Liquid cooling radiator

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a liquid cooling radiator, which comprises a cover plate and a substrate which are seamlessly connected, the substrate comprises a cavity and a plurality of heat dissipation stand columns formed by machining, the column tops of the heat dissipation stand columns are vertically connected with the cover plate, two ends of the cavity are provided with a water inlet cavity and a water outlet cavity, and the heat dissipation stand columns are positioned between the water inlet cavity and the water outlet cavity; the heat dissipation stand columns are divided into a main array and flow diffusion arrays which are separated, the flow diffusion arrays are arranged between the main array and the water inlet cavity and between the main array and the water outlet cavity respectively, the main array comprises two rows of side column heat dissipation stand columns and a center heat dissipation stand column, and the two rows of side column heat dissipation stand columns are connected with the inner wall of the cavity. The cover plate and the substrate are connected through diffusion welding, and the sealing performance is good; the water inlet hole and the water outlet hole are interchangeable; the staggered row columns and the stand columns integrated with the wall face of the inner cavity support the cover plate to prevent the cover plate from sinking inwards and deforming, the chance that fluid collides with the inner cavity is increased, and the turbulent flow effect is enhanced. And the radiating fins are arranged on the back surface of the substrate, so that the radiating speed is high.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a liquid-cooled radiator. Background Art

[0002] Nowadays, the electronic communication industry and the new energy vehicle field are developing rapidly, and the product iteration and update cycle is getting shorter and shorter. The heat dissipation problems of electronic components and energy storage batteries are not to be underestimated. The common liquid-cooled products on the market mainly include heat pipes, vapor chambers, aluminum brazed liquid-cooled plates, etc., which mainly rely on the latent heat of phase change of two-phase flow to take away heat.

[0003] Improving the heat dissipation effect of the liquid-cooled radiator is self-evidently important for electronic components and energy storage battery products, which is directly related to the performance, life, stability and safety of the equipment. Summary of the Invention

[0004] The purpose of the utility model: to provide a liquid-cooled radiator with high heat dissipation efficiency.

[0005] To solve the above technical problems, the technical scheme adopted by the utility model is as follows:

[0006] A liquid-cooled radiator includes a cover plate and a base plate connected seamlessly. The base plate includes a cavity and a number of heat dissipation columns machined. The column tops of the heat dissipation columns are vertically connected to the cover plate. Both ends of the cavity are provided with a water inlet cavity and a water outlet cavity, and the heat dissipation columns are located between the water inlet cavity and the water outlet cavity; the heat dissipation columns are divided into a separated main array and a diffusing array, and a diffusing array is respectively arranged between the main array and the water inlet cavity and between the main array and the water outlet cavity.

[0007] Further, the main array includes side column heat dissipation columns and central heat dissipation columns, and there are two columns of side column heat dissipation columns connected to the inner wall of the cavity.

[0008] Further, the side column heat dissipation columns are semi-hexagonal prisms, and the rest of the heat dissipation columns are complete hexagonal prisms.

[0009] Further, the space occupied by the main array is 10-50 times that of the diffusing array.

[0010] Further, both the main array and the diffusing array are arranged in a staggered pattern.

[0011] Further, the water inlet cavity and the water outlet cavity are provided with inclined surfaces that gradually expand and open towards the main array, and the water inlet cavity and the water outlet cavity are respectively communicated with a water inlet hole and a water outlet hole provided on the cover plate.

[0012] Further, a tin plating area is arranged in the middle of the back surface of the joint surface between the base plate and the cover plate, and heat dissipation fins are connected to the tin plating area.

[0013] Further, the cover plate and the substrate are made of T2 pure copper, the thickness of the cover plate is less than that of the substrate, and the heat dissipation fins are made of aluminum.

