Device for polishing silicon carbide planet

Abstract

The utility model relates to semiconductor wafer processing, and provides a silicon carbide planetary polishing device which comprises a placing platform, a lifting device connected to the placing platform, a mounting rack connected to the lifting device, a driving mechanism connected to the mounting rack, a planetary gear set connected to the driving mechanism and capable of driving the planetary gear set. The lifting equipment drives the mounting frame to move in the direction close to or away from the containing platform. The planet wheel set can polish and grind the silicon carbide substrate more evenly, the surface type of the silicon carbide substrate can be effectively converged, and therefore the polishing effect and the machining precision of the silicon carbide substrate are improved.

Description

Technical Field

[0001] The present disclosure relates to semiconductor wafer processing, and more particularly to an apparatus for silicon carbide planetary polishing. Background Art

[0002] With the development of semiconductor technology, the quality requirements for silicon carbide substrates are getting higher and higher. Generally, the flatness improvement can be achieved based on the polishing process. In the prior art, a traditional cylindrical or inverted T-shaped grinding head is generally used to polish a silicon carbide substrate; however, when the traditional grinding head processes the silicon carbide substrate, it only rotates in a single direction, clockwise or counterclockwise, with its own center as the center, which may result in limited or non-converging surface shape of the silicon carbide substrate, affecting the polishing effect of the silicon carbide substrate and resulting in low processing accuracy of the silicon carbide substrate. Summary of the Utility Model

[0003] The basic technical problem to be solved by the present disclosure is to provide an apparatus for silicon carbide planetary polishing, which can effectively converge the surface shape of the silicon carbide substrate to improve the polishing effect of the silicon carbide substrate.

[0004] To solve the above technical problem, the present disclosure provides an apparatus for silicon carbide planetary polishing, including a placement platform, a lifting device connected to the placement platform, a mounting frame connected to the lifting device, a driving mechanism connected to the mounting frame, a planetary gear set connected to the driving mechanism, the driving mechanism being capable of driving the planetary gear set, and the lifting device driving the mounting frame to move in a direction approaching or departing from the placement platform.

[0005] In some embodiments, the planetary gear set includes a sun gear, a plurality of planetary gears, and an outer gear ring. Each planetary gear is disposed around the sun gear, each planetary gear meshes with the sun gear, and each planetary gear meshes with the outer gear ring; the driving mechanism includes a planetary transmission frame, a sun gear driving motor, and a plurality of planetary gear driving motors. The output shaft of the sun gear driving motor is connected to the sun gear to drive the sun gear to rotate; the output shaft of the planetary gear driving motor is vertically fixed at the center of the planetary gear, and a plurality of planetary gears are equidistantly arranged and rotatably connected to the planetary transmission frame.

[0006] In some embodiments, both the sun gear driving motor and the planetary gear driving motor are fixedly connected to the mounting frame.

[0007] In some embodiments, a planetary carrier braking mechanism and a ring gear braking mechanism are further included. The planetary carrier braking mechanism is disposed on the planetary transmission frame and is adapted to contact the sun gear, and the ring gear braking mechanism is disposed on the mounting frame and is adapted to contact the outer gear ring.

[0008] In some embodiments, the carrier brake mechanism includes a carrier brake cylinder and a carrier brake assembly. The carrier brake cylinder is fixed on the planetary transmission frame so as to be able to drive the carrier brake assembly to abut between the planetary transmission frame and the piston rod of the carrier brake cylinder.

[0009] In some embodiments, the carrier brake assembly includes a first brake shoe and a first friction plate. The first brake shoe is fixed on the piston rod of the carrier brake cylinder, and the first friction plate is connected to the output shaft of the sun gear drive motor. The carrier brake cylinder can drive the first brake shoe to fit or separate from the first friction plate.

