the preset functions of the printed circuit board.

[0072] It can be understood that the embodiments of the present application are particularly applicable to multi-layer printed circuit boards including two or three core boards. However, the application scope of the core board stacking sequence detection structure is not limited thereto, and it can also be used for multi-layer printed circuit boards including more core boards.

[0073] It can be understood that parameters such as the size, pitch, and specifications of the pads can be designed according to relevant safety specifications.

[0074] It can be understood that the printed circuit board with a core board stacking sequence detection structure provided by the embodiments of the present application is mainly used to detect whether the relative sequence of multiple core boards is correct, rather than to detect whether the setting direction of a single core board itself is incorrect (whether there is a wrong core board flip). The setting direction of the core board itself can be detected by other processes.

[0075] The following briefly describes some beneficial effects of the above embodiments of the present application.

[0076] The printed circuit board with a core board stacking sequence detection structure provided by the embodiments of the present application can jointly form a test circuit through the communication parts provided on the core board, as well as the detection pads and vias. By the on-off of the test circuit, it can be quickly determined whether the core board sequence in the printed circuit board is incorrect. The detection of the core board sequence error of this printed circuit board is convenient, which can effectively improve the detection efficiency and accuracy of the core board sequence of multi-layer printed circuit boards and improve the product yield.

[0077] It can be understood that in the present application, when the number of components or members is not specifically limited, the number can be one or more. Here, multiple means two or more. For the cases where the number of components or members shown in the drawings and / or described in the specification is a specific number such as two, three, four, etc., the specific number is usually exemplary rather than restrictive, and it can be understood as multiple, that is, two or more. However, this does not mean that the present application excludes the case of one.

[0078] It should be understood that the above embodiments are merely exemplary and do not limit the present application. Those skilled in the art can make various variations and changes to the above embodiments under the teaching of the present application without departing from the scope of the present application.

Claims

1. A printed circuit board with a core board stacking sequence detection structure, characterized in that: It includes a first core plate, a second core plate, a first detection part and two first guide holes, A first connecting portion is formed on one side of the first core plate. The first detection portion is formed on one side of the printed circuit board close to the first connecting portion, and the first detection portion includes two first detection pads, and the first detection pads are used to contact the power-on detection needle. The two first detection pads are respectively connected to one of the first guide holes, When the stacking order of the first core board and the second core board is correct, the two first guide holes are connected to the first connecting portion, and the first connecting portion, the two first detection pads and the two first guide holes form a circuit path; In the case where the stacking order of the first core board and the second core board is wrong, the first connecting portion does not connect the two first guide holes, and the two first detection pads and the two first guide holes form a circuit break.

2. The printed circuit board with a core board stacking sequence detection structure according to claim 1, characterized in that: It also includes a third core board, a second detection portion and two second guide holes, A second connecting portion is formed on one side of the third core plate. The second detection portion is formed on one side of the printed circuit board close to the second connecting portion, and the second detection portion includes two second detection pads, and the second detection pads are used to contact the power-on detection needle. The two second detection pads are respectively connected to one of the second guide holes, When the stacking order of the second core board and the third core board is correct, the two second guide holes are connected to the second connecting portion, and the second connecting portion, the two second detection pads and the two second guide holes form a circuit path; In the case where the stacking order of the second core board and the third core board is wrong, the second connecting portion is not connected to the two second guide holes, and the two second detection pads and the two second guide holes form a circuit break.

3. The printed circuit board with a core board stacking sequence detection structure according to claim 1, characterized in that: The first connecting portion includes two pads for forming an electrical connection.

4. The printed circuit board with a core board stacking sequence detection structure according to claim 2, characterized in that: The second connecting portion includes two pads for forming an electrical connection.

5. The printed circuit board with a core board stacking sequence detection structure according to claim 1, characterized in that: The first detection pad forms a solder resist window.

6. The printed circuit board with a core board stacking sequence detection structure according to claim 2, characterized in that: The second detection pad forms a solder resist window.

7. The printed circuit board with a core board stacking sequence detection structure according to claim 1, characterized in that: The first via has a metal plating layer to form an electrical connection, and the first via includes one of a through hole, a blind hole and a buried hole.

8. The printed circuit board with a core board stacking sequence detection structure according to claim 2, characterized in that: The second via has a metal plating layer to form an electrical connection, and the second via includes one of a through hole, a blind hole and a buried hole.

9. The printed circuit board with a core board stacking sequence detection structure according to claim 1, characterized in that: It includes a sequential detection area and a circuit board main body area, and the sequential detection area includes the first detection part.

10. The printed circuit board with a core board stacking sequence detection structure according to claim 1, characterized in that: It also includes one or more of a substrate, a solder mask layer, a silk screen layer, and a power supply layer.

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