[0014] The beneficial effects of adopting the technical solution of the present utility model are as follows:

[0015] A liquid cooling radiator provided by the present utility model uses a diffusion welding process to connect the cover plate and the substrate, without the need for an additional brazing layer, and has good sealing performance; the water inlet hole and the water outlet hole can be interchanged, and the flow direction of the internally communicated coolant can be freely changed, which is convenient for use; a dislocation type row of columns machined by a CNC machine and columns integrated with the inner cavity wall surface are arranged in the inner cavity of the substrate to support the cover plate to prevent it from being sunken and deformed, increasing the chance of collision between the fluid and the inner cavity, and enhancing the flow disturbance effect; heat dissipation fins are arranged on the back of the substrate, and a tin plating area is provided to improve the connection reliability and reduce the contact thermal resistance between the two materials at the same time, with strong heat conduction performance and fast heat dissipation speed. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for description in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0017] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0018] Figure 2 is an exploded structural schematic diagram of the present utility model;

[0019] Figure 3 is a top view schematic diagram of the substrate in the present utility model;

[0020] Figure 4 is Figure 3 the enlarged schematic diagram at C in

[0021] Figure 5 is a bottom view schematic diagram of the substrate in the present utility model.

[0022] Reference numerals in the drawings: 1, cover plate; 1a, water inlet hole; 1b, water outlet hole; 2, substrate; 3, cavity; 3a, water inlet cavity; 3b, water outlet cavity; 4, heat dissipation column; 4a, main array; 4b, diffusing array; 5, tin plating area; 6, heat dissipation fin. Detailed Embodiments

[0023] The present utility model will be further described in detail below with reference to the drawings. A liquid cooling radiator, as Figures 1 to 5As shown in the figure, it includes a seamlessly connected cover plate 1 and a substrate 2. The substrate 2 includes a cavity 3 and several machined heat dissipation columns 4. In the connected state of the cover plate 1 and the substrate 2, the column tops of the heat dissipation columns 4 are perpendicularly connected to the cover plate 1. Both ends of the cavity 3 are provided with a water inlet cavity 3a and a water outlet cavity 3b. The heat dissipation columns 4 are located between the water inlet cavity 3a and the water outlet cavity 3b. The water inlet cavity 3a and the water outlet cavity 3b are respectively connected to a water inlet hole 1a and a water outlet hole 1b provided on the cover plate 1. The water inlet hole 1a and the water outlet hole 1b can be interchanged, that is, the flow direction of the coolant can be freely changed;

[0024] Specifically, the heat dissipation columns 4 are divided into a separated main array 4a and a diffusing array 4b. A diffusing array 4b is respectively arranged between the main array 4a and the water inlet cavity 3a and between the main array 4a and the water outlet cavity 3b. The water inlet cavity 3a and the water outlet cavity 3b are provided with gradually expanding and opening inclined surfaces facing the main array 4a. When the coolant enters the water inlet cavity 3a from the water inlet hole 1a and flows towards the cavity 3, the liquid flow is dispersed through the diffusing array 4b and the inclined surfaces and flows towards the main array 4a. The coolant makes full contact with the outer walls of the heat dissipation columns 4 in the main array 4a. The main array 4a includes side column heat dissipation columns and central heat dissipation columns. There are two columns of semi-hexagonal prism-shaped side column heat dissipation columns which are connected to the inner wall of the cavity 3. Except for the side column heat dissipation columns, the remaining heat dissipation columns 4 are complete hexagonal prism-shaped; the space occupied by the main array 4a is 10 to 50 times that of the diffusing array 4b. Both the main array 4a and the diffusing array 4b are arranged in a staggered manner. The above settings greatly increase the collision chance between the coolant fluid and the inner cavity of the substrate, increase the disturbance, and improve the heat exchange efficiency.

[0025] The cover plate 1 and the substrate 2 are made of T2 pure copper. The thickness of the cover plate 1 is less than that of the substrate 2. The two are connected by diffusion welding, that is, using the principle of molecular diffusion movement of copper molecules at high temperature to achieve the connection effect and strength required for welding. If the welding process is correct, the welding parameters are appropriate, and the quality of the welding material is good, then the joint after diffusion welding is in a tightly connected seamless state. Specifically, the diffusion welding parameter conditions are a temperature of 860 °C and a pressure of 2500 MPa. The ultimate bursting pressure that the internal cavity of the liquid-cooled radiator can withstand after welding is 168.1 bar, and the sealing performance is good, avoiding coolant leakage. After welding, nickel plating is performed on both the outer surface and the inner surface of the copper material as a whole to prevent the copper material from being oxidized and corroded when exposed to the outside.