[0010] In some embodiments, the ring gear brake mechanism includes a ring gear brake cylinder and a ring gear brake assembly. The ring gear brake cylinder is fixed on the mounting frame. The ring gear brake assembly includes a second brake shoe and a second friction plate. The second brake shoe is fixed on the piston rod of the ring gear brake cylinder, and the second friction plate is connected to the outer peripheral surface of the external ring gear. The ring gear brake cylinder can drive the second brake shoe to fit or separate from the second friction plate.

[0011] In some embodiments, both the second brake shoe and the second friction plate are formed into an arc-shaped structure.

[0012] In some embodiments, a plurality of polishing liquid nozzles are further provided on the mounting frame, and the liquid outlet of the polishing liquid nozzle is arranged facing the placement platform.

[0013] In some embodiments, an electronic controller is further installed on the mounting frame, and the electronic controller is signal-connected to the driving mechanism, the carrier brake mechanism, the ring gear brake mechanism and the polishing liquid nozzle.

[0014] Through the above technical solutions, for the device for silicon carbide planetary polishing provided by the present disclosure, the lifting device drives the mounting frame close to the placement platform on which the silicon carbide substrate is placed, and the driving mechanism drives the planetary gear set to work. While the sun gear drive motor drives the sun gear to rotate, the planetary gear drive motor drives the planetary gears to rotate, and a plurality of planetary gear members are transmitted through the planetary transmission frame, and the external ring gear limits the planetary gears, so that the sun gear rotates self, and while the planetary gears rotate self, they also revolve around the center of the sun gear, thereby performing more precise grinding on the silicon carbide substrate, and further effectively converging the surface profile of the silicon carbide substrate. When it is necessary to adjust the rotation speed of the planetary gear set during polishing, the carrier brake mechanism and the ring gear brake mechanism quickly brake the planetary gear set to ensure the processing accuracy. Description of the Drawings

[0015] To more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0016] Figure 1 is a schematic structural diagram of a device for silicon carbide planetary polishing disclosed in an embodiment of the present disclosure;

[0017] Figure 2 is a bottom view of the planetary gear set disclosed in an embodiment of the present disclosure;

[0018] Figure 3 is a top view of the planetary gear set disclosed in an embodiment of the present disclosure;

[0019] Figure 4 is disclosed in an embodiment of the present disclosure Figure 1 a partial enlarged view of part A therein;

[0020] Figure 5 is disclosed in an embodiment of the present disclosure Figure 3 a partial enlarged view of part B therein.

[0021] Explanation of reference numerals:

[0022] 1. Placing platform; 2. Lifting device; 3. Mounting frame; 31. Outer frame; 32. Central support; 33. Connecting bracket; 4. Driving mechanism; 41. Planetary transmission frame; 42. Sun gear driving motor; 43. Planetary gear driving motor; 5. Planetary gear set; 51. Sun gear; 52. Planetary gear; 53. Outer gear ring; 6. Planetary carrier braking mechanism; 61. Planetary carrier braking cylinder; 62. Planetary carrier braking assembly; 621. First brake shoe; 622. First friction plate; 7. Gear ring braking mechanism; 71. Gear ring braking cylinder; 72. Gear ring braking assembly; 721. Second brake shoe; 722. Second friction plate; 8. Polishing liquid nozzle; 9. Electronic controller. Detailed implementation manners

[0023] The following will further describe in detail the implementation manners of the present disclosure in conjunction with the accompanying drawings and embodiments. The detailed description and accompanying drawings of the following embodiments are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms, not limited to the specific embodiments disclosed herein, but including all technical solutions falling within the scope of the claims.

[0024] These embodiments are provided by the present disclosure to make the present disclosure thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, the components of materials, numerical expressions and values set forth in these embodiments should be construed as merely exemplary, rather than as limitations.

[0025] It should be noted that in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality" is greater than or equal to two; the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", etc. is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present disclosure. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0026] In addition, the "first", "second" and similar terms used in the present disclosure do not denote any order, quantity or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range. Terms such as "comprising" or "including" mean that the elements before this term cover the elements listed after this term, and do not exclude the possibility of also covering other elements.

