Electronic equipment
By designing an airflow barrier structure and independent airflow channels in electronic devices, the problem of mutual interference between the heat dissipation components in the electronic devices is solved, and the heat dissipation performance of the electronic devices is improved.
Patent Information
- Application Number
- CN202421842720.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-07-31
AI Technical Summary
Different heat dissipation components in electronic devices interfere with each other when working, affecting the heat dissipation performance of electronic devices.
An electronic device is designed, including a housing, an air flow barrier structure, a first heat dissipation member and a second heat dissipation member. Through the air flow barrier structure, an independent first air flow channel and a second air flow channel are formed in the installation cavity, so that the air inlet and air outlet structures of the first heat dissipation member and the second heat dissipation member are respectively connected to the ventilation structure through different air flow channels to avoid mutual interference.
Through the independent airflow channel design, interference between the first heat dissipation component and the second heat dissipation component is reduced, and the heat dissipation performance of the electronic device is improved.
Smart Images
Figure CN223007782U_ABST
Abstract
Description
Technical Field
[0001] This application relates to, but is not limited to, the technical field of heat dissipation for electronic devices, and particularly relates to an electronic device. Background Art
[0002] With the continuous improvement of the performance of electronic devices, the heat generated by the heat-generating components inside the electronic devices also increases accordingly. In order to maintain the normal operation of the electronic devices, the electronic devices need to design corresponding heat dissipation components for different heat-generating components to improve the heat dissipation performance of the electronic devices. However, different heat dissipation components inside the electronic devices will interfere with each other during operation, thereby affecting the heat dissipation performance of the electronic devices. Therefore, there is an urgent need to provide an electronic device to improve the heat dissipation performance of the electronic devices. Summary of the Utility Model
[0003] This application provides an electronic device, which includes a housing, an air flow partition structure, a first heat dissipation component, and a second heat dissipation component. The housing has an installation cavity inside, and a ventilation structure is provided on the side wall of the installation cavity; the air flow partition structure is arranged in the installation cavity and divides the installation cavity into a first air flow channel and a second air flow channel, and the first air flow channel and the second air flow channel are independent of each other; the first heat dissipation component and the second heat dissipation component are arranged in the installation cavity, and the air inlet structure of one heat dissipation component is communicated with the ventilation structure through the first air flow channel, and the air outlet structure of the other heat dissipation component is communicated with the ventilation structure through the second air flow channel.
[0004] In a possible implementation manner of this application, the air inlet structure on the first heat dissipation component has a first air inlet side, the air outlet structure on the first heat dissipation component has a first air outlet side, the orientation of the first air inlet side is different from the orientation of the first air outlet side, and the first air outlet side faces the first air flow channel to be communicated with the ventilation structure through the first air flow channel; the air inlet structure of the second heat dissipation component has a second air inlet side, and the second air inlet side faces the second air flow channel to be communicated with the ventilation structure through the second air flow channel.
[0005] In a possible implementation manner of this application, the first heat dissipation component includes a first type of fan, the first type of fan has a first air inlet and a first air outlet, the orientation of the first air inlet is opposite to the orientation of the first air outlet, the first air inlet forms the first air inlet side, and the first air outlet forms the first air outlet side.
[0006] In a possible implementation manner of this application, the air inlet structure of the first heat dissipation component has a third air inlet side and a fourth air inlet side, the orientation of the third air inlet side is different from the orientation of the fourth air inlet side, and one of the third air inlet side and the fourth air inlet side faces the first air flow channel to be communicated with the ventilation structure through the first air flow channel; the air outlet structure of the second heat dissipation component has a second air outlet side, and the second air outlet side faces the second air flow channel to be communicated with the ventilation structure through the second air flow channel.
[0007] In a possible implementation manner of the present application, the first heat dissipation component includes a second type of fan, the second type of fan has a second air inlet and a third air inlet, the orientations of the second air inlet and the third air inlet are opposite to each other, the second air inlet forms a third air inlet side, and the third air inlet forms a fourth air inlet side.
