Full-automatic circuit board horizontal copper deposition connecting wire VCP electroplating device

Abstract

The utility model discloses a full-automatic circuit board horizontal copper deposition connecting wire VCP electroplating device. Comprising a horizontal copper deposition incoming plate placing station, a horizontal copper deposition wire, an intelligent plate placing machine arranged at the feeding end of the horizontal copper deposition wire, an intelligent plate collecting machine arranged at the discharging end of the horizontal copper deposition wire, a VCP plating line, an intelligent feeding machine arranged at the feeding end of the VCP plating line, an intelligent discharging machine arranged at the discharging end of the VCP plating line, and a temporary storage station arranged between the horizontal copper deposition wire and the VCP plating line. The intelligent transport vehicle is used for conveying the circuit board collected by the intelligent board collecting machine of the horizontal copper deposition line to a temporary storage station for partitioned temporary storage and conveying the circuit board at the temporary storage station to a VCP plating line; and the memory is used for storing processing information of the circuit board. According to the full-automatic circuit board horizontal copper deposition connecting wire VCP electroplating device provided by the utility model, intelligent board placement and collection are realized, the working efficiency is improved, and the probability of misoperation of personnel is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit board manufacturing, in particular to a fully automatic horizontal copper deposition connection VCP electroplating device for circuit boards. Background Art

[0002] The electroplating process of circuit boards is an essential and important process in the circuit board production process, including two processes: copper deposition and hole filling / thickening. In the copper deposition process, a layer of conductive material is deposited in the holes of the board after drilling by chemical methods. In the hole filling / thickening process, the copper in the holes and on the board surface is thickened, and in the hole filling process, the holes are filled with copper.

[0003] At present, the electroplating process mainly uses VCP electroplating. The receiving and discharging of circuit boards on the copper deposition line before VCP electroplating are mainly manual operations, with low work efficiency and prone to operation errors.

[0004] In view of this, it is necessary to provide a new device to solve the above technical problems. Summary of the Utility Model

[0005] The technical problem to be solved by the utility model is to provide a fully automatic horizontal copper deposition connection VCP electroplating device for circuit boards, which realizes intelligent board discharging and receiving, improves work efficiency, and reduces the probability of personnel operation errors.

[0006] The technical solution of the utility model is as follows:

[0007] A fully automatic horizontal copper deposition connection VCP electroplating device for circuit boards includes a horizontal copper deposition incoming board placement station, a horizontal copper deposition line, an intelligent board discharging machine arranged at the feeding end of the horizontal copper deposition line, an intelligent board receiving machine arranged at the discharging end of the horizontal copper deposition line, a VCP electroplating line, an intelligent loading machine arranged at the feeding end of the VCP electroplating line, an intelligent unloading machine arranged at the discharging end of the VCP electroplating line, a temporary storage station arranged between the horizontal copper deposition line and the VCP electroplating line, an intelligent transport vehicle for transporting the circuit boards received by the intelligent board receiving machine of the horizontal copper deposition line to the temporary storage station for partitioned temporary storage and transporting the circuit boards in the temporary storage station to the VCP electroplating line, and a memory for storing circuit board processing information;

[0008] The memory is communicatively connected with the intelligent board discharging machine, the intelligent board discharging machine is communicatively connected with the intelligent board receiving machine, the intelligent board receiving machine is communicatively connected with the intelligent transport vehicle, and the intelligent transport vehicle is communicatively connected with the intelligent loading machine.

[0009] Further, there are multiple horizontal copper deposition lines, and the VCP electroplating line corresponds to the horizontal copper deposition line one by one.

[0010] Further, the temporary storage station includes a first temporary storage area and a second temporary storage area, and the first temporary storage area and the second temporary storage area are used for storing circuit boards with different production information.

[0011] Further, the intelligent transport vehicle includes a first intelligent transport vehicle and a second intelligent transport vehicle.

[0012] Further, the printed circuit board processing information includes production model, quantity, size, thickness-diameter ratio, and copper thickness.

[0013] Compared with the prior art, the full-automatic printed circuit board horizontal electroless copper plating continuous VCP electroplating device provided by the utility model has the beneficial effects that:

[0014] 1. For the full-automatic printed circuit board horizontal electroless copper plating continuous VCP electroplating device provided by the utility model, an intelligent plate loader and an intelligent plate unloader are respectively arranged at the loading end and the unloading end of the horizontal electroless copper line, and the loading and unloading of the electroless copper line are automatically completed according to the printed circuit board production plan; after the electroless copper plating is completed, the printed circuit boards are temporarily stored in zones according to the production information, and the intelligent transport vehicle transports the printed circuit boards of the production plan to the VCP electroplating line, thereby realizing the intelligent connection between the electroless copper line and the VCP electroplating line, improving the work efficiency, and reducing the probability of personnel operation errors.