[0027] It should also be noted that in the description of the present disclosure, unless otherwise clearly defined and limited, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0028] All terms used in the present disclosure have the same meanings as those understood by those of ordinary skill in the art to which the present disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in a general dictionary, such as those, should be construed to have a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense, unless specifically defined as such here.

[0029] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and devices should be regarded as part of the specification.

[0030] The present disclosure provides a device for silicon carbide planetary polishing. Refer to Figures 1 to 5 , including:

[0031] The placing platform 1 is connected with a lifting device 2, the lifting device 2 is connected with a mounting frame 3, the mounting frame 3 is connected with a driving mechanism 4, the driving mechanism 4 is connected with a planetary gear set 5, the driving mechanism 4 can drive the planetary gear set 5, and the lifting device 2 drives the mounting frame 3 to move towards or away from the placing platform 1.

[0032] In the present disclosure, a silicon carbide backing to be polished can be fixed on the placing platform 1, and a lifting device 2 is mounted on the placing platform 1 through a bracket, and there is a spacing between the lifting device 2 and the placing platform 1. The output end of the lifting device 2 is connected with a mounting frame 3, a driving mechanism 4 is mounted on the mounting frame 3, and a planetary gear set 5 is mounted on the driving mechanism 4. The lifting device 2 can drive the mounting frame 3 to move towards or away from the placing platform 1, that is, the driving mechanism 4 and the planetary gear set 5 move towards or away from the placing platform 1 under the drive of the lifting device 2, and the driving mechanism 4 can drive the planetary gear set 5 to work.

[0033] Therefore, when polishing the silicon carbide backing, first move the planetary gear set 5 to fit with the silicon carbide backing through the lifting device 2, and then the driving mechanism 4 drives the planetary gear set 5 to polish the silicon carbide backing. Compared with the traditional single grinding heads of cylindrical and inverted T-shaped, the planetary gear set 5 has multiple grinding heads, which can effectively converge the surface shape of the silicon carbide substrate to improve the polishing accuracy and effect on the silicon carbide substrate.

[0034] In some embodiments, the planetary gear set 5 includes a sun gear 51, a plurality of planetary gears 52 and an external gear ring 53. Each planetary gear 52 is arranged around the sun gear 51, each planetary gear 52 meshes with the sun gear 51, and each planetary gear 52 meshes with the external gear ring 53; the driving mechanism 4 includes a planetary transmission frame 41, a sun gear driving motor 42 and a plurality of planetary gear driving motors 43. The output shaft of the sun gear driving motor 42 is connected with the sun gear 51 to be able to drive the sun gear 51 to rotate; the output shafts of the planetary gear driving motors 43 are vertically fixed at the centers of the planetary gears 52, and the plurality of planetary gears 52 are arranged at equal intervals and rotatably connected to the planetary transmission frame 41.

[0035] A polishing disc is detachably mounted on one side of the sun gear 51 and the planetary gear 52 facing the placement platform 1. The sun gear 51 rotates driven by the sun gear drive motor 42, and the planetary gear 52 rotates driven by the planetary gear drive motor 43. The planetary gear 52 meshes with the sun gear 51, and the outer gear ring 53 limits the planetary gear 52, which enables the planetary gear 52 to revolve around the sun gear 51 with the center of the sun gear 51 as the center driven by the sun gear 51, so as to uniformly polish the surface of the silicon carbide substrate, thereby improving the polishing effect. The planetary transmission frame 41 drives several planetary gears 52, so that the several planetary gears 52 always maintain an equal distance from each other, and the several planetary gears 52 rotate and revolve at the same speed, which can effectively converge the surface profile of the silicon carbide substrate.