[0008] In a possible implementation manner of the present application, the air flow partition structure includes a partition member, the partition member has a first section and a second section connected at an angle, the first section extends towards the ventilation structure, and the second section extends towards the first heat dissipation component to partition and form a first air flow channel and a second air flow channel in the installation cavity.
[0009] In a possible implementation manner of the present application, both the first section and the second section extend along a straight line, and the first section and the second section are perpendicular to each other.
[0010] In a possible implementation manner of the present application, the electronic device further includes a detachable connection structure located in the installation cavity, and the partition member is detachably installed in the installation cavity through the detachable connection structure.
[0011] In a possible implementation manner of the present application, the detachable connection structure includes a hook, the hook is located on the ventilation structure, and a buckle adapted to be connected to the hook is provided on the first section.
[0012] In a possible implementation manner of the present application, the detachable connection structure includes an installation beam, the extending direction of the installation beam is the same as the extending direction of the first section, the end of the installation beam is connected to the side wall of the installation cavity, and a fixing groove adapted to be clamped with the installation beam is provided on the second section. Description of the Drawings
[0013] Figure 1 Structural schematic diagram of the electronic device provided by the embodiment of the present application (the first example);
[0014] Figure 2 is Figure 1 Schematic diagram of the state when the electronic device in
[0015] Figure 3 Structural schematic diagram of the electronic device provided by the embodiment of the present application (the second example);
[0016] Figure 4 is Figure 3 Schematic diagram of the state when the electronic device in
[0017] Figure 5 Front view of the air flow partition structure;
[0018] Figure 6 Right view of the air flow partition structure;
[0019] Figure 7 Top view of the air flow partition structure.
[0020] Description of the reference numerals:
[0021] 1 - Housing; 11 - Installation cavity; 111 - First air flow channel; 112 - Second air flow channel; 12 - Ventilation structure; 2 - Air flow baffle structure; 21 - First section; 22 - Second section; 23 - Reinforcing rib; 24 - Avoidance notch; 25 - Snap; 26 - Fixed groove; 3 - First heat dissipation component; 31 - First air inlet side; 32 - First air outlet side; 33 - Third air inlet side; 34 - Fourth air inlet side; 4 - Second heat dissipation component; 41 - Second air inlet side; 42 - Second air outlet side; 5 - Detachable connection structure; 51 - Hook; 52 - Installation beam. Detailed implementation manners
[0022] It should be noted that, without conflict, the embodiments and technical features in the embodiments of the present application can be combined with each other. The detailed description in the specific implementation manners should be understood as an explanatory illustration of the gist of the present application and should not be regarded as an improper limitation to the present application.
[0023] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the following will further describe the specific technical solutions of the present application in detail with reference to the accompanying drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application but are not used to limit the scope of the present application.
[0024] In the embodiments of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.
[0025] In addition, in the embodiments of the present application, the orientation terms such as "upper", "lower", "left" and "right" are defined relative to the orientation of the components shown in the drawings. It should be understood that these directional terms are relative concepts, and they are used for relative description and clarification, and they can change accordingly with the change of the orientation of the components placed in the drawings.
[0026] In the embodiments of the present application, unless otherwise clearly defined and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated; it can be directly connected or indirectly connected through an intermediate medium.
[0027] In the embodiments of the present application, the terms "include", "including" or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the presence of additional identical elements in the process, method, article or device including such element.
[0028] In the embodiments of the present application, words such as "exemplary" or "for example" are used to denote examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific manner.
[0029] With the continuous improvement of the performance of electronic devices, the heat generated by heat-generating components within the electronic devices also increases accordingly. In order to maintain the normal operation of the electronic devices, the electronic devices need to design corresponding heat dissipation components for different heat-generating components to improve the heat dissipation performance of the electronic devices. However, different heat dissipation components within the electronic devices will interfere with each other during operation, thereby affecting the heat dissipation performance of the electronic devices. Therefore, there is an urgent need to provide an electronic device to improve the heat dissipation performance of the electronic devices.