[0015] 2. In the prior art, calculated according to the single-line production capacity, the production capacity of a horizontal electroless copper line is greater than that of a VCP electroplating line. Since the horizontal electroless copper plating needs to regularly empty the cylinder and change the cylinder, it is necessary to stop the line for maintenance, which generally takes 12 - 24 hours. When the VCP electroplating line finishes producing one model, if the parameters such as the copper thickness required for the next model are inconsistent with the previous one, it is necessary to take in the line and re-load the drag cylinder plate, which results in waste of production capacity and waste of copper balls for the drag cylinder plate. For the full-automatic printed circuit board horizontal electroless copper plating continuous VCP electroplating device of the utility model, a temporary storage station is arranged between the horizontal electroless copper line and the VCP electroplating line, and the printed circuit boards produced by multiple electroless copper lines are temporarily stored according to information such as production model, quantity, size, thickness-diameter ratio, and copper thickness, which can maximize the effective utilization of the production capacity of the electroless copper line and match the production capacity of the VCP electroplating line. When the electroless copper line needs to stop for maintenance and the VCP electroplating line finishes producing one model and switches to another model, the second intelligent transport vehicle between the electroless copper line and the VCP electroplating line can timely transport the boards in the first temporary storage area and the second temporary storage area that match the VCP electroplating line to wait for loading in front of the corresponding VCP intelligent plate loader, realizing continuous production and reducing the problems of waste of production capacity and waste of copper balls for the drag cylinder plate. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1It is a schematic structural diagram of the full-automatic horizontal copper deposition and connection VCP electroplating device for circuit boards of the present utility model. Specific Embodiments

[0018] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present utility model and make the above objects, features, and advantages of the present utility model more obvious and understandable, the following further describes the specific embodiments of the present utility model.

[0019] It should be noted here that the description of these embodiments is used to help understand the present utility model, but does not constitute a limitation on the present utility model. In addition, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0020] Please refer to Figure 1 , which is a schematic structural diagram of the full-automatic horizontal copper deposition and connection VCP electroplating device for circuit boards of the present utility model. The automatic horizontal copper deposition and connection VCP electroplating device of the present utility model includes a horizontal copper deposition incoming board placement station 1, a horizontal copper deposition line 2, an intelligent board placer 3 provided at the feeding end of the horizontal copper deposition line, an intelligent board collector 4 provided at the discharging end of the horizontal copper deposition line, a VCP electroplating line 5, an intelligent loader 6 provided at the feeding end of the VCP electroplating line, an intelligent unloader 7 provided at the discharging end of the VCP electroplating line, a temporary storage station (not labeled) provided between the horizontal electroplating line and the VCP electroplating line, an intelligent transport vehicle (not labeled), and a memory 10 for storing circuit board processing information.

[0021] The memory 10 is used to store the production model, quantity, size, thickness-diameter ratio, thick copper information, etc. of the production incoming boards. The memory 10 is a storage computer, which inputs the incoming board information of the previous process into the memory and places the incoming board on the horizontal copper deposition incoming board placement station 1. Correspondingly, the horizontal copper deposition incoming board placement station 1 is partitioned according to the production board information, so that the production boards are placed in partitions according to the processing information. Subsequently, the intelligent board placer on the horizontal copper deposition line grabs the corresponding circuit boards on the horizontal copper deposition incoming board placement station 1 according to the production plan.

[0022] In the present utility model, there are multiple horizontal copper deposition lines 2 and VCP electroplating lines 5 respectively, and they correspond one by one. When some of the horizontal copper deposition lines are under maintenance, it will not cause the situation of waiting for materials in the VCP electroplating line, improving the production efficiency. As Figure 1 shown, in this embodiment, there are four horizontal copper deposition lines 2, and correspondingly, there are also four VCP electroplating lines 5.

[0023] An intelligent loading machine 3 is provided at the loading end of each horizontal copper deposition line 1, and an intelligent unloading machine 4 is provided at the unloading end of each horizontal copper deposition line 1; an intelligent feeding machine 6 is provided at the loading end of each VCP electroplating line 5, and an intelligent discharging machine 7 is provided at the unloading end of each VCP electroplating line. Moreover, the intelligent loading machine 3, the intelligent unloading machine 4, the intelligent feeding machine 6, and the intelligent discharging machine 7 are all commercially available products, and their specific structures will not be elaborated here.

[0024] The intelligent loading machine 3 is communicatively connected to the memory 10. First, according to the production plan of the copper deposition line, the circuit board information to be copper-deposited is selected and input into the intelligent loading machine 3. The intelligent loading machine 3 grabs the corresponding circuit board on the horizontal copper deposition incoming board placement station 1 and feeds it into the horizontal copper deposition line to complete the copper deposition process.