[0036] In some embodiments, both the sun gear drive motor 42 and the planetary gear drive motor 43 are fixedly connected to the mounting frame 3. The mounting frame 3 includes an outer frame 31, a central support 32 and a connecting support 33. The central support 32 is located in the middle of the mounting frame 3. The sun gear drive motor 42 is fixedly connected to the central support 32, and the output end of the central support 32 and the sun gear drive motor 42 are coaxially arranged. The output end of the sun gear drive motor 42 is fixedly connected to the center of the sun gear 51. The sun gear 51 meshes with the planetary gear 52, and the planetary gear 52 meshes with the outer gear ring 53, which enables the sun gear 51 to continuously and stably drive the planetary gear set 5 to polish the silicon carbide substrate. The mounting frame 3 includes a central support 32 and a connecting support 33. The connecting support 33 is rotatably connected to the central support 32, and the connecting support 33 and the output end of the sun gear drive motor 42 are coaxially arranged, which enables the connecting support 33 to rotate around the axis of the output end of the sun gear drive motor 42.

[0037] The planetary gear drive motor 43 is fixedly connected to one end of the connecting support 33 away from the central support 32, and the planetary gear 52 and the sun gear 51 are located in the same plane. After the lifting device 2 drives the mounting frame 3 to move towards the placement platform 1, the polishing discs of the sun gear 51 and several planetary gears 52 are simultaneously attached to the silicon carbide substrate to be polished. Then the sun gear drive motor 42 drives the sun gear 51 to rotate, and the planetary gear 52 rotates and revolves simultaneously driven by the sun gear 51 and the planetary gear drive motor. The outer gear ring 53 and the planetary transmission frame 41 limit and drive the planetary gear 52, so that the planetary gear set 5 uniformly and efficiently performs fine polishing on the silicon carbide substrate to reduce the situation that the surface profile convergence of the silicon carbide substrate is limited or cannot converge.

[0038] In some embodiments, a carrier brake mechanism 6 and a ring gear brake mechanism 7 are further included. The carrier brake mechanism 6 is disposed on the planetary transmission carrier 41 and is adapted to contact the sun gear 51. The ring gear brake mechanism 7 is disposed on the mounting bracket 3 and is adapted to contact the external ring gear 53. When it is necessary to adjust the rotational speed of the planetary gear set 5 during the polishing of the silicon carbide substrate, the carrier brake mechanism 6 can brake the planetary transmission carrier 41. The sun gear 51 serves as the driving part, which can meet the reverse movement of reducing speed and increasing torque. Under the condition of low-speed rotation, the safety of the operating environment of the device for silicon carbide planetary polishing can be improved. The ring gear brake mechanism 7 can brake the external ring gear 53, and then adjust the rotational speeds of the planetary gear 52 and the sun gear 51. The sun gear 51 and the planetary gear 52 serve as the driving parts, which can meet the forward movement of reducing speed and increasing torque or reducing torque at high speed, facilitating the trial operation and normal polishing of the device for silicon carbide planetary polishing.

[0039] In some embodiments, the carrier brake mechanism 6 includes a carrier brake cylinder 61 and a carrier brake assembly 62. The carrier brake cylinder 61 is fixed on the planetary transmission carrier 41 so as to be able to drive the carrier brake assembly 62 to abut between the planetary transmission carrier 41 and the piston rod of the carrier brake cylinder 61. The carrier brake cylinder 61 is fixed on one side of the planetary transmission carrier 41 facing the output shaft of the sun gear driving motor 42. By driving the carrier brake assembly 62 to abut between the planetary transmission carrier 41 and the piston rod of the carrier brake cylinder 61 through the carrier brake cylinder 61, the planetary transmission carrier 41 can be braked, or the braking can be ended through the carrier brake cylinder 61, which is convenient, flexible and easy to operate. The carrier brake cylinders 61 are symmetrically and evenly distributed around the planetary transmission carrier 41, and during braking, the vibration can be relatively dispersed, so as to reduce the influence of vibration on polishing.

