Circuit board copper liquid backflow device

Abstract

The utility model discloses a circuit board copper liquid backflow device, and belongs to the technical field of circuit boards. The device mainly comprises a bottom frame which is provided with at least two groups of electroplating pools; the impurity removal assembly is mounted on the bottom frame; the filtering assembly is mounted on the bottom frame; the adjusting assembly is mounted on the bottom frame; the bubble removing assembly is mounted on one group of electroplating pools, and comprises a flow dividing pipe which is arranged on a liquid outlet of the electroplating pool; the connecting pipe is arranged at one end, far away from the electroplating pool, of the shunting pipe; the exhaust valve is arranged on the connecting pipe; and the spiral baffle is arranged in the connecting pipe. According to the circuit board copper liquid backflow device, through the bubble removing assembly, when the copper liquid is extracted, the copper liquid carries gas to enter the liquid due to flowing and stirring of the liquid, so that formed bubbles are eliminated, follow-up operations such as filtering of the copper liquid are facilitated, and the effect of removing the bubbles when the copper liquid is extracted is achieved.

Description

Technical Field

[0001] This application relates to the technical field of circuit boards, specifically to a copper liquid reflux device for circuit boards. Background Art

[0002] A circuit board, also known as a printed circuit board (PCB), is an essential component in electronic products. To form conductive paths and connect electronic components, a uniform copper coating needs to be electroplated on the surface of the circuit board using copper liquid.

[0003] To ensure the stability and efficiency of the electroplating process, it is necessary to perform a reflux treatment on the copper liquid to achieve the recycling of the copper liquid.

[0004] Currently, when performing a reflux treatment on the copper liquid, the copper liquid is pumped out of the plating tank, and then filtered and purified to remove impurities and by-products. Subsequently, the copper liquid is drained back into the plating tank for use.

[0005] However, when pumping out the copper liquid, due to the flow and agitation of the liquid, gas may be entrained into the liquid, forming bubbles. The presence of bubbles may affect the filtration effect. During filtration, the bubbles will occupy a certain space, resulting in a reduction in the effective filtration area of the filter medium (such as a filter element), thereby reducing the filtration efficiency. Therefore, it is necessary to perform a defoaming treatment on the copper liquid when pumping it out.

[0006] Therefore, it is necessary to provide a copper liquid reflux device for circuit boards to solve the above problems.

[0007] It should be noted that the above information disclosed in this background art section is only used to understand the background art of the concept of this application. Therefore, it may include information that does not constitute prior art. Summary of the Invention

[0008] Based on the above problems existing in the prior art, the problem to be solved by this application is: to provide a copper liquid reflux device for circuit boards to achieve the effect of defoaming when pumping out the copper liquid.

[0009] The technical solution adopted by this application to solve its technical problems is: a copper liquid reflux device for circuit boards, including a chassis, on which at least two plating tanks are provided; a purification component installed on the chassis; a filtration component installed on the chassis; an adjustment component installed on the chassis; a defoaming component installed on one of the plating tanks. The defoaming component includes: a shunt pipe provided at the liquid outlet of the plating tank; a connecting pipe provided at the end of the shunt pipe away from the plating tank; an exhaust valve provided on the connecting pipe; and a spiral baffle provided inside the connecting pipe.

[0010] Further, the impurity removal component includes a first water pump installed on the chassis. The output end of the first water pump is connected to one end of the connecting pipe away from the shunt pipe. An impurity removal tank is installed on the chassis, and a communicating pipe is jointly arranged between the impurity removal tank and the output end of the first water pump.

[0011] Further, the filtering component includes a second water pump whose pipeline is connected to the liquid outlet of the impurity removal tank. A filtering tank is arranged on the pipeline communicating between the second water pump and the impurity removal tank, and an activated carbon filter element is arranged inside the filtering tank.

[0012] Further, the adjusting component includes a third water pump whose pipeline is connected to the liquid outlet of the filtering tank. An adjusting tank is arranged on the pipeline communicating between the third water pump and the filtering tank, and two groups of feed inlets are arranged on the adjusting tank.

[0013] Further, a fourth water pump is arranged on the chassis. A water pipe is jointly arranged between the input end of the fourth water pump and the liquid outlet of the adjusting tank, and a return pipe is jointly arranged between the output end of the fourth water pump and at least two groups of electroplating baths.

[0014] The beneficial effect of this application is that the circuit board copper liquid reflux device provided by this application, through the defoaming component, when extracting copper liquid, eliminates the bubbles formed by the copper liquid entraining gas into the liquid due to the flow and agitation of the liquid, so as to facilitate subsequent operations such as filtering of the copper liquid, achieving the effect of defoaming when extracting copper liquid.

