CPCIe board card with liquid cooling heat dissipation function

Abstract

The utility model discloses a CPCI e board card with liquid cooling heat dissipation, comprising a board card body which is fixedly provided with a main water inlet interface and a main water return interface; and the at least one cold plate is detachably mounted at the high-power-consumption component of the board card body and is provided with a water inlet interface and a water outlet interface, and the water inlet interface and the water outlet interface are respectively communicated with the main water inlet interface and the main water return interface through liquid cooling pipelines. The CPCIe board card heat dissipation device is simple in structure and convenient to install, high-efficiency heat dissipation of the CPCIe board card can be achieved, the CPCIe board card is effectively protected, and the service life of the CPCIe board card is prolonged; by adopting liquid cooling closed circulation cooling, the use requirements under different working conditions and different environments can be met, the application range is wide, and meanwhile the practicability is high; the cold plate can be flexibly arranged according to the shape and position of the high-power-consumption component, and the heat dissipation efficiency is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of CPCIe boards, and particularly relates to a CPCIe board with liquid cooling heat dissipation. Background Art

[0002] In technical fields such as aerospace, communication networks, image and video processing, and industrial control, CPCIe boards are widely used due to their high performance and high integration.

[0003] The existing heat dissipation methods of CPCIe boards mainly include external fans and heat sinks, but the above methods have significant limitations. Although the external fan has a good heat dissipation effect, it is easily damaged in harsh environments such as dust and salt spray, and the failure rate will increase during long-term operation; due to its structural limitations, the heat sink has low heat dissipation efficiency and is difficult to meet the heat dissipation requirements of CPCIe boards under high power consumption. Therefore, there is an urgent need for a CPCIe board with liquid cooling heat dissipation. Summary of the Utility Model

[0004] In view of the deficiencies in the prior art, the utility model provides a CPCIe board with liquid cooling heat dissipation.

[0005] The utility model discloses a CPCIe board with liquid cooling heat dissipation, including:

[0006] A board card body, on which a total water inlet interface and a total water return interface are fixedly installed;

[0007] At least one cold plate, which is detachably installed at the high-power components of the board card body, and has a water inlet interface and a water outlet interface, and the water inlet interface and the water outlet interface are respectively connected to the total water inlet interface and the total water return interface through liquid cooling pipelines.

[0008] As a further improvement of the utility model, when multiple cold plates are provided, the water inlet interfaces and the water outlet interfaces of the multiple cold plates are connected in series through liquid cooling pipelines to form a liquid cooling channel for the coolant to flow through;

[0009] The total water inlet interface is connected to the water inlet interface of the first-stage cold plate through the liquid cooling pipeline, and the total water return interface is connected to the water outlet interface of the last-stage cold plate through the liquid cooling pipeline.

[0010] As a further improvement of the utility model, both the total water inlet interface and the total water return interface include a mounting seat and a blind plug quick connector;

[0011] The mounting base is detachably mounted on the board card body. One end of the mounting base is connected to the blind plug quick connector. An inner cavity communicating with the blind plug quick connector is provided in the mounting base. A connection port communicating with the inner cavity is provided on one side of the mounting base. The blind plug quick connector is used to communicate with an external water supply or return water pipeline, and the connection port is used to connect the water outlet interface or the water inlet interface.

[0012] As a further improvement of the present invention, the liquid cooling pipeline is fixed to the water inlet interface, the water outlet interface and the connection port by pipe clamps, and is sealed with the water inlet interface, the water outlet interface and the connection port by sealant.

[0013] As a further improvement of the present invention, the apertures of the water inlet interface and the water outlet interface are 4-10 mm.

[0014] As a further improvement of the present invention, the cold plate is made of copper or aluminum.

[0015] As a further improvement of the present invention, the shape and size of the cold plate are adapted to the position and shape of the high-power consumption components on the board card body.

[0016] As a further improvement of the present invention, the high-power consumption components include but are not limited to CPU and MXM graphics card.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0018] The structure of the present invention is simple and easy to install. By setting the cold plate and the liquid cooling channel, high-efficiency heat dissipation of the CPCIe board card can be achieved, effectively protecting the CPCIe board card and extending the service life of the CPCIe board card.