[0030] To solve the above problems, the embodiments of the present application provide an electronic device. Here, it should be explained that the electronic device mentioned in the embodiments of the present application can be a laptop computer, a computer mainframe, a television, or a game console. The embodiments of the present application do not limit this. In an implementable manner provided by the embodiments of the present application, the electronic device is a computer mainframe.
[0031] Referring to Figure 1 and Figure 3 , in the embodiments of the present application, the electronic device includes a housing 1, an air flow partition structure 2, a first heat dissipation component 3, and a second heat dissipation component 4. The housing 1 has an installation cavity 11 inside, and a ventilation structure 12 is provided on the side wall of the installation cavity 11; the air flow partition structure 2 is disposed in the installation cavity 11 and divides the installation cavity 11 to form a first air flow channel 111 and a second air flow channel 112, and the first air flow channel 111 and the second air flow channel 112 are independent of each other; the first heat dissipation component 3 and the second heat dissipation component 4 are disposed in the installation cavity 11, the air inlet structure of one heat dissipation component is communicated with the ventilation structure 12 through the first air flow channel 111, and the air outlet structure of the other heat dissipation component is communicated with the ventilation structure 12 through the second air flow channel 112.
[0032] In the embodiments of the present application, the function of the ventilation structure 12 is to achieve air circulation between the installation cavity 11 and the external environment. Therefore, there are various possibilities for the structural design of the ventilation structure 12. For example, the ventilation structure 12 may include a first ventilation hole group and a second ventilation hole group arranged at intervals, where the first ventilation hole group is communicated with the first air flow channel 111, and the second ventilation hole group is communicated with the second air flow channel 112; or, the ventilation structure 12 only includes one ventilation hole group, and this ventilation hole group is respectively communicated with the first air flow channel 111 and the second air flow channel 112. The embodiments of the present application do not limit this.
[0033] In the embodiments of the present application, the function of the air flow partition structure 2 is to partition and form the first air flow channel 111 and the second air flow channel 112 in the installation cavity 11. Therefore, there are various possibilities for the structural design of the air flow partition structure 2. For example, the air flow partition structure 2 may be a plate-like structure or a block-like structure. The embodiments of the present application do not limit this.
[0034] In the embodiments of the present application, the functions of the first heat dissipation component 3 and the second heat dissipation component 4 are to dissipate the heat inside the installation cavity 11. Therefore, the first heat dissipation component 3 and the second heat dissipation component 4 may adopt the same structural design or different structural designs. The embodiments of the present application do not limit this.
[0035] It should be noted that in the embodiments of the present application, the heat dissipation principle of the first heat dissipation component 3 and the second heat dissipation component 4 is to transfer and dissipate heat by using air convection. Therefore, when the first heat dissipation component 3 and the second heat dissipation component 4 are working, the air inlet structures on the first heat dissipation component 3 and the second heat dissipation component 4 will inhale the air with a lower temperature, and the air outlet structures on the first heat dissipation component 3 and the second heat dissipation component 4 will discharge the air carrying heat to dissipate the heat generated by the corresponding heat generating components.
[0036] In the embodiments of the present application, the function of the heat generating component is to ensure the normal operation of the electronic device. Therefore, the heat generating component may be a Graphics Processing Unit (GPU), a Central Processing Unit (CPU), or a Power Supply Unit (PSU). The embodiments of the present application do not limit this. In a possible embodiment of the present application, the electronic device may include a graphics processor and a central processor, and one of the first heat dissipation component 3 and the second heat dissipation component 4 is located on the graphics processor, and the other is located on the central processor.