[0025] The intelligent loading machine 3 is communicatively connected to the intelligent unloading machine 4, and the circuit board information after copper deposition is input into the intelligent unloading machine 4. The intelligent unloading machine 4 unloads the circuit board after copper deposition and transports it to the temporary storage station through the intelligent transport vehicle. The circuit boards produced by multiple copper deposition lines are temporarily stored according to information such as production model, quantity, size, thickness-diameter ratio, and copper thickness, so as to avoid shortages of materials for the VCP electroplating line due to reasons such as maintenance of the copper deposition line.

[0026] In this embodiment, the temporary storage station includes a first temporary storage area 81 and a second temporary storage area 82. The first temporary storage area 81 and the second temporary storage area 82 are respectively provided with multiple storage areas for storing circuit boards with different production information.

[0027] The intelligent transport vehicle is used to transport the circuit boards collected by the intelligent unloading machine of the horizontal copper deposition line to the temporary storage station for partitioned temporary storage, and transport the circuit boards at the temporary storage station to the VCP electroplating line. In actual application, multiple intelligent transport vehicles can be arranged according to different operations. For example, the first intelligent transport vehicle 91 is used to transport the circuit boards collected by the intelligent unloading machine of the horizontal copper deposition line to the temporary storage station for partitioned temporary storage, and the second intelligent transport vehicle 92 is used to transport the circuit boards at the temporary storage station to the VCP electroplating line. Preferably, both the first intelligent transport vehicle 91 and the second intelligent transport vehicle 92 are multiple, and the first intelligent transport vehicle 91 is communicatively connected to the intelligent unloading machine 4, and the circuit board information input during their operation is the same. The second intelligent transport vehicle 92 is communicatively connected to the intelligent feeding machine 6 of the VCP electroplating line, and the circuit board information input during their operation is the same.

[0028] The first intelligent transport vehicle 91 transports the circuit boards that have completed the copper deposition to the corresponding position at the temporary storage station, and stores the circuit board production information stored at this position; the staff can search for relevant production information in the temporary storage station to obtain the specific storage location of the corresponding circuit board, and then start the second intelligent transport vehicle 92 to transport the circuit board at this storage location to the intelligent loading end of the VCP plating line, and the intelligent loading machine 6 of the VCP plating line completes the loading of the VCP plating line.

[0029] The full-automatic horizontal copper deposition connection VCP plating device of the present utility model realizes the intelligent connection between the copper deposition line and the VCP plating line, realizes continuous production, improves work efficiency, and reduces the probability of personnel operation errors; when the copper deposition line needs to stop for maintenance, or when the VCP plating line finishes producing one model and switches to another model, the circuit boards in the temporary storage area can be promptly transported to the front of the intelligent loading machine of the VCP plating line by the intelligent transport vehicle to wait for loading, effectively utilizing the production capacity of the copper deposition line in combination with the production capacity of the VCP plating line, and reducing the problems of production capacity waste and waste of copper balls for the upper drag cylinder boards.

[0030] The above has made a detailed description of the embodiments of the present utility model, but the present utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principle and spirit of the present utility model still fall within the protection scope of the present utility model.

Claims

1. A fully automatic circuit board horizontal copper plating connection VCP electroplating device, characterized in that: It includes a horizontal copper plating board placement station, a horizontal copper plating line, an intelligent board placement machine arranged at the feeding end of the horizontal copper plating line, an intelligent board collection machine arranged at the discharging end of the horizontal copper plating line, a VCP electroplating line, an intelligent loading machine arranged at the feeding end of the VCP electroplating line, an intelligent unloading machine arranged at the discharging end of the VCP electroplating line, a temporary storage station arranged between the horizontal copper plating line and the VCP electroplating line, an intelligent transport vehicle for transporting the circuit boards collected by the intelligent board collection machine of the horizontal copper plating line to the temporary storage station for partitioned temporary storage, and transporting the circuit boards at the temporary storage station to the VCP electroplating line, and a memory for storing circuit board processing information; The memory is communicatively connected to the intelligent board placing machine, the intelligent board placing machine is communicatively connected to the intelligent board collecting machine, the intelligent board collecting machine is communicatively connected to the intelligent transport vehicle, and the intelligent transport vehicle is communicatively connected to the intelligent loader.

2. The fully automatic circuit board horizontal copper plating connection VCP electroplating device according to claim 1 is characterized in that: There are multiple horizontal copper sinking lines, and the VCP electroplating lines correspond to the horizontal copper sinking lines one by one.

3. The fully automatic circuit board horizontal copper plating connection VCP electroplating device according to claim 1 is characterized in that: The temporary storage station includes a first temporary storage area and a second temporary storage area, and the first temporary storage area and the second temporary storage area are used to store circuit boards with different production information.

4. The fully automatic circuit board horizontal copper plating connection VCP electroplating device according to claim 1 is characterized in that: The intelligent transport vehicle includes a first intelligent transport vehicle and a second intelligent transport vehicle.

5. The fully automatic circuit board horizontal copper-plating VCP electroplating device according to claim 1 is characterized in that: Circuit board processing information includes production model, quantity, size, thickness-to-diameter ratio, and copper thickness.

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