[0019] Compared with the existing external fan heat dissipation, the present invention uses liquid cooling closed-loop cooling, which can meet the use requirements under different working conditions and different environments, has a wide application range, strong practicability and low noise; at the same time, the cold plate can be flexibly arranged according to the shape and position of the high-power consumption components to improve the heat dissipation efficiency of the CPCIe board card. Description of the Drawings

[0020] Figure 1 It is an axonometric view of the structure of a CPCIe board card with liquid cooling heat dissipation disclosed in an embodiment of the present invention;

[0021] Figure 2 It is a top view of the structure of a CPCIe board card with liquid cooling heat dissipation disclosed in an embodiment of the present invention;

[0022] Figure 3Schematic diagram of the liquid cooling channel of a CPCIe board with liquid cooling and heat dissipation according to an embodiment of the present utility model;

[0023] Figure 4 Axonometric view of the structure of the total water inlet interface and the total water return interface of a CPCIe board with liquid cooling and heat dissipation according to an embodiment of the present utility model;

[0024] Figure 5 Top view of the structure of the total water inlet interface and the total water return interface of a CPCIe board with liquid cooling and heat dissipation according to an embodiment of the present utility model;

[0025] Figure 6 Side sectional view of the structure of the total water inlet interface and the total water return interface of a CPCIe board with liquid cooling and heat dissipation according to an embodiment of the present utility model.

[0026] In the figure:

[0027] 1. Board card body; 11. Panel; 2. Cold plate; 21. Water inlet interface; 22. Water outlet interface; 3. Total water inlet interface; 31. Mounting seat; 311. Inner cavity; 32. Blind plug quick connector; 33. Connection port; 4. Total water return interface; 5. Liquid cooling pipeline. Detailed implementation manners

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0029] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0030] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0031] The following further describes the present utility model in detail with reference to the accompanying drawings:

[0032] As Figures 1 - 3 shown, a CPCIe board with liquid cooling provided according to the present utility model includes a board body 1 and at least one cold plate 2. Among them, a total water inlet interface 3 and a total water return interface 4 are fixedly installed on the board body 1, and at least one cold plate 2 is detachably installed at the high-power components of the board body 1. The cold plate 2 has a water inlet interface 21 and a water outlet interface 22, and the water inlet interface 21 and the water outlet interface 22 are respectively connected to the total water inlet interface 3 and the total water return interface 4 through a liquid cooling pipeline 5.

[0033] In this embodiment, the structure is simple and the installation is convenient. By setting the cold plate 2 and the liquid cooling channel, high-efficiency heat dissipation of the CPCIe board can be achieved, effectively protecting the CPCIe board and extending the service life of the CPCIe board; compared with the existing external fan heat dissipation, it uses liquid cooling closed-loop cooling, which can meet the use requirements under different working conditions and different environments, has a wide application range, strong practicability, and low noise; at the same time, the cold plate 2 can be flexibly arranged according to the shape and position of the high-power components to improve the heat dissipation efficiency of the CPCIe board.

[0034] Specifically:

[0035] As Figures 1 - 3 shown, in the above embodiment, preferably, when multiple cold plates 2 are provided, the water inlet interfaces 21 and the water outlet interfaces 22 of the multiple cold plates 2 are connected in series with each other through the liquid cooling pipeline 5 to form a liquid cooling channel for the coolant to flow through; the total water inlet interface 3 is connected to the water inlet interface 21 of the first-stage cold plate through the liquid cooling pipeline 5, and the total water return interface 4 is connected to the water outlet interface 22 of the last-stage cold plate through the liquid cooling pipeline 5. In this embodiment, through the series connection method, it can be ensured that the coolant can flow through each cold plate 2 evenly, improving the heat dissipation efficiency.

[0036] In the above embodiments, preferably, a panel 11 is further provided on one side of the board body 1. Input / output interfaces, USB interfaces and indicator lights are arranged on the panel 11. During actual installation, the total water inlet interface 3 and the total water return interface 4 are respectively placed on the left and right sides of the board body 1, and are detachably and fixedly connected to the panel 11. The detachable and fixed connection in this embodiment includes bolt connection.

[0037] In the above embodiments, preferably, the apertures of the water inlet interface 21 and the water outlet interface 22 on the cold plate 2 are the same, and are both smaller than the apertures of the total water inlet interface 3 and the total water return interface 4 to ensure sufficient flow rate and pressure to meet the heat dissipation requirements. The apertures of the water inlet interface 21 and the water outlet interface 22 on the cold plate 2 in this embodiment are 4-10 mm.

[0038] In the above embodiments, preferably, the cold plate 2 is made of copper or aluminum.

[0039] In the above embodiments, preferably, the shape and size of the cold plate 2 are adapted to the position and shape of the high-power consumption components on the board body 1 to maximize the coverage of the heat generation area of the high-power consumption components and improve the heat dissipation effect.

[0040] In the above embodiments, preferably, the high-power consumption components include but are not limited to the CPU and the MXM graphics card.