[0037] In the technical solution provided by the embodiment of the present application, the electronic device includes a housing 1, an air flow blocking structure 2, a first heat dissipation component 3, and a second heat dissipation component 4. Among them, the housing 1 has an installation cavity 11 inside, and the installation cavity 11 is used to provide an installation space for the air flow blocking structure 2, the first heat dissipation component 3, and the second heat dissipation component 4; a ventilation structure 12 is provided on the side wall of the installation cavity 11, and air circulation is realized between the installation cavity 11 and the external environment through the ventilation structure 12. The air flow blocking structure 2 is arranged in the installation cavity 11 and divides the installation cavity 11 into a first air flow channel 111 and a second air flow channel 112, and the first air flow channel 111 and the second air flow channel 112 are independent of each other; in this way, the air flow in the first air flow channel 111 and the air flow in the second air flow channel 112 will not interfere with each other. The first heat dissipation component 3 and the second heat dissipation component 4 are arranged in the installation cavity 11, and the air inlet structure of one heat dissipation component is communicated with the ventilation structure 12 through the first air flow channel 111, and the air outlet structure of the other heat dissipation component is communicated with the ventilation structure 12 through the second air flow channel 112. Here, referring to Figure 1 and Figure 2 , the air outlet structure on the first heat dissipation component 3 can be communicated with the ventilation structure 12 through the first air flow channel 111, and the air inlet structure of the second heat dissipation component 4 can be communicated with the ventilation structure 12 through the second air flow channel 112. In this way, when the first heat dissipation component 3 and the second heat dissipation component 4 are working, the air outlet structure on the first heat dissipation component 3 discharges the air carrying heat to the external environment through the first air flow channel 111 and the ventilation structure 12 in sequence, and the low-temperature air in the external environment is inhaled into the air inlet structure on the second heat dissipation component 4 through the ventilation structure 12 and the second air flow channel 112 in sequence. Since the first air flow channel 111 and the second air flow channel 112 are independent of each other, it is avoided that the high-temperature air discharged from the air outlet structure on the first heat dissipation component 3 is inhaled by the air inlet structure on the second heat dissipation component 4, thereby affecting the heat dissipation effect of the second heat dissipation component 4, and thus reducing the interference degree between the first heat dissipation component 3 and the second heat dissipation component 4. Referring to Figure 3 and Figure 4, the air intake structure of the first heat dissipation component 3 can also be communicated with the ventilation structure 12 through the first air flow channel 111, and the air outlet structure of the second heat dissipation component 4 can also be communicated with the ventilation structure 12 through the second air flow channel 112. In this way, when the first heat dissipation component 3 and the second heat dissipation component 4 are working, the low-temperature air in the external environment is successively inhaled into the air intake structure on the first heat dissipation component 3 through the ventilation structure 12 and the first air flow channel 111, and the air outlet structure on the second heat dissipation component 4 discharges the air carrying heat into the external environment successively through the second air flow channel 112 and the ventilation structure 12. Since the first air flow channel 111 and the second air flow channel 112 are independent of each other, it is avoided that the high-temperature air discharged from the air outlet structure on the second heat dissipation component 4 is inhaled by the air intake structure on the first heat dissipation component 3, thereby affecting the heat dissipation effect of the first heat dissipation component 3, and thus reducing the interference degree between the first heat dissipation component 3 and the second heat dissipation component 4.
[0038] The electronic device provided by the present application includes an air flow partition structure 2. The air flow partition structure 2 divides and forms a first air flow channel 111 and a second air flow channel 112 in the installation cavity 11, so that the first heat dissipation component 3 and the second heat dissipation component 4 can independently inhale or discharge air, reducing the interference degree between the first heat dissipation component 3 and the second heat dissipation component 4, thereby improving the heat dissipation performance of the electronic device.
[0039] In the embodiment of the present application, when the air outlet structure of the first heat dissipation component 3 is communicated with the ventilation structure 12 through the first air flow channel 111, and the air intake structure of the second heat dissipation component 4 is communicated with the ventilation structure 12 through the second air flow channel 112, the structures of the first heat dissipation component 3 and the second heat dissipation component 4 have various possibilities. For example, the air intake structure of the first heat dissipation component 3 may have a first air intake opening, the air outlet structure of the first heat dissipation component 3 has a first air outlet opening, and the orientations of the first air intake opening and the first air outlet opening are the same. Among them, the first air outlet opening is disposed opposite to the first air flow channel 111 to be communicated with the ventilation structure 12 through the first air flow channel 111. The air intake structure of the second heat dissipation component 4 may have a second air intake opening, and the second air intake opening faces the second air flow channel 112 to be communicated with the ventilation structure 12 through the second air flow channel 112.