[0015] In addition to the purposes, features, and advantages described above, this application has other purposes, features, and advantages. The following will refer to the drawings for a further detailed description of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The specification drawings forming a part of this application are used to provide a further understanding of this application. The schematic embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation to this application.

[0017] In the drawings:

[0018] Figure 1 is the overall schematic diagram of the circuit board copper liquid reflux device in this application;

[0019] Figure 2 is Figure 1 the enlarged schematic diagram at A in;

[0020] Figure 3 is Figure 2 the exploded schematic diagram of a part in;

[0021] Figure 4 is Figure 1 the overall schematic diagram from another perspective in;

[0022] Among them, the reference numerals in the drawings:

[0023] 1. Underframe; 2. Impurity removal component; 21. First water pump; 22. Impurity removal tank; 23. Electroplating tank; 3. Filtration component; 31. Filtration tank; 32. Second water pump; 4. Adjustment component; 41. Adjustment tank; 42. Feed inlet; 43. Third water pump; 44. Fourth water pump; 45. Return pipe; 5. Defoaming component; 51. Connecting pipe; 52. Exhaust valve; 53. Diverging pipe; 54. Spiral baffle. Detailed implementation manner

[0024] It should be noted that, without conflict, the embodiments in this application and the features in the embodiments may be combined with each other. The following will describe this application in detail with reference to the drawings and in combination with the embodiments.

[0025] In order to enable those skilled in the art to better understand the solution of this application, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0026] As Figure 1 - Figure 2 shown, this application provides a circuit board copper solution reflux device, including an underframe 1 and multiple groups of electroplating tanks 23 installed on the underframe 1. At the same time, a defoaming component 5 is provided on the electroplating tank 23, and this defoaming component 5 is used to eliminate the bubbles generated during the extraction of the copper solution;

[0027] As Figure 1 - Figure 4 shown, the defoaming component 5 includes a diverging pipe 53 installed at the liquid outlet of multiple groups of electroplating tanks 23. At the same time, a connecting pipe 51 is provided at the end of the diverging pipe 53 far from the electroplating tank 23, and an exhaust valve 52 is provided on the connecting pipe 51. At the same time, a spiral baffle 54 is provided inside the connecting pipe 51. In order to facilitate the subsequent extraction of the copper solution, due to the spiral shape of the spiral baffle 54, the flow direction of the fluid is changed to generate a swirling effect. And under the action of centrifugal force, the copper solution with a larger density will be pushed to the periphery of the swirl, while the bubbles with a smaller density will be pushed to the center of the swirl;

[0028] At the same time, the bubbles move towards the center of the spiral direction of the spiral baffle 54 in the connecting pipe 51. And because the top of the connecting pipe 51 is usually the low-pressure area in the swirl, the bubbles have a smaller density relative to the copper solution, and they tend to move towards the low-pressure area. When the bubbles accumulate to a certain extent at the top of the connecting pipe 51, through the exhaust valve 52 above, the bubbles can be smoothly discharged from the connecting pipe 51;

[0029] Meanwhile, a impurity removal component 2 is arranged on the chassis 1, and this impurity removal component 2 is used for the impurity removal operation of the copper liquid;

[0030] As Figure 1 shown, the impurity removal component 2 includes a first water pump 21 fixedly installed on the chassis 1. Meanwhile, the output end of the first water pump 21 is connected to one end of the connecting pipe 51 far from the shunt pipe 53. Meanwhile, an impurity removal tank 22 is fixedly installed on the chassis 1 to preliminarily remove impurities from the copper liquid by the precipitation method, and a communicating pipe (not marked in the figure) is commonly arranged between the impurity removal tank 22 and the output end of the first water pump 21;

[0031] Meanwhile, a filtering component 3 is arranged on the chassis 1, and this filtering component 3 is used for the filtering operation of the copper liquid;

[0032] As Figure 1 shown, the filtering component 3 includes a second water pump 32 connected to the liquid outlet of the impurity removal tank 22 through a pipeline. It should be noted that the liquid outlet of the impurity removal tank 22 is located on one side of the impurity removal tank 22, and a filtering tank 31 is arranged on the pipeline communicating between the second water pump 32 and the impurity removal tank 22. An activated carbon filter element (not shown in the figure) is arranged inside the filtering tank 31. Driven by the second water pump 32, the copper liquid preliminarily removed of impurities in the impurity removal tank 22 is pumped into the filtering tank 31 and filtered by the activated carbon filter element;