[0040] In some embodiments, the carrier brake assembly 62 includes a first brake shoe 621 and a first friction plate 622. The first brake shoe 621 is fixed on the piston rod of the carrier brake cylinder 61, and the first friction plate 622 is connected to the output shaft of the sun gear driving motor 42. The carrier brake cylinder 61 can drive the first brake shoe 621 to fit or separate from the first friction plate 622. When braking is required, the piston rod of the carrier brake cylinder 61 moves towards the output shaft of the sun gear driving motor 42 and abuts the first brake shoe 621 against the first friction plate 622. Through the frictional force between the first brake shoe 621 and the first friction plate 622, both the planetary transmission carrier 41 and the sun gear driving motor 42 can be braked, and thus the sun gear 51 and the planetary gear 52 can be effectively braked. At the same time, the structure of the carrier brake mechanism 6 is simple and compact, and it is easy to repair.

[0041] In some embodiments, the ring gear braking mechanism 7 includes a ring gear braking cylinder 71 and a ring gear braking assembly 72. The ring gear braking cylinder 71 is fixed on the mounting bracket 3. The ring gear braking assembly 72 includes a second brake shoe 721 and a second friction plate 722. The second brake shoe 721 is fixed on the piston rod of the ring gear braking cylinder 71. The second friction plate 722 is connected to the outer peripheral surface of the external ring gear 53. The ring gear braking cylinder 71 can drive the second brake shoe 721 to fit or separate from the second friction plate 722. When braking is required, the ring gear braking cylinder 71 drives the second brake shoe 721 to move towards the external ring gear 53 and abut against the second friction plate 722 provided on the outer edge of the external ring gear 53. The external ring gear 53 is braked by the frictional force between the second brake shoe 721 and the second friction plate 722, thereby braking the planetary gear 52 and the sun gear 51, and further meeting the requirements of speed reduction and torque increase or high-speed torque reduction under different polishing requirements. The ring gear braking cylinders 71 are symmetrically and evenly distributed around the mounting bracket 3, which can make the vibration more dispersed during braking, so as to reduce the influence of vibration on polishing. And when both the ring gear braking mechanism 7 and the planet carrier braking mechanism 6 are braked, the vibration generated by the ring gear braking mechanism 7 can partially offset the vibration generated by the planet carrier braking mechanism 6, further reducing the influence of vibration on polishing during braking.

[0042] In some embodiments, both the second brake shoe 721 and the second friction plate 722 are formed into an arc-shaped structure, and the arcs of the second brake shoe 721 and the second friction plate 722 are the same. This enables the ring gear braking mechanism 7 to effectively increase the contact area between the second brake shoe 721 and the second friction plate 722 during braking, so as to ensure the frictional force between the second brake shoe 721 and the second friction plate 722 and improve the braking effect.

[0043] In some embodiments, a plurality of polishing liquid nozzles 8 are further provided on the mounting bracket 3. The liquid outlet of the polishing liquid nozzle 8 faces the placement platform 1. The polishing liquid nozzle 8 can distribute liquid to the placement platform 1, so that the polishing liquid quickly and evenly covers the entire placement platform 1. The substances in the polishing liquid react with the surface material of the silicon carbide substrate, becoming soluble substances or softening some substances with too high hardness, and then the reaction products are removed from the surface of the silicon carbide substrate by grinding, which can improve the surface finish of the silicon carbide substrate.

[0044] In some embodiments, an electronic controller 9 is further installed on the mounting bracket 3. The electronic controller 9 is signal-connected to the drive mechanism 4, the planet carrier braking mechanism 6, the ring gear braking mechanism 7 and the polishing liquid nozzle 8. By instantaneously controlling the electronic controller 9 through the electronic controller 9, the start and stop of the electronic controller 9, the drive mechanism 4, the planet carrier braking mechanism 6, the ring gear braking mechanism 7 and the polishing liquid nozzle 8 can be controlled, which can reduce the possibility of adverse effects on polishing and grinding caused by the lag caused by manual start and stop.