[0040] Refer to Figure 1 and Figure 2, in a possible embodiment of the present application, the air inlet structure on the first heat dissipation component 3 has a first air inlet side 31, and the air outlet structure on the first heat dissipation component 3 has a first air outlet side 32. The orientation of the first air inlet side 31 is different from that of the first air outlet side 32, and the first air outlet side 32 faces the first air flow channel 111 to communicate with the ventilation structure 12 through the first air flow channel 111; the air inlet structure of the second heat dissipation component 4 has a second air inlet side 41, and the second air inlet side 41 faces the second air flow channel 112 to communicate with the ventilation structure 12 through the second air flow channel 112. In this way, when the first heat dissipation component 3 and the second heat dissipation component 4 are working, the first air inlet side 31 of the first heat dissipation component 3 sucks in air with a lower temperature, and the first air outlet side 32 of the first heat dissipation component 3 discharges the air carrying heat to the external environment through the first air flow channel 111 and the ventilation structure 12 in sequence. The low-temperature air in the external environment is sucked into the second air inlet side 41 of the second heat dissipation component 4 through the ventilation structure 12 and the second air flow channel 112 in sequence, so that the air discharged from the first air outlet side 32 of the first heat dissipation component 3 will not be sucked into the second air inlet side 41 of the second heat dissipation component 4, thereby avoiding affecting the heat dissipation effect of the second heat dissipation component 4 and improving the heat dissipation performance of the electronic device.
[0041] In the embodiment of the present application, there are various possibilities for the relationship between the orientation of the first air inlet side 31 and the orientation of the first air outlet side 32. The orientation of the first air inlet side 31 and the orientation of the first air outlet side 32 can be perpendicular, opposite, or at other angular relationships. The embodiment of the present application does not limit this.
[0042] In the embodiment of the present application, there are various possibilities for the structural design of the first heat dissipation component 3. For example, the first heat dissipation component 3 may include a fan and a diversion housing 1. The diversion housing 1 has an air inlet diversion channel and an air outlet diversion channel. The extending direction of the air inlet diversion channel is perpendicular to the extending direction of the air outlet diversion channel. The air inlet of the fan is communicated with the air inlet diversion channel, and the air outlet of the fan is communicated with the air outlet diversion channel. The air inlet end of the air inlet diversion channel forms the first air inlet side 31, and the air outlet end of the air outlet diversion channel forms the first air outlet side 32.
[0043] Refer to Figure 1 and Figure 2, in a possible embodiment of the present application, the first heat dissipation component 3 includes a first type of fan. The first type of fan has a first air inlet and a first air outlet. The orientation of the first air inlet is opposite to that of the first air outlet. The first air inlet forms a first air inlet side 31, and the first air outlet forms a first air outlet side 32. Here, since the orientation of the first air inlet on the first type of fan is opposite to that of the first air outlet, on the one hand, when the first type of fan is working, a relatively straight air flow path can be generated, reducing the eddy current and backflow of air inside the first type of fan, thereby improving the discharge efficiency of hot air; on the other hand, the opposite orientation of the first air inlet and the first air outlet helps to maintain the air pressure balance in the installation cavity 11, avoiding the disorder of air flow caused by uneven pressure, and thus improving the heat dissipation effect.