[0041] As Figure 3 shown, in the above embodiments, preferably, a plurality of internal flow channels for the coolant to flow through are arranged in the cold plate 2, and the plurality of internal flow channels are respectively communicated with the water inlet interface 21 and the water outlet interface 22. The number, position and shape of the internal flow channels in this embodiment are adapted to the shape of the cold plate 2 and the area to be cooled.

[0042] In the above embodiments, preferably, the cold plate 2 can be fixedly installed on the board body 1 by bolts.

[0043] As Figures 4 - 6 shown, in the above embodiments, preferably, the total water inlet interface 3 and the total water return interface 4 have the same structure, and both include a mounting seat 31 and a blind plug quick connector 32. Among them, the two mounting seats 31 are respectively placed on the left and right sides of the board body 1, and are detachably and fixedly connected to the panel 11. Blind plug quick connectors 32 are installed at one end of the two mounting seats 31 away from the panel 11. Inner cavity rooms 311 communicated with the blind plug quick connectors 32 are arranged in the two mounting seats 31, and a connection port 33 communicated with the inner cavity room 311 is arranged on one side of the two mounting seats 31.

[0044] During actual assembly, the blind plug quick connector 32 located at the left mounting seat 31 is used to communicate with an external water supply pipeline, and the connection port 33 located at the left mounting seat 31 is used to connect to the water inlet interface 21; the blind plug quick connector 32 located at the right mounting seat 31 is used to communicate with an external water return pipeline, and the connection port 33 located at the right mounting seat 31 is used to connect to the water outlet interface 22.

[0045] In the above embodiment, preferably, the blind plug quick connector 32 is a two-way connector.

[0046] In the above embodiment, preferably, the material of the mounting seat 31 is brass.

[0047] In the above embodiment, preferably, the diameter of the liquid cooling pipeline 5 is adapted to the diameters of the water inlet interface 21, the water outlet interface 22, and the connection port 33.

[0048] In the above embodiment, preferably, the liquid cooling pipeline 5 is fixed to the water inlet interface 21, the water outlet interface 22, and the connection port 33 by pipe clamps, and is sealed with the water inlet interface 21, the water outlet interface 22, and the connection port 33 by sealant.

[0049] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A CPCIe board with liquid cooling, characterized in that: include: A card body (1) on which a main water inlet interface (3) and a main water return interface (4) are fixedly mounted; At least one cold plate (2) is detachably mounted at a high power consumption component of the board body (1), and is provided with a water inlet interface (21) and a water outlet interface (22), wherein the water inlet interface (21) and the water outlet interface (22) are respectively connected to the main water inlet interface (3) and the main water return interface (4) through a liquid cooling pipeline (5).

2. The CPCIe board with liquid cooling according to claim 1, characterized in that: When a plurality of the cold plates (2) are provided, the water inlet interfaces (21) and the water outlet interfaces (22) of the plurality of the cold plates (2) are connected in series via a liquid cooling pipeline (5) to form a liquid cooling channel for the circulation of cooling liquid; The total water inlet interface (3) is connected to the water inlet interface (21) of the first-stage cold plate through the liquid cooling pipeline (5), and the total water return interface (4) is connected to the water outlet interface (22) of the last-stage cold plate through the liquid cooling pipeline (5).

3. The CPCIe board with liquid cooling according to claim 1, characterized in that: The main water inlet interface (3) and the main water return interface (4) both include a mounting seat (31) and a blind plug quick connector (32); The mounting seat (31) is detachably mounted on the board body (1); one end of the mounting seat (31) is connected to the blind plug quick connector (32); an inner chamber (311) communicating with the blind plug quick connector is provided in the mounting seat (31); and a connection port (33) communicating with the inner chamber (311) is provided on one side of the mounting seat (31); The blind plug quick connector (32) is used to communicate with an external water supply or return pipeline, and the connecting port (33) is used to connect to the water outlet interface (22) or the water inlet interface (21).

4. The CPCIe board with liquid cooling according to claim 2, characterized in that: The liquid cooling pipeline (5) is fixed to the water inlet interface (21), the water outlet interface (22) and the connecting port (33) by means of pipe clamps, and is sealed to the water inlet interface (21), the water outlet interface (22) and the connecting port (33) by means of sealant.

5. The CPCIe board with liquid cooling according to claim 1, characterized in that: The apertures of the water inlet interface (21) and the water outlet interface (22) are 4-10 mm.

6. The CPCIe board with liquid cooling according to claim 1, characterized in that: The cold plate (2) is made of copper or aluminum.

7. The CPCIe board with liquid cooling according to claim 1, characterized in that: The shape and size of the cold plate (2) are adapted to the position and shape of the high power consumption components on the board body (1).

8. The CPCIe board with liquid cooling according to claim 1, characterized in that: The high power consumption components include but are not limited to CPU and MXM graphics card.

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