[0045] The present disclosure provides a device for silicon carbide planetary polishing, including a placement platform 1, on which a lifting device 2 is installed. The output end of the lifting device 2 is connected to a mounting frame 3. The planetary gear set 5 is connected to the mounting frame 3 through a driving mechanism 4. The planetary gear set 5 includes a sun gear 51 driven by a sun gear driving motor 42 fixed on a central bracket 32 and several planetary gears 52 driven by planetary gear driving motors 43 fixed on a connecting bracket 33, and an outer gear ring 53 sleeved and meshed with the several planetary gears 52. The connecting bracket 33 is also rotatably connected to the central bracket 32, and the several planetary gears 52 are all rotatably connected to a planetary transmission frame 41. Inside the inner edge of the planetary transmission frame 41, several planetary bracket braking cylinders 61 are fixed. A first brake shoe 621 is fixed on the piston rod of the planetary bracket braking cylinder 61, and a first friction plate 622 corresponding to the first brake shoe 621 is fixed on the output shaft of the sun gear driving motor 42. Several gear ring braking cylinders 71 are fixed on the mounting frame 3 and arranged facing the outer gear ring 53. A second brake shoe 721 is fixed on the piston rod of the gear ring braking cylinder 71, and a second friction plate 722 corresponding to the second brake shoe 721 is fixed on the outer edge of the outer gear ring 53. Both the second brake shoe 721 and the second friction plate 722 are in an arc-shaped structure. The mounting frame 3 is also provided with several polishing liquid nozzles 8 facing the placement platform 1, and an electronic controller 9 that is signal-connected to the driving mechanism 4, the planetary bracket braking mechanism 6, the gear ring braking mechanism 7, and the polishing liquid nozzles 8.

[0046] In summary, the device for silicon carbide planetary polishing of the present disclosure has the following advantages: When polishing and grinding a silicon carbide substrate, first place the silicon carbide substrate on the placement platform 1, and then drive the planetary gear set 5 to move towards the position of the placement platform 1 and fit against the silicon carbide substrate through the lifting device 2. The sun gear driving motor 42 drives the sun gear 51 to rotate, and the planetary gear driving motors 43 drive the planetary gears 52 to rotate. The polishing discs on the sun gear 51 and the planetary gears 52 are pressed against the silicon carbide substrate for polishing and grinding. The sun gear 51, the outer gear ring 53, and the planetary transmission frame 41 form a transmission among the several planetary gears 52, so that the planetary gear set 5 can perform uniform polishing and grinding on the silicon carbide substrate, which helps to improve the polishing accuracy and effect. And during polishing, the polishing liquid can be sprayed by the polishing liquid nozzles 8, further improving the surface finish of the silicon carbide substrate. When it is necessary to brake the planetary gear set 5, use the electronic controller 9 to control the planetary bracket braking cylinder 61 to drive the first brake shoe 621 to abut against the first friction plate 622, and control the gear ring braking cylinder 71 to drive the second brake shoe 721 to abut against the second friction plate 722, then the planetary bracket and the outer gear ring 53 can be braked, and further the entire planetary gear set 5 can be braked to meet the requirements of speed reduction and torque increase or high-speed torque reduction under different polishing requirements.

[0047] Thus far, the embodiments of the present disclosure have been described in detail. To avoid obscuring the concept of the present disclosure, some details well known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0048] Although some specific embodiments of the present disclosure have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or partial technical features can be equivalently replaced without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way.