[0026] In addition, a tin-plated area 5 that is not nickel-plated is provided in the middle of the back surface of the joint surface between the substrate 2 and the cover plate 1. The tin-plated area 5 is connected to a heat dissipation fin 6 made of aluminum. The purpose of tin plating is to enhance the welding strength effect between the copper main body and the heat dissipation fin 6. Tin fills the gap between the copper material and the aluminum material, reduces the contact between the welding surface and the air, and while improving the connection reliability, can reduce the contact thermal resistance between the two materials.

[0027] The technical solution of this application applies the copper diffusion welding process to the liquid cooling plate radiator, realizing the technical integration of the diffusion welding process and the liquid cooling plate. This welding method enables no additional brazing layer material to be required between the substrate 2 and the cover plate 1, which is simple and efficient, and realizes the innovation of heat dissipation technology application. Copper is used as the main material of the liquid cooling plate, and the strong heat transfer ability of copper is utilized to achieve a high heat dissipation effect. The heat dissipation columns 4 in the inner cavity of the substrate 2 are machined by a CNC machine, and the surface of the base material is treated with nickel plating and tin plating after welding, ensuring the structural strength of the product, improving the corrosion resistance, strengthening the welding strength, and at the same time reducing the contact thermal resistance to achieve efficient heat dissipation.

[0028] Inspired by the above embodiments of the present invention, through the above description, those skilled in the art can make various changes and modifications without departing from the technical idea of the present invention. Any modifications, equivalent replacements, improvements, etc. within the spirit and principle of the present invention shall be included within the protection scope of the present invention. The technical scope of the present invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A liquid cooling radiator, characterized in that: The invention comprises a cover plate (1) and a base plate (2) which are seamlessly connected, wherein the base plate (2) comprises a cavity (3) and a plurality of machined heat dissipation columns (4), wherein the tops of the heat dissipation columns (4) are vertically connected to the cover plate (1), and water inlet cavities (3a) and water outlet cavities (3b) are arranged at both ends of the cavity (3), and the heat dissipation columns (4) are located between the water inlet cavity (3a) and the water outlet cavity (3b); the heat dissipation columns (4) are divided into a main array (4a) and a diffuser array (4b) which are separated from each other, and a diffuser array (4b) is arranged between the main array (4a) and the water inlet cavity (3a) and between the main array (4a) and the water outlet cavity (3b), respectively.

2. A liquid cooling radiator according to claim 1, characterized in that: The main array (4a) comprises side heat dissipation columns and central heat dissipation columns, and the side heat dissipation columns have two columns and are connected to the inner wall of the cavity (3).

3. A liquid cooling radiator according to claim 2, characterized in that: The side heat dissipation columns are in the shape of a semi-hexagonal prism, and the remaining heat dissipation columns (4) are in the shape of a complete hexagonal prism.

4. The liquid cooling radiator according to claim 3, characterized in that: The main array (4a) and the diffuser array (4b) are both arranged in staggered rows.

5. The liquid cooling radiator according to claim 4, characterized in that: The water inlet chamber (3a) and the water outlet chamber (3b) are provided with gradually expanding and opening inclined surfaces toward the main array (4a); the water inlet chamber (3a) and the water outlet chamber (3b) are respectively connected to the water inlet hole (1a) and the water outlet hole (1b) provided on the cover plate (1).

6. The liquid cooling radiator according to claim 1, characterized in that: A tin-plated area (5) is provided in the middle of the back surface of the contact surface between the base plate (2) and the cover plate (1), and the tin-plated area (5) is connected to a heat dissipation fin (6).

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