[0044] Referring to Figure 3 and Figure 4 , in the embodiment of the present application, the air inlet structure of the first heat dissipation component 3 may further have a third air inlet side 33 and a fourth air inlet side 34. The orientation of the third air inlet side 33 is different from that of the fourth air inlet side 34. One of the third air inlet side 33 and the fourth air inlet side 34 faces the first air flow channel 111 to communicate with the ventilation structure 12 through the first air flow channel 111; the air outlet structure of the second heat dissipation component 4 has a second air outlet side 42, and the second air outlet side 42 faces the second air flow channel 112 to communicate with the ventilation structure 12 through the second air flow channel 112. Here, it may be that the third air inlet side 33 on the first heat dissipation component 3 faces the first air flow channel 111 to communicate with the ventilation structure 12 through the first air flow channel 111; or it may be that the fourth air inlet side 34 on the first heat dissipation component 3 faces the first air flow channel 111 to communicate with the ventilation structure 12 through the first air flow channel 111. In this way, when the first heat dissipation component 3 and the second heat dissipation component 4 are working, the low-temperature air in the external environment is successively inhaled to the corresponding air inlet side on the first heat dissipation component 3 through the ventilation structure 12 and the first air flow channel 111, and the second air outlet side 42 of the second heat dissipation component 4 discharges the air carrying heat to the external environment successively through the second air flow channel 112 and the ventilation structure 12, so that the air discharged from the second air outlet side 42 of the second heat dissipation component 4 will not be inhaled by the corresponding air inlet side on the first heat dissipation component 3, thereby avoiding affecting the heat dissipation effect of the first heat dissipation component 3 and improving the heat dissipation performance of the electronic device.
[0045] In the embodiment of the present application, there are various possibilities for the relationship between the orientation of the third air inlet side 33 and the orientation of the fourth air inlet side 34. The orientation of the third air inlet side 33 and the orientation of the fourth air inlet side 34 may be perpendicular, opposite, or at other angular relationships. The embodiment of the present application does not limit this.
[0046] Referring to Figure 3 and Figure 4, in the embodiments of the present application, the first heat dissipation component 3 includes a second type of fan, the second type of fan has a second air inlet and a third air inlet, the orientations of the second air inlet and the third air inlet are opposite to each other, the second air inlet forms a third air inlet side 33, and the third air inlet forms a fourth air inlet side 34. Here, since the orientations of the second air inlet and the third air inlet on the second type of fan are opposite to each other, on the one hand, it can enable the second type of fan to cover a wider heat dissipation surface and provide more heat transfer paths, thereby improving the heat dissipation efficiency of the first heat dissipation component 3; on the other hand, the opposite orientations of the second air inlet and the third air inlet contribute to forming an effective cooling cycle in the installation cavity 11 and reducing the resistance of air flow.
[0047] It should be noted that, in the embodiments of the present application, the first type of fan may be an axial flow fan, and the second type of fan is a centrifugal fan. The embodiments of the present application do not limit this.
[0048] In the embodiments of the present application, the structural form of the air flow baffle structure 2 has various possibilities. For example, the air flow baffle structure 2 includes a first diversion pipe and a second diversion pipe located in the installation cavity 11. The interior of the first diversion pipe forms a first air flow channel 111, and the interior of the second diversion pipe forms a second air flow channel 112.
[0049] Referring to Figure 1 、 Figure 5 and Figure 6 , in a possible embodiment of the present application, the air flow baffle structure 2 includes a baffle member. The baffle member has a first section 21 and a second section 22 connected at an angle. The first section 21 extends towards the ventilation structure 12, and the second section 22 extends towards the first heat dissipation component 3 to partition and form a first air flow channel 111 and a second air flow channel 112 in the installation cavity 11. Here, the baffle member uses the first section 21 and the second section 22 to partition the space in the installation cavity 11, so that a first air flow channel 111 and a second air flow channel 112 are formed in the installation cavity 11. The baffle member has a simple structure, is easy to process, and occupies a small space, which is beneficial to the miniaturized design of the electronic device. The first section 21 extends towards the ventilation structure 12, and the second section 22 extends towards the first heat dissipation component 3. In this way, the first air flow channel 111 and the second air flow channel 112 are respectively located on opposite sides of the baffle member, so that the first heat dissipation component 3 and the second heat dissipation component 4 can be correspondingly arranged on opposite sides of the baffle member, thereby avoiding the thermal boundary overlap between the first heat dissipation component 3 and the second heat dissipation component 4 due to being too close, and further reducing the interference degree between the first heat dissipation component 3 and the second heat dissipation component 4.