Claims

1. A device for silicon carbide planetary polishing, characterized in that: The device comprises a placement platform (1), the placement platform (1) is connected to a lifting device (2), the lifting device (2) is connected to a mounting frame (3), the mounting frame (3) is connected to a driving mechanism (4), the driving mechanism (4) is connected to a planetary gear set (5), the driving mechanism (4) is capable of driving the planetary gear set (5), and the lifting device (2) drives the mounting frame (3) to move in a direction close to or away from the placement platform (1); The planetary gear set (5) comprises a sun gear (51), a plurality of planetary gears (52) and an outer gear ring (53), each of the planetary gears (52) being arranged around the sun gear (51), each of the planetary gears (52) being meshed with the sun gear (51), and each of the planetary gears (52) being meshed with the outer gear ring (53); The driving mechanism (4) comprises a planetary transmission frame (41), a sun gear driving motor (42) and a plurality of planetary gear driving motors (43); the output shaft of the sun gear driving motor (42) is connected to the sun gear (51) so as to drive the sun gear (51) to rotate; the output shaft of the planetary gear driving motor (43) is vertically fixed at the center of the planetary gear (52); and the plurality of planetary gears (52) are arranged at equal intervals and are rotatably connected to the planetary transmission frame (41).

2. The device for silicon carbide planetary polishing according to claim 1, characterized in that: The sun gear drive motor (42) and the planetary gear drive motor (43) are both fixedly connected to the mounting frame (3).

3. The device for silicon carbide planetary polishing according to claim 1, characterized in that: It also includes a planetary carrier braking mechanism (6) and a ring gear braking mechanism (7), wherein the planetary carrier braking mechanism (6) is arranged on the planetary transmission frame (41), and the planetary carrier braking mechanism (6) is suitable for contacting the sun gear (51), and the ring gear braking mechanism (7) is arranged on the mounting frame (3), and the ring gear braking mechanism (7) is suitable for contacting the outer ring gear (53).

4. The device for silicon carbide planetary polishing according to claim 3, characterized in that: The planetary carrier brake mechanism (6) comprises a planetary carrier brake cylinder (61) and a planetary carrier brake assembly (62), wherein the planetary carrier brake cylinder (61) is fixed on the planetary transmission frame (41) so as to be able to drive the planetary carrier brake assembly (62) to abut between the planetary transmission frame (41) and the piston rod of the planetary carrier brake cylinder (61).

5. The device for silicon carbide planetary polishing according to claim 4, characterized in that: The planetary carrier brake assembly (62) comprises a first brake shoe (621) and a first friction plate (622), wherein the first brake shoe (621) is fixed on the piston rod of the planetary carrier brake cylinder (61), and the first friction plate (622) is connected to the output shaft of the sun gear drive motor (42), and the planetary carrier brake cylinder (61) can drive the first brake shoe (621) to fit or separate from the first friction plate (622).

6. The device for silicon carbide planetary polishing according to claim 3, characterized in that: The annular gear brake mechanism (7) comprises an annular gear brake cylinder (71) and an annular gear brake assembly (72); the annular gear brake cylinder (71) is fixed on the mounting frame (3); the annular gear brake assembly (72) comprises a second brake shoe (721) and a second friction plate (722); the second brake shoe (721) is fixed on the piston rod of the annular gear brake cylinder (71); the second friction plate (722) is connected to the outer peripheral surface of the outer ring gear (53); the annular gear brake cylinder (71) can drive the second brake shoe (721) to fit or separate from the second friction plate (722).

7. The device for silicon carbide planetary polishing according to claim 6, characterized in that: The second brake shoe (721) and the second friction plate (722) are both formed into arc-shaped structures.

8. The device for silicon carbide planetary polishing according to any one of claims 1 to 7, characterized in that: A plurality of polishing liquid nozzles (8) are also provided on the mounting frame (3), and the liquid outlets of the polishing liquid nozzles (8) are arranged toward the placement platform (1).

9. The device for silicon carbide planetary polishing according to any one of claims 1 to 7, characterized in that: An electronic controller (9) is also installed on the mounting frame (3), and the electronic controller (9) is connected to the driving mechanism (4), the planetary carrier braking mechanism (6), the ring gear braking mechanism (7) and the polishing liquid nozzle (8) by signals.

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