[0033] Meanwhile, an adjusting component 4 is arranged on the chassis 1, and this adjusting component 4 is used for adjusting the pH value of the filtered copper liquid;

[0034] As Figure 1 and Figure 4 shown, the adjusting component 4 includes a third water pump 43 connected to the liquid outlet of the filtering tank 31 through a pipeline, and an adjusting tank 41 is arranged on the pipeline communicating between the third water pump 43 and the filtering tank 31. Meanwhile, two groups of feed ports 42 are arranged on the adjusting tank 41 to feed an acidic solution or an alkaline solution, such as hydrochloric acid or dilute ammonia water, etc. It should be noted that the two groups of feed ports 42 are respectively externally connected to storage devices storing acidic solutions and alkaline solutions, and the acid-base concentration of the copper liquid is detected inside the adjusting tank 41 through a sensor;

[0035] Driven by the third water pump 43, the copper liquid in the filtering tank 31 is pumped into the adjusting tank 41. The acid-base concentration of the copper liquid is detected through the sensor, and an acidic solution or an alkaline solution is fed according to the detection result to ensure the quality of the copper liquid;

[0036] Meanwhile, a fourth water pump 44 is arranged on the chassis 1, and a water pipe (not shown in the figure) is commonly arranged between the input end of the fourth water pump 44 and the liquid outlet of the adjusting tank 41. Meanwhile, a return pipe 45 is commonly arranged between the output end of the fourth water pump 44 and multiple electroplating tanks 23. Driven by the fourth water pump 44, the copper liquid after adjusting the pH value is discharged into the multiple electroplating tanks 23 for use;

[0037] In summary, when refluxing the copper solution, the impurity removal component 2 extracts the copper solution from the electroplating bath 23, eliminates the bubbles in the copper solution through the impurity removal component 2, and then conducts preliminary impurity removal treatment. The filtration component 3 further filters the impurity-removed copper solution, and then the adjustment component 4 adjusts its pH value to ensure the quality of the copper solution and discharges the adjusted copper solution into the electroplating bath 23.

[0038] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. Circuit board copper liquid reflux device, characterized by: include: A base frame (1), wherein at least two groups of electroplating pools (23) are arranged on the base frame (1); A debris removal component (2), wherein the debris removal component (2) is mounted on the base frame (1); A filter assembly (3), wherein the filter assembly (3) is mounted on the base frame (1); An adjustment component (4), the adjustment component (4) being mounted on the base frame (1); A debubble assembly (5), the debubble assembly (5) being installed on one of the groups of the electroplating cells (23), the debubble assembly (5) comprising: A shunt pipe (53), the shunt pipe (53) being arranged on the liquid outlet of the electroplating pool (23); A connecting pipe (51), the connecting pipe (51) being arranged at one end of the diverter pipe (53) away from the electroplating pool (23); an exhaust valve (52), the exhaust valve (52) being arranged on the connecting pipe (51); A spiral baffle (54), wherein the spiral baffle (54) is arranged inside the connecting pipe (51).

2. The circuit board copper liquid reflux device according to claim 1, characterized in that: The impurity removal component (2) comprises a first water pump (21) mounted on the base frame (1), the output end of the first water pump (21) being connected to an end of the connecting pipe (51) away from the diverter pipe (53), a impurity removal tank (22) being mounted on the base frame (1), and a connecting pipe being provided between the impurity removal tank (22) and the output end of the first water pump (21).

3. The circuit board copper liquid reflux device according to claim 2, characterized in that: The filter assembly (3) comprises a second water pump (32) connected via a pipeline to a liquid outlet of the impurity removal tank (22); a filter tank (31) is arranged on the pipeline communicating between the second water pump (32) and the impurity removal tank (22); an activated carbon filter element is arranged inside the filter tank (31).

4. The circuit board copper liquid reflux device according to claim 3, characterized in that: The regulating assembly (4) comprises a third water pump (43) connected to the liquid outlet of the filter tank (31) via a pipeline, a regulating tank (41) is arranged on the pipeline communicating between the third water pump (43) and the filter tank (31), and two groups of feed ports (42) are arranged on the regulating tank (41).

5. The circuit board copper liquid reflux device according to claim 4, characterized in that: A fourth water pump (44) is arranged on the base frame (1), a water pipe is arranged at the input end of the fourth water pump (44) and the liquid outlet of the regulating tank (41), and a reflux pipe (45) is arranged between the output end of the fourth water pump (44) and at least two groups of the electroplating pools (23).

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