[0050] In the embodiments of the present application, there are various possibilities for the extending directions of the first section 21 and the second section 22. For example, the first section 21 can extend along a straight line, along an arc, or along an irregular line; similarly, the second section 22 can extend along a straight line, along an arc, or along an irregular line, and the embodiments of the present application do not limit this. Additionally, there are also various possibilities for the angle between the first section 21 and the second section 22. For example, the angle between the first section 21 and the second section 22 can be 30 degrees, 45 degrees, or 90 degrees, and the embodiments of the present application do not limit this.
[0051] Referring to Figure 1 、 Figure 3 and Figure 7 , in a possible embodiment of the present application, both the first section 21 and the second section 22 extend along a straight line, and the first section 21 is perpendicular to the second section 22. In this way, on the one hand, the structural design of the partition can be simplified, facilitating the processing and installation of the partition; on the other hand, the airflow flowing through the first airflow channel 111 and the second airflow channel 112 can be made more uniform, reducing the generation of vortices and turbulence, thereby improving the heat dissipation efficiency of the electronic device.
[0052] Referring to Figure 5 、 Figure 6 and Figure 7 , in the embodiments of the present application, the partition can be a plate-like structure. In this way, the weight of the partition can be reduced, which is beneficial for the lightweight design of the electronic device. Additionally, to enhance the structural strength of the partition, referring to Figure 7 , reinforcing ribs 23 can be provided on the partition. Furthermore, referring to Figure 5 , to facilitate the arrangement of cables in the installation cavity 11, an avoidance notch 24 can be provided on the first section 21 of the partition for the cables to pass through and be arranged.
[0053] In the embodiments of the present application, there are various possibilities for the installation method of the partition in the installation cavity 11. For example, the partition can be integrally provided in the installation cavity 11 or can be detachably installed in the installation cavity 11, and the embodiments of the present application do not limit this. Referring to Figure 1 and Figure 3 , in a possible embodiment of the present application, the electronic device further includes a detachable connection structure 5 located in the installation cavity 11, and the partition is detachably installed in the installation cavity 11 through the detachable connection structure 5. In this way, when cleaning and maintaining the electronic device, the partition can be removed from the installation cavity 11, improving the convenience of cleaning and maintenance.
[0054] In the embodiments of the present application, the structural form of the detachable connection structure 5 has various possibilities. For example, the detachable connection structure 5 includes a fixing hole and a fastener. The fixing hole is provided on the ventilation structure 12, and a connection hole is provided on the partition member. When installing the partition member, the connection hole can be aligned with the fixing hole, and then the fastener is sequentially passed through the connection hole and the fixing hole to complete the installation of the partition member.
[0055] Referring to Figure 1 、 Figure 3 and Figure 7 In a possible embodiment of the present application, the detachable connection structure 5 includes a hook 51. The hook 51 is located on the ventilation structure 12, and a buckle 25 adapted to be connected to the hook 51 is provided on the first section 21. In this way, when installing the partition member, the buckle 25 on the first section 21 can be snap-fitted with the hook on the ventilation structure 12, and the installation process is relatively convenient.
[0056] Referring to Figure 1 、 Figure 3 and Figure 7 In a possible embodiment of the present application, the detachable connection structure 5 includes an installation beam 52. The extending direction of the installation beam 52 is the same as the extending direction of the first section 21. The end of the installation beam 52 is connected to the side wall of the installation cavity 11, and a fixing groove 26 adapted to be snap-fitted with the installation beam 52 is provided on the second section 22. Here, the extending direction of the installation beam 52 is the same as the extending direction of the first section 21, and the end of the installation beam 52 is connected to the side wall of the installation cavity 11, so that the installation beam 52 can provide support for the inner wall of the installation cavity 11, improving the structural strength of the housing 1. A fixing groove 26 adapted to be snap-fitted with the installation beam 52 is provided on the second section 22. When installing the partition member, the buckle 25 on the first section 21 can be snap-fitted with the hook on the ventilation structure 12, and then the end of the installation beam 52 is connected to the side wall of the installation cavity 11, and the installation beam 52 is snap-fitted with the fixing groove 26 on the second section 22. Since both the first section 21 and the second section 22 on the partition member are fixed, the partition member is not easily loosened in the installation cavity 11, thereby improving the reliability during the use of the electronic device.
[0057] As described above, only the embodiments of the present application are provided, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed in the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application.
Claims
1. An electronic device, characterized in that: include: A housing having an installation cavity therein, and a ventilation structure is provided on a side wall of the installation cavity; an airflow blocking structure, disposed in the installation cavity, and separating the installation cavity into a first airflow channel and a second airflow channel, wherein the first airflow channel and the second airflow channel are independent of each other; A first heat dissipation component and a second heat dissipation component are arranged in the installation cavity, an air inlet structure of one heat dissipation component is connected with the ventilation structure via the first air flow channel, and an air outlet structure of the other heat dissipation component is connected with the ventilation structure via the second air flow channel.
2. The electronic device according to claim 1, characterized in that: The air inlet structure on the first heat dissipation component has a first air inlet side, and the air outlet structure on the first heat dissipation component has a first air outlet side, the orientation of the first air inlet side is different from the orientation of the first air outlet side, and the first air outlet side faces the first air flow channel to communicate with the ventilation structure through the first air flow channel; The air inlet structure of the second heat dissipation component has a second air inlet side, and the second air inlet side faces the second air flow channel to communicate with the ventilation structure through the second air flow channel.
3. The electronic device according to claim 2, characterized in that: The first heat dissipation component includes a first type of fan, the first type of fan has a first air inlet and a first air outlet, the direction of the first air inlet is opposite to the direction of the first air outlet, the first air inlet forms the first air inlet side, and the first air outlet forms the first air outlet side.
4. The electronic device according to claim 1, characterized in that: The air inlet structure of the first heat dissipation component has a third air inlet side and a fourth air inlet side, the direction of the third air inlet side is different from the direction of the fourth air inlet side, and one of the third air inlet side and the fourth air inlet side faces the first air flow channel to communicate with the ventilation structure through the first air flow channel; The air outlet structure of the second heat dissipation component has a second air outlet side, and the second air outlet side faces the second air flow channel to communicate with the ventilation structure through the second air flow channel.
5. The electronic device according to claim 4, characterized in that: The first heat dissipation component includes a second type fan, the second type fan has a second air inlet and a third air inlet, the direction of the second air inlet is opposite to the direction of the third air inlet, the second air inlet forms the third air inlet side, and the third air inlet forms the fourth air inlet side.
6. The electronic device according to any one of claims 1 to 5, characterized in that: The airflow blocking structure includes a blocking member having a first section and a second section connected at an angle, wherein the first section extends toward the ventilation structure, and the second section extends toward the first heat dissipation component to separate the first airflow channel and the second airflow channel in the installation cavity.
7. The electronic device according to claim 6, characterized in that: The first section and the second section both extend along a straight line, and the first section and the second section are perpendicular to each other.
8. The electronic device according to claim 6, characterized in that: The electronic device further comprises a detachable connection structure located in the installation cavity, and the barrier member is detachably installed in the installation cavity via the detachable connection structure.
9. The electronic device according to claim 8, characterized in that: The detachable connection structure comprises a hook, the hook is located on the ventilation structure, and the first section is provided with a buckle adapted to be connected with the hook.
10. The electronic device according to claim 8, characterized in that: The detachable connection structure includes a mounting beam, the extension direction of the mounting beam is consistent with the extension direction of the first section, the end of the mounting beam is connected to the side wall of the mounting cavity, and the second section is provided with a fixing groove that is snap-fitted with the mounting beam.